JP2593416Y2 - IC socket for chip substrate - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION The present invention mainly relates to an IC socket used for a leadless type IC chip substrate such as a chip substrate in which a plurality of IC elements are mounted on a circuit board and whose outer periphery is not packaged with a synthetic resin. It is about.

[0002]

2. Description of the Related Art In recent years, the arrangement of external connection terminals (hereinafter, referred to as electrodes of an IC chip substrate) on an IC chip substrate has been increased in density due to high integration of ICs and miniaturization of IC chip substrates. Further, IC chip substrates in which electrodes are densely arranged on both surfaces of the chip substrate are increasing. Therefore, even in an IC socket on which such a highly integrated and small IC chip substrate is mounted, the lead pins are arranged at high density according to the electrodes of the IC chip substrate, and the electrodes on both sides of the chip substrate can be easily connected. At the same time, there is a demand for an IC socket for high-density terminals that can be electrically connected.

FIGS. 4 and 5 show a leadless type IC.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory view of a conventional IC socket used for a chip substrate, showing a main part related to a problem to be solved by the present invention. FIG. 4 is a schematic view of the IC socket, and FIG. 5 is a sectional view showing a state where the IC chip substrate is mounted.
The socket body 11 is provided with a plurality of lead pins 13 which are in contact with the electrodes of the IC chip substrate 14 and are electrically connected thereto. The lead pins 13 have contact portions (terminals) inside and outside the socket body 11, respectively. The outside contact portion 13a is connected to the electrode pattern of the electronic circuit board 21 by soldering or the like, and the inside contact portion 13b is connected to the IC chip board 14. Contact with the electrodes. The lead pins 13 are formed of an elastic metal, and press the IC chip substrate 14 from the back with the pressing cover 12, so that a reliable connection can be obtained. Holding cover 1
Numeral 2 is formed of a metal plate such as stainless steel.
a and the notch 11 a of the socket body 11 are fixed to the socket body 11.

FIG. 6 is an exploded perspective view showing a conventional example of an IC socket for a leadless type IC package. Connection pattern 13 provided on substrate 21
A frame 11 is attached around the frame. The connection between the frame 11 and the cover 12 is performed by connecting the pin 11 a to the support hole 11 on the frame 11 side.
b and the support hole 12b on the side of the cover 12 are coaxially inserted. When the cover 12 is closed, the frame 11 and the cover 1 are closed.
The engaging portions 11c and the engaging pieces 12c at the respective peripheral end portions of FIG. Then, the conductive connector 16 and the leadless type IC package 15 are put in the frame body 11, the support cover 12 'is fitted to the frame body 11, and the cover 12 is closed. The IC package 15 has a connection pattern 15a on the lower surface, and the conductive connector 16 has a gold-plated thin wire conductor buried in a silicon rubber insulator. A conical coil spring 12a is provided inside the cover 12 so that a predetermined pressure acts on the connection pattern 13.

[0005]

SUMMARY OF THE INVENTION In the case of the conventional IC chip substrate IC socket described with reference to FIGS.
When the C chip substrate is highly integrated and miniaturized, and the pitch of the electrodes on the IC chip substrate is narrowed, the lead pins 13 must also be thinned. If the lead pin 13 is thin, permanent deformation is likely to occur.
Elastic pressure contact with the electrodes of the C chip substrate 14 becomes impossible.

The IC socket described with reference to FIG.
On the chip substrate, a so-called IC package in which the entire portion other than the surface on which the electrodes (connection patterns) are provided is packaged with a synthetic resin is mounted. In the case of such an IC package 15, as shown in FIG. 6, even if the center portion of the IC package 15 is strongly pressed by the coil spring 12a, the IC chip substrate does not bend. Further, since the IC elements on the chip substrate are also protected by the synthetic resin, there is no possibility of damaging the IC elements even if the chip substrate on which the IC elements are mounted is pressed.

[0007] However, in the case of an IC chip substrate in which the outer periphery of the chip substrate is not packaged with a synthetic resin, the pressing position is not limited to any location. 4 to 6
In the IC socket having the structure shown in (1), it is not possible to mount an IC chip substrate having electrodes on both sides and simultaneously make electrical connection with the electrodes on both sides.

