JP2858439B2 - Inner lead bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to a spacer tape detection system in an inner lead bonding apparatus.

(Prior Art) Generally, an inner lead bonding apparatus bonds a semiconductor chip to an inner lead of a carrier tape unwound from a supply reel, and superimposes a spacer tape on the bonded carrier tape and winds it on a storage reel. It is configured.

Here, the spacer tape prevents deformation of the inner leads provided on the carrier tape, or prevents damage to the semiconductor chip bonded to the leads,
This protects the leads and the semiconductor chip.

When starting to wind a new carrier tape on the storage reel, the operator attaches the leading end of the spacer tape to the core of the storage reel using an adhesive tape or the like, and attaches the spacer tape to the storage reel.

(Problems to be Solved by the Invention) However, in the related art, when the carrier tape after bonding is wound around a storage reel, a means for confirming that the spacer tape is always supplied to the storage reel is provided. Has not been taken into account.

For this reason, in the prior art, as a result of starting the bonding apparatus while the operator forgets the work of attaching the spacer tape to the storage reel, the lead of the carrier tape and the semiconductor chip may be damaged, which may cause a large number of product defects. There was.

The present invention detects whether or not a spacer tape is supplied to a storage reel on which a bonded carrier tape is wound, and prevents occurrence of a product defect due to winding of the bonded carrier tape without the spacer tape. The purpose is to prevent.

[Constitution of the Invention] (Means for Solving the Problems) The present invention relates to a storage reel in which a semiconductor chip is bonded to an inner lead of a carrier tape unwound from a supply reel, and a spacer tape is superimposed on the bonded carrier tape. In the spacer tape detecting system in the inner lead bonding apparatus configured to wind up the tape, a spacer tape supply state detecting means for detecting a supply state of the spacer tape to the storage reel is provided.

(Operation) According to the present invention, the presence of the spacer tape supply state detecting means detects whether or not the spacer tape is supplied to the storage reel on which the bonded carrier tape is wound, and performs the bonding without the spacer tape. It is possible to prevent the occurrence of product defects caused by winding the carrier tape later.

(Embodiment) FIG. 1 is a front view schematically showing an inner lead bonding apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing a control system of the present invention, and FIG. It is a flowchart which shows a procedure.

As shown in FIG. 1, the bonding apparatus 10 includes a supply reel 11 on which the carrier tape 1 is wound, and a supply reel 11 on which the carrier tape 1 is wound.
The supply reel 11 is driven by the reel drive motor 11A, and the storage reel 12 is driven by the reel drive motor 12A. The reel drive motors 11A and 12A are controlled by the control device 20. 11B and 12B are reel drive motor driver circuits. Note that the carrier tape 1 has a lead pattern formed by etching or the like, so that the electrode portions of the semiconductor chip 2 can be connected to inner leads projecting inside device holes.

The bonding device 10 includes a supply reel 11 and a storage reel 12.
And a bonding head 13 is disposed between them. The bonding head 13 includes a tool 14, and the tip of the tool 14 faces the upper surface of the carrier tape 1. On the lower surface side of the carrier tape 1, a mounting portion 15 on which the semiconductor chip 2 is mounted is arranged. The mounting section 15 is mounted on an XY table 16 driven in the XY directions. The bonding head 13 and the XY table 16 are controlled by the control device 20. 13A is the bonding head driver circuit, 16A is
This is an XY table driver circuit.

The bonding apparatus 10 includes guide pulleys 21A and 21B, tape supply sprocket gears 22A and 22B, and a guide plate 22C on both sides of the bonding head 13, a guide plate 23C, a tape storage sprocket gear 23A and 23B, and guide pulleys 24A and 24B.
And a tape feed motor 25 such as a pulse motor.
Drives the sprocket gear 23A on the tape storage side. Each sprocket gear 22A, 22B, 23A, 23B is engaged with a sprocket hole provided in the carrier tape 1, and the carrier tape 1 is intermittently fed by the sprocket gear 23A by a length controlled by the control device 20. I do. 25A is a tape feed motor driver circuit.

In the bonding apparatus 10, the storage reel 31 of the spacer tape 3 is attached to the supply reel 11 of the carrier tape 1 and the supply reel 32 of the spacer tape 3 is attached to the storage reel 12 of the carrier tape 1. .

That is, in the bonding apparatus 10, in order to prevent deformation of the leads provided on the carrier tape 1 and protect the leads, the spacer tape 3 is superposed on the carrier tape 1 and wound around the supply reel 11. When the carrier tape 1 is unwound from the supply reel 11, the spacer tape 3 is separated from the carrier tape 1, and the spacer tape 3 is wound on the storage reel 31.

In the bonding apparatus 10, the spacer tape 3 unwound from the supply reel 32 is superimposed on the carrier tape 1 on which bonding has been completed, and is wound together on the storage reel 12. Thereby, the leads provided on the carrier tape 1 are prevented from being deformed, or the semiconductor chip 2 bonded to the leads is prevented from being damaged, and the leads and the semiconductor chip 2 are protected.

