JP2002134565A - Electronic circuit component punching machine and its tape head detection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To detect automatically the position of the head of a electronic circuit component on a carrier tape. SOLUTION: While a TAB tape 1 is fed from a feed reel 10 and rolled up by a take-up reel 11, a guide sprocket 12 and a feed sprocket are arranged on the way, and the TAB tape 1 is driven horizontally between these sprockets. A sensor 14 and a press cutting machine 15 are arranged on this horizontal running route. An encoder 17 is loaded on an output axis 16a of a drive motor 16 driving the feed sprocket 13 rotatingly, so as to detect the rotation angle of the feed sprocket 13. After an IC chip 4 has been detected by the sensor 14, once a TAB 8 on the TAB tape 1 is transferred to the position of the punching machine 15 by a signal from the encoder 17, the first cutting is carried out by the punching machine 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for punching electronic circuit components from a carrier tape in which electronic circuit components having IC chips mounted on a flexible tape at predetermined intervals are formed, and a method for cueing the tape. It is.

[0002]

2. Description of the Related Art For example, a liquid crystal panel is formed by sealing liquid crystal between upper and lower transparent substrates, for example, between a TFT substrate and a color filter. In TAB (Tape Automated Bond), a driver IC is mounted on a flexible substrate on which a circuit pattern including inner leads and outer leads is formed.
An electronic circuit component (hereinafter, referred to as TAB) mounted by the ING) method is mounted. Here, TAB is a long flexible tape (for example, polyimide tape) having a predetermined width.
It is manufactured as a so-called TAB tape having a large number of circuit patterns formed on its surface in the length direction and an IC chip mounted on each of these circuit patterns. Therefore, T
It is necessary to punch out TAB from a TAB tape before mounting AB on a transparent substrate. For this purpose, a TAB tape punching device is used.

A TAB tape punching device includes a supply reel wound with a TAB tape and a take-up reel for winding the remaining tape from which the TAB has been punched, and a TAB tape between the supply reel and the take-up reel. By providing a pair of front and rear guide rollers in the middle of the traveling path, a horizontal traveling section is formed in the traveling path of the TAB tape,
In general, a tape punching means is provided in a horizontal running portion formed between the pair of guide rollers. The punching of the TAB from the TAB tape must be performed very accurately. Since the TAB interval on the TAB tape is controlled very precisely, if the pitch of the TAB tape is strictly controlled, it is possible to punch the next TAB accurately after punching one TAB. It is.

[0004]

By the way, although the arrangement interval of the TAB on the TAB tape is accurately controlled, the TAB tape located from the leading end to the leading end of the TAB tape is controlled.
Are slightly different. For this reason, unless the position of the leading TAB on the TAB tape is accurately detected,
In addition to the fact that the TAB cannot be punched at an accurate position, in a severe case, a problem arises in that the cutter constituting the punching means contacts the IC chip and damages the blade of the cutter. For this purpose, a so-called tape cueing adjustment must be performed to position the TAB located at the leading end of the TAB tape so as to be extremely accurate with respect to the punching means. Was performed manually, so this work was bothersome and took a long time. Moreover, the length of the TAB tape is finite, and when the TAB tape is completely supplied from the supply reel, the reel needs to be replaced.
In each case, the above-described tape cueing adjustment must be repeatedly performed.

The present invention has been made in view of the above points, and an object of the present invention is to enable automatic cueing of a carrier tape.

[0006]

In order to achieve the above-mentioned object, a punching device for an electronic circuit component according to the present invention comprises a carrier tape having sprocket holes provided on both sides at predetermined pitch intervals. An electronic circuit component on which an IC chip is mounted and a circuit pattern connected to the IC chip is formed at predetermined intervals, and a connecting tape having a leader tape of a predetermined length connected to at least the leading end of the carrier tape. The electronic reel device is configured to be wound around a supply reel, and the connecting tape is fed out from the supply reel, and the electronic circuit components are taken out by punching out each of the electronic circuit components by a punching device. A sensor disposed at a position closer to the supply reel side than a setting position and detecting at least a mounting portion of the IC chip A tape feeding means comprising a roller provided on the outer peripheral surface with claws at which the sprocket holes engage and disengage at predetermined angles, a motor for rotating the roller, and a tape feeding means; and a point in time when the sensor detects a mounting portion of the IC chip. When the carrier tape has moved by the distance to the arrangement position of the punching means, the first punching of the carrier tape is performed by the punching means, and thereafter, the carrier tape is moved by an angle preset by the rotation angle detecting means. Control means for controlling the punching operation to be repeated each time the roller rotates.