The present invention has been made in view of the above-mentioned problems of an IC socket for a chip substrate, and is capable of mounting an IC chip substrate that is not packaged with a synthetic resin, has high durability, and has electrodes on both sides. Provided is an IC socket that can be electrically connected to electrodes on both sides of the IC chip substrate at the same time.

[0009]

SUMMARY OF THE INVENTION An IC socket for a chip substrate according to the present invention includes a socket body having a protrusion on an inner side surface and an inner contact portion located in the socket body and having different inner contact portions. A lead pin arranged in a socket body and a curved lower portion having a substantially S-shaped cross section are formed around the lead pin, and the outer surface of the curved lower portion can be electrically connected to an internal contact portion at a high position of the lead pin and the socket A holding cover having a conductive wiring pattern formed so as to be electrically connectable also to an electrode of a chip substrate housed in the main body, and having an engaging portion for engaging with the projection at an upper portion of the curved lower portion; It is characterized by having.

[0010]

1 and 2 show an embodiment of an IC socket for a chip substrate (double-sided electrode type) according to the present invention. FIG. 1 is a sectional view showing a state where the chip substrate is mounted on the IC socket. FIG. 2 is a perspective view of a holding cover of the IC socket shown in FIG. In the drawing, reference numeral 1 denotes a socket body having a projection 1a formed above the inner surface of the side wall, and 2 denotes a metal holding cover. The holding cover 2 has cutouts 2a at the four corners, and a curved lower portion 2 having a substantially S-shaped cross section (small upper and smaller lower) around the periphery.
b is formed. In the curved lower portion 2b having a substantially S-shaped cross section, a concave portion which is located on the upper portion of the S-shape and which is concave outward is formed by a protrusion
A conductive wiring pattern 2e is provided on a spring portion 2d which is an engaging portion 2c for a and which is located at a lower portion of the S-shape and which is convex outward.

Reference numerals 3a and 3b denote an upper lead pin and a lower lead pin having contact portions inside and outside the socket body 1, respectively. Upper lead pin 3a, lower lead pin 3
b is made of a conductive metal having a higher rigidity than a conventional lead pin. The inner contact portion 3ai of the upper lead pin 3a is located immediately below the protrusion 1a, while the inner contact portion 3bi of the lower lead pin 3b is
Is located below and away from the inner contact portion 3ai. On the other hand, the contact portions 3ao and 3bo outside the upper lead pin 3a and the lower lead pin 3b are at the same height. The upper lead pin 3a and the lower lead pin 3 having such a positional relationship
b are paired, and many pairs are arranged in a row through the side wall of the socket body 1. Reference numeral 4 denotes a chip substrate to which a plurality of IC elements 5 are joined. On both sides of the chip substrate 4, I
Electrodes 4a and 4b are provided in connection with C element 5.

An insulating layer is formed by coating on the outer surface of the spring portion 2d of the pressing cover 2, and a conductive wiring pattern 2e matching the inner contact portion 3ai of the upper lead pin 3a is formed on the insulating layer. I have. The material of the holding cover 2 having such a spring portion 2d is a metal plate having an appropriate elastic range.

As a method of manufacturing the holding cover 2, for example, first, a square plate having a required shape and dimensions is punched from such a metal plate. Next, using an appropriately designed press bending die, press the press plate to hold the square plate and cover 2
Bending to the shape of After that, the insulating film on which the conductive wiring pattern 2e is formed is adhered to the outer surface of the spring portion 2d to form a structure. Alternatively, it may be manufactured by punching a metal plate, coating an insulating material, etching a conductive material on the metal plate in a pattern, and then bending the metal.

To mount the chip substrate 4 on the socket body 1, first, a jig is hooked on one of the notches 2a at the four corners of the holding cover 2, and the holding cover 2 is removed from the socket body 1. Next, the chip substrate 4 is placed on the inner contact portion 3bi of the lower lead pin 3b in the socket body 1 so that the electrode 4b is in contact therewith. Then, the spring portion 2d of the holding cover 2 is pressed against the projection 1a formed in the socket body 1 to push the holding cover 2 into the socket body 1 while elastically deforming the spring portion 2d. The engagement portion 2c of the lower portion 2b is projected 1
a. FIG. 1 shows a state in which the mounting of the chip substrate 4 on the socket body 1 and the fitting of the holding cover 2 have been completed.

