JPH1074550A - Equipment with connector and liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an equipment having a connector, and a liquid crystal display device, which reduces the emission of unnecessary radiation waves to cause electromagnetic interference(EMI) or the entry of unnecessary radiation waves from the outside of the device and improves EMI measures for the parts of the connector. SOLUTION: In such a liquid crystal display device that a connector CTa provided on a flexible board FPC is fitted to a connector CTb provided on a printed board PCB and the flexible board FPC is electrically connected to the printed board PCB, the outer peripheries of the connectors CTa, CTb are coated with a conductive connector shield SHC and the connector shield SHC is electrically connected to either of a ground line or a power line for the flexible board FPC or the printed board PCB.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to various devices having a wiring structure such as a printed circuit board having a connector, a flexible printed circuit (FPC), and a liquid crystal display for driving a liquid crystal. The present invention relates to a liquid crystal display device provided with a connector for connecting electronic circuits such as a printed circuit board and an FPC mounted on an outer peripheral portion of an element.

[0002]

2. Description of the Related Art A hard printed circuit board made of, for example, glass epoxy or the like, provided with a connector, and an FP made of a flexible material
C and the like are built in various devices and devices. Hereinafter, a liquid crystal display device (that is, a liquid crystal display module) will be described as an example of the devices and apparatuses.

In a liquid crystal display device, for example, two transparent insulating substrates made of glass or the like are overlapped with a predetermined gap therebetween so that the surfaces on which a transparent electrode for display and an alignment film and the like are laminated face each other. The two substrates are bonded together by a sealing material provided in a frame shape (a square shape) near the peripheral portion between the two substrates, and the inside of the sealing material between the two substrates is inserted through a liquid crystal sealing opening provided in a part of the sealing material. A liquid crystal display element comprising a liquid crystal sealed and sealed, and a polarizing plate provided outside both substrates (ie,
Liquid crystal display panel, LCD: a liquid crystal display, a backlight disposed below the liquid crystal display element to supply light to the liquid crystal display element, and a liquid crystal disposed outside the outer periphery of the liquid crystal display element. A liquid crystal driving circuit board arranged on substantially the same plane as the display element, a frame-shaped body which is a molded product holding these members, and a metal shield housing these members and opening a display window. It is configured to include a case (frame) and the like.

[0004] Such a conventional liquid crystal display device has the following features.
For example, Japanese Patent Publication No. Sho 60-19474 and Japanese Utility Model Laid-Open No. 4-22
780.

FIG. 10 is a sectional view of an essential part of an example of a conventional liquid crystal display device.

In the figure, PNL is a liquid crystal display element, FP
C is a liquid crystal driving flexible board (flexible printed circuit), PCB is a liquid crystal driving printed board, CTa is a connector provided on the flexible board FPC, and CTb is a connector provided on the printed board PCB.

[0007] A flexible substrate FPC which is arranged on the outer periphery of two to four sides of the liquid crystal display element PNL and is divided one by one
(Circuit board-to-board connector, ie, stacking connector) C for electrically connecting a plurality of liquid crystal driving circuit boards composed of a PCB and a printed circuit board PCB.
Ta and CTb are used. Although not shown, for example, the connector CT provided on the flexible substrate FPC
a is a male connector CT provided on the printed circuit board PCB
b is a female relationship, and the connector CTa is inserted into the connector CTb and is electrically connected.

[0008]

As the definition of the liquid crystal display element becomes higher, the circuit board for driving the liquid crystal of the liquid crystal display element tends to be densely wired and electronic components are mounted at a high density. In the case of a multilayer circuit board with high-density wiring and high-density component mounting, the area allowed for forming a wiring pattern on the circuit board is reduced, and it is difficult to obtain a sufficiently large ground line formed on the circuit board. ing. If the ground line is not sufficiently wide, the EMI (Electro-Magnetic Interface) causes intrusion from the outside of the device or unnecessary display quality due to unnecessary radiated radio waves (ie, noise) generated inside the device. (Electro Magnetic Interference),
(Electromagnetic interference). Note that the driving frequency of the liquid crystal display device is increasing year by year, and prevention of noise is particularly important.

