JPS6120782Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a semiconductor device in which a semiconductor integrated circuit element (hereinafter referred to as IC) and a switch mechanism are integrated.

Recently, devices such as electronic volume regulators that have a function that combines a voltage generation IC and a switch have been widely used. When such a function is provided, the IC and switch are generally integrated into a printed circuit board separately, which has the disadvantage of increasing the number of parts and the number of man-hours needed to incorporate them into the printed circuit board. Furthermore, there is a problem in assembling a large number of parts in a limited space.

Furthermore, as the number of parts increases, the yield of the product decreases, or the probability of a disconnection accident increases, so this is not necessarily the best method.

The present invention has been made from the above-mentioned viewpoints, and the main purpose of the present invention is to provide a semiconductor device in which an IC and a switch are integrally formed.

The present invention will be explained below based on the drawings.
Note that the same parts in each figure are given the same reference numerals.

FIGS. 1 and 2 show an embodiment of a semiconductor device equipped with a switch according to the present invention. In FIGS. 1 and 2, 1 is a package in which an IC element is sealed with resin, 2 is a terminal pin, 3 is a movable shaft of the switch, and 4 is a frame. In the embodiment shown in FIG. 1, switches are formed on both sides of the package, and in FIG. 2, switches can be formed on both sides of the package in the same manner as in FIG. In Fig. 1, the pressing direction of the movable shaft 3 is perpendicular to the arrangement direction of the terminal pins, whereas in the embodiment shown in Fig. 2, the pressing direction of the movable shaft 3 is perpendicular to the arrangement direction of the terminal pins. are done in parallel.

3 and 4 are partially cutaway exploded perspective views of the embodiments shown in FIGS. 1 and 2. FIG. In Figure 3, the terminal pins 2 arranged on the side of the package 1
The inner end of the outermost terminal pin protrudes outward from the other side of the package 1 and connects to the contact 2a.
is forming. This terminal pin has an inner end branched to form a T-shape, one forming a contact 2a, and another inner end 2b extending to the opposite side reaching the vicinity of the IC element via wiring 6. 5 is connected.
Further, a part of the package supports the contact 2a and forms a convex portion 1a. In FIG. 4, the tip of the contact 2a is bent downward at a right angle so that it can easily come into contact with the contact on the movable shaft 3 of the switch. If the switch of the semiconductor device shown in FIG. 1 is shown in FIG. 5, a movable shaft 3 is housed in a frame 4, and a contact 8 is provided at the bottom of the movable shaft 3. Contact point 8 is
Although various shapes are possible, it may be formed in the shape of a leaf spring or made of conductive rubber. 7 is a spring. A locking portion 9 protrudes from the frame 4 and locks the movable shaft 3. An opening 4a is formed in the lower part of the frame 4, and a contact 2a and a convex portion 1a formed on the side surface of the package 1 fit into the opening 4a, so that the frame 4 is attached to the package 1. It is fixed.

FIG. 6 is a sectional view of an embodiment in which the pressing direction A of the movable shaft 3 is parallel to the arrangement direction of the terminal pins. In FIG. 6, the bottom of the frame 4 is provided with an opening 4a into which the contact 2a and the convex portion 1a fit, the contact 2a is inserted into the bottom opening 4a of the frame 4, and the frame 4 is connected to the package 1. is fixed to. By pressing the movable shaft in the direction of arrow A, the contact 8 and the contact 2a are brought into contact. Although not shown,
Protrusions are provided on the frame body 4 to hold the package cage 1,
It is easy to securely secure the package 1 so as to sandwich it therebetween to increase the mechanical strength.

Furthermore, the movable shaft 3 and frame 4 of the switch portion are not limited to those shown in the drawings, and various forms are possible. In addition, the spring 7 can be of various O-ring or spring-like shapes, and it goes without saying that the contact 8 can also be made of a leaf spring-like contact or conductive rubber. It is also possible to use both a spring and a contact point. Further, the contact point 2a can also be made in various shapes.

A semiconductor device equipped with a switch according to the present invention is
By integrating the semiconductor integrated circuit element and the switch, it is possible to improve the convenience of use, reduce the number of parts, and reduce the occupied space. Furthermore, since the number of parts can be reduced, the number of man-hours for assembling it into a printed circuit board can be reduced, so it is economically advantageous.

In addition, by providing the portion that becomes the contact point of the switch exposed to the outside of the package, the package housing the IC element and the switch forming portion can be easily integrated.

Needless to say, the present invention provides various effects such as being able to easily fit a switch equipped with a plurality of movable shafts into the contacts of the terminal pin portion protruding from the package.

[Brief explanation of the drawing]

1 and 2 are perspective views showing one embodiment of a semiconductor device equipped with a switch according to the present invention,
3 and 4 are partially cutaway exploded perspective views of the semiconductor device shown in FIGS. 1 and 2, with the movable shaft of the switch removed. 5 and 6 are partially cutaway sectional views of the switch. 1... Package cage, 2... Terminal pin, 3... Movable shaft, 4... Frame, 5... IC element, 6... Wiring, 7... Spring, 8... Contact, 1a... Convex part, 2a...Contact point.

Claims (1)

[Claims for Utility Model Registration] (1) A part of a lead frame used in a package containing a semiconductor integrated circuit element is used as a contact point of a switch, and a movable contact of the switch is arranged at the contact point, and the semiconductor integrated circuit A semiconductor device equipped with a switch characterized by integrating an element and a switch. (2) A semiconductor device comprising a switch according to claim 1, in which the contact point protrudes from the side surface of the package.