That is, when the mounting of the chip board 4 on the socket body 1 and the fitting of the holding cover 2 are completed, the chip board 4 is sandwiched between the lower lead pins 3 b and the spring portion 2 d of the holding cover 2 at the peripheral edge. It becomes like. Then, the upper electrode 4a of the chip substrate is
Are connected to the inner contact portions 3ai of the upper lead pins 3a via conductive wiring patterns 2e formed on the spring portions 2d. On the other hand, the lower electrode 4b of the chip substrate is in direct contact with the inner contact portion 3bi of the lower lead pin 3b.

In the above case, the inner contact portion 3ai of the upper lead pin 3a is located directly below the protrusion 1a, and is configured to contact the conductive wiring pattern 2e at the engaging portion 2c. The position of the inner contact portion 3ai is not limited to this as long as it can make contact with the wiring pattern 2e.

FIG. 3 shows a second embodiment of an IC socket for a chip board according to the present invention, in which a chip board 4 to be mounted is mounted.
Is the case where the electrode 4b exists only on one side (the lower face in this embodiment). The IC socket of the first embodiment can also be used for the single-sided electrode type chip substrate. However, the IC socket for single-sided electrode type chip substrate shown in FIG. 3 has a simpler structure because the upper lead pin 3a and the conductive wiring pattern 2e of the holding cover 2 in the IC socket of the first embodiment are omitted.

[0018]

The chip socket IC socket of the present invention configured as described above has the following effects. (1) Since the lead pin is formed of a conductive metal having a high rigidity and the spring portion of the pressing cover is provided on the outer periphery of the wide pressing cover, the spring portion is unlikely to cause plastic strain and belongs to the same type. More durable than conventional IC sockets. (2) Since the holding cover is configured to press the electrode located on the peripheral edge of the chip substrate from directly above,
It is easy to set the contact pressure between the lead pins and the electrodes of the chip substrate. In addition, the contact stability is good, the chip substrate does not bend, and furthermore, the IC element is pressed just above the electrode irrespective of the position of the IC element on the chip substrate. (3) The structure is simple, consisting of only two parts, the socket body and the holding cover. Even when electrodes are provided on both sides of the chip substrate, these electrodes can be externally connected at the same time.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of an IC socket for a chip substrate according to the present invention.
FIG. 4 is a cross-sectional view showing a state where the chip substrate is mounted in the example.

FIG. 2 is a perspective view of a holding cover of the IC socket for a chip substrate shown in FIG. 1;

FIG. 3 shows a second embodiment of the chip board IC socket of the present invention.
FIG. 4 is a cross-sectional view showing a state where the chip substrate is mounted in the example.

FIG. 4 is an exploded perspective view of a conventional chip substrate IC socket.

FIG. 5 is a cross-sectional view showing a state in which a chip substrate is mounted on a chip substrate IC socket according to a conventional technique.

FIG. 6 is an exploded perspective view of a conventional IC package IC socket.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket main body 1a Projection 2 Press cover 2b Curved lower part 2c Engagement part 2d Spring part 2e Conductive wiring pattern 3a Upper lead pin 3ai Inner contact part of upper lead pin 3b Lower lead pin 3bi Inner contact part of lower lead pin 4 Chip board

Claims (1)

(57) [Scope of request for utility model registration] 1. A socket body having a projection on an inner side surface, lead pins arranged in the socket body so as to be located inside the socket body so that the heights of inner contact portions thereof are different from each other, and substantially S around the periphery. A curved lower part with a U-shaped cross section is formed,
A conductive wiring pattern formed on the outer surface of the curved lower portion so as to be electrically connectable to an internal contact portion at a high position of the lead pin and to be electrically connectable to an electrode of a chip substrate housed in the socket body. An IC socket for a chip substrate, comprising: a holding cover provided with an engaging portion for engaging with the projection on an upper portion of the curved lower portion.