JP3958341B2 - Liquid crystal display module and liquid crystal display device - Google Patents

Description

  The present invention relates to a liquid crystal display module and a liquid crystal display device.

  For example, in a liquid crystal display element of an active matrix type liquid crystal display device, a liquid crystal layer side surface of one of the two transparent insulating substrates made of glass or the like disposed opposite to each other with a liquid crystal layer interposed therebetween. A gate line group extending in the x direction and juxtaposed in the y direction, and a drain line group extending in the y direction insulated from the gate line group and juxtaposed in the x direction are formed. ing.

  Each region surrounded by the gate line group and the drain line group becomes a pixel region, and for example, a thin film transistor (TFT) and a transparent pixel electrode are formed as switching elements in the pixel region.

  When the scanning signal is supplied to the gate line, the thin film transistor is turned on, and the video signal from the drain line is supplied to the pixel electrode through the turned on thin film transistor.

  Note that each drain line of the drain line group, as well as each gate line of the gate line group, extends to the periphery of the transparent insulating substrate to constitute an external terminal, and is connected to each of the external terminals. A video driving circuit and a gate scanning driving circuit, that is, a plurality of driving ICs (semiconductor integrated circuits) constituting them are externally attached to the periphery of the transparent insulating substrate. That is, a plurality of tape carrier packages (TCP) each mounting these driving ICs are externally attached to the periphery of the substrate.

  However, since the transparent insulating substrate has a configuration in which a TCP having a driving IC mounted on the periphery thereof is externally attached, the gate line group and the drain line group of the transparent insulating substrate are formed by these circuits. The area occupied by the area (usually referred to as a frame) between the outline of the display area formed by the intersecting areas of the transparent insulating substrate and the outline of the outer frame of the transparent insulating substrate is increased. Contrary to the desire to reduce dimensions.

  Therefore, in order to eliminate such problems as much as possible, that is, in order to reduce the density of the liquid crystal display element and reduce the external shape of the liquid crystal display module as much as possible. There has been proposed a configuration in which the IC and the gate scan driving IC are directly mounted on the transparent insulating substrate. Such a mounting method is called a flip-chip method or a chip-on-glass (COG) method.

  Although not a known example, the flip-chip liquid crystal display device is the same applicant, but there is a prior application for a module mounting method (Japanese Patent Application No. 6-256426).

  A liquid crystal display device (that is, a liquid crystal display module) incorporated as a display unit in an information processing device such as a personal computer or a word processor has a predetermined gap so that, for example, surfaces on which a transparent electrode for display and an alignment film are laminated face each other. Two transparent insulating substrates made of glass or the like are overlapped with each other, and both substrates are bonded together by a sealing material provided in a frame shape (b-shaped) in the vicinity of the peripheral edge between the two substrates. A liquid crystal display element (that is, a liquid crystal display) in which a liquid crystal is sealed inside a sealing material between both substrates from a liquid crystal sealing opening which is a cutout portion provided in a part of the substrate, and a polarizing plate is provided outside the both substrates. Panel, LCD: Liquid Crystal Display), a backlight that is placed under the liquid crystal display element and supplies light to the liquid crystal display element, and an outer periphery of the liquid crystal display element A liquid crystal driving circuit board arranged, housing a backlight, and the lower case is molded article for holding, each member was housed, and a display window spaced metal shield case or the like.

  The backlight is, for example, a light guide made of a synthetic resin plate such as a transparent acrylic plate for guiding light emitted from the light source to a direction away from the light source and uniformly irradiating the entire liquid crystal display element with light. A fluorescent tube, such as a cold cathode fluorescent tube, which is a linear light source disposed in parallel with the end surface in the vicinity of at least one end surface (one side surface) of the light guide, and the fluorescent tube covering almost the entire length thereof, A prism surface having a substantially U-shaped cross-section and a lamp reflecting sheet whose inner surface is a reflecting surface, and a prism that is arranged on the light guide and has, for example, a large number of triangular prisms arranged in parallel on the upper surface. The bottom surface is made of a smooth surface, and the light emitted from the light guide is diffused by a prism sheet for aligning the backlight light emitted over a wide angle range and improving the backlight brightness. Sheet, It is arranged below the optical member, and the light from the light guide member from the reflection sheet or the like that reflects toward the liquid crystal display device.

