JP2867704B2 - Visual inspection support apparatus and board inspection apparatus, and soldering inspection method and correction method using the same - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a visual inspection support device and a substrate inspection device used by an inspector to visually inspect the quality of soldering of an electronic component mounted on a printed wiring board, and also relates to these devices. The present invention relates to a method for inspecting soldering and a method for correcting a defective soldering using the above-mentioned apparatus.

BACKGROUND ART In devices of this type, which are called by various names, such as a visual inspection support device, a board inspection device, an automatic board inspection device, and a visual inspection device, generally, the three primary colors of red (R), green (G), and blue (B) are used. A light source is used. These light sources are arranged to project illumination light at different angles to the inspection location. When the inspection location is imaged by the imaging device and the obtained image is displayed, the slopes or planes having different angles are displayed in different colors. Therefore, color information can also be used to determine the quality of soldering.

Various proposals have been made in the direction of automating the determination of the quality of soldering. For example, there is a proposal for an illumination method (Japanese Patent Application Laid-Open No. 4-355311) and a proposal for image processing or determination processing (Japanese Patent Application Laid-Open No. 4-343046).

However, there are not many ideas and proposals from the viewpoint of assisting visual inspection by inspectors. It is also extremely important to improve the work efficiency of the inspector and to guarantee a more objective judgment independent of the individual differences of the inspector. In particular, visual inspection has the advantage that when a defective solder spot is found, it can be corrected immediately on the spot, and it is desired to realize an appropriate device that supports such a visual inspection.

DISCLOSURE OF THE INVENTION The present invention is intended for a visual inspection that makes it easier for inspectors to perform work and can improve work efficiency.
And a support device for correcting a defective portion.

Another object of the present invention is to provide a visual inspection support device that can ensure the objectivity of judgment by an inspector.

Another object of the present invention is to provide a board inspection apparatus that can be developed not only for visual inspection support but also for automatic inspection.

The present invention provides a method for determining the quality of soldering of a board and a method for correcting a soldered portion determined to be defective using such a visual inspection support apparatus and a board inspection apparatus.

A visual inspection support apparatus according to the present invention includes an illumination device that illuminates a substrate to be inspected, an imaging device that captures an image of an area on the substrate illuminated by the illumination device, and outputs an image signal representing the captured image, A stage movable in two directions that are relatively perpendicular to the apparatus and the imaging device; a substrate support supported by the stage and supporting a substrate to be inspected; and a substrate supported by the substrate support includes the illumination device. And a mechanism for moving the stage to a position outside the range where the imaging device exists.

In general, a display device for displaying an image represented by an image signal output from the imaging device is provided.

This visual inspection support device is suitable not only for inspection but also for correcting a defective portion. Since the substrate supported on the stage is pulled out from a place where the lighting device and the image pickup device are located, it is possible to correct a defective portion at the pulled-out position.

Preferably, a mechanism is provided for supporting the substrate support upright on the stage, and for holding the substrate support in an upright posture.

Since the defective portion can be corrected for the substrate raised obliquely, the inspector can easily perform the correction work.

The image taken before the stage is pulled out is frozen and displayed as a still image on the display device. The inspector can look for a defective portion on the board by looking at this image.

A visual inspection support apparatus according to the present invention includes an illumination device that illuminates a substrate to be inspected, an imaging device that captures an image of an area on the substrate illuminated by the illumination device, and outputs an image signal representing the captured image, A stage movable in two directions relatively orthogonal to the apparatus and the imaging device; a movable body supported on the stage so as to be movable in one of the two directions; A substrate support is provided that supports the substrate to be inspected.

Even if this apparatus is used, the substrate can be pulled out together with the moving body, so that the work of correcting the defective portion can be easily performed.

A visual inspection support apparatus according to the present invention includes an illumination device that illuminates a substrate to be inspected, an imaging device that captures an image of an area on the substrate illuminated by the illumination device, and outputs an image signal representing the captured image, A stage movable in two directions relatively orthogonal to the apparatus and the imaging apparatus, a rotating body rotatably supported by the stage, and a substrate supporting body supported by the rotating body and supporting a substrate to be inspected. Have.

With this device, the substrate can be rotated.
Therefore, it is suitable for soldering inspection and correction of components having leads on all sides.

The visual inspection support apparatus and the board inspection apparatus further include storage means for storing pre-taught position data representing points to be inspected on the board to be inspected,
And display control means for controlling so as to perform point display indicating a point to be inspected on an image displayed on the display device in accordance with the position data stored in the storage means.

As a result, the location to be inspected is specified, and the work efficiency of the inspection is improved.

The inspection result is immediately input from the input device. As a result of the inspection, a portion determined to be defective is displayed on the screen.

More preferably, layout display is performed to clearly indicate the position of the image area displayed on the display device on the substrate. From this, the inspector can know the area currently being inspected and can grasp the progress of the inspection.

In order to eliminate individual differences among inspectors and ensure objectivity,
A scale indicating the length is displayed on the image displayed on the display device.

In addition, two lines are movably displayed on the display screen, and the interval between these two lines is calculated and displayed.

Further, a window is displayed on the display screen of the display device, and data relating to the size of a specific image in the window is displayed. More preferably, data relating to a reference size is displayed in addition to the data relating to the size of the specific image.

Other features of the present invention will become more fully apparent in the embodiments described below.

BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 to 4 show an example (1) of a mechanical configuration of a visual inspection support device.

 FIG. 1 is a perspective view of the entire apparatus.

 FIG. 2 is an enlarged perspective view showing a Y-axis table.

FIG. 3 is an enlarged sectional view showing a portion for fixing the movable plate.

FIG. 4 is a perspective view showing a state where the substrate support is raised.

5a to 5d and FIGS. 6a to 6d are cross-sectional views showing the structure and operation of a stay for holding the substrate support in an upright state.

FIG. 7 is a sectional view showing the configuration of the light projecting device and the image pickup device (part 1).

FIG. 8 is a cross-sectional view showing a configuration of the light emitting device and the imaging device (part 2).

FIG. 9 shows a configuration of a light source device to which the light projecting device shown in FIG. 8 is connected.

FIG. 10 is a block diagram showing an electrical configuration (part 1) of the visual inspection support device.

 FIG. 11 is a flowchart showing a teaching processing procedure.

 FIG. 12 shows an example of the teaching table.

FIG. 13 is a plan view showing an example of a printed wiring board.

FIG. 14 shows an example of a display image displayed in the teaching process.

 15a and 15b show examples of layout display.

FIG. 16, FIG. 17, FIG. 18, and FIG. 19 are flow charts showing the processing procedure of the inspection processing and the correction processing.

 FIG. 20 shows an example of the inspection result table.

21a and 21b show how marks indicating designated points are sequentially driven.

22a and 22b show how the layout display changes.

FIG. 23 shows an example of an image in which marks indicating all designated points in one inspection area are displayed at a glance.

 FIG. 24 shows another example of specifying the designated point.

 FIG. 25 shows another example of the layout display.

 FIG. 26 shows an example of displaying a standard image.

 FIG. 27 shows an example of displaying a scale on an image.

 FIG. 28 shows an example of displaying two lines on an image.

FIG. 29 shows a display example showing the measured fillet length together with the inspection standard.

FIG. 30a is a cross-sectional view of the lead, solder and land, and FIG. 30b shows the corresponding image.

FIG. 31 shows a display example when the fillet length is automatically measured.

FIG. 32 shows a display example when the fillet area is automatically measured.

33a and 34a are cross-sectional views of the solder and its vicinity, and FIGS. 33b and 34b show corresponding display image examples.

FIG. 35 is a block diagram showing an electrical configuration (part 2) of the visual inspection support device.

36 to 40 show an example (part 2) of a mechanical configuration of the visual inspection support device.

 FIG. 36 is an enlarged perspective view of the Y-axis table.

FIG. 37 is an enlarged sectional view taken along line VII-VII of FIG.

FIG. 38 is an enlarged sectional view taken along line VIII-VIII of FIG.

 FIG. 39 is an enlarged sectional view taken along line IX-IX of FIG.

FIG. 40 is a perspective view showing a state where the substrate support is raised.

FIG. 41 is an example of a mechanical configuration of the visual inspection support device (part 3)
FIG.

FIGS. 42a and 42b show a configuration in which the Y table base is inclined.

FIGS. 43a and 43b show a configuration in which the light projecting device and the image pickup device are tilted.

 FIG. 44 is an enlarged perspective view of the X stage.

FIG. 45 is a block diagram showing a system in which a soldering correction device is combined with an automatic board inspection device.

BEST MODE FOR CARRYING OUT THE INVENTION (1) Mechanical Configuration of Visual Inspection Support Device (Part 1) Example of Mechanical Configuration of Visual Inspection Support Device that Aids Visual Inspection of Soldering of Component Mounting Board Are shown in FIGS. 1 to 4.

Generally, a component mounting board is a mounting process of positioning and mounting an electronic component (hereinafter simply referred to as a component) on a printed wiring board (hereinafter simply referred to as a board), a flow soldering method, a reflow soldering method, and other soldering. It is manufactured through a soldering process by a soldering process, a soldering inspection process for judging the quality of soldering, and a solder repairing process for correcting a soldered portion determined to be defective. Of course, a solder repair process is not required for a board having no defective soldering. If the soldering is difficult or impossible, the soldering process may be restarted.

This visual inspection support device is used in one or both of the soldering inspection process and the solder correction process.
In other words, this visual inspection support device assists the inspector (operator) in visually inspecting the quality of the soldered portion on the board, and corrects the soldering defective portion by the operator (inspector). Used to assist work.
As will be clear from the description below, it is also possible to correct the defective part after the visual inspection of one or more substrates is completed, and when a defective part is found in the visual inspection of one substrate Each time, the defective part can be corrected.

With particular reference to FIGS. 1 and 2, a fixed table 11 is placed on the rear half of
Is fixed to the base 10. The upper surface of the table 11 is higher than the base 10, and the CRT display 13
Is placed.