Here, the sensor further detects a seam between the leader tape and the carrier tape of the connecting tape, and the control unit runs the connecting tape at a high speed until the sensor detects the position of the seam. Then, it is preferable that when the sensor detects the end of the carrier tape, the running speed of the connecting tape is controlled to be reduced to the punching operation speed.

[0008] Further, as a punching device for electronic circuit components and a tape cueing method thereof, a carrier tape having sprocket holes provided on both sides at predetermined pitch intervals is used.
An electronic circuit component on which an IC chip is mounted and a circuit pattern connected to the IC chip is formed is formed at predetermined intervals, and a connection tape in which a leader tape of a predetermined length is connected to at least the leading end of the carrier tape is supplied. It is provided to be wound around a reel, the connecting tape is fed out from the supply reel, and the electronic circuit components are taken out by punching out each of the electronic circuit components by a punching means. It is arranged at a position on the supply reel side, and detects a seam between the leader tape and the carrier tape of the connection tape,
A sensor for detecting a mounting portion of the IC chip, a roller provided on the outer peripheral surface thereof with claws for engaging and disengaging the sprocket hole at predetermined angles, a motor for rotating the roller, and a rotation angle detecting means for the roller. And a tape feed amount control means including the tape, and the connecting tape is run at high speed until the sensor detects the position of the seam, and at the time when the sensor detects the end of the carrier tape, The traveling speed of the carrier tape is reduced to the punching operation speed, and when the carrier tape has moved by a distance from the point at which the sensor detects the mounting portion of the IC chip to the position where the punching means is provided, the carrier means The first punching of the tape is performed.

[0009]

An embodiment of the present invention will be described below with reference to the drawings. In the present embodiment, the electronic circuit component is an example of a carrier tape punching device formed with a TAB mounted on a transparent substrate of a liquid crystal panel. However, the carrier tape of the present invention is not limited to the TAB tape. Instead, the present invention can be configured as a device for punching out each electronic circuit component from a device in which various electronic circuit components are formed on a carrier tape.

FIG. 1 shows T as a carrier tape.
The appearance of a joint portion between an AB tape 1 and a leader tape 2 connected to the end of the TAB tape 1 is shown. Here, the TAB tape 1 itself is made of, for example, polyimide or the like. Therefore, a transparent resin tape is used as the leader tape 2, and the TAB tape 1 and the leader tape 2 have different light transmittances. Here, the length dimension of the leader tape 2 depends on the length of the tape traveling path in the punching device, and can be applied to various devices by making the length sufficiently longer than the tape traveling path. Like that. In addition, the same tape as the leader tape is connected to the rear end side of the TAB tape 1 and provided.

A large number of sprocket holes 3 are arranged on both left and right sides of the TAB tape 1 and the leader tape 2 at a constant pitch. The sprocket hole 3 is wound around a sprocket provided with a claw on the outer peripheral surface at a predetermined angle, and by rotating the sprocket, the TAB tape 1 is rotated.
For driving the vehicle in a predetermined direction. T
On the AB tape 1, IC chips 4 are mounted at predetermined intervals, and a large number of inner leads 5 and outer leads 6 electrically connected to the electrodes of the IC chips 4.
Are formed, and an alignment mark 7 is provided at a predetermined position. Accordingly, a region S indicated by a dashed line including the IC chip 4, the circuit pattern having the inner lead 5 and the outer lead 6, and the alignment mark 7 is a TAB punching region. Therefore, by punching out this area S from the TAB tape 1, the TA as an electronic circuit component can be obtained.
B8 is separated from the tape and taken out.

