JP2826499B2 - IC measuring method and device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC measuring method and an apparatus for measuring electrical characteristics of an IC in an IC characteristic selecting step.

[0002]

2. Description of the Related Art FIG. 3 is a diagram showing an example of a conventional IC measuring device. Conventionally, as shown in FIG. 3, an IC measuring device in an IC handling device has a flat portion on which the lead 10 of the IC 9 is placed and the IC 9 is placed, and a curved portion having a spring property between the flat portion and the base portion. The IC socket 3 includes a plurality of contacts to be formed, and a pusher 5 that descends against the repulsive force of the spring 7 by the pressure of the cylinder 8 and presses the lead 10 against the contact 4.

FIGS. 4 (a) and 4 (b) and FIGS. 5 (a) and 5 (b) are diagrams showing an IC measuring operation in the order of the IC measuring apparatus of FIG. When the IC 9 is measured by the IC measuring device of FIG. 3, first, as shown in FIG. 4A, the pusher 5 is lifted by the repulsive force of the spring 7, and the lead 10 of the IC 9 is put on the flat portion of the contact 4. Next, as shown in FIG. 4B, the cylinder is operated, the pusher 5 is lowered, and the lead 10 is pressed against the flat portion of the contact 4 to apply a constant pressure to bring the lead 10 into contact with the contact 4.

[0005] As shown in FIG.
Even if 0 has a warp, the flat portion of the pusher 5 is pressed against the lead 10 and the lead 10 is brought into contact with the flat portion of the contact 4 for measurement.

[0005]

However, the above-described conventional IC measuring apparatus has the following problems when the lead 10 is warped or bent as shown in FIG.

The first problem is that the conventional pusher 5
When the lead 10 is bent vertically as shown in FIG. 5 or when the IC 9 itself is inclined as shown in FIG. 5, the inclination between the pressing surface of the pusher 5 and the surface of the lead 10 is small. The contact pressure between the lead 10 and the contact 4 on both sides is not uniform, and the difference in the contact pressure causes variation in contact resistance. This can lead to unstable measurement results in tests on signals.

The second problem is that if the pusher and the lead contact only one side, the contact may be subjected to excessive force so that the other lead is deformed, and the contact may promote the deformation of the lead 9. In this case, even if the lead does not deform, the pusher and the lead come into contact with each other in an oblique direction, so that there is a problem that the pusher and the lead are rubbed and a fatal scratch is caused on the lead surface. .

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an IC measuring method and an apparatus for measuring the electrical characteristics of an IC by making the leads and the contact pins come into contact in a regular state even for an IC having a bent lead or an inclined lead. It is to be.

[0009]

SUMMARY OF THE INVENTION A feature of the present invention is that a plurality of leads, which are arranged from both sides of an outer shell of an IC and project outward, are mounted on contacts of an IC socket corresponding to the leads, and a roller member is mounted on the leads. This is an IC measuring method for measuring the electrical characteristics of the IC by applying a contact pressure between the lead and the contact by moving the roller member in a direction in which the lead extends while pressing and rotating the roller member.

Another feature is that the contact is provided with a tip portion on which the lead of the IC is placed and on which the IC is mounted, and a curved portion having a spring property is formed between the tip portion and a root portion. And the roller member is rotatably mounted, and the roller member is brought into contact with the lead as it descends, and the roller member is rotated while moving in the direction in which the lead extends, and the lead is attached to the contact. This is an IC measuring device including a pressing mechanism for pressing.

[0011]

Next, the present invention will be described with reference to the drawings.

FIGS. 1A and 1B are a partial cutaway view and an XX sectional view of an IC measuring apparatus according to an embodiment of the present invention. As shown in FIG. 1, this IC measuring device has a contact in which a lead 10 of an IC 9 is placed and a tip 4 on which the IC 9 is placed and a curved portion 4a having a spring property are formed between the tip and the base. IC socket 3 with 4
The movable portion 2a and the wedge portion 11 that rotatably mount the roller 1 by a ball bearing 1a and move in the direction in which the lead 10 extends as the wedge portion 11 descends.
And a pressing mechanism 2b configured to transmit the repulsive force of the spring 7 to the movable part 2a by the lowering of the pressing mechanism 2b.