An X-axis table 20 is provided along the front edge of the table 11. In addition, the base is orthogonal to the X-axis table 20.
A Y-axis table 30 is provided on 10. X axis table
Numeral 20 moves and positions the light projecting device 70 and the imaging device 80 in the X-axis direction. Y-axis table 30 is printed circuit board PC
Move and position B in the Y-axis direction.

The X-axis table 20 is attached to the lower surface of the front edge of the table 11, and includes an X-axis rail 23 and a support rail 24 extending in the lateral direction (X-axis direction). The X stage 21 is provided with a sliding portion 22, which is slidably fitted on an X-axis rail 23. The portion including the sliding portion 22 of the X stage 21 is slidably supported by a support rail 24.

An endless timing belt 25 is disposed along the X-axis rail 23, and the timing belt 25 is hung on pulleys (gears) 27 and 28 having teeth on the peripheral surface. The pulley 27 is rotatably attached to the lower surface of one end of the table 11, and the pulley 28 is fixed to the rotation shaft of an X-axis motor (DC motor) 29. The motor 29 is fixed to the lower surface of the table 11. A part of the timing belt 25 is fixed to the X stage 21.

By driving the motor 29, the X stage 21 moves right and left along the X-axis rail 23 via the timing belt 25, and is positioned at an arbitrary position. X stage 21
Is mounted with a light emitting device 70 and an imaging device 80.

Y-axis table 30 is a Y-axis rail fixed on base 10
Including 33. The Y-axis rail 33 is orthogonal to the X-axis rail 23.

The Y stage 41 includes a support plate 43, a sliding member 42 fixed to the lower surface of the support plate 43, side members 44 integrally formed on both sides of the support plate 43, and extending in the front-rear direction (Y-axis direction). A rear member 45 is fixed between the rear ends of the side members 44. The sliding member 42 is slidably fitted to the Y-axis rail 33.

An endless timing belt 35 is provided along the Y-axis rail 33. At the front and rear ends of the base 10,
Pulleys (gears) 37 and 38 having teeth formed on the peripheral surface are provided rotatably, and a timing belt 35 is hung on these pulleys 37 and 38. Timing belt 35
Part of the bracket is fixed to the lower surface of the support plate 43
Fixed to 43a.

A pulley 31 is provided coaxially with the rear pulley 38.
On the other hand, a pulley 36 is fixed to a rotation shaft of a Y-axis motor (DC motor) 39. A timing belt 32 is hung on these pulleys 31 and 36. The rotation shafts of the pulleys 31 and 38 are rotatably received by appropriate bearings (not shown).
This bearing and motor 39 are mounted on a base by mounting members (not shown)
Fixed on 10

A frame 34 is provided around the Y-axis rail 33 and the timing belt 35, and the frame 34 is fixed to the base 10. A stopper 34a is provided at the front end of the frame 34.
Stoppers 34b are fixed to the rear ends, respectively. These stoppers 34a and 34b regulate the moving range of the Y stage 41. The frame 34 has a cover (not shown) on the Y stage
It can be mounted to the extent that it cannot prevent 41 movements.

By driving the Y-axis motor 39, the timing
The Y stage 41 moves back and forth along the rail 33 via the belts 32 and 35, and is positioned at an arbitrary position.

A substrate support 50 is mounted on the Y stage 41 so as to be able to move up and down. The substrate support 50 includes a front plate 51, a movable plate 52, a rear plate 53, and a rod. Previous play51
Each of the movable plates 52 has legs extending downward from both ends, and support arms 51A and 52A extending horizontally in the horizontal direction (left and right directions) are integrally formed at the upper portion. The rear plate 53 has legs extending downward from both ends. Both legs of the front plate 51 and the rear plate 53 are connected by a rod 54. Both ends of the rod 54 are fixed to both legs of the front plate 51 and the rear plate 53.

A cylindrical body 55 is vertically fixed to both legs of the movable plate 52, respectively. Holes are also formed in both legs corresponding to the through holes of these cylinders 55. The rod 54 slidably passes through the through hole of the cylindrical body 55 and the holes of both legs.

As shown in FIG. 3, a split piece 61 is attached to one leg of the movable play 52 on a surface opposite to the surface on which the cylinder 55 is attached. Split piece 61 is also a rod
54 has a hole that slidably passes, and a slit 61a is formed below this hole. A female screw hole is formed in a direction orthogonal to the slit 61a, and a male screw 62a integrally fixed to the lever 62 is screwed into the female screw hole. By screwing the male screw 62a into the female screw hole using the lever 62, the hole of the split piece 61 is reduced, and the rod 54 is tightened. Thereby, the movable plate 52 is fixed.

The supporting arms 51A and 52A formed on the front plate 51 and the movable plate 52 are formed with stepped portions 51a and 52a on the inner upper portion thereof along the longitudinal direction of the supporting arm. A receiving piece 58 is attached to one end of the support arm 51A of the front plate 51, and a bracket 59 is attached to the other end, and a shaft 57 is attached to the receiving piece 58 and the bracket 59.
Are fixed at both ends. Shaft 57 supports arm 51A
And are parallel with a slight gap. A holding piece 56 is slidably and rotatably attached to the shaft 57.

The printed circuit board PCB has a receiving portion 51a of the supporting arm 51A and a receiving portion of the supporting arm 52A.
Received between 52a. The printed circuit board PCB
The position of the movable plate 52 is adjusted so as to just fit between the moving plate 52a and the moving plate 52a, and is fixed using the lever 62. PCB PC
B is shifted to the left and positioned at a position where it contacts the receiving piece 58. The holding piece 56 is moved to a position where it comes into contact with the right end of the substrate PCB. A permanent magnet is embedded in the front end of the holding piece 56, and the front plate 51 is formed of a magnetic material (for example, iron). The holding piece 56 is moved along the shaft 57 while being raised as shown by a chain line in FIG.
If it is prone when it hits the right end, the permanent magnet is attracted to the front play 51, and the holding piece 56 is fixed. PCB PCB
Is received and sandwiched by the receiving steps 51a and 52a, and is fixed in a state of being sandwiched between the receiving piece 58 and the pressing piece 56. If the front plate 51 is not made of a magnetic material, the magnetic material plate may be fixed along the support arm 51A.

The front plate 51 of the substrate support 50 has Y
The side member 44 of the stage 41 is rotatably (up and down) attached to a front end of a side member 44 by a shaft 48. In the state where the substrate support 50 is lying down (the state shown in FIG. 2), the substrate support 50
The block 53A fixed to the rear side of the rear plate 53 contacts and is received by the rear member 45 of the Y stage 41. A handle 60 extending upward is attached to the block 53A, and a permanent magnet 46 is embedded in the lower surface. On the other hand, Y
A magnetic sensor (for example, a Hall element) 47 is embedded in a portion of the rear member 45 of the stage 41 corresponding to the permanent magnet 46. If the substrate support 50 is in the state shown in FIG. 2, the magnetic sensor 47 detects the permanent magnet 46 and outputs a detection signal. This makes it possible to recognize that the substrate support 50 is in the prone position (horizontal position). It goes without saying that other sensors (limit switches, etc.) can be used instead of the magnetic sensors.

A bracket 63 is provided in front of the side member 44 of the Y stage 41,
Brackets 64 are provided on both legs of the rear plate 53 of the substrate support 50.
Are respectively attached. The stay 65 includes a guide 67, a shaft 66 that can be inserted into and removed from the guide 67, and a latch mechanism that fixes the shaft 66 at a predetermined position of the guide 67. The base end of the guide 67 of this stay 65 is a bracket 63
In addition, the tip of the shaft 66 is pivotally attached to the bracket 64, respectively.

The rear end of the substrate support 50 can be pulled up by holding the handle 60 by hand. The substrate support 50 rises rotating about an axis 48. After the substrate support 50 has been pulled up to an appropriate height, when the rear end is slightly lowered, the latch mechanism of the stay 65 operates and the stay 65 is pulled, so that the substrate support 50 is
As shown in FIG. 4, it is kept in a state of rising obliquely.

Thereafter, when the rear end portion of the substrate support 50 is slightly pulled up using the handle 60, the latch mechanism of the stay 65 is released, and the substrate support 50 returns to the horizontal posture shown in FIG. When the substrate support 50 is standing upright, the magnetic sensor 47 is a permanent magnet 46.
Cannot be detected.

In FIG. 1, an inspection keyboard 14 and an emergency stop switch 15 are further placed on the base 10. These keyboard 14 and switch 15 are connected to a control device as described later. Inspection keyboard 14, emergency stop switch 1
5 is used when performing a board inspection. When performing a teaching operation to be described later, a mouse or a teaching keyboard is placed on the base 10.

Although the structure of the stay 65 acting as described above is already known, its structure and operation will be briefly described with reference to FIGS. 5a to 5d and FIGS. 6a to 6d. deep.

In FIG. 5a, the guide 67 is a hollow prism (having a rectangular cross section), and the shaft 66 is inserted into the guide 67 from its open end (the end opposite to the base end attached to the bracket 63). I have. An opening 67a is formed in the side surface of the guide 67 near the opening end. A stopper 68 having four claws is rotatably provided at the base end of the shaft 66 (the end opposite to the tip attached to the bracket 64). The guide 67 is provided with a claw 69 outside the stopper 68, and protrudes into the guide 67. The stopper 68 and the claw 69 constitute a latch mechanism.

In the process in which the substrate support 50 is raised obliquely from the prone position, the stay 65 operates as shown in FIGS. 5a to 5d. When the guide 67 moves to the right (when the shaft 66 moves to the left), the stopper 68 contacts the pawl 69 and rotates counterclockwise, and one of the pawls goes out of the opening 67a (the guide 67 is You cannot move to the right of the position) (Fig. 5b).
When the guide 67 returns to the left, the claw projecting outward from the opening 67a comes into contact with the edge of the opening 67a, and the stopper 68 turns counterclockwise (FIG. 5c). Then, one claw of the stopper 68 contacts the edge of the opening 67a, and an adjacent claw contacts the inner surface of the guide 67, so that the guide 67 cannot move to the left (the shaft 66 cannot move to the right) ( (Figure 5d). In this way, the substrate support 50 is maintained in a posture that is raised obliquely.