  In the conventional liquid crystal display module, the fluorescent tube is arranged on the upper side of the display of the liquid crystal display module. For this reason, when an inverter for driving a fluorescent tube (that is, an inverter power supply circuit) is not disposed on the display unit side of the information processing apparatus in which the liquid crystal display module is incorporated as a display unit, There is a problem that the wiring of the fluorescent lamp becomes longer and the startability of the fluorescent tube is lowered.

  An object of the present invention is to provide a liquid crystal display device capable of shortening the wiring of the fluorescent tube and improving the startability of the fluorescent tube even when the inverter is arranged on the keyboard portion side of the information processing device.

In order to solve the above problems, a liquid crystal module of the present invention is a liquid crystal module used in an openable liquid crystal display device having a display unit and a keyboard unit, and the display unit side includes a liquid crystal display element, A liquid crystal module having a light guide for irradiating light to the liquid crystal display element and a linear light source arranged in the vicinity of one end surface of the light guide is arranged, and the linear light source is on the long side of the light guide And the lower side of the display unit is arranged so that the ground side is on the left side and the high voltage side is on the right side, and the lamp cable on the ground side and the high voltage side lamp cable of the linear light source are connected from the lower right side of the liquid crystal module. Thus, it is configured such that it can be connected to an inverter that drives the linear light source disposed on the keyboard side, at the upper right of the keyboard portion.
In the liquid crystal display device of the present invention, the inverter is disposed on the keyboard unit side and in a region between the keyboard layout position and the display unit when the display unit is opened. The ground-side lamp cable and the high-pressure-side lamp cable are connected on the right side in the region between the keyboard and the display section in a state where the inverter and the display section are opened.
Further, in the liquid crystal display device of the present invention, the ground side lamp cable and the high voltage side lamp cable are attached with connectors for connecting to an inverter arranged on the keyboard side.

  According to the present invention, even when the inverter is arranged on the keyboard side of the information processing apparatus in which the liquid crystal display module is incorporated as a display unit by arranging the linear light source of the backlight on the display lower side of the liquid crystal display apparatus. The wiring of the fluorescent tube can be shortened, and the startability of the fluorescent tube can be improved.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings described below, components having the same function are denoted by the same reference numerals, and repeated description thereof is omitted.

<Overall configuration of liquid crystal display module>
FIG. 1 is an exploded perspective view of the liquid crystal display module MDL.

  SHD is a shield case made of a metal plate (also called a metal frame), WD is a display window, SPC1 to 4 are insulating spacers, FPC1 and FPC2 are bent multilayer flexible circuit boards (FPC1 is a gate side circuit board, FPC2 is a drain side) Circuit board), PCB is an interface circuit board, ASB is an assembled liquid crystal display element with a drive circuit board, PNL is a liquid crystal display element having a driving IC mounted on one of the two transparent insulating substrates superimposed ( GC1 and GC2 are rubber cushions, PRS is a prism sheet (two sheets), SPS is a diffusion sheet, GLB is a light guide plate, RFS is a reflection sheet, and MCA is a lower case formed by integral molding. Mold case), LP for fluorescent tube, LPC for lamp cable, LCT for inverter Continued connector, GB is a rubber bush for supporting the fluorescent tube LP, the liquid crystal display module MDL is assembled members are stacked in the arrangement relation of the upper and lower as shown in FIG.

  FIG. 2 is a completed assembly view of the liquid crystal display module MDL, and is a front view, a front side view, a right side view, and a left side view as seen from the front surface side (that is, the upper side and the display side) of the liquid crystal display element PNL.

  FIG. 3 is an assembled view of the liquid crystal display module MDL, and is a back view as seen from the back side (lower side) of the liquid crystal display element.

  The module MDL has two types of storage / holding members, a lower case MCA and a shield case SHD.

  The HLD is four mounting holes provided for mounting the module MDL as a display unit on an information processing apparatus such as a personal computer or a word processor. A mounting hole HLD of the shield case SHD is formed at a position corresponding to the mounting hole MH (see FIGS. 10 and 11) of the lower case MCA (see FIG. 2). Fixed and implemented. In the module MDL, an inverter for backlight is arranged in the MI portion, and power is supplied to the backlight BL via the connection connector LCT and the lamp cable LPC. A signal from the main computer (host) and necessary power are supplied to the controller and power supply of the liquid crystal display module MDL via the interface connector CT1 located on the back of the module.