Here, in the bonding apparatus 10, a spacer tape detecting device 41 for detecting the presence or absence of the spacer tape 3 in the spacer tape introduction path from the supply reel 32 to the storage reel 12 is used as the spacer tape supply state detecting means of the present invention. Provided. The spacer tape detecting device 41 is controlled by the control device 20.

The spacer tape detecting device 41 is composed of, for example, a pair of transmissive photoelectric switches arranged above and below the spacer tape introduction path, and sends an off signal if there is the spacer tape 3, and sends an on signal if there is no spacer tape.

The spacer tape detecting device 41 is, for example, a bonding device.
The operation is started when the power of 10 is turned on, and the detection result is transferred to the control device 20. The control device 20 enables the bonding device 10 to be started if the spacer tape 3 is present, and activates the alarm device 42 without starting the bonding device 10 if the spacer tape 3 is not present, and sounds a buzzer and a lamp to indicate this spacer tape abnormality. And so on.

Accordingly, the bonding device 10 is operated by the control device 20 as follows.

That is, in the bonding apparatus 10, each time the tape storage side sprocket gear 23A intermittently drives, the supply reel 1
The carrier tape 1 wound around 1 is unwound and positioned below the bonding head 13. Then, the carrier tape 1 loosened between the tape storage side sprocket gear 23A and the storage reel 12 is detected by a detector (not shown), whereby the reel drive motor 12A is driven, and the carrier tape 1 is wound on the storage reel 12. . At the same time, the spacer tape 3 unwound from the supply reel 11 is separated from the carrier tape 1 and wound on the storage reel 31, and the spacer tape 3 unwound from the supply reel 32 is superposed on the bonded carrier tape 1 and It is wound on a storage reel 12 together with the carrier tape 1.

Also, in the bonding apparatus 10, the XY table 16 is moved every time a new lead of the carrier tape 1 is positioned below the bonding head 13 by intermittently driving the sprocket gear 23A on the tape storage side, and Is positioned immediately below the bonding head 13, and then the bonding head 13 is lowered to bond the semiconductor chip 2 to the lead of the carrier tape 1.

Here, in the bonding device 10, as shown in FIG. 3, when the power of the bonding device 10 is turned on, the operation of the spacer tape detecting device 41 is started, and the detection result of the spacer tape detecting device 41 is transferred to the control device 20. Is done. Then, the control device 20 detects the presence or absence of the spacer tape 3 in the spacer tape introduction path from the supply reel 32 to the storage reel 12, and if the spacer tape 3 is present, the bonding device 10 can be started. Without starting the bonding device 10, the alarm device 42 is operated to notify the operator of this spacer tape abnormality by a buzzer, a lamp display, or the like.

 Next, the operation of the above embodiment will be described.

According to the above embodiment, the presence of the spacer tape detecting device 41 detects whether or not the spacer tape 3 is supplied to the storage reel 12 on which the bonded carrier tape 1 is wound. It is possible to prevent the occurrence of product defects due to winding the carrier tape 1 after bonding.

Incidentally, in the embodiment of the present invention, the spacer tape supply state detecting means may be constituted by a spacer tape supply reel rotation presence / absence detecting device. That is, in this case, the supply reel 32 is configured to be rotated by winding the spacer tape 3 around the storage reel 12 (the supply reel 32 is not provided with a rotation drive source, and only the back tension is applied. Put), supply reel during bonding
The presence or absence of rotation is detected by the rotation presence / absence detection device 32, and when there is no rotation, it is determined that the supply of the spacer tape is abnormal, thereby achieving the object of the present invention.

In the embodiment of the present invention, the spacer tape unwound from the carrier tape supply reel may be supplied directly to the carrier tape storage reel without passing through the reel.

[Effects of the Invention] As described above, according to the present invention, it is detected whether or not a spacer tape is supplied to a storage reel on which a carrier tape after bonding is wound, and the carrier tape after bonding without the spacer tape is detected. Can be prevented from occurring due to winding of the product.

[Brief description of the drawings]

FIG. 1 is a front view schematically showing an inner lead bonding apparatus according to one embodiment of the present invention, FIG. 2 is a block diagram showing a control system of the present invention, and FIG. 3 is a flowchart showing a control procedure of the present invention. It is. DESCRIPTION OF SYMBOLS 1 ... Carrier tape, 2 ... Semiconductor chip, 3 ... Spacer tape, 10 ... Bonding device, 11 ... Supply reel, 12 ...
Storage reel, 41 ... spacer tape detection device.

Claims (1)

(57) [Claims] 1. A spacer in an inner lead bonding apparatus configured to bond a semiconductor chip to an inner lead of a carrier tape unwound from a supply reel, superpose a spacer tape on the bonded carrier tape and wind the spacer tape on a storage reel. A spacer tape detecting system in an inner lead bonding apparatus, wherein a spacer tape supplying state detecting means for detecting a supplying state of a spacer tape to a storage reel is provided in the tape detecting system.