FIG. 2 shows a schematic configuration of a TAB punching apparatus. In the drawing, 10 is a supply reel, 11 is a take-up reel, and T is the time from when the TAB tape 1 is unwound from the supply reel 10 and taken up by the take-up reel 11.
A guide sprocket 12 is provided on the side near the supply reel 10 and a feed sprocket 13 is provided on the side near the take-up reel 11 in the middle of the running path of the AB tape 1. At the position between the guide sprocket 12 and the feed sprocket 13, the TAB tape 1 runs horizontally. A sensor 14 and a press-type punching machine 15 are arranged on a path along which the TAB tape 1 travels in the horizontal direction. Here, sensor 1
4 is the upstream side in the running direction, that is, the guide sprocket 12
The punching machine 15 is disposed on the downstream side, that is, on the feed sprocket 13 side.

FIG. 3 shows an enlarged view of a main part of the TAB punching apparatus. As is apparent from this figure, both the guide sprocket 12 and the feed sprocket 13 are provided with two rows of claws 12a, 13a each having a predetermined size on the outer peripheral surface thereof at predetermined angles, and these claws 12a, 13a are provided. Is TA
The B tape 1 is adapted to engage with sprocket holes 3 provided on both right and left sides. This prevents the TAB tape 1 from being displaced in the horizontal direction, and the TAB tape 1 is driven by a drive motor 16 connected to the feed sprocket 13.
The B tape 1 runs in the direction of the arrow in the figure. It is desirable to provide a means for generating back tension, such as a motor and a friction member, on the guide sprocket 12 side.

Since there is a predetermined distance between the supply reel 10 and the take-up reel 11, the leading end of the TAB tape 1 cannot be wound directly on the take-up reel 11.
A leading end of the TAB tape 1 is connected to a leader tape 2. Also, the last TAB on TAB tape 1
If the trailing end of the TAB tape 1 is in a free state when the TAB tape 8 is punched out, punching cannot be performed. Similar tapes are spliced together. Therefore, a connecting tape in which the leader tape 2 is joined to both ends of the TAB tape 1 is formed.

An output shaft 16a of a drive motor 16 for rotating the feed sprocket 13 is provided with an encoder 17 for detecting the rotation angle, and the encoder 17 detects the rotation angle of the feed sprocket 13. . Here, a speed reducer (not shown) is provided between the drive motor 16 and the feed sprocket 13. When the drive motor 16 makes one rotation by the action of the speed reducer, the feed sprocket 13 is moved forward and backward by the front and rear claws 13a. It rotates by the angle θ between them. Also, the encoder 17
The angular resolution of A phase (or A phase, B phase) is TA
This corresponds to the amount of movement of the TAB punching area S in the B tape 1 that is smaller than the allowable error range. Also, the encoder 17 is provided with a so-called Z-phase that generates a pulse for each rotation. Therefore, the feed sprocket 13 has the angle θ
A pulse signal is output each time the motor rotates.

The sensor 14 is constituted by a transmission type sensor. And, with this sensor 14, a tape running between the guide sprocket 12 and the feed sprocket 13;
In other words, of the connecting tape composed of the TAB tape 1 in which the leader tape 2 is spliced back and forth, the joint portion between the leader tape 2 and the TAB tape 1 on the leading end side is detected, and the IC chip mounted on the TAB tape 1 is detected. 4 is detected. The sensor 14 exhibits two detection functions as described above. However, the level of the light receiving side is significantly different between the time of detecting the seam and the time of detecting the IC chip.
By setting one, it is possible to configure with a single sensor, but it is also possible to configure with two sensors that detect each separately.

The punching machine 15 comprises a lower die 18 provided on the lower side and an upper die 19 provided on the upper part of the lower die 18. The upper die 19 can be moved up and down along a guide 20. And driven up and down by a cylinder (not shown). Then, the TAB tape 1 is
When the upper mold 19 is lowered at the predetermined position, the TAB 8 is punched out of the TAB tape 1. The lower part of the lower die 18 is a space, and means (not shown) for taking out the punched TAB 8 can enter and leave this space.