As described above, when the substrate support 50 is slightly pulled up by the handle 60, the latch mechanism is released, and the substrate support 50 returns to the horizontal posture. This process is shown in FIGS. 6a to 6d.

When the guide 67 is moved rightward from the state shown in FIG. 5d, the stopper 68 hits the claw 69 and rotates counterclockwise (FIGS. 6a to 6b) (the guide 67 cannot move further rightward from this position). ). Next, when the guide 67 moves to the left, the claw of the stopper 68 protruding outside from the opening 67a hits the edge of the opening 67a, and the stopper 68 rotates counterclockwise and enters the guide 67 (FIG. 6c). ). In this state, the guide 67 can move to the left (the shaft 66 can move to the right) (FIG. 6d).

(2) Light Projection Device and Imaging Device (Part 1 and 2) A configuration example of the light projection device 70 will be described with reference to FIG. An annular fluorescent lamp 71 is arranged in an upper part in a cylindrical case 79. The periphery of the fluorescent lamp 71 is covered by a cover 79a. An annular light guide (for example, made of acrylic) 72 is provided below the fluorescent lamp 71. The inner peripheral surface of the light guide 72 is formed in three steps, with the uppermost section being thickest and becoming thinner downward. This peripheral surface is also annular.

Red (R) at the position of the lower surface of the uppermost step of the light guide 72
, A green (G) color filter 74 is provided on the lower surface of the middle step, and a blue (B) color filter 75 is provided on the lower surface of the light guide 72. Diffusion plates 76 having slopes are arranged inside these color filters 73 to 75, and a black annular wall is disposed between the upper and lower diffusion plates 76.
77 are provided. The color filters 73 to 75 are also annular,
The diffusion plate 76 is also annular. R filter 73, diffusion plate 76, annular wall
77, G filter 74, diffusion plate 76, annular wall 77, B filter 75, diffusion plate 76
The inner peripheral surface of the light projecting device 70 is assembled by screwing it into 79.

The light emitted from the fluorescent lamp 71 reaches the R, G, and B color filters 73 to 75 through the light guide 72, and is converted into R, G, and B light by these color filters, respectively. It will be spread downward. These color filters 73 ~
The projection angles of the R, G, and B light projected downward through 75 are different from each other. With the horizontal surface of the object located just below the center of the light emitting device 70 (coincident with the center of the imaging device 80)
The angles formed by the projection directions of the R, G, and B light are θ3, θ2, θ, respectively.
Assuming that 1, the relationship is θ3>θ2> θ1. An image due to the light reflected from the object is captured by the imaging device 80 directly above the object. Therefore, when the surface of the object is nearly horizontal, the red reflected light is the strongest among the light incident on the imaging device, and the more the surface of the object is inclined from the horizontal plane, the greener the reflected light.
Blue reflected light becomes stronger. In this way, the magnitude of the inclination of the object surface is expressed in different colors on the captured image.

Preferably, the emission spectrum of the fluorescent lamp and the color filters 73 to 75 are used so that white light is obtained when the R, G, and B lights are mixed.
Is determined.

The image pickup device 80 is fixed above the center of the light projecting device 70, and includes a zoom lens system (lens tube) 81 and a camera head.
82. The camera head 82 includes a CCD (solid-state electronic image sensor). The zoom lens system 81 forms an image of the reflected light from the object directly below the image on the CCD of the camera head 82. The zoom magnification can be changed manually.

FIG. 8 shows another configuration example of the light projecting device. FIG. 9 shows the configuration of the light source device. The imaging device is the same as described above.

The light emitting device 90 is not provided with a color filter and a fluorescent lamp. Three optical fiber cables 93 to 95 are guided from the light source device 91 to the light projecting device 90. Each of these optical fiber cables 93 to 95 is formed by bundling a number of thin optical fibers and coating the periphery thereof. The optical fiber cable 93 guides red light, and the multiple optical fibers 93A are arranged such that their tips (light is emitted from the tips) are positioned on the uppermost diffusion plate 76. Are arranged at regular intervals in an annular shape. Similarly, the optical fiber cables 94 and 95 guide green and blue light, respectively, and the optical fibers 94A and 95A
Are annularly arranged at regular intervals so that their tips are located on the middle and lower diffusion plates 76, respectively. Even with such a light projecting device 90, an object directly below the light projecting device 90 can be illuminated with different colors at different angles.

In FIG. 9, three halogen lamps (light sources) 92 are arranged in a light source device 91, and these light sources 92 are shielded from each other by a partition wall 98. In front of the light source 92, a heat insulating glass 96 and color filters (R, G, B) 73, 74, 75 are arranged, respectively. An optical fiber cable connector 97 is further provided in front of these color filters 73 to 75. Optical fiber cables 93 to 95 are inserted into these connectors 97,
And if it is fixed with the screw 97a, the optical fiber cable 9
R, G, and B lights are introduced into 3,94,95, respectively.

The features of this light source device 91 are optical fiber cables 93 to 95
Can be connected to an arbitrary connector 97. Therefore, the light projecting angles of the R, G, and B lights in the light projecting device 90 can be switched. For example, the optical fiber cable 93 is connected to the connector 97 in front of the blue color filter 75.
, The blue light can be projected at the largest angle θ3 from the uppermost position in the light projecting device 90.
One or two optical fiber cables may be omitted, and a two-color or one-color light projecting device may be used.

In addition, by electrically controlling the emission intensities of the three light sources 92, the light emitted from the light emitting device 90 becomes white when mixed with the R, G, and B lights. It is possible to adjust the intensity of R, G, B light.

(3) Electrical Configuration of Visual Inspection Support Device (Part 1) FIG. 10 shows an electrical configuration example of the visual inspection support device. The visual inspection support device is controlled by a computer system. A computer main body including a CPU which may be called the heart of the computer system is shown as a control device 100. It is assumed that the control device 100 includes an interface circuit for connecting an input / output device as necessary.

The visual inspection support device roughly has a teaching mode and an inspection mode. In any mode, the drive of the X-axis table 20 and the Y-axis table 30 and the printed circuit board
Photographing of the PCB and display of the captured image are performed.

As described above, the camera head 82 of the image pickup device 80 processes color CCDs as image pickup devices and processes video signals output from the CCDs (white balance adjustment, gamma correction,
Circuit for generating R, G, B signals). The video signal output from the camera head 82 is converted into digital image data (generally R, G, B image data) by an A / D conversion circuit (including three for R, G, B) 101, -Temporarily stored in the memory 102; The image data read from the frame memory 102 is converted into an analog video signal by the D / A conversion circuit 103, and the display control circuit 104
Is given to the CRT display device 13. Preferably, the frame memory 102 can perform writing and reading at the same time, and the image captured by the camera head 82 is always displayed on the display device 13.

The display control circuit 104 creates, under the control of the control device 100, image data representing a cursor, a mark to be described later, a layout display of the entire substrate, a scale, and the like, and superimposes these on the screen of the display device 13. .

The X-axis motor 29 and the Y-axis motor 39
Is controlled by the XY table controller 105 on the basis of this command.

Current position of X-axis table 20, more precisely X stage
The X coordinate of the center position of the field of view of the imaging device 80 attached to 21 is detected by the X position detection device 106. Similarly, the current position of the Y-axis table 30, that is, the Y coordinate of the center position of the field of view of the imaging device 80 is detected by the Y position detection device 107. These position detecting devices 106 and 107 are, for example, rotary transducers, and are attached to the rotary shafts of the X and Y axis tables 20 and 30, for example, the rotary shaft of the motor 29, the rotary shaft of the pulley 31, and the like. The X position signal indicating the X coordinate output from the X position detection device 106, the Y position signal indicating the Y coordinate output from the Y position detection device 107, and the substrate support 50 output from the magnetic sensor 47 are in the horizontal posture. The detection signal indicating the fact is input to the control device 100 via the interface 108.
On / off of the power of the light emitting device 70 is also controlled by the control device 100.

In the teaching mode, a mouse 111 and a teaching keyboard 112 are used to input various data and commands. The mouse 111 is used to specify the position and size of a cursor, a mark, and the like displayed on the CRT display device 13. The teaching keyboard 112 includes a board name, board size, zoom magnification,
In addition to a key for inputting the input confirmation, a key for inputting a command for moving the X-axis table 20 and the Y-axis table 30 (hereinafter collectively referred to as an XY table) is included.

In the inspection mode, an inspection keyboard 14 and an emergency stop switch 15 are used to input various data and commands. A teaching keyboard 112 is also used as needed. Keys for moving marks on the display screen (previous point, next point), XY
Keys for moving the table to the previous or next inspection area (previous inspection area, next inspection area), keys for moving the XY table back and forth, left and right, keys for inputting codes indicating soldering failure, Y A pull-out command key for commanding to pull out the stage 41 forward (in the direction where the worker is present), a return key for inputting a buttocks for returning the Y stage 41 to its original position, and the like are provided. The emergency stop switch 15 is pressed when driving the XY table. That is, unless the switch 15 is turned on, the XY table does not move even if a movement command is input from the inspection keyboard 14. This is for work safety (operators cannot move the XY table without using both hands).

The memory 109 attached to the control device 100 has an area for storing image data representing an image indicating a standard (or exceeding the limit) soldering state of the component mounted on the reference board, and is created by a teaching process described later. Area for storing the teaching table to be performed, area for storing the inspection result table created in the inspection processing, area for storing the position to return to before the Y stage 41 is pulled out (return position), XY
An area for storing the current position (X, Y coordinates) of the table, a work area, and other areas are provided.

The teaching table created in the teaching process and the inspection result table created in the inspection process are stored on a floppy disk or printed out after these processes are completed. Storage of these data,
Floppy disk (FD) drive device for output
A printer 113 and a printer 114 are connected to the control device 100.

(4) Teaching process FIG. 11 shows the operation (teaching process) in the teaching mode in the visual inspection support device. This teaching process is mainly controlled by the control device 100. FIG. 12 shows an example of a teaching table created in the teaching process.