  In FIG. 2, regarding the maximum external dimensions of the shield case SHD of the module MDL, the length W in the horizontal (long side) direction is 275.5 ± 0.5 mm, and the length H in the vertical (short side) direction is 199 ± 0.5 mm, thickness T is 8 ± 0.5 mm, the width X1 from the effective pixel part AR to the upper frame of the shield case SHD is 5.25 mm, the width X2 to the lower frame is 9.25 mm, The width Y1 to the left frame is 16.5 mm, the width Y2 to the right frame is 5.5 mm, and the width Y3 of the wide portion near the corner to the right frame is 7.5 mm.

FIG. 29 is a block diagram showing a TFT liquid crystal display element of the TFT liquid crystal display module according to the embodiment shown in FIG. 1 and a circuit disposed on the outer periphery thereof. Although not shown, in this example, the drain drivers IC _{1 to} IC _M and the gate drivers IC _{1 to} IC _N are the drain side lead lines DTM and gate side lead lines formed on one transparent insulating substrate of the liquid crystal display element. Chip-on-glass mounting (COG mounting) is performed using a line GTM and an anisotropic conductive film or an ultraviolet curable resin. In this example, the present invention is applied to a liquid crystal display element having 800 × 3 × 600 effective dots (vertical and horizontal pixel size = 307.5 μm) that are XGA specifications. For this reason, on the transparent insulating substrate of the liquid crystal display element, there are ten 240-output drain driver ICs on one long side (M = 10) and six 101-output and 100-output gate driver ICs on the short side ( N = 6) and COG mounting. A drain driver unit 103 is disposed below the liquid crystal display element, a gate driver unit 104 is disposed on the left side surface, and a controller unit 101 and a power source unit 102 are disposed on the same left side surface. The controller unit 101, the power supply unit 102, the drain driver unit 103, and the gate driver unit 104 are interconnected by electrical connection means JN1 and JN2, respectively. The controller unit 101 and the power supply unit 102 are arranged on the back side of the gate driver unit 104.

  The specific configuration of each component is shown in FIGS. 2 to 28, and each member will be described in detail.

《Metal shield case SHD》
FIG. 2 shows the top surface, front side surface, right side surface, and left side surface of the shield case SHD, and FIG. 1 shows a perspective view of the shield case SHD as viewed obliquely from above.

  The shield case (metal frame) SHD is manufactured by stamping and bending a single metal plate by a press working technique. WD indicates an opening that exposes the liquid crystal display element PNL in the field of view, and is hereinafter referred to as a display window.

  NL is a fixing claw (12 in total) between the shield case SHD and the lower case MCA, and HK is also a fixing hook (6 in total), and is provided integrally with the shield case SHD. 1 and 2, the fixing claw NL is in a state before being bent, and after the liquid crystal display element ASB with a drive circuit is accommodated in the shield case SHD with the spacer SPC interposed therebetween, each of the fixing claws NL is bent inwardly. It is inserted into a square fixing recess NR (see each side view of FIG. 10) provided in the case MCA (see FIG. 3 for the folded state). The fixing hooks HK are fitted into fixing protrusions HP (see the side view of FIG. 10) provided on the lower case MCA, respectively. As a result, the shield case SHD that holds and stores the liquid crystal display element ASB and the like with the drive circuit and the lower case MCA that holds and stores the light guide plate GLB, the fluorescent tube LP, and the like are firmly fixed. Further, thin and long rectangular rubber cushions GC1 and GC2 (also referred to as rubber spacers, also referred to as FIG. 1) are provided around the four edges that do not affect the display on the lower surface of the liquid crystal display element PNL. In addition, because the fixing claw NL and the fixing hook HK are easy to remove (just extend the bending of the fixing claw NL and remove the fixing hook HK), it is easy to repair and disassemble and assemble the two parts. The fluorescent tube LP of the backlight BL can be easily replaced. In this embodiment, as shown in FIG. 2, one side is mainly fixed by the fixing hook HK, and the other side facing each other is fixed by the fixing claws NL. Even if it is not removed, it can be disassembled by simply removing some of the fixing claws NL. Therefore, repair and replacement of the backlight are easy.