The operation of each part in the TAB punching apparatus configured as described above is controlled on the basis of a signal from the control unit 21, and the output signals of the sensor 14 and the encoder 17 are taken into the control unit 21. Predetermined signal processing is performed, so that control signals are output to the operating parts.

The following data is set in the control unit 21 in advance. First, the relationship between the sprocket hole 3 provided in the TAB tape 1 and the IC chip 4 will be described. T
The pitch interval of the sprocket holes 3 in the AB tape 1 is set accurately, and the mounting pitch interval of the IC chip 4 is also set accurately. Moreover, the pitch interval between the sprocket holes 3 is shorter than the mounting interval of the IC chips. As described above, in the TAB tape 1, there are n sprocket holes 3 between the front and rear IC chips 4 and 4. Therefore, after the preceding IC chip 4 is detected by the sensor 14, after the n number of sprocket holes 3 are sent,
Until the (n + 1) sprocket holes 3 are sent, that is, after the n number of Z-phase pulse signals are output from the encoder 17, the sensor 14 outputs the next IC chip 4 until the (n + 1) pulse signals are output. Should be detected. Moreover, the feed sprocket 13 is fed by one claw 13a while the encoder 17 makes one rotation. Therefore, the interval between the IC chips 4 on the TAB tape 1 is replaced with the pulse number n of the encoder 17, and data on the pulse number n between chips is set in the control unit 21 in advance.

The distance from the sensor 14 to the punching machine 15 is also set in the control unit 21 in advance. This distance can be replaced by the rotation angle of the feed sprocket 13. That is, the angle at which one claw 13a is fed is θ, and therefore, when the sensor 14 detects the IC chip 4, the feed sprocket 13 is then moved to the angle (mθ + α).
When rotated by °, the TAB 1 reaches the punching position by the punching machine 15. The rotation angle (mθ + α) ° of the feed sprocket 13 described above is the rotation number m + rotation angle Α of the encoder 17 (where the rotation angle A is D / 360 ° when the angular resolution per rotation of the encoder 17 is D / 360 °). D × (α / θ)). Therefore, this data is also set in the control unit 21 in advance.

In addition to the above, the threshold value of the sensor 14, that is, the difference in the amount of transmitted light between the leader tape 2 and the TAB tape 1, the difference in the amount of transmitted light between the TAB tape 1 and the IC chip 4, and the like are set in the control unit 21. Is done. Here, in order to facilitate the control, it is desirable to use two sensors as the sensor 14, a sensor 14A for detecting the tape and a sensor 14B for detecting the IC chip 4. Therefore, in the following description, it is assumed that two sensors are used. However, leader tape 2 and TAB
Although there is a difference in the amount of light from the tape 1, the amount of transmitted light is always obtained, and the light is not substantially transmitted from the IC chip 4. Therefore, two functions can be provided by one sensor. .

Therefore, using this device, the TAB tape 1
An example of the operation for punching TAB8 from
This will be described with reference to the timing chart of FIG. In addition,
It is assumed that data necessary for the control unit 21 is registered in advance.

To punch out the TAB 8, first, the supply reel 10 around which the TAB tape 1 is wound is set, and the leader tape 2 connected to the leading end of the TAB tape 1 is pulled out from the supply reel 10. . Then, the leader tape 2 is transferred between the supply reel 10 and the sensor 14.
The leading end is fixed to the take-up reel 11 between the lower die 18 and the upper die 19 in the punching machine 15 and through the feed sprocket 13.

In the above state, the drive motor 16 is operated to run the TAB tape 1 with the leader tape 2 connected to the end. Here, this tape running is detected by the sensor 14A.
The drive motor 16 is operated at a high speed until the joint tape between the leader tape 2 and the TAB tape 1 is detected, so that the connecting tape runs at a high speed. The leader tape 2 is sufficiently longer than the traveling path from the supply reel 10 to the take-up reel 11, so that the TAB tape 1 can quickly travel to the punching position by traveling at high speed during this time. .