In the teaching mode, a reference board on which components are appropriately soldered is used. First, the reference substrate is the support arm of the substrate support 50.
It is set in the receiving portions 51a and 52a of 51A and 52A. The board name of the reference board (model name indicating the board type, number, etc.) and board size are input from the teaching keyboard 112 (step 20).
1). The substrate size is useful for performing an erasure display of the substrate.

When an initial positioning command is input from the teaching keyboard 112, the XY table is positioned at the initial position (step 202). The initial position is a position where a predetermined position of the substrate set on the substrate support 50, for example, the lower left corner is located at the center of the field of view of the imaging device 80.

Generally, the entire substrate does not fit within the field of view of the imaging device 80. Therefore, the entire substrate is divided into a plurality of visual fields. The divided one field of view becomes one inspection area.

FIG. 13 shows an example of a printed wiring board PCB.
A number of components are mounted and soldered on the board PCB. The range of one field of view is indicated by a dashed line. Code IA1
The range indicated by is the first inspection region, and the range indicated by IA2 is the second inspection region. When the image is enlarged by the zoom lens system 81, the inspection area becomes narrow like the eighth inspection area indicated by reference numeral IA8. Such an inspection area is designated by an inspector (operator). Serial numbers are automatically assigned to the inspection areas in order from No. 1 and these are identified.

When the XY table is positioned at the initial position, the inside of the field of view of the imaging device 80 becomes the first inspection area IA1. At this time, an example of an image displayed on the screen of the display device 13 is shown in FIG. At the lower right of the screen, the entire outline of the substrate PCB and the position of the first inspection area IA1 within the outline are displayed. This is the layout display LD.

Looking at such a display screen, the inspector specifies a portion (designated point) to be inspected by soldering (step 20).
3). Inspection points can be specified using various marks. For example, a part to be inspected can be designated by a circular mark as shown by a circle mark MC. Alternatively, as indicated by a frame mark MF, a section to be inspected can be designated by surrounding it with a frame. One circle mark MC or frame mark MF does not necessarily need to correspond to one part.
You can indicate multiple parts with one mark,
One part may be divided into a plurality of sections and designated by a plurality of marks.

Such a circle mark MC or frame mark MF is created by the display control circuit 104 in response to a command from the teaching keyboard 112 or the mouse 111, and is displayed in a specific color on the display screen. The size of the circle of the circle mark MC and the size of the frame of the frame mark MF can be changed by a command from the mouse 111.

The inspector sequentially designates points to be inspected using the marks MC or MF while looking at the image of the component displayed on the display screen. Designated points in designated order N
o. (Serial number) is added.

When the inspector finishes specifying all points on the display screen (one inspection area) and enters that, teaching and
The designated point is stored in the table (step 20)
Four).

Referring to FIG. 12, the teaching table stores the input board name and board size, and for each inspection area No., coordinates indicating the position of the inspection area;
Data relating to a point designated in the inspection area is stored. The coordinates of the inspection area are coordinates of a specific point of the inspection area, for example, a point at a lower left corner. The data relating to the designated point includes a designated number and a designated point position (coordinate data) corresponding thereto. The designated point position data includes a code indicating the type of the mark (MC or MF), the radius and center coordinates (XY coordinates) for a circle mark MC, and the vertical and horizontal lengths for the frame mark MF. And the coordinates of the center. If the coordinates of the inspection area are known and the zoom magnification is known, the coordinates of an arbitrary point on the screen in the XY table are uniquely determined.
The control device 100 calculates the center coordinates, the radius or the length of the side based on the position of the designated mark on the screen.

Note that, in the display image of FIG. 14, for only one component, the electrode (lead) L of the component, the land L on the board, and the solder regions R, G, and B displayed in color are shown. The same applies to the other display screens.

When designation of all points in one inspection area is completed, the inspector inputs a movement command of the XY table from the teaching keyboard 112 to position the next inspection area (steps 206 and 207). The next inspection area may partially overlap or be separated from the previous inspection area. The inspector may determine the next inspection area based on his / her own judgment.

On the layout display LD, a layout display image indicating the next inspection area appears. The layout display LD may consist of an inspection area and a designated mark as shown in FIG. 15a, or may indicate the last designated mark by an arrow as shown in FIG. 15b. The current inspection area may be indicated by an arrow. When the specification of the points has already been completed for a plurality of inspection areas, all the specified inspection areas and points are displayed on the layout display LD. This allows the inspector to know to what extent the designation of the inspection area and points has progressed. In particular, when the already specified inspection area and the currently specified inspection area are displayed in different forms (different colors, etc.), it is easier to understand. The inspector sequentially specifies the locations (inspection areas and points) to be inspected on the board without omission.

The processing of steps 203 and 204 is repeated for the next inspection area. The same process is repeated for the new inspection area while sequentially positioning the new inspection area (steps 206 and 207).

When the above operation and processing are completed for all the regions on the reference substrate set on the substrate support 50 (step 20).
5) In response to the inspector inputting that fact, the created teaching table is stored in the FD by the FD drive device 113 (step 208).

In the above description, the zoom magnification is fixed. If the zoom magnification is constant for one substrate, the zoom magnification is stored in the teaching table in correspondence with the substrate name. This zoom factor will be entered from the keyboard 112.

However, when a predetermined zoom magnification is set, it is not sufficient to input the zoom magnification by key. At this time, the zoom magnification is not stored in the teaching table.

The zoom magnification may be changed for each inspection area. In this case, the size of the inspection area changes according to the zoom magnification as described above. Prior to designating an inspection point (step 203), a zoom magnification is input. The teaching table stores a zoom magnification corresponding to the inspection area No. The zoom magnification may be input for each designated point.

Further, an image storage command may be input from the keyboard 112 when an inspection point is designated. In this case, an image near the part specified by the mark is cut out, and this image data is
It is stored in the image data area by linking to No.
The image data may be stored in a teaching table. The image data cut out in this manner is used as a teaching image to represent a standard image (or a limit image).
Stored in the FD along with the table. Inspector has keyboard
When a part name is input in association with the specified No. using 112, the specified No. may be replaced with the input part name in the teaching table.

(5) Inspection Processing As described above, the visual inspection support device is used by the inspector to inspect the quality of the solder on the board (the board to be inspected) in the inspection mode, and the soldering position determined to be defective is determined. It can also be used by the inspector to make corrections on site. In the following description, for the sake of convenience, the case where only inspection is performed on a plurality of substrates,
The explanation will be made separately for the case of correction.

FIG. 16 to FIG. 18 show a processing procedure when only inspection is performed. This process is also mainly performed by the controller
Controlled by 100. FIG. 20 shows an example of the inspection result table.

Inspection is sequentially performed on a plurality of substrates of the same type. The FD storing the teaching table for the type of board to be inspected is set in the FD drive device 113. Further, the board name (board type) of the board to be tested is input from the teaching keyboard 112 (or the testing keyboard 14) (step 211). A plurality of substrates to be inspected have the same substrate name. Numbers (No.) are assigned to the substrates in order to identify the plurality of substrates. As the substrate No., the one previously attached to each substrate can be used. In this case, when the board is set (step 213), the board number is input. The apparatus may automatically assign a board number from No. 1 in the order of inspection. In this case, it will be necessary to save the inspected boards so that the order of inspection can be determined (numbering or stacking).

In any case, when the board name is input, the teaching table specified by the board name is read from the FD, and the teaching table is stored in the memory 109 (step 212).

The inspector sets the substrate PCB to be inspected on the substrate support 50 (step 213). When the information of the board set is input, the control device 100 reads the teaching and
The XY table is moved to a position where the first inspection area (No. 1) is imaged with reference to the table (particularly the coordinates of the inspection area) (step 214). Therefore, the image of the inspection area No. 1 is displayed on the display screen of the display device 13. The inspector judges the quality of the soldering on the board while viewing the displayed image with his own eyes. A good soldering point is not input, and only a soldering point determined to be defective is input together with a code indicating the content of the defect.

The soldering point to be inspected is specified using the mark in the teaching process as described above, and the specified mark is also displayed over the display image of the board to be inspected. It is only necessary to follow the places to be inspected with your eyes. Since data relating to the designated mark is stored in the teaching table, the designated mark is displayed by the display control device 104 based on this data.

There are roughly three ways to display the designated mark. These are called a mark manual feed mode, an automatic feed mode, and an inspection area manual feed mode. The inspector selects one of these modes using the inspection keyboard 14 (or the teaching keyboard 112) (step 21).
Five).

When the mark manual feed mode is selected, the designated No. 1 circle mark MC is first displayed on the display screen image (the image of the inspection area No. 1) as shown in FIG. 21a ( Step 216). The inspector judges the quality of the soldering of the component provided with the mark MC (in the case of the frame mark MF, the section surrounded by the frame mark MF) by referring to the display image. If the soldering is good, the inspector presses the next point key on the inspection keyboard 14 (step 221). Then, the mark MC of the designated No. 2 is displayed on the display screen as shown in FIG. 21b (step 222). The inspector presses the next point key in order while holding the mark (circle mark MC or frame mark M
F) is sequentially moved to determine the quality of the soldering at the inspection location indicated by the mark. The display of the mark is performed based on data relating to a designated point in the teaching table.

To revisit the previously displayed mark again, the inspector presses the previous point key (step
219). Then, the previously displayed mark is displayed again (step 220) (for example, from the display of FIG.
aReturn to the display of the figure).

In the layout display LD on the display screen, the position of the currently displayed inspection area on the substrate is clearly indicated by an arrow. Alternatively, as shown in FIGS. 22a and 22b, the location on the substrate where the mark is displayed appears in the layout display. FIG. 22a corresponds to FIG. 21a, and FIG. 22b corresponds to FIG. 21b.

Upon finding a defective solder portion, the inspector presses a defect code key representing the found defect on the inspection keyboard 14 (step 227). The defective codes include, for example, "no solder", "excessive solder", "bridge", "missing parts (no parts)" and the like. When the defect code is entered,
The board number (substrate name if necessary) for identifying the board to be inspected, and the inspection area indicating the area being inspected
No., designation No. indicating the location where the defect was found, and designation N
The coordinates (designated point: code, radius or length and width, center coordinates) of o. and the defect code are registered in the inspection result table (step 228) (see FIG. 20).