Conventionally, as a countermeasure against EMI, in a circuit board such as an FPC or a printed board, matching of the impedance of wiring is performed, and a component such as a filter is additionally mounted. However, particularly, unnecessary radiation waves causing EMI are emitted from the portions of the connectors CTa and CTb shown in FIG. 10, or unnecessary radiation waves enter from the outside of the device, thereby deteriorating the display quality. was there. In contrast, conventionally, no EMI countermeasures have been taken for the connector, and EMI countermeasures have been insufficient.

[0010] The object of the present invention is to provide an E
To provide a device equipped with a connector that can reduce unnecessary emission of electromagnetic waves that cause MI or intrusion of unnecessary radiation from the outside of the device, and can enhance EMI countermeasures at the connector. is there.

Another object of the present invention is to prevent unnecessary radiated radio waves which cause EMI from being emitted from a connector portion for connection between boards or the like, or that unnecessary radiated radio waves enter from outside the apparatus. EM of connector part can be reduced
It is an object of the present invention to provide a liquid crystal display device capable of strengthening the measures for I and obtaining stable display quality.

[0012]

In order to solve the above-mentioned problems, a device provided with a connector according to the present invention is characterized in that, in a device provided with a connector, an outer periphery of the connector is covered with a conductor.

Further, according to the liquid crystal display device of the present invention, in a liquid crystal display device in which a first circuit board and a second circuit board are electrically connected via a connector, an outer periphery of the connector is covered with a conductor. It is characterized by the following.

Further, the invention is characterized in that the conductor is electrically connected to a ground line or a power supply line.

In the present invention, the outer periphery of the connector is covered with a conductor, and furthermore, the conductor is electrically connected to a ground line or a power supply line.
Unnecessary radiated radio waves that cause EMI to be emitted from the connector portion, or unnecessary radiated radio waves entering from outside the device can be reduced. Therefore, in a display device such as a liquid crystal display device, stable display quality can be obtained.

[0016]

Embodiments of the present invention will be described below in detail. Here, among various devices equipped with a connector, a liquid crystal display device will be described as an example.
This is merely an example, and it is a matter of course that the present invention is not limited to this. In the drawings described below, those having the same functions are denoted by the same reference numerals, and the description thereof will not be repeated.

Embodiment 1 FIG. 1 is a sectional view of a main part of a liquid crystal display device (ie, a liquid crystal display module) according to an embodiment of the present invention.

In the figure, PNL is a liquid crystal display element, FP
C is a liquid crystal driving flexible board (flexible printed circuit), PCB is a liquid crystal driving printed board, CTa is a connector provided on the flexible board FPC, CTb is a connector provided on the printed board PCB, and SHC is a connector CTa, CTb. This is a connector shield for EMI countermeasures whose outer periphery is covered with a conductor.

A flexible substrate FPC which is disposed on the outer periphery of two to four sides of the liquid crystal display element PNL and is divided one by one
(Circuit board-to-board connector, ie, stacking connector) C for electrically connecting a plurality of liquid crystal driving circuit boards composed of a PCB and a printed circuit board PCB.
Ta and CTb are used. Although not shown, for example, the connector CTa provided on the flexible substrate FPC
Is male, connector CTb provided on printed circuit board PCB
Is a female relationship and the connector CTa is the connector C
It is inserted into Tb and is electrically connected.

The material of the connector shield SHC is as follows.
For example, a conductor such as copper, aluminum, and phosphor bronze can be used. The connector shield SHC is formed by pressing a metal plate so as to conform to the outer shape of the connectors CTa and CTb.
b. Alternatively, connectors CTa, CT
b may be provided by coating a conductor on the outer periphery,
The conductor may be provided by plating.

Although not shown, the connector shield SHC is made of a flexible board FPC or a printed board P.
It is electrically connected to either the ground line or the power supply line of the CB. For example, connector shield SHC
Is mounted, a part of the ground line or the power supply line is formed on one or both of the flexible printed circuit board FPC and the printed circuit board PCB so that the connector shield SHC and one of the ground line and the power supply line are in contact with each other. I have. In this case, the mounted connector shield SHC may be soldered to a part of the ground line or the power supply line. Of course, the terminals of the connectors CTa and CTb and other wiring of the flexible printed circuit board FPC and the printed circuit board PCB are not in contact with each other.

