JP2822558B2 - Liquid crystal display device and method of manufacturing the same - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device used for a liquid crystal display of a liquid crystal television or an OA device, and a method of manufacturing the same.

[Related Art] In recent years, a liquid crystal display device has been able to obtain display performance comparable to a display device using a conventional cathode ray tube, and is widely used in televisions and displays instead of a cathode ray tube. The liquid crystal display device includes both a dot matrix type and an active matrix type, and each of them includes a circuit board on which a liquid crystal panel and electronic components are mounted, and a driving IC.

There are various types of driving circuit modules and various mounting methods for the driving circuit board. Generally, external connection terminals corresponding to the number of pixels are arranged on three or four sides of the liquid crystal panel.
A film carrier on which the driving IC is mounted is connected in a form that bridges the external connection terminals of the liquid crystal panel and the circuit board on which the electronic components are mounted.

In order to reduce the size of the liquid crystal display device, it is necessary to make the mounting area at the outer edge of the display area as small and thin as possible.

As a conventional example, a mounting form in a thin film transistor (TFT) active matrix type liquid crystal display device is shown in FIGS. 3 and 4 described in JP-A-63-253390. FIG. 3 is a side view of a conventional embodiment, and FIG. 4 is a side view before completion.

In the figure, (1) is a liquid crystal panel, (2) is a color filter substrate, (3) is a TFT array substrate, and an external connection terminal (4) connected to an internal pixel is provided at an edge of each side of the TFT array substrate. The number corresponding to the number of pixels is provided side by side. (5) is a film carrier in which a driving IC (6) is subjected to inner lead bonding (7), and outer leads (8) connected to the IC output are connected to external connection terminals (4) of the array substrate by an anisotropic conductive film. And the outer lead (9) connected to the IC input is soldered to the connection pad (10) of the circuit board (12). On the circuit board, in addition to the control IC that constitutes the control circuit of the drive IC, electronic components consisting of chip components such as resistor chips, capacitor chips, inductor chips, volume chips, and trimmer capacitors as noise reduction components (15) Is installed.

The film carrier (5) is provided with a plurality of voids (11) at a plurality of locations. As shown in FIG. 4, after connecting each side of the liquid crystal panel to external connection terminals of the panel and connection pads of a circuit board, As shown in FIG. 3, the liquid crystal panel (1), the circuit board (12), and the driving IC (6) are arranged in a multi-layered manner such that the circuit board is positioned at the middle stage by being bent inward in the gap. The circuit boards on each side are interconnected by connection leads. The circuit board (12) has a portion that does not overlap with either the liquid crystal panel (1) or the film carrier (5), and a tall electronic component (15) is attached to this portion.

[Problem to be Solved by the Invention] According to the above configuration, since the driving IC mounted on the circuit board and the film carrier is arranged below the liquid crystal panel, although there is an advantage that the mounting dimension of the outer edge of the display area can be reduced, After connecting the outer lead of the film carrier, it is bent so as to be wound up in the gap (11) provided in the base film (13), and furthermore, it is necessary to connect with the connecting lead between the circuit boards connected to each side, so assembling. Poor workability.
In addition, the bent gap portion has a low mechanical strength because there is no base film, and when the pattern width of the wiring pattern (14) of the film carrier decreases with the number of connection terminals, not only there is a risk of disconnection, but also Since the conductor is exposed, there has been a problem that the electrical insulation is reduced when the pattern interval is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a compact liquid crystal display device which has good assembling workability and does not deteriorate electrical insulation, and a method of manufacturing the same.

[Means for Solving the Problems] A liquid crystal display device according to the present invention includes a liquid crystal panel, a circuit board, a film carrier on which electronic components and a driving IC are mounted. Connected by a film carrier, the above circuit board is provided with a liquid crystal panel storage recess on the upper surface and a driving IC on a predetermined surface.
It is constituted by a three-dimensional frame provided with a storage recess and an electronic component storage recess.