At this time, the defective portion may be clearly displayed by changing the color or shape of the mark (MC, MF) designating the portion pointed out as defective. It is preferable that the arc representing this defective portion is not erased until the display of the next inspection area is started. The display of the defective portion may be performed on the layout display LD. Further, the content of the input defective code may be displayed in characters on the display screen to prompt the inspector to confirm. It is preferable that the faulty code once input can be canceled if necessary.

When the inspection of inspection area No. 1 is completed, the inspector presses the next inspection area key (step 225), so that the inspection area N is referred to by referring to the inspection area coordinate data in the teaching table.
The XY table is driven so that o.2 can be imaged (step 226). The inspector will repeat the above operation. In this way, the inspector can carry out the soldering inspection for all designated points in all inspection areas registered in the teaching table.

When the previous inspection area key on the inspection keyboard 14 is pressed (step 223), the XY table is driven so that the immediately preceding inspection area is imaged by the imaging device 80 (step 224).

When the automatic feed mode is designated, the mark MC or MF to be displayed moves on the screen in order of designated No. at regular time intervals (step 217). The inspector determines the quality of the soldering at the location indicated by the mark while sequentially following the displayed mark.

When a soldering defect is found, the inspector presses the defect code key in the same manner as described above, so that data relating to the soldering defect is registered in the inspection result table (steps 227 and 228).

When the inspection for one inspection area is completed, pressing the next inspection area key moves to the inspection of the next inspection area as described above (steps 225 and 226).

The time interval at which the displayed mark moves may be predetermined or the inspector may use the keyboard 14 or
It can also be input using 112.

It is preferable that a stop key be provided on the inspection keyboard 14 so that when the stop key is pressed, the mark display is fixed so as not to move. By doing so, the inspector can carefully inspect a specific location.

If the inspection area manual feed mode is selected,
As shown in the figure, all the marks MC and MF belonging to the area to be inspected are displayed at once (step 21).
8). The inspector visually inspects all inspection points while visually following these marks.

When a defect is found, the inspector points a mark indicating the defect with a cursor (displayed on the display screen), specifies the defect, and key-inputs the defect code. Alternatively, each time the inspector presses the next point key, the color or shape of the displayed mark may be sequentially changed so that the inspector can indicate a defective point. Further, the designated number may be displayed adjacent to the mark so that the inspector can key in the designated number of the defective point. In any case, the point determined to be defective and the defective code are registered in the inspection result table.

When the inspection for one inspection area is completed, the inspector presses the next inspection area key on the inspection keyboard 14 (step 225), so that the imaging device 80 and the Y stage 41 are moved so that the next inspection area can be imaged. (Step 226). After this, all the marks MC, M belonging to the set inspection area
F is displayed at once. In this way, the inspector can perform the visual inspection for each inspection area.

Regardless of the inspection mode, when the inspection for one substrate is completed in this way (when the inspection for all inspection regions registered on the substrate is completed)
(Step 229), the inspection result stored in the inspection result table is displayed on the display device 13 (Step 230).

Thereafter, the inspector takes out the substrate to be inspected from the substrate support 50 (step 231), sets the next substrate to be inspected (step 213), and performs the soldering inspection in the same manner.

When the inspection is completed for all the boards to be inspected prepared in advance (step 232), the contents of the inspection result table are stored in the FD.

If necessary, statistical calculation and display of the result are performed. That is, when the inspector inputs a calculation command from the keyboard 14 or 112, the inspection result data of all the boards for which inspection has been completed is used to calculate the total number, which is effective for the analysis of the mounting quality.
The statistical calculation is executed, and the calculation result is displayed on the display device 13 and stored in the FD. The tabulation or statistical calculation includes the board defect rate (value of the number of defective boards divided by the total number of boards), component failure rate (the value of the number of defective parts divided by the total number of parts), the defect occurrence rate by component type, It includes the defect item order by component type, the worst order of the defect occurrence location, the content of the defect, and the like. The inspection results and calculation results are printed out from the printer 114 as needed.

FIG. 24 shows another method of displaying a portion to be inspected (particularly in a mark manual feed mode and an automatic feed mode). Instead of being surrounded by the frame mark MF, the brightness of the background of the portion to be inspected (inside the mark MF) is made different from the brightness of other portions (for example, the inside of the mark MF is made brighter). The inspection location is indicated by an arrow in the layout display LD. In the inspection area manual feed mode,
The brightness of the background in the area surrounded by all the frame marks will be displayed differently from other places.

FIG. 25 shows another example of the layout display LD. In this display, the area for which inspection has already been completed is displayed in a form different from the other areas (by changing the brightness and color of the inspected area as indicated by reference numeral IB). The area under inspection is also displayed so that it can be identified as indicated by the code IC (enclosed in a frame, changed in brightness and color, etc.).

The above description is based on the assumption that the zoom magnification is fixed. As described above, when a zoom magnification is stored for each board in the teaching table, this zoom magnification is displayed on the display device 13. The inspector looks at this zoom magnification display and manually adjusts the zoom / lens system 81 so that the displayed zoom magnification is obtained. If the zoom magnification is stored in the teaching table for each inspection area, the zoom magnification is displayed on the display device 13 each time the inspection area is changed (step 226).
The inspector manually adjusts the zoom lens system 81 so that the displayed zoom magnification is obtained.

If standard image data obtained by photographing a reference board is stored by linking to a specified point (or part) in the teaching table, specify it using the mark MC (or MF) as shown in Fig. 26. The standard image (limit image) of the part is displayed on the display screen (in FIG. 26, it is displayed at the upper left position). The inspector compares the standard image (the image with good soldering or the one at the boundary between good and bad) with the image specified by the mark to judge the quality of soldering in the image specified by the mark. can do.

If the visual inspection support device includes a marking device, the inspector can input a marking command when finding a solder defect. Since the marking device moves to a defective solder location on the board pointed out by the inspector and drops ink on the defective solder location, the defective location is clearly specified on the actual board.

FIG. 27 shows another display example. Here, a scale SC is displayed near a part, a part or a part to be inspected specified by the mark MC. By referring to the scale SC, the inspector can determine the quality of the soldering. In particular, the quality of the solder at the tip of the lead (electrode) is determined by whether or not the fillet (the portion displayed in blue B on the display screen) is correctly formed. The quality of the soldering is determined by measuring the length of the fillet on the scale SC (described later with reference to FIGS. 30a and 30b).

If the zoom magnification is determined, the length on the display screen can be converted, so that the display of the scale SC is formed based on the zoom magnification. When the zoom magnification is fixed, the zoom magnification is used. When the zoom magnification is input, the input zoom magnification is used. As described later (see FIG. 35), when the zoom magnification is detected, the detected zoom magnification is used. This is the same in other display examples described below.

By displaying the scale in this way, it is possible to eliminate individual differences among inspectors, to make objective and accurate judgments, and to keep the quality of the inspection constant. Also, work efficiency is improved.

In FIG. 28, two cursors CU1 and CU2 are displayed on the display screen, and these cursors can be moved by using the mouse 111. The inspector positions the cursors CU1 and CU2 at both ends of the fillet (one end is usually the tip of the lead). The distance between these two cursors is calculated using the zoom magnification and displayed. Inspection labor is further reduced and work efficiency is improved.

FIG. 29 shows still another display example, in which a part of the display screen is shown in an enlarged manner. Here, the distance between the two cursors is displayed as an actually measured value, and a standard value or a boundary value (inspection reference) is also displayed. Objective judgment will be further secured.

FIG. 30a shows a cross section of the component PA, its lead (electrode) E, solder SO, land L and substrate PCB, and FIG. 30b shows a captured image thereof. A portion of the solder SO having a large inclination is represented by blue B, and a gentle slope is represented by green G (the light emitting device 70 or the light emitting device described above).
90 configuration). The portion represented by blue B is called a fillet.

FIGS. 31 and 32 show still another display example, in which the fillet length and the fillet area are each automatically measured. In the teaching mode, a window W is set in the inspection target portion by the inspector. Window W
The position and size will be determined by the inspector using the mouse 111 or the like. Of the three primary color signals obtained from the imaging device 80, a color signal B representing blue is used. Within the set window W, the maximum value of the horizontal length (the number of pixels) in which the color signal B has a value equal to or greater than a predetermined threshold represents the fillet length. In the window W, the number of pixels in which the color signal B has a value equal to or larger than a predetermined threshold indicates a fillet area. Fillet area will be expressed in units of pixels or mm ² .

In this way, the fillet length and fillet area are automatically obtained and displayed, thereby improving work efficiency.

Similarly, the area and length of the flat portion (red R portion) and the gentle slope portion (green G portion) are automatically obtained. Then, by calculating the ratio (length ratio, area ratio) of the blue B portion to the red R portion and the ratio of the green G portion to the red R portion, the state of soldering is represented by numerical values. become able to.

As shown in FIGS. 33a and 33b, when the solder SO is slightly and almost vertically attached, the area and length of the red R portion are much larger than those of the other colors.
As shown in FIGS. 34a and 34b, when the solder SO is slightly and almost horizontally attached, the area and length of the green G portion become large. In this way, the soldering state can be determined depending on which color portion is larger.

Finally, an operation and a process in which an inspector corrects a soldering defect during the inspection will be described with reference to FIG.

When the inspector finds a soldering defect, he enters the point and the defect code as described above, and these defect data are stored in the inspection result table (step
227,228).

Thereafter, the inspector can pull out the substrate together with the Y stage 41 in his own direction and manually correct the defective portion.
The inspector sends a board withdrawal command to the keyboard 14 (or 112).
(Step 234), the positions (coordinates of the center of the visual field) of the X stage 21 and the Y stage 41 at that time are stored in the memory 109 as return positions, and the display screen is frozen (steps 235 and 236). That is, the image of the inspection area at that time is stored in the frame memory 10.
By repeatedly reading the same image data from 2, it is displayed as a still image.