When the sensor 14A detects a joint between the leader tape 2 and the TAB tape 1, the signal is sent to the control unit 21.
Is controlled by a command from the control unit 21 so that the feed speed of the feed sprocket 13 by the drive motor 16 is reduced to the normal speed. Here, the normal speed means that the IC chip 4
Activates the punching machine 15 every time reaches a predetermined position,
This is the speed required to perform the operation of punching TAB8, that is, the punching operation speed. When the punching operation of the TAB 8 is actually started, the TAB tape 1 is pitch-fed, but immediately after the TAB tape 1 has passed the position of the sensor 14, the part on which the IC chip 4 is mounted is naturally located. It does not reach the position of the punching machine 15. Therefore, it is desirable to perform continuous feeding during this time. However, it may be set so that the TAB tape 1 is fed at a pitch from this stage.

Each time the drive motor 16 makes one rotation, the Z phase of the encoder 17 is detected, and a predetermined pulse signal is generated. That is, each time the feed sprocket 13 rotates by the angle θ and is fed by one claw 13a, the encoder 17
A pulse signal is output from the controller 2
It is taken into 1. After several pulse signals are output from the encoder 17 after the TAB tape 1 passes through the position of the sensor 14, the IC chip 4 is detected by the sensor 14B. After that, a pulse signal Ps is output from the Z phase of the encoder 17. Therefore, the pulse signal Ps is defined as the first pulse signal after the IC chip 4 has passed through it, including the first pulse signal Ps among the following Z-phase pulses of P ₁ , P ₂ , P ₃ ,. It counts that the n pulse signals have been output from the Z phase of the encoder 17 and outputs the nth pulse signal (for example, the third pulse signal P ₂ ). reading angle signal a ₁ obtained from B equality.

As a result of performing the above operation, the pulse signal Ps
Is output, and after detecting m−1 pulse signals from the Z phase of the encoder 17, that is, the encoder 17 outputs (m
-1) After the rotation, the position where the rotation angle (360-A ₁ ) = A is advanced is the cueing position of the TAB tape 1, and the TAB 8 is located at the punching position of the punching machine 15. Therefore, the drive motor 16 is stopped at this position,
The TAB 8 is punched from the TAB tape 1 by lowering the upper mold 19.

[0028] After thereafter the n pulse signals from the Z phase of the encoder 17 is output by the angle signal A ₁ operates the punching machine 15 for each obtained sequentially TAB
The TAB 8 is punched from the tape 1. That is,
After the pulse signals of P ₅ , P ₈ , P ₁₁ , P ₁₄ ,... Are output from the encoder, the pitch feed is performed until the angle A advances, and the punching machine 15 is controlled to operate. When the rear end of the TAB tape 1 is detected by the sensor 14A, the drive motor 16 is again fed at a high speed,
The leader tape connected to the rear end of the TAB tape 1 is wound around the take-up reel 11 at high speed.

The TAB tape 1 has a position where the IC chip 4 is missing. The lack of the IC chip 4 is caused by testing the electrical characteristics of each TAB 8 in the state of the TAB tape 1 and determining that the IC chip 4 is defective when the IC chip 4 is determined to be defective. This is because it is punched and removed. Therefore, it is desirable to control the punching machine 15 so that the IC chip 4 does not operate when the place where the IC chip 4 is missing reaches the position of the punching machine 15.

When the control section 21 counts n pulse signals by rotating the encoder 17 n times, the counter is reset, and the encoder 17 outputs a pulse signal from the next Z phase. Is received, the counter is set. During this reset period, the passage detection signal of the IC chip 4 from the sensor 14B should be taken into the control unit 21, but if the IC chip 4 is missing, for example, as shown by a virtual line in FIG. When the fifth IC chip is missing, there is no signal output from the sensor 14B. Therefore, when the IC chip detection signal from the sensor 14B is not transmitted to the control unit 21 during the reset period, the IC chip 4 is considered to be missing, and the TAB tape 1 is normally located at a position where the TAB 8 should be punched out. Even if is shifted, the punching machine 15 is not operated, and as shown by a virtual line in FIG.
Pass the TAB tape 1 through. Thus, it is possible to prevent the disadvantage that the missing substrate of the IC chip 4 is mounted.