The method for manufacturing a liquid crystal display device according to the present invention includes a liquid crystal panel, a plurality of film carriers on which electronic components and a driving IC are mounted, a liquid crystal panel housing concave portion on an upper surface, and a driving
The method includes the following steps (a) to (d) using an IC housing recess and a circuit board formed of a frame having an electronic component housing recess on the lower surface.

(A) Connect the lead of the film carrier to the connection terminal of the liquid crystal panel. (B) Place the liquid crystal panel in the liquid crystal panel storage recess of the circuit board. (C) Drive the film carrier by bending it along the side surface of the frame. The IC is stored in the driving IC storage recess. (D) The film carrier is bent along the lower surface of the frame to connect the lead of the film carrier to the circuit board. [Function] In the present invention, the IC is provided on the upper surface of the circuit board. A liquid crystal panel is disposed in the liquid crystal panel storage recess, and a drive IC is stored in a drive IC storage recess provided on a predetermined surface, and an electronic component is stored in the electronic component storage recess.

In another invention, a lead of a film carrier is connected to a connection terminal of a liquid crystal panel (step a), the liquid crystal panel is placed in a liquid crystal panel storage recess of a circuit board (step b), and the film carrier is placed on a side surface of the frame. The drive IC is folded in the drive IC storage recess (step c), and the film carrier is bent along the lower surface of the frame to connect the lead of the film carrier to the circuit board (step e). Therefore, since the driving IC and the circuit board are not disposed at the outer edge of the display area, the mounting structure of the driving circuit can be made compact.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing a state in which a liquid crystal panel having a plurality of film carriers connected to three sides is placed in a concave portion above a frame body. FIG. 2 is a side view of the liquid crystal display device after the outer lead connection of the film carrier is completed.

In the figure, (1) is a liquid crystal panel and a TFT array substrate (3)
And a color filter substrate (2) are integrated with a seal (20), and a liquid crystal (21) is filled between the two substrates. On the array substrate, an external connection terminal (4) connected to the source line or gate line of the internal TFT is formed,
Outer leads (8) of the film carrier (5) are connected by an anisotropic conductive film. A drive IC (6) is subjected to inner lead bonding (7) on the film carrier. (30) is a frame circuit board, a concave portion (31) for storing the liquid crystal panel on the upper surface of the frame, and a driving side on the side of the frame.
A concave portion (32) for accommodating an IC and a concave portion (33) for accommodating an electronic component are formed on a lower surface of the frame body. A wiring pattern (14) constituting a control circuit of the driving IC (6) is formed on the lower surface of the frame.

The film carrier connected to the external connection terminal of the liquid crystal panel is driven into the recess on the side of the frame at the upper corner of the frame
It is bent at a right angle with the IC stored, and the outer leads of the film carrier are soldered to connection pads on the surface of the frame. Further, the driving IC (6) housed in the concave portion on the side surface of the frame is coated with a protective coat (34).

The frame circuit board of the present invention is made of, for example, an injection-molded resin obtained by transferring a film on which a conductor pattern is formed in a mold, and a desired conductor pattern is formed on the surface of the frame and a part of the concave portion. A recess for mounting the liquid crystal panel on the top of the frame, and a film carrier drive IC on the side of the frame
A recess for accommodating chip components, and a recess for accommodating a chip component on the lower surface of the frame body, and a depth of the concave portion where the chip component connected to the wiring pattern transferred in the recess does not protrude from the frame circuit board. have.

In the mounting procedure, first, the various chip components described above are electrically connected to the wiring pattern in the concave portion of the frame circuit board having the concave portion formed at a desired position. Next, after the outer leads of the plurality of film carriers are mounted on the liquid crystal panel connected to the external connection terminals in the concave portions on the upper portion of the frame circuit board, the film carriers are moved along the frame into the concave portions on the side surfaces of the frame. The liquid crystal panel is bent at right angles to the lower part of the liquid crystal panel so as to accommodate the driving IC, and then the film carrier is bent on the lower surface of the frame, and the outer leads are connected to connection pads formed on the surface of the frame. Next, the assembly is completed by applying an IC protective coat to the concave portion on the side of the frame housing the drive IC.