The Y stage 41 is sent forward (in a direction approaching the inspector) along the Y-axis rail 33 to the tip of the rail 33 (step).
237). The inspector holds the handle 60 and raises the substrate support 50 obliquely. As a result, the substrate PCB mounted on the substrate support 50 also becomes oblique. In this state, while referring to the layout display LD and the frozen image on the display screen,
The inspector searches for defective soldering points on the board, and corrects the defective soldering using a soldering iron (step 28).
8).

When the correction of the soldering failure is completed, the inspector returns the substrate support 50 to the horizontal posture and inputs the fact from the keyboard 14 (step 239). Magnetic sensor 47 is permanent magnet 4
After confirming that 6 has been detected (step 240), the Y stage 41 is returned to the stored return position (step 241). Then, the freeze of the display image is released (step 242). The fact that the soldering defect has been corrected is stored in the inspection result table corresponding to the defective point.

In this way, the inspector can carry out the soldering inspection of the board and, whenever a defective spot is found, correct the defective spot while pulling the board PCB toward himself and standing upright. Moreover, even after the substrate PCB is pulled out, the image of the inspection area is kept frozen and displayed, so that the inspector can easily find a defective portion on the substrate.

Instead of correcting the soldering defect, the inspector may put a marking on the defective portion.

Step after the inspection of one inspection area is completed or after the inspection of one board is completed
Needless to say, correction work after 234 can be performed.

Of course, after inspection of all the boards is completed, it is needless to say that only the board having the defective portion can be set on the board support 50 and the soldering correction can be performed as described above.

(6) Electrical Configuration of Visual Inspection Support Device (Part 2) FIG. 35 shows another example of the electrical configuration of the visual inspection support device. The same components as those shown in FIG. 10 are denoted by the same reference numerals, and description thereof will be omitted.

Control unit 100 for zoom lens of zoom lens system 81
Lens drive that moves in response to commands from the camera
115 and a zoom position detecting device 116 for detecting the position of the zoom lens. The zoom position signal of the detection device 116 is provided to the control device 100. Instead of providing the detection device 116, a position command value given to the zoom lens driving device 115 can be used as zoom lens position data. In any case, the zoom magnification is determined by the zoom / lens position. Further, a light source device 91 shown in FIG. 9 is connected to the control device 100 instead of the light projecting device 70.

With this configuration, the zoom magnification can be determined for each board type or for each inspection area by inputting a zoom command from the keyboard 112 in the teaching process. This zoom magnification is stored in the teaching table. The zoom magnification may be specified for each component (designated point). In this case, the zoom magnification is stored for each designated No. in the teaching table.

In the inspection mode, according to the Jume magnification stored in the teaching table,
The zoom lens is automatically driven by the zoom lens driving device 115 for each inspection area or for each component (point), and the designated zoom magnification is set. The zoom magnification is also used for displaying scales, calculating lengths, and calculating areas shown in FIGS. 27 to 32.

(7) Mechanical Configuration of Visual Inspection Support Device (Part 2) FIGS. 36 to 40 show another example of the mechanical configuration of the visual inspection support device.

The base 10, the table 11, the X-axis table 20, the light projecting device 70, and the imaging device 80 are the same as those shown in FIG. FIG. 36 shows the Y-axis table 120 corresponding to FIG. 36 to 40, the same components as those shown in FIGS. 1 to 4 (including those having the same or similar functions as well as those having the same shape) are denoted by the same reference numerals,
Avoid duplicate explanations as much as possible.

The configuration of the Y stage 41 is basically the same as that described above. A guide member 121 is fixed to the front half of both sides of the Y stage 41 (support plate 43), and a guide groove 121a is formed on the outer surface of the guide member 121 horizontally in the longitudinal direction (particularly, FIG. 37). reference). Guide member 12
A guide / lock plate 122 is fixed to the lower surface of the guide plate 1, and the guide / lock plate 122 extends outward and rises upward at an outer end. A female screw hole 122a is formed at the front of the rising portion. A mounting piece 124 is fixed to the rear end of the Y stage 41, and a magnetic sensor 125 is provided on the mounting piece 124. The front end of the Y-axis rail 33 rises and serves as a stopper 33a.

A particular configuration in this embodiment is that a sliding body 130 is provided. The sliding body 130 has sliding walls 131 provided on both sides thereof. A ridge 131a extending in the front-rear direction is formed inside the sliding wall 131. The ridge 131a is slidably fitted in the guide groove 121a of the guide member 121. As a result, the slide 130 is moved to the Y stage 41.
Is slidable in the front-rear direction.

The left and right sliding walls 131 are fixedly connected to each other by a cover 134 extending between the front plate 51 of the substrate support 50 and the sliding walls 131.

An auxiliary plate 132 long in the front-rear direction is provided outside the sliding wall 131.
Is installed. The auxiliary plate 132 extends outward and is bent downward. A long hole 133 long in the front-rear direction is formed in a portion bent downward. A male screw 136a protruding in the axial direction is fixed to the fixing lever 136 (see especially FIG. 37). The male screw 136a is screwed into the female screw 122a of the guide / lock plate 122 through the elongated hole 133.

If the male screw 136a screwed into the female screw 122a is loosened using the lever 136, the sliding body 130 moves in the front-rear direction with respect to the Y stage 41. When the male screw 136a is tightly screwed into the female screw 122a using the lever 136, the lock plate 122 and the auxiliary plate 132 are tightly fastened, and the slide 130 is fixed to the Y stage 41 and moves together with the Y stage 41.

A stopper 131 is provided at the rear end of the ridge 131a of the sliding wall 131.
b is formed. This stopper 131b is the Y stage 41
A guide limit of the sliding member 130 with respect to the front end is determined by hitting the rear end face of the guide member 121 (see FIG. 40). A stopper 137 protruding inward is attached to a front end inside the sliding wall 131. When the sliding body 130 retreats, the stopper 137 hits the projection 41a provided on the front end surface of the stage 41. As a result, the retracted position of the slide 130 is determined.
In a normal state (at the time of substrate inspection), the sliding body 130 is at the retracted position.

The substrate support 50 is the same as the above-mentioned embodiment in that it comprises a front plate 51 and a rear plate 53 connected by a rod 54, and a movable plate 52 movable by the rod 54.

The substrate support 50 is attached to the sliding body 130, not the Y stage 41, so as to be able to move up and down. That is, the front plate 51 of the substrate support 50 is pivotally attached to the front end of the sliding wall 131 of the slide 130 by the shafts 48 at both lower ends.

A hole 135 is formed in the front end of one of the sliding walls 131 of the sliding body 130 (see especially FIG. 38). Bolt 145 in this hole 135
Is passing. On the other hand, a bracket 142 bent at a right angle is attached to the corresponding portion of the substrate support 50,
The arc-shaped long hole 1
43 has been opened. The bolt 145 passes through the arc-shaped long hole 143 and is screwed to the lever 141. Therefore, by turning the lever 141 and tightening the bolt 145 to the female screw in a state in which the substrate support 50 is in a horizontal position or in an upright position at an arbitrary angle, the substrate support 50 is in a horizontal position or in an inclined position. It is fixed to the standing posture. A handle 147 is attached to the front plate 51 via a bracket 146 to facilitate the operation of raising and lowering the substrate support 50.

On the rear surface of the movable plate 52, two split pieces 61 into which two rods 54 are respectively inserted are attached. Holes are formed so as to be orthogonal to the slits 61a of the split pieces 61, and a tightening screw rod 148 passes through the holes (particularly, see FIG. 39). The threaded rod 148 passes through the spacing pipe 149 between the two split pieces 61. Screw rod 148
A fastening tool 150 and a cap 151 each having female threads formed at both ends protruding outward from the split piece 61 are screwed. Therefore, by turning the fastening tool 150, the two split pieces 61 fasten the rods 54 respectively.

A permanent magnet 152 is attached to a portion of the rear plate 53 corresponding to the magnetic sensor 125. The permanent magnet 152 is detected by the sensor 125 only when the slide 130 is in the retracted position and the substrate support 50 is in the horizontal position.

The Y-axis table having such a configuration is used in the teaching mode and the inspection mode in the same manner as in the above-described embodiment. At this time, the slide 130 is moved to the retracted position and the substrate support 50 is
Is kept in a horizontal position.

The method of using the Y-axis table is different from that of the above embodiment only when correcting a defective soldering point on the board. It is assumed that a predetermined inspection area on the substrate PCB is imaged by the imaging device 80, and the image is displayed on the display device 13. When correcting the soldering of the defective part on the board in this state.
The inspector loosens the lever 136 while holding the Y stage 41 at that position, and pulls out the sliding body 130 forward. Then, the soldering failure is corrected in a state where the substrate support 50 is erected obliquely (see FIG. 40).

After the repair work of the soldering, the inspector returns the substrate support 50 to the horizontal position, and returns the slide 130 to the original retracted position. Since this state is detected by the sensor 125, Y
Driving of the stage 41 by the motor 39 is permitted.

When the sliding body 130 is pulled forward, in response to the correction start input from the inspector or the disappearance of the detection signal from the sensor 125, the image captured up to that point is displayed on the display device.
Needless to say, it is displayed as a still image in 13 (image freeze).

(8) Mechanical Configuration of Visual Inspection Support Device (Part 3) FIG. 41 shows another configuration example of the Y-axis table. In this embodiment, a rotation base 160 is rotatably provided on the Y stage 41. The substrate support 50 is provided on the rotating base 160. When a board on which components whose leads (electrodes) protrude in all directions are mounted on the board support 50, the board support 50 is rotated in a horizontal plane to rotate the board. The work of correcting the defective soldering is easy.

A support plate 161 is fixed on the Y stage 41 via a holding plate 165. A cross roller bearing 162 is provided on the support plate 161. On the other hand, a positioning ring 164 and a shaft 163 are fixed to the lower surface of the rotating base 160. The positioning ring 164 has four V-grooves 164A, 164B at 90 degree intervals.
Are formed. Of these V grooves, the V groove indicated by reference numeral 164B is deeper than the other V grooves 164A and represents the origin position. The rotation base 160 is rotatably supported on the Y stage 41 by the shaft 163 being rotatably received by the bearing 162.