In the present embodiment, the connectors CTa, CT
b is covered with a connector shield SHC made of a relatively inexpensive material such as a metal plate, and the connector shield SHC is connected to a ground line or a power supply line.
It is possible to reduce the emission of unnecessary radiation waves that cause MI or the intrusion of unnecessary radiation waves from the outside of the device, and it is possible to enhance the EMI countermeasures at the connector. Therefore, stable display quality can be obtained on the liquid crystal display screen. Further, connector C
The support force of Ta and CTb can be strengthened. As a result, the reliability of the product can be improved.

If the liquid crystal display module has a plurality of connectors, it is of course desirable to cover all the connectors with the connector shield SHC.

Embodiment 2 In an active matrix type liquid crystal display device, of two transparent insulating substrates made of glass or the like which are arranged to face each other with a liquid crystal layer interposed therebetween, the surface of one of the glass substrates on the liquid crystal layer side. A gate line group extending in the x direction and juxtaposed in the y direction, and a drain line group extending in the y direction insulated from the gate line group and juxtaposed in the x direction are formed. Have been. Each region surrounded by the gate line group and the drain line group is a pixel region, and a switching element, for example, a thin film transistor (TFT) and a transparent pixel electrode are formed in the pixel region. When the scanning signal is supplied to the gate line, the thin film transistor is turned on, and a video signal from the drain line is supplied to the pixel electrode through the turned on thin film transistor. In addition, each of the drain lines of the drain line group, as well as each of the gate lines of the gate line group, extend to the periphery of the transparent insulating substrate to form an external terminal, which is connected to the external terminal. Video drive circuit, gate scan drive circuit,
That is, a plurality of driving ICs (semiconductor integrated circuits) constituting these are externally mounted around the transparent insulating substrate. That is, a plurality of tape carrier packages (TCPs) each mounting these driving ICs are externally provided around the substrate.

However, since the transparent insulating substrate is configured such that a TCP on which a driving IC is mounted is externally attached to the periphery thereof, the gate line group and the drain of the transparent insulating substrate are formed by these circuits. The area occupied by a region (usually called a frame) between the outline of the display region formed by the intersection region with the line group and the outline of the outer frame of the transparent insulating substrate increases, and the liquid crystal display This is contrary to the desire to reduce the external dimensions of the module. Therefore, in order to solve such a problem as much as possible, that is, in order to increase the density of the liquid crystal display element and to reduce the outer shape of the liquid crystal display module as much as possible, it is not necessary to use TCP parts, A configuration has been proposed in which an IC and a gate scanning drive IC are directly mounted on a transparent insulating substrate. Such a mounting method is called a flip chip method or a chip-on-glass (COG) method.

Although it is not a known example, the same applicant has applied to the flip-chip type liquid crystal display device.
Prior application for module mounting method (Japanese Patent Application No. 6-2)
56426). Hereinafter, a flip-chip type liquid crystal display device (liquid crystal display module) will be described in detail with reference to the drawings.

<< Overall Configuration of Liquid Crystal Display Module >> FIG.
3 is an exploded perspective view of the liquid crystal display module MDL.

SHD is a shield case (also called a metal frame) made of a metal plate, WD is a display window, SPC1
4 are insulating spacers, FPC1 and 2 are bent multilayer flexible circuit boards (FPC1 is a gate side circuit board, FPC2 is a drain side circuit board), PCB is an interface circuit board, and ASB is an assembled liquid crystal display with a drive circuit board. A liquid crystal display element (also referred to as a liquid crystal display panel) in which a driving IC is mounted on one of two superposed transparent insulating substrates, GC1 and G
C2 is a rubber cushion, PRS is a prism sheet (2
), SPS is a diffusion sheet, GLB is a light guide plate, RFS is a reflection sheet, MCA is a lower case (mold case) formed by integral molding, LP is a fluorescent tube, LPC is a lamp cable, and LCT is a connection for an inverter. Connector, G
B is a rubber bush that supports the fluorescent tube LP, and the members are stacked in a vertical arrangement as shown in the figure to assemble the liquid crystal display module MDL.

