JP2777524B2 - IC socket for leadless chip - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket mainly for a leadless chip having a plurality of IC elements mounted on a circuit board and not packaged with a synthetic resin or the like.

[0002]

2. Description of the Related Art FIG. 11 and FIG.
No. 0 is a conventional IC socket for a leadless chip carrier. In the case of this IC socket, the inner end of the lead pin 2 of the socket body 1 is in elastic contact with the electrode of the leadless chip carrier 9 by its elastic force. In the figure, reference numeral 5 denotes a cover for pressing the leadless chip carrier 9 from the back, which is formed of a metal plate such as stainless steel, and is fixed to the socket main body 1 by the cutout portion 10 of the socket main body 1 and the caulking portion 5a. Reference numeral 12 denotes an electronic circuit board, and a socket body 1 is formed on the electrode pattern by solder 12a.
The outer ends of the lead pins 2, 2,... Are surface-mounted.

[0003]

An IC of such a system
In the socket, if the distance between the electrodes of the chip carrier 9 is small, the lead pins 2 must be made thinner. If the lead pins 2 become thinner, the elastic force becomes weaker, and permanent deformation tends to occur, resulting in reduced durability.

[0004]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has a socket body 1 having a storage portion for mounting a leadless chip 4 therein.
And a plurality of lead pins 2 extending from the inside of the socket body 1 to the outside of the socket body, and a cover 5 attached to the socket body 1 so as to be openable and closable. The contact portions 2a and 2b on the inner side of 1 are integrated with the electrodes 4a and 4b of the leadless chip 4 mounted on the housing and the lead pins 2.
The chip IC is in an electrically connected state via the contact portion 2a or the separate contact portion 6a , and the external ends of the plurality of lead pins 2 on the socket body 1 can be soldered to a circuit board. In the socket, an elastic body such as a heat-resistant O-ring 3 or silicon rubber 8 having elasticity is arranged on the back side of the contact portion 2a.

[0005]

The contact portions 2a and 2b make resilient contact with the electrodes 4a and 4b of the chip 4 mounted on the housing portion of the socket body 1.

[0006]

FIG. 1 is a partially cutaway perspective view showing an embodiment of a socket body of an IC socket according to the present invention, FIG. 2 is a partially cutaway perspective view showing a back side of a cover thereof, and FIG. It is the elements on larger scale which show a state. The socket body 1 has an end 2 on the inner side of the socket body 1 of the lead pin 2.
lead pins 2 and 2 so that the heights of c and 2d alternate.
Are arranged. The end 2c is closer to the end 2d.
Located on the inner side of the socket body 1 at each end side
The contact portion 2a, and 2b are provided below the contact portion 2a be disposed in heat resistance O-ring 3, the contact portion 2a
Are supported by a heat-resistant O-ring 3.

The electrodes 4 are provided on the upper and lower surfaces on the contact portion 2a.
The chip 4 is placed so that the lower electrode 4a of one of the chips 4a and 4b is in contact with the other, and the cover 5 is placed thereon. A flexible film 6 made of polyimide on which a conductive circuit pattern 6a is formed is attached to the back surface of the cover 5. The other contact portion 2b is formed by disposing the heat-resistant O-ring 3 under the film 6. . When the cover 5 is placed at a predetermined position, the conductive circuit pattern 6a of the film 6 comes into contact with both the electrode 4b on the chip 4 and the high end 2d of the lead pin 2. Next, engaging portions 1a (holes) provided at the four corners of the socket body 1 are provided with holes 5 provided at the four corners of the cover 5.
b, the engaging portions 1a, 1a... and the holes 5b, 5
4b, the cover 5 is attached to the socket body 1 by inserting a snap fit 7 as shown in FIG. Then
Due to the elasticity of the heat-resistant O-rings 3, 3,..., The electrodes 4a, 4b make elastic contact with the contact portions 2a, 2b, respectively, and the lead pins 2 of the socket body 1 and the electrodes 4a, 4b of the chip 4
Becomes an electrically connected state. Projections 1b are provided at the four corners of the socket body 1 to protect the lead pins 2 projecting outside the socket body 1.

FIG. 5 shows a second embodiment of the present invention.
In this case, instead of the heat-resistant O-ring 3, silicon rubber 8
Is used. Further, a contact portion 2a for contacting the electrode 4a of the chip 4 is also formed of the flexible film 6 described above, and the electrode 4a and the end 2c of the lead pin 2 via the conductive circuit pattern 6a of the flexible film 6.
Are in an electrically connected state. As a method of attaching the flexible film 6 to the socket body 1 or the cover 5, when the socket body 1 or the cover 5 is formed, the flexible film 6 is inserted into a mold and integrally molded, or the socket body 1 or the cover 5 is molded. In the case of the socket body 1, the cover 5 is a two-piece body. For example, as shown in FIG. 6, the flexible film 6 is sandwiched and fixed, as shown in FIG.
And 1d may be fixed together.

Further, as shown in FIG.
To the socket body 1 or the cover 5 so as to be elastically deformable. The flexible film 6 may be provided with not only the conductive circuit pattern 6a but also bumps 6b as shown in FIG. 7 so that the bumps 6b contact the electrodes 4a and 4b of the chip. As shown in FIG. 7, the bumps 6b protruding from the flexible film 6 greatly
The electrical connection becomes more reliable by making contact with a and 4b.

In the case of FIG. 7, since the conductive portion 6c penetrating through the flexible film 6 is provided, the ends 2c and 2d of the lead pins can be arranged below the flexible film 6.

FIG. 8 shows a cut-out 1e communicating with an engaging portion 1a which engages with a snap fit 7 at four or two corners of a portion of the socket body 1 where the chip 4 is mounted. The chip 4 is easily taken out by hooking the corner from the notch 1e side. Since the cover 5 of the present invention is attached to the socket body 1 by the snap fit 7, the snap fit 7 does not exist in the engagement portion 1a when the chip 4 is attached or detached. When the communication is established, the notch portion can be used widely so that the work is easy. FIG.
FIG. 10 is a perspective view showing an example of a chip IC socket having electrodes only on one side. In this case, the pressing portion 5c of the cover 5 does not need a conductive wiring pattern.

[0012]

The effects of the present invention are as follows. 1. The durability is improved by obtaining the elastic force for resilient contact between the lead pin and the electrode of the chip from a member separate from the lead pin. 2. With a simple structure, it can be connected simultaneously with the electrodes on both sides of the chip. 3. By providing a portion where the notch and the engagement hole of the snap fit are connected at the corner of the chip mounting portion, the chip can be easily taken out from the socket body. 4. Projections are provided at the four corners of the socket body to protect the lead pins. 5. By making the contact part a flexible film,
The manufacture of the C socket has become easier.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view showing an embodiment of a socket body of an IC socket according to the present invention.

FIG. 2 is a partially broken perspective view showing the back side of the cover.

FIG. 3 is a partially enlarged view showing a state where the chip is mounted.

FIG. 4 is a perspective view of the snap fit.

FIG. 5 is a perspective view of a main part of a second embodiment of the present invention.

FIG. 6 is an exploded perspective view of a socket body according to a third embodiment of the present invention.

FIG. 7 is a sectional view of a flexible film according to a fourth embodiment of the present invention.

FIG. 8 is a perspective view of a main part of a fifth embodiment of the present invention.

FIG. 9 is a perspective view of a back surface of a cover showing an example of a chip IC socket having electrodes on only one side according to a sixth embodiment of the present invention.

FIG. 10 is a perspective view of the socket body.

FIG. 11 is an exploded perspective view of a conventional IC socket.

FIG. 12 is a sectional view of the same.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket main body 2 Lead pin 2a, 2b Contact part 2c, 2d End part 3 O-ring 4 Tip 4a, 4b Electrode 8 Silicon rubber

Claims (8)

(57) [Claims] 1. A socket body having a storage portion for mounting a leadless chip therein, a plurality of lead pins extending from the inside of the socket body to the outside of the socket body, and an openable / closable door. And a contact portion of the plurality of lead pins on the inner side of the socket body, and an electrode of a leadless chip mounted on the storage portion and an integral contact with the lead pin.
An IC for a chip which is in an electrically connected state via a contact portion or a separate contact portion, and an end of the plurality of lead pins on the outside of the socket body can be soldered to a circuit board.
In the socket, a heat-resistant O-ring having elasticity or an elastic body such as silicon rubber is arranged on the back side of the contact portion, and the contact portion makes elastic contact with the electrode of the chip mounted on the housing portion of the socket body. An IC socket for a leadless chip. 2. The position of a contact portion on the inner side of the socket body of each of the adjacent lead pins is configured to be alternately changed in height, and the contact portion on the inner side of the socket body of each of the lead pins located at a lower position. contacting the contact portion in electrical connection state of the internal side of the socket body of the lead pins in the are formed in the socket body, a high position and
The contact portion in electrical contact with the contact portion is formed of a conductive circuit pattern formed on the back surface of the cover, and is formed so as to be connected to the electrode of the chip through each contact portion, and formed in the socket body. The surface of the chip provided differs between the electrode of the chip to which the contact portion connected is connected and the electrode of the chip to which the contact portion formed of the conductive circuit pattern formed on the back surface of the cover connects. The IC socket for a leadless chip according to claim 1, wherein: 3. The leadless chip IC according to claim 1, wherein the electrical contact between the lead pin and the chip is made via a flexible conductive film having a conductive circuit pattern formed on a polyimide film. socket. 4. The electrical connection between the lead pin and the chip is made via a flexible conductive film having a conductive circuit pattern and an electrode bump protruding from the conductive circuit pattern formed on a polyimide film. An IC socket for a leadless chip according to claim 1 or 2. 5. The flexible conductive film is formed integrally with the socket body or the cover, or the socket body or the cover is formed as a two-piece body,
The leadless chip IC socket according to claim 3, wherein the IC socket is fixed by being sandwiched between the IC sockets. 6. The leadless chip IC socket according to claim 1, wherein said cover is attached to said socket body by snap fitting. 7. An engaging portion for engaging the snap fit with the socket body is provided at a projecting portion projecting from four corners of the socket body, and the projecting portion projects from the socket body at least from the lead pin. The leadless chip IC socket according to claim 6, wherein: 8. A notch for taking out a chip mounted in the storage portion is provided at four or two corners of a storage portion provided in the socket body, and the notch engages with the snap fit. 8. The IC socket for a leadless chip according to claim 6, wherein the IC socket is in communication with the engaging portion.