An arm 166 is rotatably mounted at one end on a support plate 161 by a shaft 168, a thrust bearing 169, and a bush 170. A lever 167 is fixed to a base end of the arm 166. A cam follower 171 is rotatably attached to a substantially middle point of the arm 166. Pin 172 erected on support plate 161 and spring post 17 at the tip of arm 166
A spring (tension spring) 173 is attached between the first and fourth springs.
As a result, the tip of the arm 166 is urged by the spring 173, and the cam follower 171 comes into contact with the peripheral surface of the positioning ring 164 or fits into the V groove 164A or 164B. The rotation base 160 is positioned at four positions where the cam followers 171 are fitted into the V-grooves 164A or 164B.

When rotating the rotation base 160, the cam follower 171 is turned to the V by using the lever 167 against the urging force of the spring 173.
The rotary base 160 may be pulled out from the groove 164A or 164B and rotated by hand.

Proximity switch 175 by bracket 176 on support plate 161
Is installed. On the other hand, the detection target 177 of the proximity switch 175 is attached to the tip of the arm 166. When the cam follower 171 is fitted in the deepest groove 164B, the detection target 177 comes closest to the proximity switch 175. The proximity switch 175 outputs a detection signal only at this time. Therefore, it is recognized from the detection signal of the proximity switch 175 that the rotation base 160 is at the origin position. The driving of the Y stage 41 may be permitted based on this detection signal.

If necessary, the substrate support 50 can be provided on the rotating base 160 so as to be undulated. In addition, a slide body that can be pulled out may be provided on the rotating base 160, and a substrate support may be fixedly or undulatingly provided on the slide body.

(9) Still Another Mechanical Configuration Example In FIG. 42a, a Y-axis table base 181 is supported on a device base 180 so as to be swingable by a shaft 182.
The swing center axis 182 coincides with the movement path of the light projecting device 70 and the imaging device 80. That is, the axis 182 is located directly below the center VC of the visual field of the imaging device 80. The rail 33 is provided on the base 181, and the Y stage 41 moves along the rail 33. A substrate support plate 50 for supporting the substrate PCB on the Y stage 41
Is fixedly provided.

A swing motor 183 is provided at the rear of the device base 180, and a timing belt 186 is hung between a pulley 185 provided on the rotating shaft of the motor 180 and a pulley 184 provided rotatably above the pulley 185. ing. A part of the timing belt 186 is fixed to a mounting piece 187 provided on the base 181.

By rotating the motor 183, the base 181 is tilted as shown in FIG. 42b. As described above, it is possible to observe the detection area on the substrate through the imaging device 80 while the substrate PCB is tilted.

However, tilting the base 181 causes the visual field center VC to move as indicated by VC1. VC imaging device 80
The Y stage 41 is moved slightly (to the rear in this example) to bring it to the center of the visual field. PCB from center of axis 182
Assuming that the height up to h is α and the inclination angle of the base 181 is α, the Y stage 41 may be moved by h · sin α. The height h is a fixed value, and the tilt angle α can be calculated from the rotation amount of the motor 183, so that the Y stage 41 can be moved automatically.

FIGS. 43a and 43b relate to the X-axis table, in which the light projecting device 70 and the imaging device 80 are tilted. The Y stage 41 runs on the swing base 181 or the fixed base 10 described above.

Assuming that the light projecting device 70 and the imaging device 80 are inclined at an angle β with respect to the perpendicular, the visual field of the imaging device 80 is shifted by a distance of h · sin β. Here, h is the distance between the imaging plane of the imaging device 80 and the substrate PCB. Therefore, in order to compensate for this shift in the visual field, the X stage is moved by this shift amount.

FIG. 44 shows a mechanism for tilting the light projecting device 70 and the imaging device 80. The light emitting device 70 and the imaging device 80 are mounted on a mounting plate 191.
It is fixed to. A shaft 192 is fixed to the mounting plate 191, and the shaft 192 is rotatably received by the X stage 21. Axis 1
A pulley 195 is fixed to 92. A motor 193 is mounted on the X stage 21, and a pulley 194 is fixed to a rotation shaft thereof. Timing belts on these pulleys 194 and 195
196 is hung. By rotating the motor 193 in the forward and reverse directions, the light projecting device 70 and the imaging device 80 can be tilted in an arbitrary direction at an arbitrary angle. The movement of the X stage 21 depends on the motor 29 as described above.

(10) Still Another Embodiment In the teaching process described above, the inspector inputs a designated point indicating a point to be inspected from the keyboard, but the designated point is stored in the CAD system for designing the board. The determination can also be made using the position data of the component, the component mounting position held by the component mounting apparatus that mounts the component on the board, and the position data indicating the soldering position. In this case, the position represented by the existing data or a group thereof may be all designated points, or the position data may be displayed together with an image on a display screen, and the inspector may select the position data. .

In the configuration example of the above-described mechanism, the substrate support is pivotally attached at the front end and the rear end is pulled up to stand up. However, the substrate support may be pivotally attached at an intermediate position before and after the substrate support. . Alternatively, the substrate support can be pivotally attached at the rear end and lowered to the front end to be in an upright state (inclined state).

In the above-described teaching processing, the inspector sets the inspection area. However, the inspection area may be set by the apparatus. It is calculated from the size of the substrate and the size of the field of view of the imaging device whether the substrate should be divided into several inspection areas. When the number of divisions of the substrate is determined, the XY table is controlled so that the field of view is sequentially set in the divided areas. Teaching processing is performed for each field of view (inspection area).

FIG. 45 shows a configuration example of a system using the above-described visual inspection support device as a soldering correction device.

The automatic board inspection apparatus 301 determines the quality of soldering on the board and creates inspection result data. The inspection result data includes at least a board ID, position data of a defective part, and a defective code. Inspection result data is collected by the data collection device 30
Sent to 2. Data collection device 302 FD the inspection result data
, Or sent to the soldering correction device 303 online or through the server 304 to the soldering correction device 303. The inspection result data stored in the FD is read by the soldering correction device 303.

When the defective board is set on the XY table and the ID of the board is input in the soldering correction device 303, the XY table is imaged so that an area including the soldering defective portion is imaged based on the corresponding inspection result data. Controlled. The captured image is displayed on the display device. This display image is frozen. The repair operator pulls out the board toward the front and corrects the defective soldering on the board while watching the displayed image.

The input of the board ID can be performed by an operator, or the barcode reader connected to the data collection device 302 reads the barcode written on the board and outputs the data to the data collection device.
It may be transmitted from 302 to the soldering correction device 303.

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Norihito Yamamoto 24, Yamanouchi Yamanoshita-cho, Ukyo-ku, Kyoto-shi, Kyoto Inside OMRON Life Science Research Institute, Inc. Address OMRON Corporation (56) References JP-A-61-251705 (JP, A) JP-A-61-89192 (JP, A) JP-A-62-38306 (JP, A) JP-A-63-120203 ( JP, A) JP-A-61-256207 (JP, A) JP-A-2-231510 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) G01B 11/00-11/30

Claims (39)