In the above embodiment, a three-dimensional injection molded resin substrate in which a wiring pattern is transferred in a mold is used as the frame circuit substrate. However, a resin substrate or a metal base substrate made of aluminum or the like by another three-dimensionally molded manufacturing method is also used. Applicable.

Further, in the above-described embodiment, the accommodating concave portion of the driving IC or the accommodating concave portion of the electronic component is arranged on the side surface or the lower surface of the frame circuit board. It may be arranged on the lower surface or the side surface.

[Effects of the Invention] As described above, according to the present invention, the circuit board described above is provided with a liquid crystal panel housing recess on the upper surface and a driving surface on a predetermined surface.
Since it is constituted by a three-dimensional frame provided with the IC housing recess and the electronic component housing recess, a compact liquid crystal display device can be realized.

Further, according to another invention, a step a of connecting a lead of the film carrier to a connection terminal of the liquid crystal panel, a step b of placing the liquid crystal panel in the liquid crystal panel housing recess of the circuit board, and placing the film carrier on the side of the frame body. Fold along and drive
A step c for accommodating the IC in the driving IC accommodating recess and a step e for connecting the lead of the film carrier to the circuit board by bending the film carrier along the lower surface of the frame are provided. Since it is not necessary to bend the film carrier after the connection or to interconnect the circuit boards on each side with leads, there is an effect that the assembling workability of the drive circuit portion of the liquid crystal display device is good, and the mounting is highly reliable and compact.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a state in which a liquid crystal panel having a plurality of film carriers connected to three sides is placed in a recess at the top of a frame, and FIG. 2 is a liquid crystal display device after the film carrier has been connected to outer leads. FIG. 3 is a side sectional view showing a conventional example, and FIG. 4 is a side view showing a state before bending the film carrier of FIG. In the figure, (1) is a liquid crystal panel, (2) is a color filter substrate, (3) is a TFT array substrate, (4) is an external connection terminal, (5) is a film carrier, (6) is a driving IC,
(7) is an inner lead bonding, (8) is an outer lead connected to an IC output, (9) is an outer lead connected to an IC input, (10) is a connection pad, (11) is a gap, and (12) is a circuit board. , (13) is the base film, (1
4) is a wiring pattern, (15) is an electronic component, (20) is a seal, (21) is a liquid crystal, (30) is a frame circuit board, (31) is a liquid crystal panel storage recess, and (32) is a driving IC. Storage recess, (33)
Denotes an electronic component storage recess, and (34) denotes a protective coat. In the drawings, the same reference numerals indicate the same or corresponding parts.

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hayato Takasago 8-1-1, Tsukaguchi Honcho, Amagasaki City, Hyogo Prefecture, Mitsubishi Materials Corporation Materials Research Laboratory (58) Field surveyed (Int. Cl. ⁶ , DB name) G02F 1/1333 G02F 1/1345

Claims (2)

(57) [Claims] 1. A liquid crystal display device comprising a liquid crystal panel, a circuit board, a film carrier on which electronic components and a driving IC are mounted, and having a structure in which the liquid crystal panel and the circuit board are connected by a plurality of film carriers. A liquid crystal display device characterized in that the circuit board is constituted by a three-dimensional frame having a liquid crystal panel housing recess on an upper surface and a driving IC housing recess and an electronic component housing recess on a predetermined surface. . 2. A liquid crystal panel, a plurality of film carriers on which electronic components and drive ICs are mounted, a liquid crystal panel storage recess on an upper surface, a drive IC storage recess on a side surface, and an electronic component storage recess on a lower surface. A method for manufacturing a liquid crystal display device, comprising the following steps (a) to (d) using a circuit board formed of a frame. (A) Connect the lead of the film carrier to the connection terminal of the liquid crystal panel. (B) Place the liquid crystal panel in the liquid crystal panel storage recess of the circuit board. (C) Drive the film carrier by bending it along the side surface of the frame. Store the IC in the drive IC storage recess. (D) Bend the film carrier along the lower surface of the frame and connect the lead of the film carrier to the circuit board.