<< EMI shield connector shield SHC >>
FIG. 2 is a cross-sectional view (a cross-sectional view taken along line AA in FIG. 5 described later) of a main part of a liquid crystal display module according to another embodiment of the present invention.

In the figure, FPC2 is a liquid crystal driving drain side flexible substrate (flexible printed circuit), PCB is a liquid crystal driving interface circuit board, CT4 is a connector provided on the flexible substrate FPC, and CT2 is provided on the interface circuit board PCB. Connector, ERH is flexible board FPC2
And a solid or mesh pattern covering the surface of the interface circuit board PCB (to be described in detail later);
HC is a connector shield for EMI measures formed by covering the outer periphery of the connectors CT4 and CT2 with a conductor.

To electrically connect the drain-side flexible board FPC and the interface circuit board PCB, which will be described in detail later, connectors (board-to-board connectors, ie, stacking connectors) CT4 and CT2 are used.
Is used. The connector CT4 provided on the flexible board FPC has a male relationship (see FIG. 6A), the connector CT2 provided on the interface circuit board PCB has a female relationship (see FIG. 7), and the connector CT4 is connected to the connector CT2. Inserted and electrically connected.

As in the first embodiment, as the material of the connector shield SHC, a conductor such as copper, aluminum, phosphor bronze or the like can be used. The connector shield SHC may be formed by pressing a metal plate so as to conform to the external shape of the connectors CT4 and CT2, for example, and inserted into the connector. Alternatively, a conductor may be provided on the outer periphery of the connector by coating or plating.

Although not shown, the connector shield SHC is electrically connected to any one of the ground line and the power supply line of the flexible board FPC2 and the interface circuit board PCB. That is, for example, when the connector shield SHC is mounted, a part of the ground line or the power supply line is formed on one or both circuit boards so that the connector shield SHC and one of the ground line and the power supply line are in contact with each other. ing. In this case, the mounted connector shield SHC and a part of the ground line or the power supply line may be soldered. Of course, connectors CT4, CT2
Terminal and other wiring on the circuit board.

In the present embodiment, the connectors CT4, CT
2 is covered with a connector shield SHC made of a relatively inexpensive material such as a metal plate, and the connector shield SHC is connected to a ground line or a power supply line.
It is possible to reduce the emission of unnecessary radiation waves that cause MI or the intrusion of unnecessary radiation waves from the outside of the device, and it is possible to enhance the EMI countermeasures at the connector. Therefore, stable display quality can be obtained on the liquid crystal display screen. Further, connector C
The supporting force of T4 and CT2 can be strengthened. As a result, the reliability of the product can be improved.

<< Multilayer Flexible Substrates FPC1, 2 >> FIG. 4 is a rear view of a liquid crystal display device with a drive circuit board on which an interface circuit board PCB is mounted.

FIG. 5 shows a state where the shield case SHD is placed below and the flexible boards FPC1, 2 and the interface circuit board PCB are mounted.
2 and the liquid crystal display element PNL is shielded with the shield case S.
It is a rear view of the state stored in HD.

The IC chips on the left six flexible substrates FPC1 shown in FIG. 3 are a driving IC chip on the vertical scanning circuit side and a lower IC chip on the flexible substrate FPC2.
Each is a driving IC chip on the video signal driving circuit side, and is mounted on a transparent insulating substrate by chip-on-glass (COG) using an anisotropic conductive film or an ultraviolet curing agent. In the conventional method, a tape carrier package (TCP) in which a driving IC chip is mounted by a tape automated bonding method (TAB) is connected to a liquid crystal display element PNL using an anisotropic conductive film. In the COG mounting, since the direct drive IC is used, the TAB process is not required and the process is shortened, and the tape carrier is not required, so that there is also an effect of cost reduction. Furthermore, COG mounting is
It is suitable as a mounting technology for the high-density liquid crystal display element PNL. That is, in this example, the SVGA panel is 800
× 3 × 600 dots 12.1-inch screen size TF
A T liquid crystal display module was designed. Therefore, the size of each of the red (R), green (G), and blue (B) dots is 3
07.5 μm (gate line pitch) × 102.5 μm (drain line pitch), and one pixel has red (R),
307.5 combinations of three dots of green (G) and blue (B)
It is a μm square. Therefore, the drain line drawer D
If the TM is 800 × 3, the lead line pitch is 10
This is less than 0 μm, which is less than the connection pitch limit of currently available TCP mounting. On the other hand, in COG mounting,
Although it depends on the material of the anisotropic conductive film or the like to be used, about 70 μm in the pitch of the bumps of the driving IC chip and about 50 μm square in the intersection area with the underlying wiring can be said to be the minimum values currently usable. For this reason, in this example, the drain driver ICs are arranged in a line on one long side of the liquid crystal display element PNL, and the drain line is drawn out on one long side. Therefore, the pitch of the bumps of the driving IC chip is set to about 70 μm.
In addition, the crossing area with the underlying wiring can be designed to be about 50 μm square, and the connection with the underlying wiring can be more highly reliable.
Since the gate line pitch is sufficiently large as 307.5 μm, the gate line lead-out GTM is drawn out on one short side. However, when the definition is further increased, the gate line lead-out line GTM is placed on two opposing short sides. It is also possible to draw out alternately.

In the method in which the drain line or the gate line is alternately drawn, as described above, the connection between the lead line DTM or GTM and the output side of the driving IC becomes easy, but the peripheral circuit substrate is opposed to the liquid crystal display element PNL. In this case, it is necessary to dispose them on the outer periphery of the two long sides. In particular, when the number of display colors increases, the number of data lines of display data increases, and the outermost shape of the information processing apparatus increases. For this reason, in this example, the conventional problem is solved by using a multilayer flexible substrate and extracting the drain line to only one side.

FIG. 6A shows the back surface (lower surface) of the multilayer flexible substrate FPC2 for driving the drain driver.
FIG. 2B is a front (top) view.

The flexible substrates FPC1 and FPC2 shown in FIG.
, The length of the output terminal TM is usually designed to be about 2 mm in order to secure connection reliability. However, since the long sides of the flexible substrates FPC1 and FPC2 are as long as 170 to 264 mm, positional displacement including slight rotation in the long axis direction causes positional displacement between the input terminal wiring Td and the output terminal TM, resulting in poor connection. there is a possibility. The alignment between the liquid crystal display element PNL and the flexible substrates FPC1 and FPC2 is performed by inserting the opening holes FHL opened at both ends of each substrate into the fixing pins and then aligning the input terminal wiring Td and the output terminal TM at several places. Can be. However, in this example, in order to further improve the alignment accuracy, the alignment marks ALMG, ALMD
Are provided for each protruding portion FSL.

As inputs to the gate driver driving IC,
There are a total of 24, and each is electrically connected to the output terminal TM. The pitch PG of the terminals TM is about 500 μm. The alignment mark ALMG is positioned in the vicinity of the 24 terminals TM to each drive IC, and the alignment accuracy with the input terminal wiring Td pattern is improved and inspection after connection is performed. In this example, in order to improve connection reliability, a dummy line is provided at a position adjacent to the 20 input terminals TM, and a square-shaped alignment mark ALMG is formed by pattern connection with the dummy line. Positioning is performed so that the square fill pattern on the opposing transparent substrate SUB1 fits within the square of the square.

Next, the shape of the conductor layer portion FSL of two or less layers will be described.

The protruding length of the portion FSL composed of a single-layer or two-layer conductor wiring is set to about 3.7 mm in this embodiment because a bent portion is provided. However, in a structure that is not bent, the portion FSL can be further shortened.

The projecting shape of the portion FSL was a convex shape separated for each driving IC. Thus, the thermal expansion flexible substrate in the longitudinal direction at the time of thermocompression bonding of a heat tool, the pitch P _G and P _D are changed in the terminal TM, it can prevent a phenomenon in which peeling or poor connection occurs between the connection terminals Td.
That is, by the convex shape separated for each drive IC, it is possible to the thermal expansion amount corresponding to the length of the pitch P _G and P _D cycle also each driver IC shift up to the terminal TM. In this example, the flexible substrate is formed into a convex shape separated into ten parts in the major axis direction, and the amount of thermal expansion can be reduced to about 1/10.
Liquid crystal module M
DL reliability can be improved.

As described above, the alignment mark AL
By providing the MG and the ALMD and making the protruding shape of the portion FSL into a convex shape separated for each driving IC, even if the number of connection wirings and the number of display data increase, the connection reliability is ensured with high accuracy. The peripheral drive circuit can be reduced.

Next, three or more conductor layer portions FML will be described.

Chip capacitors CHG and CHD are mounted on the conductor layer portions FML of the FPCs 1 and 2. That is, in the gate-side substrate FPC1, the ground potential Vss
(0 volts) and the power supply Vdg (10 volts) or between the power supply Vsg (5 volts) and the power supply Vdg, six chip capacitors CHG are soldered. Further, in the drain-side substrate FPC2, the ground potential Vss and the power supply V
A total of ten chip capacitors CHD are soldered between dd (5 volts or 3.3 volts) or between the ground potential Vss and the power supply Vdd. These capacitors CHG and CHD are for reducing noise superimposed on the power supply line.

In this example, these chip capacitors CH
D was soldered to only one surface conductor layer L1 and was designed so as to be located entirely under the transparent insulating substrate SUB1 after bending. Therefore, it is possible to mount a power supply noise smoothing capacitor on the substrates FPC1 and FPC2 while keeping the thickness of the liquid crystal module MDL constant.

Next, a method of reducing high-frequency noise generated from the information processing apparatus will be described.

Since the metal shield case SHD side is the front side of the liquid crystal module MDL and the front side of the information processing equipment, the generation of EMI (Electro Magnetic Interference) noise from this surface is not applicable to external equipment. Causes major environmental problems.

For this reason, in this example, the surface layer L1 of the conductor layer portion FML is covered with a solid or mesh pattern ERH of a DC power source as much as possible. Mesh ME
The SH is composed of a large number of holes having a diameter of about 300 μm formed in the surface conductor layer L1, and the mesh pattern ERH covers almost the entire surface except for the through holes VIA and the capacitor components CHD.

Further, as shown in FIG. 6B, the pattern EGP in which the pattern ERH is exposed from the solder resist SRS is arranged at five places on the drain-side substrate FPC2, and a frame ground HS (FIG. ), The EMI noise is reduced by soldering to the ground FGF of the shield case SHD. That is, as in this example, when the circuit board is divided into a plurality, if at least one portion of the drive circuit board is connected to the frame ground in terms of direct current, no electrical problem occurs, If there are few places in the high frequency region, the reflection of electric signals, the potential of the ground wiring will fluctuate due to differences in the characteristic impedance of each drive circuit board, etc.
The generation potential of unnecessary radiated radio waves causing EMI increases. In particular, in an active matrix type module MDL using thin film transistors, a high-speed clock is used, so that EMI countermeasures are difficult. To prevent this, the ground wiring (AC ground potential) is connected to the common frame (that is, the shield case SHD) having a sufficiently low impedance at at least one location, in this example, five locations, on the drain driver substrate FPC2. Through the frame ground HS, the ground wiring in the high frequency region is strengthened. Therefore, compared with the case where the shield case SHD is connected at only one place as a whole, the electric field strength of the five places in this example is greatly reduced due to the electric field intensity of radiation. Improvements have been seen.

<< Interface Circuit Board PCB >> FIG.
FIG. 3 is a back (lower) view of an interface circuit board PCB having functions of a controller unit and a power supply unit.

In this example, a six-layer multilayer printed circuit board made of a glass epoxy material was used as the substrate PCB. Although a multi-layer flexible substrate can be used, this portion did not employ a bent structure, so that a relatively low-cost multi-layer printed circuit board was used.

All the electronic components are mounted on the lower surface side of the substrate PCB, which is the back side when viewed from the information processing apparatus. One integrated circuit element TCON is arranged on a substrate for a display control device. The integrated circuit element TCON is not housed in a package, and is formed by mounting an integrated circuit IC directly on a printed circuit board in a ball grid array. The interface connector CT1 is located substantially at the center of the board, and further includes a plurality of resistors, capacitors, and high-frequency noise removing circuit components EMI.

The hybrid integrated circuit HI is formed by hybridizing a part of the circuit and mounting a plurality of integrated circuits and electronic components mainly for forming a power supply on the upper and lower surfaces of a small circuit board. One is mounted on the interface circuit board PCB. As shown in the figure,
The leads of the hybrid integrated circuit HI are formed long, and a plurality of electronic components EP including TCON and the like are also mounted on the circuit board PCB between the circuit board PCB and the hybrid integrated circuit HI.

Further, means JN1 for electrically connecting gate driver board FPC1 to interface circuit board PCB.
, The connector CT3 is used in this example.

The reason why the connector CT3 is used is that even if the number of pixels and the number of display colors are increased and the pitch between wirings is narrowed, the electrical connection with the flexible substrate FPC1 can be made with high reliability.

The upper surface of the substrate PCB is on the front side when viewed from the information processing apparatus, and is in a direction in which the potential at which EMI noise is radiated most is high. For this reason, in this example, the multilayer surface conductor layer is almost entirely covered with the solid or mesh pattern ERH of the ground. Under the solder resist SRS, a mesh pattern ERH of a copper conductor is formed so as to cover the entire surface except for the through holes VIA. This pattern ERH can reduce EMI noise radiation by being electrically connected to the ground pattern GND on the lower surface of the substrate PCB. Note that the ground pattern G
The ND is connected to the ground on the main body side by connecting the ground GND of the board PCB and the ground FGN of the shield case SHD and soldering the ground coming from the connector CT1.

In this embodiment, the length of the interface circuit board PCB is 172.3 mm and its width is 13.1 mm.

As described above, the flexible substrate FPC
In both 1 and 2, the surface conductor layer of the substrate is covered with the pattern ERH, and the outer peripheral portions of the two sides of the liquid crystal display element PNL are all fixed at DC potential, effectively reducing EMI noise radiation from the inside of the substrate. Can be done.

<< Liquid crystal display element ASB with drive circuit board >>
Next, a method of bending and mounting the flexible substrate will be described.

FIG. 8 is a perspective view showing a method of bending and mounting a multilayer flexible substrate. Drain driver board F
The connection between the PC2 and the gate driver board FPC1 is made by using a flat connector CT4 provided as a joiner at the tip of a protruding portion JT2 formed of a flexible board integrated with the FPC2, and bending the interface board P shown in FIG.
It is electrically connected to the connector CT2 of the CB.

Next, a double-sided tape BAT is attached to the surface of the flexible printed circuit board FPC2 where no component is mounted on the conductor layer portion FML.
(See FIG. 4), and using a jig, the conductor layer portion BN
Bend at T.

The width of the used double-sided tape BAT is 3 mm, and the length is 160 to 240 mm.
It suffices if adhesiveness can be ensured, and a short shape may be attached at several places. Further, the double-sided tape BAT may be pasted on the transparent insulating substrate SUB1 side in advance.

As described above, the multilayer flexible substrate FPC2 can be accurately bent by using the jig, and can be bonded to the surface of the transparent insulating substrate SUB1.

<< Information Processing Implementing Liquid Crystal Display Module MDL >> FIG. 9 is a perspective view of a notebook personal computer or a word processor equipped with the liquid crystal display module MDL. Here, a case is shown where the inverter IV is arranged in the display unit, that is, in the inverter storage unit MI of the liquid crystal display module MDL.

The CO on the liquid crystal display element PNL of the driving IC
By adopting a multi-layered flexible substrate as the G mounting and the peripheral circuit for the drain and gate driver in the outer peripheral portion and employing the bending mounting for the drain driver circuit, the outer size can be greatly reduced as compared with the conventional case. In this example, since the drain driver peripheral circuit mounted on one side can be arranged above the display section above the hinge of the information device, compact mounting is possible.

First, a signal from an information device goes to a display control integrated circuit element (TCON) from a connector located substantially at the center of the left interface board PCB in the figure, and the display data converted here is drained. It flows to the driver peripheral circuit. As described above, by using the flip-chip method and the multilayer flexible substrate, the restrictions on the outer shape of the information device in the lateral width can be eliminated, and a small-sized information device with low power consumption can be provided.

Although the present invention has been described in detail with reference to the embodiments, the present invention is not limited to the above-described embodiments, and may be variously modified without departing from the gist thereof. Of course. For example, in the first and second embodiments, an example is shown in which the present invention is applied to an active matrix type liquid crystal display device, but the present invention is also applicable to a simple matrix type liquid crystal display device. In the second embodiment, an example in which the present invention is applied to a flip-chip type liquid crystal display device is described. However, the present invention is also applicable to other types of liquid crystal display devices. Further, in the first and second embodiments, an example in which the present invention is applied to a liquid crystal display device has been described. However, the present invention is not limited to this.
It is needless to say that the present invention can be applied to various devices provided with a connector.

[0071]

As described above, according to the present invention,
It is possible to reduce the emission of unnecessary radiated radio waves that cause EMI from the connector portion or the intrusion of unnecessary radiated radio waves from the outside of the device, and it is possible to enhance the EMI measures at the connector portion. it can. Therefore, in a display device such as a liquid crystal display device, stable display quality can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of a liquid crystal display module according to an embodiment of the present invention.

FIG. 2 is a sectional view of a main part of a liquid crystal display module according to another embodiment of the present invention (a sectional view taken along line AA in FIG. 5);
It is.

FIG. 3 is an exploded perspective view of a liquid crystal display module to which the present invention can be applied.

FIG. 4 is a rear view of the liquid crystal display device with a drive circuit board on which the interface circuit board PCB is mounted.

FIG. 5 shows a case where the shield case SHD is placed on the lower side, and the flexible substrates FPC1 and FPC2 and the interface circuit substrate PC are provided.
FIG. 11 is a rear view of the state where the flexible substrate FPC2 is folded after mounting B, and the liquid crystal display element PNL with a drive circuit board is housed in a shield case SHD.

FIG. 6A is a rear (lower) view of a multilayer flexible substrate FPC2 for driving a drain driver, and FIG.
Is a front (top) view.

FIG. 7 is a rear (lower) view of an interface circuit board PCB having functions of a controller unit and a power supply unit.

FIG. 8: Foldable multilayer flexible substrate FPC2
Bending mounting method and multilayer flexible substrate FPC1
FIG. 3 is a perspective view showing a connection portion between the first and second devices.

FIG. 9 is a perspective view of a notebook personal computer or a word processor on which a liquid crystal display module is mounted.

FIG. 10 is a sectional view of a main part of an example of a conventional liquid crystal display module.

[Explanation of symbols]

PNL: liquid crystal display element, FPC, FPC2: flexible board, PCB: printed board (interface circuit board), CTa, CTb, CT2, CT4: connector,
SHC… Connector shield.

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[Procedure amendment]

[Submission date] October 31, 1996

[Procedure amendment 1]

[Document name to be amended] Drawing

[Correction target item name] Fig. 6

[Correction method] Change

[Correction contents]

FIG. 6

Claims (4)

[Claims] 1. An apparatus provided with a connector, wherein the outer periphery of the connector is covered with a conductor. 2. The apparatus according to claim 1, wherein said conductor is electrically connected to a ground line or a power supply line.
A device equipped with the connector as described. 3. A liquid crystal display device in which a first circuit board and a second circuit board are electrically connected via a connector.
A liquid crystal display device wherein the outer periphery of the connector is covered with a conductor. 4. The liquid crystal according to claim 3, wherein said conductor is electrically connected to a ground line or a power supply line of at least one of said first circuit board and said second circuit board. Display device.