(57) [Claims] 1. A substrate support for supporting a substrate to be inspected, a stage provided with the substrate support and movable in at least one direction, an illuminating device for illuminating the substrate, on a substrate illuminated by the illuminating device An imaging device that captures an image of an area and outputs an image signal representing the captured image, a memory that stores an image signal output from the imaging device, and a display that displays an image represented by the image signal output from the imaging device Apparatus, command input means for inputting a board pull-out command, a stage driving device for moving the stage to a predetermined position in response to a board pull-out command input from the command input means, and a board input from the command input means In response to the pull-out command, the image signal stored in the memory is repeatedly read out and stored in the display device in the memory. Visual inspection supporting apparatus having a display control means for controlling to display a still image represented by the image signal that. 2. The apparatus according to claim 1, further comprising: means for detecting a position of said stage when a substrate withdrawal command is input from said command input means, and storing the detected position as a return position. Visual inspection support device. 3. A predetermined position where the stage is moved is a position where an inspector can correct a substrate.
The visual inspection support device according to claim 1. 4. The visual inspection support device according to claim 1, wherein the predetermined position at which the stage is moved is a position outside a range where the illumination device and the imaging device exist. 5. A substrate support for supporting a substrate to be inspected, a stage provided with the substrate support and movable in at least one direction, an illumination device for illuminating the substrate, An imaging device that captures an image of an area and outputs an image signal representing the captured image, a display device that displays an image represented by the image signal output from the imaging device, a command input that inputs a board movement command and a return command Means, in response to a movement command input from the command input means,
A stage driving device for moving the stage to a predetermined position, and storing the current position of the stage when the movement command is given, and returning the stage to the current position when a return command is given. A visual inspection support device comprising: means for controlling a driving device. 6. The visual inspection support apparatus according to claim 5, wherein said substrate support is supported on said stage so as to be able to stand upright. 7. A sensor for detecting that the substrate support is in a horizontal position on the stage, wherein the stage responds to a return command on condition that a detection signal is output from the sensor. 7. The visual inspection support device according to claim 6, wherein the visual inspection support device is controlled to return to the current position. 8. A movable stage for supporting a substrate to be inspected, an illuminating device for illuminating the substrate, an image of an area on the substrate illuminated by the illuminating device, and outputting an image signal representing the captured image. Imaging device, display device for displaying an image represented by an image signal output from the imaging device, storage means for storing pre-taught position data representing a point to be inspected on a substrate to be inspected, and the storage device Display control means for performing a point display for specifying a point to be inspected on an image displayed on the display device in accordance with the position data stored in the display means; When there are multiple inspection points, the above point display is changed according to a predetermined order for each inspected input. It is intended to further, visual inspection supporting apparatus. 9. A movable stage for supporting a substrate to be inspected, an illuminating device for illuminating the substrate, imaging an area on the substrate illuminated by the illuminating device, and outputting an image signal representing the captured image. Imaging device, display device for displaying an image represented by an image signal output from the imaging device, storage means for storing pre-taught position data representing a point to be inspected on a substrate to be inspected, and the storage device Display control means for performing a point display for specifying a point to be inspected on an image displayed on the display device in accordance with the position data stored in the display means; When there are multiple inspection points in a room, the above point display is changed at predetermined intervals according to a predetermined order. It is intended to, visual inspection supporting apparatus. 10. An illumination device for illuminating a substrate to be inspected, an imaging device for imaging an area on the substrate illuminated by the illumination device, and outputting an image signal representing the captured image. A display device for displaying an image represented by an image signal, display control means for controlling the display device to perform a layout display for specifying a position on the substrate of an area of the image displayed on the display device, A substrate support for supporting the substrate, a movable stage provided with the substrate support, and the stage until the substrate supported by the substrate support comes to a position outside the range where the illumination device and the imaging device exist. The illumination device and the imaging device are fixed to each other,
A visual inspection support device provided movably in one of two orthogonal directions, and wherein the stage is movably provided in another of the two orthogonal directions. 11. The visual inspection support apparatus according to claim 10, wherein said display control means controls to specify an image area which has been inspected. 12. An illumination device for illuminating a substrate to be inspected, an imaging device for imaging an area on the substrate illuminated by the illumination device, and outputting an image signal representing the captured image. A display device for displaying an image represented by an image signal, a substrate support for supporting a substrate to be inspected, a movable stage having the substrate support, a substrate supported by the substrate support being the illumination device, A mechanism for moving the stage until it comes to a position outside the range where the imaging device exists, storage means for storing pre-taught position data representing a point to be inspected on a substrate to be inspected, and storage in the storage means Control to perform a point display that clearly indicates a point to be inspected on an image displayed on the display device according to the position data that has been input The illumination device and the imaging device are fixed to each other,
And the stage is movably provided in one of the two orthogonal directions. The stage is movably provided in the other one of the two orthogonal directions. A visual inspection support device that controls the layout display to clearly indicate the position on the board. 13. An illumination device for illuminating a substrate to be inspected, an imaging device for imaging an area on the substrate illuminated by the illumination device, and outputting an image signal representing the captured image. A display device for displaying an image represented by an image signal, a movable stage for supporting a substrate to be inspected, a display control means for displaying a window on a display screen of the display device, and a specific image in the window. A visual inspection support device comprising: control means for generating data relating to size and displaying the data on the display device. 14. The visual inspection support device according to claim 13, further comprising input means for designating a position and a size of said window. 15. An illumination device for illuminating a substrate to be inspected, an imaging device for imaging an area on the substrate illuminated by the illumination device, and outputting an image signal representing the captured image, and an image output from the imaging device. A display device for displaying an image represented by an image signal, a movable stage for supporting a substrate to be inspected, a display control means for displaying a window on a display screen of the display device, and a specific image in the window. A visual inspection support device comprising: control means for creating data relating to the size and data relating to the reference size and displaying the data on the display device. 16. An illumination device for illuminating a substrate to be inspected, an imaging device for imaging an area on the substrate illuminated by the illumination device, and outputting an image signal representing the captured image. A display device for displaying an image represented by an image signal, and a substrate support for supporting a substrate to be inspected, wherein the lighting device emits a plurality of optical fiber cables and a plurality of lights of different colors. A visual inspection support device comprising a light-emitting device, wherein the optical coupling between the optical fiber cable and the light-emitting device is detachable. 17. The visual inspection support device according to claim 1, wherein the visual inspection support device is a soldering defect correction device. 18. Using the visual inspection support device according to claim 1, the stage is moved until the substrate comes to a position outside the range where the illumination device and the imaging device exist, and A method of manufacturing a board by correcting soldering defects. 19. An illumination device for illuminating a substrate to be inspected, an imaging device for imaging an area on the substrate illuminated by the illumination device, and outputting an image signal representing the captured image, and an image output from the imaging device. A display device for displaying an image represented by an image signal and a visual inspection support device having a movable stage for supporting the substrate to be inspected, so that the substrate is out of the range where the illumination device and the imaging device are present. After moving the above stage until it comes to the position of,
A method of manufacturing a board by correcting soldering defects. 20. An illumination device for illuminating a substrate to be inspected, an imaging device for imaging an area on the substrate illuminated by the illumination device and outputting an image signal representing the captured image, the illumination device, and the imaging 2 that is relatively orthogonal to the device
A stage movable in the direction, a substrate supporter supported on the stage and supporting a substrate to be inspected, a display device for displaying an image represented by an image signal output from the imaging device, and a tiltably supported stage. A substrate inspection apparatus, comprising: a base that moves; and, when the base is tilted, a device that moves the stage so that the center of the visual field of the imaging device does not move on the substrate in accordance with the tilt angle. 21. An illumination device for illuminating a substrate to be inspected, an imaging device for imaging an area on the substrate illuminated by the illumination device, and outputting an image signal representing the captured image, the illumination device, and the imaging device 2 that is relatively orthogonal to the device
A first stage movable in a direction, a substrate supporter supported on the first stage and supporting a substrate to be inspected, a display device for displaying an image represented by an image signal output from the imaging device, A second stage for tiltably supporting the illumination device and the imaging device, and a center of the visual field of the imaging device does not move on the substrate according to the tilt angle when the illumination device and the imaging device are tilted. An apparatus for moving the second stage. 22. An illumination device for illuminating a substrate to be inspected, an imaging device for imaging an area on the substrate illuminated by the illumination device and outputting an image signal representing the captured image, the illumination device, and the imaging device A stage movable in two directions perpendicular to the apparatus, a substrate supporter supported on the stage and supporting a substrate to be inspected, a memory for storing image signals output from the imaging device, the imaging device A display device for displaying an image represented by an image signal output from the device, command input means for inputting a board movement command, and moving the stage to a predetermined position in response to a board movement command input from the command input means. In response to a substrate movement command input from the stage driving device and the command input means, the image signal stored in the memory is repeatedly output. Out,
Display control means for controlling the display device to display a still image represented by the image signal stored in the memory. 23. The apparatus according to claim 22, further comprising: means for detecting a position of said stage when a substrate movement command is input from said command input means, and storing the detected position as a return position. Board inspection equipment. 24. The substrate inspection apparatus according to claim 22, wherein the predetermined position at which the stage is moved is a position where an inspector can correct the substrate. 25. The substrate inspection apparatus according to claim 22, wherein the predetermined position at which the stage is moved is a position outside a range where the illumination device and the imaging device exist. 26. An illumination device for illuminating a substrate to be inspected, an imaging device for imaging an area on the substrate illuminated by the illumination device, and outputting an image signal representing the captured image, the illumination device, and the imaging A stage movable in two directions perpendicular to the apparatus, a substrate supporter supported on the stage and supporting a substrate to be inspected, and an inspection area displayed on one display screen on the substrate to be inspected. Storage means for storing data indicating the position of the inspection site to be inspected for each inspection area, and storing position data instructed in advance for each inspection area; enlargement of the inspection area designated based on the image signal output from the imaging device; A display device for displaying an image, and data displayed on the display device according to the data and the position data representing the examination area stored in the storage means. And on the enlarged image display control means for controlling to perform the examination region position display demonstrates the test site location to be examined, a substrate inspection device provided with a. 27. The display control means, when there are a plurality of inspection part positions on a displayed image, displays the inspection part position display in every predetermined input or every predetermined time in a predetermined order. Therefore it is subject to change,
27. The substrate inspection apparatus according to claim 26. 28. The display control means according to claim 28, wherein, when there are a plurality of inspection site positions on the displayed image, all of said plurality of inspection site positions are displayed at a glance. 27. The board inspection device according to claim 26, wherein 29. The substrate inspection apparatus according to claim 26, further comprising input means for inputting an inspection result of an image displayed on said display device. 30. The board inspection apparatus according to claim 26, further comprising input means for inputting an inspection result of the inspection part position inspected in relation to the inspection part position display displayed on said display device. . 31. The board inspection apparatus according to claim 30, wherein said display control means specifies a position of an inspection part which is input as a defect by said input means. 32. The display control means further performs a layout display for specifying a position on the substrate of an area of an image displayed on the display device, and the inspection part position displayed in the layout display. 27. The substrate inspection apparatus according to claim 26, wherein the display device is controlled so as to specify a position on the substrate. 33. An illumination device for illuminating a substrate to be inspected, an imaging device for imaging an inspection area on the substrate illuminated by the illumination device, and outputting an image signal representing the captured image, the illumination device, and the illumination device. 2 that is relatively orthogonal to the imaging device
A stage that is movable in the direction, a substrate support that is supported by the stage and supports a substrate to be inspected, a display device that displays an image in an inspection area represented by an image signal output from the imaging device, Means for storing position data representing each inspection area; and a layout display for specifying the position of the image displayed on the display device on the board based on the position data, the image being displayed in the inspection area. A substrate inspection apparatus comprising: a display control unit configured to perform control on the display device in addition to the display. 34. The board inspection apparatus according to claim 33, wherein said display control means controls to specify an image area which has been inspected. 35. An illumination device for illuminating a substrate to be inspected, an imaging device for imaging an area on the substrate illuminated by the illumination device, and outputting an image signal representing the captured image, the illumination device, and the imaging device A stage movable in two directions perpendicular to the apparatus, a substrate supporter supported on the stage and supporting a substrate to be inspected, and a display for displaying an image represented by an image signal output from the imaging device Device, display control means for displaying a window on the display screen of the display device, and converting a predetermined specific image size in the window into numerical information, and displaying the numerical information on the display device A board inspection apparatus comprising: a control unit. 36. The board inspection apparatus according to claim 35, further comprising input means for designating a position and a size of said window. 37. The board inspection apparatus according to claim 35, wherein said control means displays data relating to a reference size in addition to data relating to the size of said specific image. 38. The board inspection apparatus according to claim 20, wherein said board inspection apparatus is a soldering defect correction apparatus. 39. A method for correcting a defective soldering using the board inspection apparatus according to any one of claims 20 to 37.