[0031]

As described above, according to the present invention, the cueing of the carrier tape to the punching machine can be automatically performed.

[Brief description of the drawings]

FIG. 1 is a main part external view showing a connecting tape of a TAB tape as an example of a carrier tape and a leader tape connected to the TAB tape.

FIG. 2 TAB tape to TAB as electronic circuit components
It is a schematic structure figure of the punching device for punching.

FIG. 3 is an enlarged view of a main part of FIG. 2;

FIG. 4 is a timing chart of an operation of punching a TAB from a TAB tape.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 TAB tape 2 Soda tape 3 Sprocket hole 4 IC chip 8 TAB 10 Supply reel 11 Take-up reel 12 Guide sprocket 13 Feed sprocket 14 Sensor 15 Punching machine 16 Drive motor 17 Encoder 21 Control part

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Hideki Moriya 3-16-3 Higashi, Shibuya-ku, Tokyo F-term in Hitachi Electronics Engineering Co., Ltd. 5F044 MM40 MM41 NN24 PP00

Claims (3)

[Claims] An IC chip mounted on a carrier tape having sprocket holes provided on both sides at predetermined pitch intervals, and an electronic circuit component having a circuit pattern connected to the IC chip formed at predetermined intervals. The carrier tape is provided with a connecting tape in which a leader tape of a predetermined length is connected to at least the front end of the carrier tape and wound around a supply reel, and the connecting tape is fed out from the supply reel, and punching means is used for each electronic circuit component. In a configuration in which the electronic circuit component is taken out by punching, a sensor is provided at a position closer to the supply reel side than a mounting position of the punching means and detects at least a mounting portion of the IC chip. A roller provided with pawls for engaging and disengaging the sprocket holes at predetermined angles, and a motor for rotating the rollers. When the carrier tape has moved by a distance from the time when the sensor detects the mounting portion of the IC chip to the position where the punching means is disposed, the punching means uses the first tape of the carrier tape. Control means for performing a second punching and thereafter controlling the punching operation to be repeated each time the roller rotates by an angle preset by the rotation angle detecting means. Parts punching device. 2. The sensor further detects a seam between the leader tape and the carrier tape of the connection tape, and the control unit controls the seam until the sensor detects a position of the seam. The connecting tape is run at a high speed, and when the sensor detects the end of the carrier tape, the running speed of the connecting tape is controlled to be reduced to the punching operation speed. Item 1. An electronic component punching apparatus according to Item 1. 3. An electronic circuit component having an IC chip mounted on a carrier tape having sprocket holes provided on both sides thereof at predetermined pitch intervals and having a circuit pattern connected to the IC chip formed at predetermined intervals. The carrier tape is provided with a connecting tape in which a leader tape of a predetermined length is connected to at least the front end of the carrier tape and wound around a supply reel, and the connecting tape is fed out from the supply reel, and punching means is used for each electronic circuit component. By punching out, in taking out the electronic circuit component, the electronic circuit component is disposed at a position on the supply reel side from a position at which the punching means is disposed, and a seam between the leader tape and the carrier tape of the connection tape is detected, A sensor for detecting a mounting portion of the IC chip, and a claw on the outer peripheral surface of which the sprocket hole is engaged and disengaged. A roller provided for each fixed angle, a motor for rotating and driving the roller, and a tape feed amount control unit including a rotation angle detection unit for the roller; and the sensor detects the position of the seam until the sensor detects the position of the seam. The connecting tape is run at high speed, and when the sensor detects the end of the carrier tape, the running speed of the connecting tape is reduced to the punching operation speed, and the sensor detects the mounting portion of the IC chip. A first punching of the carrier tape by the punching means when the carrier tape has moved by a distance from the carrier tape to a position at which the punching means is provided. Method.