The cylinder 8 is fixed to a gantry (not shown), and serves to move up and down the wedge portion 11 that slides on the stroke guide 6. Further, the wedge portion 11 which is lowered by the operation of the cylinder 8 applies a repulsive force of the spring 7 to the roller 1 via the pressing portion 2b and the movable portion 2a, and moves the movable portion 2a in the direction in which the lead 10 extends.
Move along. The roller 1 comes into contact with the lead 10 while rotating with the movement of the movable portion 2a.

FIGS. 2A and 2B are partial cross-sectional views showing the order of operation of the IC measuring apparatus of FIG. Next, a description will be given of an IC measuring method according to the present invention in accordance with the operation of the IC measuring apparatus shown in FIG. First, as shown in FIG. 2A, one of the leads 10 is bent on the contact 4 of the IC socket.
Put C9.

Next, as shown in FIG. 2B, the wedge portion 11 lowered by the cylinder gives the repulsive force of the spring 7 to the lead 10 to the roller 1 via the pressing portion 2b and the movable portion 2a. At the same time, the movable part 2a is moved in the direction of the arrow. As a result, the roller 1 descends from a position where it first comes into contact with the bent lead 10 on the right side of the paper surface to a position where it comes into contact with the contact 4 by pressing on the bent lead 10 while rolling. Then, at the lowering stop position of the roller 1, the bent lead 10 is corrected by the roller 1 and comes into contact with the contact 4 in the same state as the normal state of the left lead 10.

As described above, by moving the roller 1 having a certain pressing force due to the repulsive force of the spring 7 toward the tip of the lead 10 while rotating, the IC 9 having the bent lead 10 or the IC 9 placed obliquely is mounted. However, it is possible to correct the bending of the lead 10 or the posture of the IC without causing rubbing between the lead 10 and the roller 1, and the contact between the lead 10 and the contact 4 in a normal state becomes possible.

Although not shown in the drawings, the movable part 2
There is provided a return mechanism by a spring for returning a to its original position. The material of the roller 1 is the lead 1
Resin such as vinyl chloride, which is a soft material so as not to damage the zero, is desirable. Further, the sliding surface of the dovetail groove 12 on which the movable portion 2a slides is desirably coated with Teflon (vinyl hexafluoride) having a small coefficient of friction.

[0018]

As described above, the present invention is directed to a roller member for pressing a lead to a contact, and a pressing member for rotatably mounting the roller member and moving the roller member toward the leading end of the lead as the roller member is lowered. By providing a mechanism, when the lead is bent in the vertical direction,
Even if C itself is inclined, the roller member moves toward the tip of the lead while rotating, corrects the bend and posture, applies a constant contact pressure, and can measure the electrical characteristics and obtain stable results. . As a result, there is an effect that the measurement can be performed accurately without causing deformation or damage to the lead.

[Brief description of the drawings]

FIG. 1 is a partial cutaway view and an XX cross-sectional view of an IC measuring device according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view showing an operation order of the IC measuring device of FIG. 1;

FIG. 3 is a diagram showing an example of a conventional IC measuring device.

FIG. 4 is a diagram showing an IC measuring operation sequence of the IC measuring device of FIG. 3;

FIG. 5 is a diagram showing an IC measuring operation sequence by the IC measuring device of FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Roller 2 Pressing mechanism 2a Movable part 2b Pressing part 3 IC socket 4 Contact 4a Bending part 5 Pusher 6 Stroke guide 7 Spring 8 Cylinder 9 IC 10 Lead 11 Wedge part 12 Dovetail groove

Claims (2)

(57) [Claims] 1. A method of mounting a plurality of leads, which are arranged from both sides of an outer shell of an IC and projecting outward, on a contact of an IC socket corresponding to the lead, pressing a roller member on the lead and rotating the roller member. An IC measuring method, comprising: moving the lead in a direction in which the lead extends, applying a contact pressure to the lead and the contact, and measuring an electrical characteristic of the IC. 2. An IC socket having the contact, wherein a tip portion on which the lead of the IC is mounted and the IC is mounted and a curved portion having a spring property are formed between the tip portion and a root portion. A pressing mechanism that rotatably mounts the roller member, contacts the roller member with the lead as it descends, and rotates the roller member while moving in a direction in which the lead extends to press the lead against the contact; An IC measuring device comprising: