JPH09138388A - Liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the size of external shape of an liquid crystal display element and an information processor, such as personal computer or word processor, into which the liquid crystal display element is built as a displaying section by reducing the width and area of the circumference, i.e., picture frame part, of a display region. SOLUTION: An interface circuit board PCB when viewed from the direction perpendicular to the surfaces of transparent glass substrates SUB1, SUB2 is superposed on the liquid crystal display element consisting of these transparent glass substrates SUB1, SUB2 and is arranged on the rear surface side of the substrate SUB1. These circuit board and the substrates are then stuck to by double coated adhesive tapes. In addition, the one end of the a gate driver flexible circuit board FPC1 is directly electrically and mechanically connected to the substrate SUB1 of the liquid crystal display element. Nearly entire width thereof is superposed on the interface circuit board PCB and is arranged thereon without bending.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a liquid crystal display device,
The present invention relates to a liquid crystal display device having the driving circuit board.

[0002]

2. Description of the Related Art For example, in a liquid crystal display element of an active matrix type liquid crystal display device, a liquid crystal of one of two transparent insulating substrates made of glass or the like arranged opposite to each other with a liquid crystal layer interposed therebetween. The x on the layer side
A gate line group that extends in the y direction and is arranged in parallel in the y direction and a drain line group that is insulated from the gate line group and that extends in the y direction and that is arranged in the x direction are formed.

Each region surrounded by the group of gate lines and the group of drain lines becomes a pixel region, and the pixel region includes, for example, a thin film transistor (T) as a switching element.
FT) and a transparent pixel electrode.

By supplying the scanning signal to the gate line, the thin film transistor is turned on, and the video signal from the drain line is supplied to the pixel electrode through the turned on thin film transistor.

It is to be noted that not only each drain line of the drain line group, but also each gate line of the gate line group is extended to the periphery of the transparent insulating substrate to form external terminals. A plurality of driving ICs (semiconductor integrated circuits) constituting the video driving circuit and the gate scanning driving circuit which are connected to each other are externally mounted around the transparent insulating substrate. That is, a plurality of tape carrier packages (TCP) on which these driving ICs are mounted are externally attached around the substrate.

However, since the transparent insulating substrate has a configuration in which a TCP on which a driving IC is mounted is externally mounted, a gate line group and a drain of the transparent insulating substrate are formed by these circuits. The area occupied by a region (usually called a frame) between the outline of the display region formed by the intersection region with the line group and the outline of the outer frame of the transparent insulating substrate increases, and the liquid crystal display This is contrary to the desire to reduce the external dimensions of the module.

Therefore, in order to solve such a problem as much as possible, that is, in response to a demand to increase the density of the liquid crystal display element and to reduce the outer shape of the liquid crystal display module as much as possible, TCP components are not used. There has been proposed a configuration in which an image driving IC and a gate scanning driving IC are directly mounted on a transparent insulating substrate. Such a mounting method is called a flip chip method or a chip-on-glass (COG) method.

Although not a known example, the same applicant has applied to the flip-chip type liquid crystal display device.
There is a prior application regarding the module mounting method (Japanese Patent Application No. 6-2
56426).

[0009]

A liquid crystal display device (that is, a liquid crystal display module) includes, for example, two liquid crystal display devices separated by a predetermined gap so that surfaces on which a transparent electrode for display and an alignment film are laminated face each other. The transparent insulating substrates made of glass, etc., are superposed on each other, and the two substrates are bonded together by a sealing material provided in the shape of a frame (square shape) in the vicinity of the peripheral portion between the two substrates, and also provided on a part of the sealing material. A liquid crystal display element (that is, a liquid crystal display panel, LCD: liquid: liquid crystal display panel, LCD: liquid crystal) that seals liquid crystal inside the sealing material between both substrates from the liquid crystal sealing port that is a notch A liquid crystal display, a backlight arranged below the liquid crystal display element to supply light to the liquid crystal display element, a liquid crystal drive circuit board arranged outside the outer periphery of the liquid crystal display element, and a battery. Receiving light, and the lower case is molded article for holding, each member was housed, and a display window spaced metal shield case or the like.

In recent years, along with the progress of information society, portable information processing devices such as a personal computer and a word processor have been desired, such as a notebook size, and a liquid crystal display device and a liquid crystal display module incorporating the same have been demanded. It is desired to reduce the external dimensions and enlarge the display area.

A power supply circuit for obtaining a plurality of divided and stabilized voltage sources from one voltage source, and a circuit for converting display information from a host (upper processing unit) into information for a TFT liquid crystal display device. Conventionally, the interface circuit board on which is mounted is arranged outside one side of the liquid crystal display element, which hinders the reduction of the width and area of the so-called frame portion around the display area.

An object of the present invention is to reduce the width and area of a frame portion and to reduce the outer dimensions of a liquid crystal display element and an information processing apparatus such as a personal computer or a word processor incorporating the liquid crystal display element as a display section. To provide.

[0013]

In order to solve the above problems, the present invention mounts a driving IC chip on one of the surfaces of two transparent insulating substrates which are superposed with a liquid crystal layer interposed therebetween. In a liquid crystal display device having a flip-chip type liquid crystal display element and a first circuit substrate electrically connected to the liquid crystal display element, the first liquid crystal display device has a first circuit board when viewed from a direction perpendicular to the substrate surface. A part of the circuit board is overlapped with the liquid crystal display element.

Also, a flip-chip type liquid crystal display device having a driving IC chip mounted on one of the two transparent insulating substrates laminated with a liquid crystal layer interposed therebetween, and a power source for the liquid crystal display device. A first circuit board for supplying a voltage;
In a liquid crystal display device having a second circuit board for supplying a drive signal of the IC chip, which is electrically and mechanically directly connected to the liquid crystal display element, in the case where viewed from a direction perpendicular to the substrate surface, Part of the first circuit board is superposed on the liquid crystal display element, and the second circuit board is superposed on the first circuit board.

Further, the first circuit board is an interface circuit board.

Further, the second circuit board is a gate driver driving circuit flexible board.

Further, the upper surface of the first circuit board and the lower surface of the one transparent insulating board are adhered to each other by a double-sided tape.

By overlapping a part of the first circuit board with the liquid crystal display element and further stacking the second circuit board on the first circuit board, the width of the frame portion,
The area can be reduced, and the external dimensions of a liquid crystal display element and an information processing device such as a personal computer or a word processor incorporating the liquid crystal display element as a display unit can be reduced.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In the drawings described below, components having the same function are designated by the same reference numeral, and repeated description thereof will be omitted.

<< Overall Structure of Liquid Crystal Display Module >> FIG.
3 is an exploded perspective view of the liquid crystal display module MDL.

SHD is a shield case made of a metal plate (also called a metal frame), WD is a display window, and SPC1
4 are insulating spacers, FPCs 1 and 2 are bent multilayer flexible circuit boards (FPC1 is a gate side circuit board, FPC2 is a drain side circuit board), PCB is an interface circuit board, and ASB is an assembled liquid crystal display with a drive circuit board. The elements and PNLs are liquid crystal display elements (also referred to as liquid crystal display panels) in which a driving IC is mounted on one of two transparent insulating substrates that are superposed, GC1 and G1.
C2 is a rubber cushion, PRS is a prism sheet (2
Sheet), SPS is a diffusion sheet, GLB is a light guide plate, RFS is a reflection sheet, MCA is a lower case (molded case) formed by integral molding, LP is a fluorescent tube, LPC is a lamp cable, and LCT is a connection for an inverter. Connector, G
B is a rubber bush that supports the fluorescent tube LP, and the members are stacked in a vertical arrangement as shown in the figure to assemble the liquid crystal display module MDL.

FIG. 2 is a completed assembly view of the liquid crystal display module MDL, which is a front view, a front side view, a right side view, and a left side view of the liquid crystal display element PNL viewed from the front side (that is, the upper side and the display side). .

FIG. 3 is a completed assembly view of the liquid crystal display module MDL, which is a rear view of the liquid crystal display element as viewed from the rear surface side (lower side).

The module MDL includes a lower case MCA,
The shield case SHD has two types of storage / holding members.

The HLD is four mounting holes provided for mounting the module MDL as a display unit on an information processing device such as a personal computer or a word processor. A mounting hole HLD of the shield case SHD is formed at a position corresponding to the mounting hole MH of the lower case MCA (see FIGS. 10 and 11) (see FIG. 2), and a screw or the like is passed through both mounting holes to form an information processing device. Fixed and implemented. In the module MDL, a backlight inverter is arranged in the MI portion, and power is supplied to the backlight BL via the connection connector LCT and the lamp cable LPC. Signals and necessary power from the main computer (host) are supplied to the controller section and the power section of the liquid crystal display module MDL via the interface connector CT1 located on the back surface of the module.

In FIG. 2, regarding the maximum outer dimensions of the shield case SHD of the module MDL, the length W in the lateral (long side) direction is 275.5 ± 0.5 mm, and the length in the vertical (short side) direction. The height H is 199 ± 0.5 mm, the thickness T is 8 ± 0.5 mm, the width X1 from the effective pixel portion AR to the upper frame of the shield case SHD is 5.25 mm,
Width X2 to the lower frame is 9.25mm, width Y to the left frame
1 is 16.5 mm, the width Y2 to the right frame is 5.5 mm,
The width Y3 of the wide part near the corner up to the right frame is 7.5.
mm.

FIG. 29 shows a TF which is the embodiment shown in FIG.
FIG. 3 is a block diagram showing a TFT liquid crystal display element of a T liquid crystal display module and a circuit arranged on an outer peripheral portion thereof. Although not shown, in this example, the drain drivers IC _{1 to} IC _M and the gate drivers IC _{1 to} IC _N are the drain side lead lines DTM and the gate side lead lines formed on one transparent insulating substrate of the liquid crystal display element. Chip-on-glass mounting (COG mounting) is performed using the wire GTM and an anisotropic conductive film or an ultraviolet curable resin. In this example, it is applied to a liquid crystal display element having 800 × 3 × 600 effective dots (vertical and horizontal pixel size = 307.5 μm) which is an XGA specification. For this reason, the transparent insulating substrate of the liquid crystal display element has two
40 output drain driver ICs 10 (M
= 10) and 6 gate driver ICs with 101 outputs and 100 outputs on the short side (N = 6) are COG mounted. A drain driver unit 103 is provided below the liquid crystal display element.
Is disposed on the left side surface of the gate driver unit 1.
04, the controller unit 101 and the power supply unit 102 are arranged on the same left side surface. The controller unit 101, the power supply unit 102, the drain driver unit 103, and the gate driver unit 104 are connected to each other by electrical connection means JN1 and JN2. The controller unit 101 and the power supply unit 102 are arranged on the back side of the gate driver unit 104.

The specific construction of each component will be described below with reference to FIGS.
28, each member will be described in detail.

<< Metal Shield Case SHD >> FIG.
The top surface, front side surface, right side surface, and left side surface of the shield case SHD are shown, and a perspective view of the shield case SHD when viewed obliquely from above is shown in FIG.

Shield case (metal frame) SHD
Is manufactured by punching and bending a single metal plate by a pressing technique. WD is a liquid crystal display element P
An opening that exposes the NL to the visual field is shown, and is hereinafter referred to as a display window.

NL is a fixing claw (12 in total) for the shield case SHD and the lower case MCA, and HK is a fixing hook (6 in total) for the shield case SHD.
It is integrated with HD. The fixing claws NL shown in FIG. 1 and FIG. 2 are, before being bent, housed in the shield case SHD with the liquid crystal display element ASB with a drive circuit sandwiching the spacer SPC, and then bent inward respectively. Square fixing recess NR provided in case MCA
(See side views of FIG. 10) (see FIG. 3 for bent state). The fixing hooks HK are fitted into fixing protrusions HP (see the side view of FIG. 10) provided on the lower case MCA. As a result, a shield case SHD that holds and stores the liquid crystal display device ASB with a drive circuit, etc.
And the lower case MCA for holding and storing the light guide plate GLB, the fluorescent tube LP and the like are firmly fixed. Further, thin and elongated rectangular rubber cushions GC1 and G are provided around the four edges that do not affect the display of the lower surface of the liquid crystal display element PNL.
C2 (also referred to as a rubber spacer, see FIG. 1) is provided. Further, since the fixing claw NL and the fixing hook HK can be easily removed (only by extending the bending of the fixing claw NL and removing the fixing hook HK), it is easy to disassemble and assemble the two members, so that the repair is easy. , Backlit BL fluorescent tube L
Exchange of P is also easy. In addition, in this embodiment, as shown in FIG. 2, one side is mainly fixed by the fixing hook HK,
Since the other side facing each other is fixed by the fixing claws NL, it is possible to disassemble by simply removing a part of the fixing claws NL without removing all the fixing claws NL. Therefore, it is easy to repair and replace the backlight.

The CSP is a through hole, and the shield case SHD is inserted into the through hole CSP and mounted on a pin which is fixed and stood up at the time of manufacture, whereby the relative position of the shield case SHD and other parts is set accurately. It is for doing.
The insulating spacers SPC1 to SPC4 are coated with an adhesive material on both surfaces of the insulating material, and can securely fix the shield case SHD and the liquid crystal display element ASB with a drive circuit while keeping the distance between the insulating spacers. Further, when the module MDL is mounted on an applied product such as a personal computer, the through hole CSP can be used as a positioning reference.

<< Insulating Spacer >> As shown in FIGS. 1 and 26 to 28, the insulating spacer SPC is a shield case SHD.
And the liquid crystal display element ASB with a drive circuit are secured, and the positional accuracy with the shield case SHD is secured, and the liquid crystal display element ASB with a drive circuit and the shield case S are secured.
Fix with HD.

<< Multilayer Flexible Substrates FPC1 and 2 >> FIG. 4 shows a liquid crystal display device with a drive circuit substrate in which a gate-side flexible substrate FPC1 and a drain-side flexible substrate FPC2 before being bent are mounted on the outer periphery of the liquid crystal display device PNL. It is a front view.

FIG. 5 shows the interface circuit board PCB.
FIG. 5 is a back view of the liquid crystal display element with the drive circuit board of FIG.

FIG. 6 shows the flexible board FPC after the flexible case FPC1 and 2 and the interface circuit board PCB are mounted with the shield case SHD placed below.
2 and the liquid crystal display element PNL is shielded with the shield case S.
It is a rear view of the state stored in HD.

4 on the left side of FIG. 4 are driving IC chips on the side of the vertical scanning circuit, and 10 on the lower side are driving IC chips on the side of the video signal driving circuit, which are anisotropic conductive films (ACF2 in FIG. 24).
Chip on a transparent insulating substrate using
It is mounted on glass (COG). In the conventional method,
A tape carrier package (TCP) in which a driving IC chip is mounted by a tape automated bonding method (TAB) is connected to a liquid crystal display element PNL using an anisotropic conductive film. In COG implementation, direct drive I
Since C is used, the above-mentioned TAB step is not necessary and the steps are shortened, and the tape carrier is also unnecessary, so that there is an effect of cost reduction. Further, the COG mounting is suitable as a mounting technology for the high-definition / high-density liquid crystal display element PNL. That is, in this example, the SVGA panel is 800 × 3 × 6.
A TFT liquid crystal display module with a 12.1 inch screen size of 00 dots was designed. Therefore, the size of each dot of red (R), green (G), and blue (B) is 307.5μ.
m (gate line pitch) × 102.5 μm (drain line pitch), and one pixel is red (R), green (G),
A combination of 3 dots of blue (B) forms a 307.5 μm square. Therefore, the drain line lead-out DTM is set to 80
If the number is 0 × 3, the lead line pitch will be 100 μm or less, which is less than the connection pitch limit of the currently available TCP packaging. On the other hand, in COG mounting, although it depends on the material such as the anisotropic conductive film to be used,
It can be said that about 70 μm in the pitch of bumps BUMP (see FIG. 24) of the C chip and about 50 μm square in the area of intersection with the underlying wiring are the currently available minimum values. For this reason, in this example,
The drain driver ICs were arranged in a line on one long side of the liquid crystal display element PNL, and the drain lines were drawn to one long side. Therefore, the bump BUMP of the driving IC chip
(See FIG. 24) The pitch can be designed to be about 70 μm and the crossing area with the underlying wiring can be designed to be about 50 μm square, and the connection with the underlying wiring can be achieved with higher reliability. Gate line pitch is 30
Since it is sufficiently large at 7.5 μm, the gate line lead-out line GTM is drawn out on the short side of one side.
It is also possible to pull out TM alternately.

In the method of alternately drawing out the drain lines or the gate lines, as described above, the connection between the lead lines DTM or GTM and the output side BUMP of the driving IC becomes easy, but the peripheral circuit board is connected to the liquid crystal display element PNL. Since it is necessary to dispose them on the outer peripheral portions of the two long sides facing each other, there is a problem that the outer dimension becomes larger than that in the case of the one-sided drawing. In particular, as the number of display colors increases, the number of data lines of display data increases, and the outermost shape of the information processing device increases. Therefore, in this example, the conventional problem is solved by using the multilayer flexible substrate and drawing out the drain wire only on one side.

FIG. 17A shows the back surface (lower surface) of the multilayer flexible substrate FPC1 for driving the gate driver.
FIG. 2B is a front (top) view. FIG. 15A shows
FIG. 3 is a back surface (lower surface) view of the multilayer flexible substrate FPC2 for driving the drain driver, and FIG. 21A is a sectional view taken along the line AA ′ of FIG. 15A, FIG. 21B is a sectional view taken along the line BB ′, and FIG. 21C is a sectional view taken along the line CC ′. Is.
Note that the ratio of the dimension in the thickness direction and the dimension in the plane direction of FIG. 21 is exaggeratedly different from the actual dimension.

FIG. 18 is a wiring schematic diagram showing the connection relationship between the signal wiring in the multilayer flexible substrate FPC and the input signal to the driving IC on the transparent insulating substrate SUB1. The signal wiring in the multilayer flexible substrate FPC is a transparent insulating substrate S.
There is a first wiring group parallel to one side of UB1 and a second wiring group vertical to one side. The first wiring group is a common wiring group that supplies a common signal between the driving ICs, and the second wiring group is each driving I
It is a wiring group that supplies signals necessary for C. Therefore, at least the partial FSL is composed of one conductor layer. Further, the partial FML is composed of at least two conductor layers, and it is necessary to electrically connect the first wiring group and the second wiring group with the through holes. In this example, it is necessary to shorten the short side length of the portion FML to a length that does not touch the edge of the lower deflection plate when folded.

That is, as shown in FIG. 21, three or more conductor layers, for example, in this example, eight portions of the conductor layers L1 to FML are provided in parallel with one side of the liquid crystal display element PNL. Even if the number of data lines is increased by mounting the peripheral circuit wiring and the electronic component in this portion, it is possible to cope with the increase in the number of layers while maintaining the outer shape of the substrate. The conductor layer L1 is for component pad and ground, L2 is for gradation reference voltage V _ref , 5 volt (3.3 volt) power source, L3 is for ground, L4 is for data signal, clock CL2, clock CL1, and L5 is first L6 is for the gradation reference voltage V _ref , L7 is for a data signal, and L8 is for a 5 volt (3.3 volt) power supply.

The connection between the conductor layers is made through the through-hole VIA (see FIG. 2).
3 (a)). Conductor layer L
Although 1 to 8 are formed from copper CU wiring, input terminal wiring Td to the driving IC of the liquid crystal display element PNL (see FIGS. 19 and 20).
In the portion of the conductor layer L5 that is connected to (see), gold plating AU is further applied on the nickel base Ni on the copper CU.
Therefore, the connection resistance between the output terminal TM and the input terminal wiring Td can be reduced. Between the conductor layers L1 to L8, an intermediate layer made of a polyimide film BFI is interposed as an insulating layer, and the conductor layers are fixed by an adhesive layer BIN. The conductor layer is covered with an insulating layer except for the output terminal TM, but in the multilayer wiring portion FML, a solder resist SRS is applied to the uppermost and lowermost layers to ensure insulation. Further, an insulating silk material SLK was attached to the outermost surface side.

The advantage of the multilayer flexible substrate is that the conductor layer L5 including the connection terminal portion TM required for COG mounting is used.
Can be configured integrally with other conductor layers, and the number of parts can be reduced.

Further, by forming the portion FML of the conductor layer of three or more layers, it becomes a hard portion with little deformation, so that the positioning hole FHL can be arranged in this portion. Further, even when the multilayer flexible substrate is bent, it can be bent with high reliability and accuracy without causing deformation in this portion. Further, as will be described later, a solid shape or a diameter of 200
A mesh-shaped conductor pattern ERH (see FIG. 23A) provided with a large number of fine holes MESH of μm can be arranged on the surface layer L1, and the remaining two or more conductor layers can be used for component mounting or peripheral wiring conductor patterns. Wiring can be done.

Furthermore, the protruding portion FSL does not have to be a single-layer conductor layer L5, and the protruding portion FSL can also be formed of two conductor layers. With this configuration, when the pitch of the input terminal wiring Td to the driving IC becomes narrow, the terminal wiring T
The pattern of d and the connection terminal portion TM is formed in a zigzag pattern in a plurality of rows of wiring groups, and each is electrically connected by an anisotropic conductive film or the like, and the connection terminal portion TM in the first conductor layer is formed.
When the wiring group of one column is connected to the second conductor layer of the other layer through the through hole VIA when pulling out, or a part of the peripheral wiring is arranged on the second conductor layer in the protruding portion FSL. In this case, the structure of the two conductor layers is effective.

As described above, by forming the protruding portion FSL with two or less conductor layers, good heat conduction can be achieved and pressure can be uniformly applied during thermocompression bonding with a heat tool, and the connection terminal portion TM and the terminal The electrical reliability of the wiring Td can be improved. Also, when bending a multilayer flexible board,
Accurate bending can be performed without applying bending stress to the connection terminal portion TM. In addition, since the protruding portion FSL is semitransparent, the pattern of the conductor layer can be observed from the upper surface side of the multilayer flexible substrate, so that there is an advantage that the pattern inspection such as the connection state can be performed from the upper surface side. In addition,
JT2 in FIG. 15 is a drain side flexible substrate FPC.
2 is a convex portion for electrically connecting the interface circuit board PCB and CT4, and CT4 is a flexible substrate FPC2 and an interface circuit board P provided at the tip of the convex portion JT.
It is a flat type connector for electrically connecting to a CB.

FIG. 16 (a) is an enlarged detailed view of the J portion of FIG. 15 (a), and FIG. 16 (b) is a side view showing the mounted and folded state of the multilayer flexible substrate FPC2.

In FIG. 16 (a), P _X is the wavelength of the polyimide film BFI with wavy edges, P _Y is the wave height (wave amplitude × 2), and P ₁ is the straight line connecting the wave peaks (wave peak). referred to as line), P ₂ is referred to as linear (wave trough line connecting each other wave trough), LY2 is referred to as length (connecting length of the connection portion of the lower transparent glass substrate SUB1 of the multilayer flexible substrate FPC 2), LY1 is the length between the connection portion of the multilayer flexible substrate FPC2 with the lower transparent glass substrate SUB1 and the wave peak line P ₁ .

The drain side flexible substrate FPC2 is
As shown in FIG. 16B, one end has a liquid crystal display element PNL.
Is connected to the drain line terminal (Td in FIGS. 19 and 20) at the end of the lower transparent glass substrate SUB1 via the anisotropic conductive film ACF, and is folded back at the middle of the wave height P _Y outside the end. , The multilayer wiring portion FML at the other end is arranged below the end portion of the lower transparent glass substrate SUB1, and the double-sided tape BAT
Is attached to the lower surface of the lower transparent glass substrate SUB1. Note that the numbers 1 to 45 given to the output terminal TM in FIG. 16A are the numbers 1 given to the terminal Td in FIGS.
Up to 45, and is electrically connected via the anisotropic conductive film ACF1. P _{D in} FIG. 16A is an output terminal TM
The pitch is 0.41 mm. In this example, an end portion of a polyimide film (cover film) BFI made of a polyimide resin which is an insulating layer of the flexible substrate FPC2 is formed in a wavy shape (or a sawtooth shape) along the bending line direction. For example, wavelength P _X = 0.6 mm, wave height P _Y = 0.6 to 1 mm, wave waviness radius (R) is 0.3 mm, connection length LY2 = 1.75 mm, LY1 =
It is 0.3 to 0.5 mm. Lower transparent glass substrate SUB
The length from the end of the flexible substrate FPC2 connected to No. 1 to the mountain line P ₁ is the connection length LY2 = 1.75 of the flexible substrate FPC2 to the lower transparent glass substrate SUB1.
mm + glass cutting error of transparent glass substrate SUB1 0.
It is within 3 to 0.5 mm. In addition, the flexible substrate F
The length of the bent portion of PC2 is the thickness of the transparent glass substrate SUB1 (0.7 to 1.1 mm) × circular ratio π / 2 = 1.7 to
It is 1.1 mm. A wave peak line P ₁ and a wave trough line P ₂ exist between the lengths of the bent portions. Further, in this example, the length of the flexible substrate FPC2 is 263.42 ± 0.5 mm,
The width including the multilayer wiring portion FML and the protruding portion FSL is 8.
7 mm, width of multilayer wiring portion FML is 5 mm, protruding portion F
SL width is 3.7 mm, frame ground pad FGP
And the center line distance between FGP (see FIG. 15B) are 47.
76 mm, the length of the long side of the rectangular portion provided with the connector CT4 at the tip of the convex portion JT2 is 22 mm, and in FIG. 16 (a), the interval between the center lines of the output terminals TM numbered 1 and 45 is 18.04 mm, The outermost terminals of the connector CT4 have a center line interval of 14.5 mm, and the total thickness of the multilayers is about 350 to 40.
0 μm.

As described above, in this example, one end of the flexible substrate FPC2 for signal input is connected to the end of the transparent glass substrate SUB1 of the liquid crystal display element and the other end is folded back to the lower surface (or upper surface) of the substrate SUB1. Since the end portion of the polyimide film BFI of the protruding portion FSL is formed in a wave shape (or a shape having a ridge portion and a valley portion such as a sawtooth shape) along the bending line direction, the end portion of the polyimide film BFI at the bent portion is Disperse stress concentration,
A good radius can be provided at the bent portion, occurrence of disconnection can be suppressed, and reliability can be improved.

In this example, the gate side flexible substrate FPC1 has three conductor layers, and L1 is V _dg (10 V),
For V _sg (5 V), V _ss (ground), L2 is lead wiring, clock CL3, FLM, V _dg (10 V), L3
Is V _EG (-10 to -7V), V _EE (-14V), V
_{It is for SG} (5V) and common voltage V _com . The length of the flexible substrate FPC1 is 172.3 mm, and the width including the multilayer wiring portion FML and the protruding portion FSL is 7.25 m.
m, the width of the multilayer wiring portion FML is 4.5 mm, and the protruding portion F is
The width of SL is 2.75 mm, the width of the electrical connecting means JN1 is 5.5 mm, the length is 9.6 mm, the center line interval of the outermost output terminals TM of the protruding portion FSL is 11.5 mm, and the total thickness of the multilayers. Is 273 μm.

Alignment marks ALMG (FIG. 17A) and ALMD (FIG. 16) on the flexible substrate.
(A)) will be described.

Flexible substrate F shown in FIGS.
In the PCs 1 and 2, the length of the output terminal TM is usually designed to be about 2 mm in order to secure the connection reliability. However, the long sides of the flexible boards FPC1 and 2 are 170 to 264 m.
Since the length is long, the positional deviation between the input terminal wiring Td and the output terminal TM may occur due to the positional deviation including a slight rotation in the major axis direction, resulting in a poor connection. Liquid crystal display element P
The alignment between the NL and the flexible boards FPC1 and 2 is
After inserting the opening holes FHL opened at both ends of each substrate into the fixing pin, the input terminal wiring Td and the output terminal TM can be combined at several places. However, in this example, in order to further improve the alignment accuracy, the alignment mark ALM
Two G and ALMD are provided for each protruding portion FSL.

As an input of the gate driver driving IC,
There are a total of 24, and each is electrically connected to the output terminal TM. The pitch PG of the terminals TM is about 500 μm. The alignment mark ALMG is positioned in the vicinity of the 24 terminals TM to each drive IC, and the alignment accuracy with the input terminal wiring Td pattern is improved and inspection after connection is performed. In this example, in order to improve the connection reliability, a dummy line is provided at a position adjacent to the 20 input terminals TM, and the square-shaped alignment mark ALMG is pattern-connected to the dummy line. A square filled pattern on the opposing transparent substrate SUB1 (on the drain side, as shown in FIG.
(Refer to ALC 9 and 20) just fit in the square shape.

As shown in FIGS. 19 and 20, there are 45 inputs in total for the drain driver drive IC.
The output terminals TM shown in (a) are electrically connected to the numbers 1 to 45. The pitch PD of the terminals TM is about 410 μm. In this example, the alignment mark AL shown in FIG.
The MD is adjacent to the 41 input terminals TM and has a dummy line NC (terminal numbers 2 and 44) for improving connection reliability.
Place. Further, the counter electrode of the liquid crystal capacitance Clc is provided on the outer side of the liquid crystal capacitor Clc, and the voltage V _com is supplied to the common transparent pixel electrode COM inside the transparent insulating substrate SUB2.
The terminals (Nos. 1 and 45) shown in 6 (a) are arranged. Thus, the common voltage passes through the wiring Td pattern on the transparent insulating substrate SUB1 from the conductive beads or paste to the common transparent pixel electrode CO on the transparent insulating substrate SUB2 side.
M.

The alignment mark ALMD has terminals (numbers 1 and 45) electrically connected to this electrode COM.
Then, the pattern is connected to and the square fill pattern ALD (see FIG. 20) on the transparent substrate SUB1 is matched.
Further, in this example, a joint pattern (not shown) for making a connection with the gate driver substrate FPC1 at the lower end portion of the drain driver substrate FPC2 in FIG. 15A.
Is provided.

Next, the shape of the conductor layer portion FSL of two layers or less will be described.

In this example, the protruding length of the portion FSL formed of a single-layer or two-layer conductor wiring is the bent portion (see FIG. 16).
(See (a)), so that the distance is about 3.7 mm. However, in a structure that is not bent, the portion FSL can be further shortened.

The protruding shape of the portion FSL is a convex shape separated for each drive IC. Thus, the thermal expansion flexible substrate in the longitudinal direction at the time of thermocompression bonding of a heat tool, the pitch P _G and P _D are changed in the terminal TM, it can prevent a phenomenon in which peeling or poor connection occurs between the connection terminals Td.
That is, by the convex shape separated for each drive IC, it is possible to the thermal expansion amount corresponding to the length of the pitch P _G and P _D cycle also each driver IC shift up to the terminal TM. In this example, the flexible substrate is formed into a convex shape separated into ten parts in the major axis direction, and the amount of thermal expansion can be reduced to about 1/10.
Liquid crystal module M
DL reliability can be improved.

As described above, the alignment mark AL
By providing the MG and the ALMD and making the protruding shape of the portion FSL into a convex shape separated for each driving IC, even if the number of connection wirings and the number of display data increase, the connection reliability is ensured with high accuracy. The peripheral drive circuit can be reduced.

Next, the conductor layer portion FML having three or more layers will be described.

Chip capacitors CHG and CHD are mounted on the conductor layer portions FML of the FPCs 1 and 2. That is, in the gate-side substrate FPC1, the ground potential Vss
(0 volts) and the power supply Vdg (10 volts) or between the power supply Vsg (5 volts) and the power supply Vdg, six chip capacitors CHG are soldered. Further, in the drain-side substrate FPC2, the ground potential Vss and the power supply V
A total of ten chip capacitors CHD are soldered between dd (5 volts or 3.3 volts) or between the ground potential Vss and the power supply Vdd. These capacitors CHG and CHD are for reducing noise superimposed on the power supply line.

In this example, these chip capacitors CH
It was designed such that D was soldered only to the surface conductor layer L1 on one side, and after being bent, it was entirely located under the transparent insulating substrate SUB1. Therefore, the capacitors for smoothing the power supply noise can be mounted on the substrates FPC1 and 2 while keeping the thickness of the liquid crystal module MDL constant.

Next, a method of reducing high frequency noise generated from the information processing apparatus will be described.

Since the metal shield case SHD side is the front side of the liquid crystal module MDL and the front side of the information processing equipment, the generation of EMI (electro magnetic interference) noise from this side is not used for external equipment. It causes a big problem in the environment.

Therefore, in this example, the surface layer L1 of the conductor layer portion FML is covered with the solid or mesh pattern ERH of the DC power source as much as possible. FIG. 23 (a)
Is a plane (front surface, top surface) showing the surface conductor layer pattern configuration of the multi-layer wiring portion FML portion which is a part of FIG.
FIG. The mesh MESH is composed of a large number of holes having a diameter of about 300 μm formed in the surface conductor layer L1, and this mesh-shaped pattern ERH covers almost the entire surface except for the through holes VIA and the capacitor component CHD.

Further, as shown in FIG. 15B, the pattern FGP in which the pattern ERH is exposed from the solder resist SRS is arranged on the drain side substrate FPC2 at five positions,
The frame ground HS (Fig. 1,
14) via the ground FG of the shield case SHD
F (see FIG. 2) is soldered to reduce EMI noise. That is, in the case where the circuit board is divided into a plurality as in this example, if at least one of the drive circuit boards is connected to the frame ground in terms of direct current, no electrical problem occurs, If there are few places in the high frequency region, the potential for generation of unnecessary radiated radio waves that causes EMI increases due to reflection of electric signals and fluctuations in the potential of the ground wiring due to differences in the characteristic impedance of each drive circuit board. . In particular, an active matrix type module M using thin film transistors
Since DL uses a high-speed clock, it is difficult to take measures against EMI. To prevent this, the ground wiring (AC ground potential) is connected to the common frame (that is, the shield case SHD) having a sufficiently low impedance at at least one location, in this example, five locations, on the drain driver substrate FPC2. By passing through the frame ground HS,
Since the ground wiring in the high-frequency region is reinforced, compared with the case where only one place is connected to the shield case SHD as a whole, in the case of the five places of this embodiment, the electric field intensity of radiation was significantly improved.

<< Frame Ground HS >> FIG. 14 (a)
Is a front side view of a metal thin plate (hereinafter, referred to as a frame ground) HS for taking a frame ground, (b) is a rear view, (c) is a side view, (d) is (a), (b). Of A
FIG. 3 is an enlarged detailed view of a portion, a portion B, a portion C, and a portion D.

The structure of the frame ground HS is shown in FIG.
4 and the positional relationship between the frame ground HS and other members is shown in FIG. 1, and the positional relationship after the installation of the frame ground HS is shown in FIGS.

As a frame ground HS for taking a so-called frame ground as a measure for EMI, one thin metal plate having a thickness of 0.2 mm, which is thinner than the thickness of the shield case SHD, is set at 90 degrees along the extending direction. It is composed of a bent first elongated metal sheet HSB and a second elongated metal sheet HSH which are perpendicular to each other. From the metal thin plate HSB, the convex portion JT extends in the same plane as the metal thin plate HSB and in the downward direction. As shown in FIG. 14A, five convex portions JT are provided at regular intervals in the extending direction of the thin metal plate HSH, and are provided with the ground FGF of the metal shield case SHD.
(FIG. 2) is a portion that is electrically and mechanically connected by soldering. The HIS2 includes five frame ground pads FGP provided on the surface of the drain-line-driving flexible substrate FPC2 at regular intervals in the extending direction.
(See FIG. 15B) By soldering, five electrically and mechanically connected portions are provided correspondingly. Holes H adjacent to each solder joint HIS2
OLE is provided. Due to the presence of the hole HOLE, the heat capacity at the time of soldering can be reduced, and the soldering portion HIS2 and the frame ground pad FGP can be well soldered. A cutout may be provided instead of the hole HOLE. HIS1 is an insulating material stuck on a thin metal plate HSH, and covers the metal surface except for the soldered portion HIS2 to prevent short circuit with other parts. Both surfaces of the soldered portion HIS2 and the convex portion JT are solderable surfaces, and the other surfaces are coated with rust preventives. Further, the metal thin plate HSH has chip parts (FIGS. 4, 15, 22) mounted on the flexible board FPC2.
(A), 26 CHD: Notch DN that is connected to the power supply line and accommodates the power supply noise elimination chip capacitor)
T is provided.

As shown in FIGS. 1, 26 and 28, one end of the flexible substrate FPC2 is connected to the upper end portion of the lower transparent glass substrate SUB1 of the liquid crystal display element PNL, and the middle portion is near the outside of the end side. It is folded back and the other end is arranged below the lower surface of the end of the lower transparent glass substrate SUB1. The frame ground HS including the metal thin plate HSB and the metal thin plate HSH which are perpendicular to each other is a flexible substrate FPC2.
For electrically connecting the ground line and the metal shield case SHD, and the metal thin plate HSH is arranged below the flexible substrate FPC2 arranged below the end of the lower transparent glass substrate SUB1. Sheet metal HSH
The solder connection portion HIS2 is electrically and mechanically connected to the frame ground pad (FGP in FIGS. 4, 6, 15, 22 (a)) of the flexible substrate FPC2 by the solder SLD2. As shown in FIGS. 26 and 28, the thin metal plate HSB is arranged along the inner side surface of the shield case SHD, and the convex portion JT thereof is the ground FG of the shield case.
F (see FIG. 2) and the solder SLD1 are electrically and mechanically connected.

In this example, the ground line of the drain-board-driving flexible substrate FPC2 and the metal shield case SHD having a sufficiently low impedance are electrically connected via the frame ground HS made of a metal thin plate. As described above, a stable ground line can be supplied, and the ground line in the high frequency region can be strengthened. Therefore, it is possible to remove the influence of noise that enters from the outside or that is generated inside, so that stable display quality can be obtained, and generation of harmful radiated radio waves that cause EMI can be suppressed. In addition, the workability of the connection is better than that of the technique in which the claw integrally formed by notching a part of the upper surface or the side surface of the shield case SHD is bent and is connected to the ground line of the circuit board. Space can be reduced, the frame portion and thickness of the liquid crystal display module MDL can be reduced, and the liquid crystal display module MDL and the information processing device (FIG. 35,
It is advantageous in thinning, downsizing, and large screen of 36). In this example, the circuit board electrically connected to the shield case SHD via the frame ground HS is the drain line driving flexible board FPC2, and the gate line scanning driving flexible board FPC1 has a frame ground. However, this is because the clock input to the drain side flexible substrate FPC2 is fast and noise is easily generated, and the clock input to the gate side flexible substrate FPC1 is slow and noise is less likely to occur.
Moreover, since the plurality of frame ground pads FGP are provided at intervals in the extension direction of the flexible substrate FPC2, the potentials of the power supply and the ground become more stable,
Impedance matching can be achieved better than when connecting to the shield case SHD at one point. In addition, taking the frame ground at a portion far from the signal input side of the circuit board can make the ground more stable and prevent the effect of the flexible board as an antenna.

<< Interface Circuit Board PCB >> FIG.
5A is a back surface (bottom surface) view of the interface circuit board PCB having the functions of the controller section and the power supply section,
(B) is a partial front side and side view of the mounted hybrid integrated circuit HI, and (c) is a front (top) view of the interface circuit board PCB.

In this example, the substrate PCB is a 6-layer multilayer printed circuit board made of a glass epoxy material. A multilayer flexible printed circuit board can also be used, but since a bent structure was not adopted in this portion, a multilayer printed circuit board having a relatively low price was used.

All electronic components are mounted on the lower surface side of the substrate PCB, which is the rear surface side as viewed from the information processing apparatus. For the display control device, one integrated circuit element TCON is arranged on the substrate. The integrated circuit element TCON is not housed in a package, and is formed by mounting an integrated circuit IC directly on a printed circuit board in a ball grid array. The interface connector CT1 is located substantially at the center of the board, and further includes a plurality of resistors, capacitors, and high-frequency noise removing circuit components EMI.

In the hybrid integrated circuit HI, a part of the circuit is hybrid-integrated, and a plurality of integrated circuits and electronic parts for forming a power supply are mounted on the upper and lower surfaces of a small circuit board. One is mounted on the interface circuit board PCB. As shown in the figure,
The leads of the hybrid integrated circuit HI are formed long, and a plurality of electronic components EP including TCON and the like are also mounted on the circuit board PCB between the circuit board PCB and the hybrid integrated circuit HI.

Also, electrical connection means JN1 for connecting the gate driver board FPC1 and the interface circuit board PCB.
, The connector CT3 is used in this example.

The reason why the connector CT3 is used is that it can be electrically connected to the flexible substrate FPC1 with high reliability even if the number of pixels and the number of display colors increase and the pitch between wirings becomes narrow.

The upper surface of the substrate PCB is the surface side when viewed from the information processing device, and the direction in which the EMI noise is most radiated is the highest potential. Therefore, in this example, as shown in FIG.
As shown in (c), a multi-layered surface conductor layer is almost entirely covered with a ground solid or mesh pattern ERH. FIG. 23B shows a mesh pattern E.
It is the expanded upper surface (front) figure of RH. Under the solder resist SRS, a copper conductor mesh pattern ERH is formed over the entire surface except the through hole VIA portion. This pattern ERH can reduce EMI noise radiation by being electrically connected to the ground pattern GND on the lower surface of the substrate PCB. In addition, the ground pattern GN
D is the ground GND of the board PCB and the shield case S
Connect to HD FGN and connect to connector C
It is connected to the ground on the main body side by soldering with the ground coming from T1.

In this example, the interface circuit board PCB has a length of 172.3 mm and a width of 13.1 mm.

As described above, the flexible substrate FPC
In both 1 and 2, the surface conductor layer of the substrate is covered with the pattern ERH, and the outer peripheral portions of the two sides of the liquid crystal display element PNL are all fixed at DC potential, effectively reducing EMI noise radiation from the inside of the substrate. Can be done.

FIG. 27A is a sectional view taken along the line CC 'of FIG. 2, and FIG. 27B is a sectional view taken along the line DD'.

As shown in FIG. 27, a transparent glass substrate SU
When viewed from the direction perpendicular to the B1 and SUB2 surfaces, the interface circuit board PCB is overlapped with the liquid crystal display element PNL and is arranged below the lower surface of the lower transparent insulating substrate SUB1. Further, the gate driver flexible substrate FPC1 has one end directly electrically and mechanically connected to the transparent glass substrate SUB1 of the liquid crystal display element PNL, and unlike the drain side, does not bend and has almost the entire width of the interface circuit substrate PCB. Overlaid on top. In this way, the interface circuit board PCB is partially overlapped with the liquid crystal display element PNL, and further, the gate driver circuit board FPC1 is arranged so as to be superposed on the interface circuit board PCB, whereby the width and area of the frame portion can be reduced. It is possible to reduce the external dimensions of the liquid crystal display element and the information processing apparatus such as a personal computer or word processor in which the liquid crystal display element is incorporated as a display unit. The surface of the interface circuit board PCB on which the mesh-shaped pattern ERH shown in FIG. 25C is formed is attached and fixed to the lower surface of the lower transparent glass substrate SUB1 by the double-sided tape BAT. The interface circuit board PCB of this example has a length of 172.3 mm and a width of 13.1 m.
m. The conductor layer is composed of 6 layers L1 to L6, L1 is for component pad, L2 is for signal and ground, L3 is for signal, L4 and L5 are for power supply respectively, L6 is for ground, and a mesh pattern ERH is formed. Has been done.

<< Liquid Crystal Display Element ASB with Driving Circuit Board >>
Next, the liquid crystal display element ASB with a drive circuit board will be described.

As shown in FIG. 26A, the drain driver flexible substrate FPC2 is bent and adhered to the surface of the transparent insulating substrate SUB1 opposite to the surface on which the pattern is formed. Polarizing plates POL1 and POL2 are slightly outside (about 1 mm) of the effective pixel area AR, and from there, about 1 to
The end of the FML of the substrate FPC2 is located 2 mm apart.
The distance from the end of the transparent insulating substrate SUB1 to the tip of the protrusion of the bent portion of the FPC 2 is as small as about 1 mm, which enables compact mounting. Therefore, in this example, the distance from the effective pixel area AR to the tip of the protrusion of the bent portion of the substrate FPC2 was about 7.5 mm.

Next, a method of bending and mounting a flexible substrate will be described.

FIG. 22 is a perspective view showing a method of bending and mounting a multilayer flexible substrate. The drain driver substrate FPC2 and the gate driver substrate FPC1 are connected to each other by a flat connector CT4 provided at the tip of a convex portion JT2 which is a flexible substrate integrated with the FPC2 as a joiner.
And is bent and electrically connected to the connector CT2 of the interface board PCB shown in FIG.

Next, the double-sided tape BAT is applied to the surface of the flexible substrate FPC2 on which the conductor layer portion FML is not mounted.
(See FIGS. 28, 26, and 5) are attached and bent at the conductor layer portion BNT using a jig.

The width of the double-sided tape BAT used is 3 mm, and the length is 160 to 240 mm, which is an elongated shape.
It suffices if adhesiveness can be ensured, and a short shape may be attached at several places. Further, the double-sided tape BAT may be attached in advance on the transparent insulating substrate SUB1 side.

As described above, the multi-layer flexible substrate FPC2 can be accurately bent by using the jig and adhered to the surface of the transparent insulating substrate SUB1.

<< Rubber Cushion GC >> Rubber Cushion G
C1, 2 are shown in FIGS. 1, 6, 26 (b), 27 (b). The rubber cushions GC1 and GC2 are liquid crystal display elements PN.
A prism sheet PRS is arranged between the lower surface of the end of the L lower transparent glass substrate SUB1 around the frame and the lower case MCA housing the backlight BL. By using the elasticity of the rubber cushions GC1, 2 to push the shield case SHD toward the inside of the device, the fixing hook HK is caught by the fixing protrusion HP, and the fixing claw NL is bent to form the fixing recess NR. When inserted, each fixing member functions as a stopper, the shield case SHD and the lower case MCA are fixed, and the entire module is firmly held as one unit, and other fixing members are unnecessary. Therefore, the assembly is easy and the manufacturing cost can be reduced. Further, the mechanical strength is high, the vibration and shock resistance is high, and the reliability of the device can be improved. The rubber cushions GC1 and GC2 are provided with an adhesive material on one side, and are attached to a predetermined portion of the substrate SUB2.

<< Backlight BL >> FIG. 7 is a front view of the backlight BL, and FIG. 8 is a front view of the backlight BL when the prism sheet PRS and the diffusion sheet SRS are removed from the backlight BL of FIG. . FIG. 9 is a front view of the backlight BL similar to FIG. 8 showing another configuration example.

The side-light type backlight BL which illuminates the liquid crystal display element PNL from the back is one cold cathode fluorescent tube LP, lamp cable LPC of the fluorescent tube LP, fluorescent tube LP.
And two rubber bushes GB for holding the lamp cable LPC, the light guide plate GLB, the diffusion sheet SPS arranged in contact with the entire upper surface of the light guide plate GLB, the reflection sheet RFS arranged on the entire lower surface of the light guide plate GLB, and the diffusion sheet. SPS
Two prism sheets P placed in contact with the entire upper surface of the
It is composed of RS.

The reflection sheet LS has the fluorescent tube LP arranged on the reflection sheet LP, then rolled and bent 180 degrees, and the end portion thereof is guided by the double-sided tape BAT having an adhesive material.
It is adhered to the lower surface of the end portion of the LB (see FIG. 26A).

<< Diffusion Sheet SPS >> Diffusion Sheet SPS
Is placed on the light guide plate GLB, diffuses the light emitted from the upper surface of the light guide plate GLB, and uniformly illuminates the liquid crystal liquid crystal display element PNL.

<Prism Sheet PRS> The prism sheet PRS is placed on the diffusion sheet SPS, the lower surface is a smooth surface, and the upper surface is a prism surface. The prism surface is composed of, for example, a plurality of grooves each having a V-shaped cross-section arranged in parallel to each other (in other words, a large number of triangular prisms are arranged in parallel). The prism sheet PRS can improve the brightness of the backlight BL by collecting the light diffused from the diffusion sheet SPS over a wide angle range in the normal direction of the prism sheet PRS. Therefore, it is possible to reduce the power consumption of the backlight BL, and as a result, the module M
The DL can be reduced in size and weight, and the manufacturing cost can be reduced. The prism sheet PRS is 2
When using one sheet, two prism sheets PRS are arranged in a stacked manner so that the extending directions of the grooves are orthogonal to each other.

<< Diffusion Sheet SPS and Prism Sheet PR
Fixing method of S >> Optical sheet diffusion sheet SPS and 2
At each side edge of each of the two prism sheets PRS, two fixing small holes whose positions coincide with each other when the sheets are installed are provided. Correspondingly, pin-shaped convex portions MPN are integrally provided with the case MCA at both ends of one side of the lower case MCA manufactured by molding.
As shown in FIG. 8, the convex portion MPN is provided on each of the upper and lower sides of the inverter housing MI of the backlight BL on the one side of the lower case MCA. When the diffusion sheet SPS and the prism sheet PRS are installed, the convex portions MPN are made to penetrate through these small holes, and then the convex portions M are formed.
The sleeves SLV through which the convex portions penetrate are respectively fitted to the tip portions of the PN, and the diffusion sheet SPS and the two prism sheets PRS are fixed. The sleeve SLV is made of an elastic material such as silicon rubber, for example, and the inner diameter of the hole of the sleeve SLV is smaller than the outer diameter of the convex portion MPN, so that the sleeve SLV is hard to fall off.

Further, in this example, in order to further improve the position fixing accuracy, at least one small hole is provided at the other side edge of the optical sheet, and the optical sheet is integrally formed at the other side edge. The pinhole is provided so as to penetrate the small hole. FIG. 11 shows a planar relative positional relationship between the transparent insulating substrate SUB1 and the circuit board PCB and the case MCA.
On the side opposite to the backlight BL, an additional small hole of the optical sheet is passed through a pin-shaped convex portion MPN integrally provided at one end of the case, and a total of three small holes are formed. Fix the position with high accuracy. The additional small hole and the pin-shaped convex portion MPN are provided below the transparent insulating substrate SUB1 and further,
The transparent insulating substrate SUB1 is arranged inside the outer peripheral portion to reduce the outer shape of the liquid crystal module. Pin-shaped protrusion MPN
Since it is at a position where it does not overlap with the circuit board PCB arranged under the gate side flexible board FPC1 in plan view, it can be integrally provided in the case MCA without increasing the thickness of the liquid crystal module.

With such a structure, when the diffusion sheet SPS of the backlight and the prism sheet PRS are installed,
The workability is good, and the position is automatically determined by the combination of the projection MPN and the small hole, so that the positioning can be performed accurately and easily. Further, one predetermined sheet can be easily attached and detached, only the defective sheet can be replaced, and the sheets can be easily regenerated (repaired). As a result, manufacturing time can be reduced, workability can be improved, and cost can be reduced.

<< Reflective Sheet RFS >> Reflective Sheet RFS
Is disposed below the light guide plate GLB, and reflects light emitted from the lower surface of the light guide plate GLB toward the liquid crystal liquid crystal display element PNL.

<< Lower Case MCA >> FIG. 10 is a front view, front side view, rear side view, right side view, left side view, and FIG. 11 of the lower case MCA. Part B, C
Part, D part (that is, the corner part of the lower case MCA)
FIG.

Lower case M formed by molding
CA is a fluorescent tube LP, a lamp cable LPC, a light guide plate G
A holding member such as LB, that is, a backlight storage case, which is made by integrally molding a synthetic resin in one mold. Since the lower case MCA is firmly united with the metal shield case SHD by the action of each fixing member and the elastic body, the vibration shock resistance and the heat shock resistance of the module MDL can be improved, and the reliability can be improved.

On the bottom surface of the lower case MCA, a large opening MO occupying an area of more than half of the surface is formed in the central portion excluding the peripheral frame-shaped portion. As a result, after the module MDL is assembled, the liquid crystal liquid crystal display element PNL is
And the rubber cushion GC1 between the lower case MCA and
2 (see FIG. 26 (b) and FIG. 27 (b)), the bottom surface of the lower case MCA is bulged by the force applied vertically to the bottom surface of the lower case MCA from the top surface to the bottom surface. It can be prevented and the maximum thickness can be suppressed. Therefore, it is not necessary to increase the thickness of the lower case in order to suppress the bulge, and the thickness of the lower case can be reduced, so that the module MDL can be made thin and lightweight.

The MCL shown in FIG. 10 is a heat-generating component of the interface circuit board PCB.
A cutout (connector CT) provided in the lower case MCA at a location corresponding to a mounting portion of the hybrid IC power supply circuit (DC-DC converter DD) shown in (a) and (b).
1 includes a notch for connection). As described above, by providing the notch without covering the heat generating portion on the circuit board PCB with the lower case MCA, it is possible to improve the heat dissipation of the heat generating portion of the interface circuit board PCB. That is, at present, in order to improve the performance and improve the usability of a liquid crystal display device using a thin film transistor TFT, it is required to have multiple gradations and a single power source. A circuit for achieving this consumes a large amount of power, and if the circuit means is to be compactly mounted, high density mounting is required and heat generation becomes a problem. Therefore, by providing the lower case MCA with the notch MCL corresponding to the heat generating portion, it is possible to improve the high-density mounting property and compactness of the circuit. In addition to this, the display control integrated circuit element TCON is considered to be a heat-generating component, and the lower case MCA above it may be cut out.

MH in FIG. 10 is four mounting holes for mounting the module MDL to an application device such as a personal computer. The metal shield case SHD also has mounting holes HLD that match the mounting holes MH of the lower case MCA, and is fixed and mounted on the applied product using screws or the like.

The rubber bush GB holding the fluorescent tube LP and the lamp cable LPC is fitted into the housing portion MG formed so that the rubber bush GB fits tightly, and the fluorescent tube LP is housed in the lower case MCA without contact. It is stored in the section ML.

MB in FIGS. 10 and 11 is a holding portion of the light guide plate GLB, and the PJ portion is a positioning portion. ML is a fluorescent tube LP
, MG is a storage part of the rubber bush GB. M
C1 to 4 are storage units for the lamp cables LPC1 and LPC2.

<< Housing in Lower Case MCA of Light Guide Plate GLB >> In this example, the positioning portion (support frame) PJ of the lower case MCA that houses and holds the light guide plate GLB of the backlight is prevented from being damaged. did.

FIG. 12 (a) is a front view showing a corner portion of the positioning portion PJ of the lower case MCA that houses and holds the light guide plate GLB, and FIG. 12 (b) shows the positioning by the conventional light guide plate GLB. The front view showing how the force is applied when the module MDL is dropped to the lamp side at the corner portion of the portion PJ, and (c) is the front view showing the force application at the corner portion of the positioning portion PJ by the light guide plate GLB of this example. It is a figure.

As shown in FIG. 12A, the light guide plate GLB
The four corners are chamfered to provide a linear diagonal portion, and the positioning portion P is provided corresponding to the diagonal portion of the light guide plate GLB.
Straight corners are also provided at the corners of J. Conventionally, as shown in (b), since the corner portion of the light guide plate GLB is a right angle and the corner portion of the positioning portion PJ is also a right angle, it is weak against the force F in the side direction (y direction) of the light guide plate GLB. When the light guide plate, which is a particularly heavy member among the components of the module, moves within the liquid crystal display module due to vibration or shock, the positioning portion PJ may be damaged and the lamp LP may be destroyed. However, in this example, since diagonal portions are provided at the corners of the light guide plate GLB and the positioning portion PJ, as shown in (c), the force F applied to the positioning portion PJ has two directional components f _x and f. _It is decomposed into _y , and even if the resultant force is equal, it can be reduced as two x and y component forces. Therefore, in recent years, the impact applied to the positioning portion PJ of the lower case MCA, which tends to become smaller in width and thinness. Is reduced, damage to the positioning portion PJ can be prevented, impact resistance is improved, and reliability is improved.

<< Arrangement Position of Cold Cathode Fluorescent Lamp LP >> FIG.
As shown in (a), in the module MDL, the elongated fluorescent tube LP has a space below the drain-side flexible substrate FPC2 and the drain-side drive IC mounted on one of the long sides of the liquid crystal liquid crystal display element PNL (see FIG. 26). reference)
Are located in As a result, the external dimensions of the module MDL can be reduced, so that the module MD
L can be made smaller and lighter, and the manufacturing cost can be reduced.

That is, as shown in FIGS. 7 to 9, the cold cathode fluorescent lamp LP of the backlight BL is arranged on the long side of the liquid crystal display module MDL and on the lower side of the display.
That is, as shown in FIGS. 35 and 36, when the liquid crystal display module MDL is incorporated as a display unit in an information processing device such as a personal computer or a word processor, the cold cathode fluorescent tube L
It is arranged so that P is on the lower side of the long side of the display section.
In addition, LPC2 is a high voltage side lamp cable to which a high voltage of about 1100 V is applied, and LPC1 is a ground voltage side lamp cable. The example shown in FIGS. 7 and 8 is an inverter IV.
Is placed in the inverter housing MI in the display,
As will be described later in detail, the lamp cable LPC1 is wired along the left and upper two sides of the liquid crystal display module MDL, the lamp cable LPC2 is wired along the right one side, and both lamp cables LPC1 and 2 are connected. , From the upper right. On the other hand, in the example shown in FIG. 9, the inverter IV can be arranged in the keyboard portion of the information processing device, and the lamp cable LPC1 is located on the left side of the liquid crystal display module MDL.
The lamp cables LPC1 and LPC2 are wired along the upper and right three sides, and extend from the lower right.

By thus disposing the cold cathode fluorescent tube LP on the lower side of the display of the liquid crystal display module MDL, even when the inverter IV is arranged in the keyboard portion of the information processing apparatus as shown in FIG. The length of the lamp cable LPC2 on the high voltage side of the fluorescent tube LP can be shortened, the impedance causing the generation of noise and the change in waveform can be reduced, and the startability of the cold cathode fluorescent tube LP can be improved. In addition, when the inverter IV is arranged on the keyboard portion side, the width of the display portion can be further reduced. Further, as compared with the case where the cold cathode fluorescent tube LP is arranged on the display upper side of the liquid crystal display module MDL, the cold cathode fluorescent tube LP is shown in FIGS.
The impact of opening and closing the display section 6 is not easily received, and the reliability is improved. Further, as shown in FIGS. 35 and 36, since the center of the liquid crystal display element PNL (display screen) is shifted upward from the center of the display portion, it is difficult for the user to see the lower part of the display screen with the hand of the keyboard. Can be prevented.

Further, as apparent from FIGS. 9 to 11 and 26, since the lamp cable LPC1 passes under the light guide plate GLB on the upper side of the display, the length in the vertical direction can be reduced.

<< Lower case MC of the lamp cable LPC
Storage in A >> In this example, the wiring of the lamp cable LPC is devised so as to be compactly mounted and so as not to have an adverse effect on EMI noise.

FIG. 26B is a sectional view taken along the line BB ′ of the liquid crystal display module MDL shown in FIG.

That is, as described above, in FIG. 8, among the two lamp cables LPC, the cable LPC1 on the ground voltage side is located at the lower side so as to follow the outer shape of the two sides other than the housing portion of the fluorescent tube LP. It is accommodated in the accommodating portions MC4 and MC2, which are formed by the grooves formed in the case MCA (FIG. 10, FIG.
(B), FIG. 27 (a)). High voltage side cable LPC2
Is shortly wired so as to be close to a portion connected to the inverter (inverter power supply circuit) IV, and is housed in a housing portion MC1 including a groove formed in the lower case MCA (FIG. 1).
0, see FIG. 27 (b)). Further, in FIG. 9, the cable LPC1 on the ground voltage side is formed of grooves formed in the lower case MCA so as to follow the outer shapes of the three sides of the fluorescent tube LP other than the housing portions MC4, MC2, MC1 ( (See FIG. 10). The high-voltage side cable LPC2 is shortly wired so as to be close to the keyboard section of the information processing apparatus having the built-in inverter IV, and is housed in the housing section MC3 including a groove formed in the lower case MCA. Therefore, since only the ground voltage wiring has a long path, the adverse effect on EMI noise does not change as compared with the conventional case. Therefore, as compared with the case where the two lamp cables LPC1 and 2 are taken out from one side as in the conventional case, as shown in FIG.
There is no lamp cable LPC1 on the fluorescent tube LP side, and the wiring area can be reduced by 1.5 to 2 mm. In this example, as shown in FIG. 26 (b), the lamp cable LPC1 is arranged inside the transparent insulating substrate SUB1 so as to be positioned below the light guide plate GLB, and has a compact design.

An inverter IV is connected to the tip ends of the lamp cables LPC1 and LPC2. Inverter IV
Is stored in the inverter storage MI or in the keyboard of an information processing device such as a personal computer or word processor. As described above, when the module MDL is incorporated in an applied product such as a personal computer, the lamp cable LPC does not pass through the outer side surface of the module, and the inverter IV does not extend outside the module MD, and the backlight B
The L fluorescent tube LP, the lamp cable LPC, the rubber bush GB, and the inverter IV can be compactly housed and mounted, the module MDL can be downsized and lightened, and the manufacturing cost can be reduced.

The fluorescent tube LP is installed at the light guide plate G.
You may install on the short side of LB.

The outline of the TFT liquid crystal display module of this embodiment will be described below.

FIG. 30 shows a TFT liquid crystal display element (panel).
FIG. 3 is a block diagram showing a circuit arranged on the outer peripheral portion thereof. The drain driver section 103 is arranged only under the TFT liquid crystal display element (TFT-LCD), and
A gate driver unit 104, a controller unit 101, and a power supply unit 102 are arranged on a side surface portion of an XGA specification liquid crystal display element (TFT-LCD) composed of × 3 × 600 pixels.

As described above, the drain driver section 103 was formed by bending and mounting a multi-layer flexible substrate, and could have a sufficiently compact design.

Controller section 101 and power supply section 102
Are mounted on the multilayer printed circuit board PCB. The interface board PCB on which the controller unit 101 and the power supply unit 102 are mounted is arranged on the back side of the gate driver unit 104 arranged on the outer periphery of the short side of the liquid crystal element PNL. This is because the width of the information processing device (device) is limited, and the width of the module MDL that is the display unit needs to be reduced as much as possible.

As shown in FIG. 30, the thin film transistor T
The FT is arranged in an intersection region between two adjacent drain signal lines D and two adjacent gate signal lines G.

Drain electrode of thin film transistor TFT,
The gate electrodes are connected to the drain signal line D and the gate signal line G, respectively.

Since the source electrode of the thin film transistor TFT is connected to the pixel electrode and the liquid crystal layer is provided between the pixel electrode and the common electrode, the liquid crystal capacitance CLC is equivalently connected to the source electrode of the thin film transistor TFT. To be done.

The thin film transistor TFT becomes conductive when a positive bias voltage is applied to the gate electrode, and becomes non-conductive when a negative bias voltage is applied to the gate electrode.

Further, the storage capacitor Ca is provided between the source electrode of the thin film transistor TFT and the gate signal line of the previous line.
dd is connected.

It should be understood that the source electrode and the drain electrode are originally determined by the bias polarity between them, and since the polarity is reversed during operation in the circuit of this liquid crystal display device, it is understood that the source electrode and drain electrode are switched during operation. . However, in the following description, for convenience, one is fixed as the source electrode and the other is fixed as the drain electrode.

FIG. 33 shows each driver (drain driver, gate driver,
2 is a block diagram showing a schematic configuration of a common driver) and a signal flow. FIG.

In FIG. 33, the display controller 201 and the buffer circuit 210 are the controller unit 101 shown in FIG.
The drain driver 211 is provided in the drain driver unit 103 shown in FIG.
Reference numeral 06 is provided in the gate driver unit 104 shown in FIG.

The drain driver 211 is composed of a data latch unit for display data and an output voltage generating circuit.

The gradation reference voltage generator 208, multiplexer 209, common voltage generator 202, common driver 203, level shift circuit 207, gate-on voltage generator 204, gate-off voltage generator 205 and DC.
The DC converter 212 is provided in the power supply unit 102 shown in FIG.

FIG. 32 shows the common voltage applied to the common electrode, the drain voltage applied to the drain, the level of the gate voltage applied to the gate electrode, and the waveform thereof. The drain waveform shows the drain waveform when black is displayed.

FIG. 31 is a diagram showing the flow of display data and clock signals for the gate driver 206 and the drain driver 211 in the TFT liquid crystal display module of this example. In addition, FIG. 34 is a timing chart showing display data input from the main body computer to the display control device 201 and signals output from the display control device 201 to the drain and gate drivers.

The display control device 201 receives the control signals (clock, display timing signal, synchronizing signal) from the main computer and uses the clock D1 (CL1) and the shift clock D2 as control signals to the drain driver 211.
(CL2) and display data are generated, and at the same time, a frame start instruction signal FLM, a clock G (CL3), and display data are generated as control signals to the gate driver 206.

Further, the carry output of the previous stage of the drain driver 211 is the same as that of the drain driver 211 of the next stage.
Is input to the carry input of.

As is apparent from FIG. 34, the shift clock D2 (CL2) of the drain driver is the same as the frequency of the clock signal (DCLK) and display data input from the main body computer, and is about 4 in the XGA element.
The high frequency of 0 MHz makes it important to take measures against EMI.

<< Information Processing in which Liquid Crystal Display Module MDL is Mounted >> FIGS. 35 and 36 are perspective views of a notebook personal computer or a word processor in which the liquid crystal display module MDL is mounted, respectively. FIG. 35 shows an inverter IV
Is arranged in the display unit, that is, the inverter housing MI (see FIGS. 7 and 10) of the liquid crystal display module MDL, and FIG. 36 is arranged in the keyboard unit.

CO on the liquid crystal display element PNL of the driving IC
By adopting the G mounting and the multilayer flexible substrate as the peripheral circuit for the drain and gate driver in the outer peripheral portion and adopting the bending mounting for the circuit for the drain driver, the outer size can be significantly reduced as compared with the conventional one. In this example, since the peripheral circuit for the drain driver mounted on one side can be arranged above the display section above the hinge of the information device, compact mounting is possible.

First, in the figure, the signal from the information device goes to the display control integrated circuit element (TCON) from the connector located substantially in the center of the interface board PCB on the left side, and the display data converted here is drained. It flows to the driver peripheral circuit. As described above, by using the flip chip method and the multi-layer flexible substrate, it is possible to eliminate the restriction of the lateral width of the information device, and it is possible to provide a small-sized and low power consumption information device.

<< Plane and Cross Sectional Structure in the Vicinity of the Driving IC Chip Mounting Portion >> FIG. 19 is a plan view showing a state in which the driving IC is mounted on the transparent insulating substrate SUB1 made of glass, for example. Further, a cross-sectional view taken along the line AA is shown in FIG.
It is shown in FIG. In FIG. 19, one transparent insulating substrate SUB
Reference numeral 2 is shown by a one-dot chain line, but it is located above the transparent insulating substrate SUB1 and overlaps with it, and the seal pattern SL (see FIG. 19).
Thus, the liquid crystal LC is enclosed by including the effective display portion (effective screen area) AR. The electrode COM on the transparent insulating substrate SUB1 is a wiring electrically connected to the common electrode pattern on the transparent insulating substrate SUB2 side via conductive beads, silver paste, or the like. The wiring DTM (or GTM) supplies the output signal from the driving IC to the wiring in the effective display area AR. The input wiring Td supplies an input signal to the driving IC. The anisotropic conductive film ACF has an elongated shape common to a plurality of driving IC portions arranged in a line ACF2 and an elongated shape common to the input wiring pattern portions to the plurality of driving ICs. ACF1 is attached separately. Although the passivation films (protective films) PSV1 and PSV are also shown in FIG. 24, the wiring portion is covered as much as possible and the exposed portion is covered with the anisotropic conductive film ACF1 in order to prevent electrolytic corrosion.

Further, the periphery of the side surface of the driving IC is filled with epoxy resin or silicone resin SIL (see FIG. 2).
4), protection is multiplexed.

FIG. 32 shows the common voltage applied to the common electrode, the drain voltage applied to the drain, the level of the gate voltage applied to the gate electrode, and the waveform thereof. The drain waveform shows the drain waveform when black is displayed.

The gate on level waveform (direct current) and the gate off level waveform change in level between -9 and -14 volts, and the gate is turned on at 10 volts. The drain waveform (during black display) and the common voltage Vcom waveform change in level between about 0 to 3 volts. For example, in order to change the black level drain waveform every horizontal period (1H), the logic processing circuit performs logical inversion bit by bit and inputs the result to the drain driver. The off-level waveform of the gate operates with substantially the same amplitude and phase as the common voltage Vcom waveform.

FIG. 31 is a diagram showing the flow of display data and clock signals for the gate driver 104 and the drain driver 103 in the TFT liquid crystal display module of this example.

The display control device 101 receives the control signals (clock, display timing signal, synchronizing signal) from the main computer and uses the clock D1 (CL1) and the shift clock D2 as control signals to the drain driver 103.
(CL2) and display data are generated, and at the same time, a frame start instruction signal FLM, a clock G (CL3), and display data are generated as control signals to the gate driver 104.

The carry output of the previous stage of the drain driver 103 is the same as that of the drain driver 103 of the next stage.
Is input to the carry input of.

Although the present invention has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention. is there. For example, in the above-described embodiment, the example in which the liquid crystal display device of active matrix type is applied is shown, but the present invention is also applicable to the liquid crystal display device of simple matrix type. Further, in the above-mentioned embodiment, the example applied to the liquid crystal display device of the flip chip type is shown, but it is also applicable to the liquid crystal display device of other types.

[0150]

As described above, according to the present invention,
The width and area of a so-called frame portion around the display region can be reduced, and the external dimensions of a liquid crystal display element and an information processing device such as a personal computer or a word processor incorporating the liquid crystal display element as a display portion can be reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a liquid crystal display module to which the present invention can be applied.

FIG. 2 is a front view, a front side view, a right side view, and a left side view of the liquid crystal display module as viewed from the display side after completion of assembly.

FIG. 3 is a rear view of the liquid crystal display module after completion of assembly.

FIG. 4 is a front view of a liquid crystal display element with a drive circuit in which a gate side flexible substrate FPC1 and a drain side flexible substrate FPC2 before being bent are mounted on an outer peripheral portion of the liquid crystal display element PNL.

5 is a rear view of the liquid crystal display element with the drive circuit board of FIG. 4 on which the interface circuit board PCB is mounted.

FIG. 6 shows the flexible case FPC1, 2 and the interface circuit board PC with the shield case SHD placed below.
FIG. 11 is a rear view of the state where the flexible substrate FPC2 is folded after mounting B, and the liquid crystal display element PNL with a drive circuit board is housed in a shield case SHD.

FIG. 7 is a front view and a front side view of a backlight BL.

FIG. 8 is a diagram showing the backlight BL to the prism sheet P of FIG.
It is the front view and front side view of the backlight BL when RS and the diffusion sheet SRS are removed.

9 is a backlight B similar to FIG. 8 showing another configuration example.
It is the front view and front side view of L.

FIG. 10 is a front view, a front side view, a rear side view, a right side view, and a left side view of a lower case MCA.

11 is an enlarged detailed view of a portion A, a portion B, a portion C, and a portion D (that is, a corner portion of the lower case MCA) in the front view of FIG.

12A is a front view showing a corner portion of a light guide plate GLB and a positioning portion PJ of a lower case MCA that houses and holds the light guide plate GLB, and FIG. 12B is a positioning portion by a conventional light guide plate GLB. FIG. 6C is a front view showing how force is applied to a corner portion of PJ, and FIG. 7C is a front view showing how force is applied to a corner portion of the positioning portion PJ by the light guide plate GLB of this example.

FIG. 13 is a front view and a side view of the backlight before the reflection sheet LS is bent.

14A is a front side view of a metal thin plate (hereinafter, referred to as a frame ground) HS for obtaining a frame ground, FIG. 14B is a back view, FIG. 14C is a side view, and FIG. It is an enlarged detailed view of A section, B section, C section, and D section of (a).

FIG. 15A is a back surface (lower surface) view of a multilayer flexible substrate FPC2 for driving a drain driver,
(B) is a front (upper) view.

16 (a) is an enlarged detailed view of a J portion of FIG. 15 (a),
(B) is a side view showing a mounting and folded state of the multilayer flexible substrate FPC2.

FIG. 17A is a back surface (lower surface) view of a multilayer flexible substrate FPC1 for driving a gate driver, and FIG.
Is a front (top) view.

FIG. 18 is a wiring schematic diagram showing the connection relationship between the signal wiring in the multilayer flexible substrate FPC and the input signal to the driving IC on the transparent insulating substrate SUB1.

FIG. 19 is a plan view showing a state in which a driving IC is mounted on a transparent insulating substrate SUB1 of a liquid crystal display element.

FIG. 20: Drain driving IC of transparent insulating substrate SUB1
FIG. 3 is a plan view of the main part around the mounting part and the cutting line CT1 of the substrate.

21A is a sectional view taken along the line AA ′ of FIG. 15A, FIG. 21B is a sectional view taken along the line BB ′ of FIG.
(C) is a sectional view taken along the line C-C '.

FIG. 22 is a foldable multilayer flexible substrate FPC.
Folding mounting method 2 and multilayer flexible board FPC
It is a perspective view which shows the connection part of 1 and 2.

FIG. 23 (a) is a multilayer flexible substrate FPC2 3
The front (top) view showing the pattern of the surface conductor layer in the partial FML of more than two layers, (b) is a partially enlarged detailed front view of the interface circuit board PCB of FIG. 25 (c), and each mesh is fixed to a DC voltage. It is a figure which shows the state in which substantially the whole surface was covered with the striped pattern ERH.

24 is a cross-sectional view taken along the line AA of FIG.

FIG. 25 (a) is a rear surface (lower surface) view of an interface circuit board PCB having functions of a controller unit and a power supply unit; FIG. 25 (b) is a partial front side view and a side view of a mounted hybrid integrated circuit HI; 8A is a front (top) view of the interface circuit board PCB. FIG.

26A is a sectional view taken along the line AA ′ of FIG. 2, and FIG. 26B is a sectional view taken along the line BB ′ of FIG.

27A is a sectional view taken along the line CC ′ of FIG. 2, and FIG. 27B is a sectional view taken along the line DD ′.

FIG. 28 is an enlarged detail view of an essential part of FIG. 26A showing a solder connection state of the frame ground HS.

FIG. 29 is a block diagram showing a liquid crystal display element of a liquid crystal display module and circuits arranged around the liquid crystal display element.

FIG. 30 is a block diagram showing an equivalent circuit of a TFT liquid crystal display module.

FIG. 31 is a diagram showing the flow of display data and clock signals from the display controller to the gate and drain drivers in the TFT liquid crystal display module.

FIG. 32 is a diagram showing the common voltage applied to the common electrode, the drain voltage applied to the drain electrode, the level of the gate voltage applied to the gate electrode, and their waveforms in the TFT liquid crystal display module.

FIG. 33 is a block diagram showing a schematic configuration of each driver of the TFT liquid crystal display module and a signal flow.

FIG. 34 is a diagram showing a timing chart of display data input from the main body computer to the display control device and signals output from the display control device to the gate and the drain in the TFT liquid crystal display module.

FIG. 35 is a perspective view of a notebook personal computer or a word processor in which a liquid crystal display module is mounted.

FIG. 36 is a perspective view of another notebook-type personal computer or word processor in which the liquid crystal display module is mounted.

[Explanation of symbols]

SUB1, SUB2 ... Transparent glass substrate, PCB ... Interface circuit board, FPC1 ... Gate driver flexible circuit board.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Naoto Kobayashi 3681 Hayano, Mobara-shi, Chiba Hitachi Device Engineering Co., Ltd.

Claims (5)

[Claims] 1. A liquid crystal display device having a first circuit board electrically connected to a liquid crystal display element, wherein a part of the first circuit board is part of the first circuit board when viewed from a direction perpendicular to the board surface. A liquid crystal display device characterized by being superposed on a liquid crystal display element. 2. A flip-chip type liquid crystal display device having a driving IC chip mounted on one substrate surface of one of two transparent insulating substrates laminated with a liquid crystal layer interposed therebetween, and a power source for the liquid crystal display device. A first circuit board for supplying a voltage to the liquid crystal display device is electrically and mechanically directly connected to the I circuit board.
In a liquid crystal display device having a second circuit board that supplies a drive signal for a C chip, a part of the first circuit board is overlapped with the liquid crystal display element when viewed from a direction perpendicular to the board surface. And a liquid crystal display device in which the second circuit board is superposed on the first circuit board. 3. The liquid crystal display device according to claim 1, wherein the first circuit board is an interface circuit board. 4. The liquid crystal display device according to claim 2, wherein the second circuit board is a gate driver driving circuit flexible board. 5. The liquid crystal display device according to claim 2, wherein an upper surface of the first circuit board and a lower surface of the one transparent insulating substrate are adhered to each other by a double-sided tape.