  The CSP is a through hole. By inserting the shield case SHD into the through hole CSP and mounting the pin on a pin that is fixed at the time of manufacture, the relative position between the shield case SHD and other parts can be set accurately. Is. The insulating spacers SPC1 to SPC4 are coated with an adhesive on both surfaces of the insulator, and can securely fix the shield case SHD and the liquid crystal display element ASB with drive circuit while keeping the distance between the insulating spacers. Further, when the module MDL is mounted on an application product such as a personal computer, the through hole CSP can be used as a positioning reference.

《Insulating spacer》
As shown in FIGS. 1 and 26 to 28, the insulating spacer SPC not only secures insulation between the shield case SHD and the liquid crystal display element ASB with drive circuit, but also secures positional accuracy with the shield case SHD and with drive circuit. The liquid crystal display element ASB and the shield case SHD are fixed.

<< Multilayer flexible board FPC1, 2 >>
FIG. 4 is a front view of a liquid crystal display element with a drive circuit board in which the gate side flexible board FPC1 and the drain side flexible board FPC2 before being bent are mounted on the outer periphery of the liquid crystal display element PNL.

  5 is a back view of the liquid crystal display element with a drive circuit board of FIG. 4 on which the interface circuit board PCB is mounted.

  FIG. 6 is a back view of a state in which the flexible substrate FPC1 and interface circuit board PCB are mounted with the shield case SHD on the bottom, the flexible substrate FPC2 is bent, and the liquid crystal display element PNL is accommodated in the shield case SHD. is there.

  6 on the left side of FIG. 4 is a driving IC chip on the vertical scanning circuit side, and 10 on the lower side are driving IC chips on the video signal driving circuit side. An anisotropic conductive film (ACF2 in FIG. 24) and UV curing are used. Chip-on-glass (COG) is mounted on the transparent insulating substrate using an agent or the like. In the conventional method, a tape carrier package (TCP) in which a driving IC chip is mounted by a tape automated bonding method (TAB) is connected to the liquid crystal display element PNL using an anisotropic conductive film. In the COG mounting, since the direct drive IC is used, the TAB process is not required and the process is shortened, and the tape carrier is not required, so that the cost can be reduced. Furthermore, COG mounting is suitable as a mounting technology for the high-definition, high-density liquid crystal display element PNL. That is, in this example, a TFT liquid crystal display module of 12.1 inch screen size of 800 × 3 × 600 dots was designed as the SVGA panel. For this reason, the size of each dot of red (R), green (G), and blue (B) is 307.5 μm (gate line pitch) × 102.5 μm (drain line pitch). , Red (R), green (G), and blue (B) in a combination of 3 dots, which is 307.5 μm square. Therefore, if the drain line lead DTM is 800 × 3, the lead line pitch is 100 μm or less, which is less than the connection pitch limit of the currently available TCP mounting. On the other hand, in COG mounting, depending on the material such as the anisotropic conductive film used, the pitch of bumps BUMP (see FIG. 24) of the driving IC chip is approximately 70 μm and the crossing area with the underlying wiring is approximately 50 μm. It can be said that the corner is the minimum value that can be used at present. Therefore, in this example, the drain driver ICs are arranged in a line on the long side on one side of the liquid crystal display element PNL, and the drain line is drawn out on the long side on one side. Therefore, the bump BUMP (see FIG. 24) pitch of the driving IC chip can be designed to be about 70 μm and the crossing area with the base wiring can be set to about 50 μm square, and the base wiring can be connected with higher reliability. Since the gate line pitch is sufficiently large as 307.5 μm, the gate line pull-out GTM is pulled out on one short side. However, when the definition becomes higher, the gate line lead line GTM is formed on two opposing short sides. It is also possible to pull out alternately.

  In the method of drawing out the drain lines or the gate lines alternately, as described above, the connection between the lead line DTM or GTM and the output side BUMP of the driving IC is facilitated, but the peripheral circuit board is opposed to the liquid crystal display element PNL. There is a need to dispose on the outer peripheral portion of the long side, and thus there is a problem that the outer dimension becomes larger than in the case of one-side drawer. In particular, when the number of display colors increases, the number of data lines of display data increases and the outermost shape of the information processing apparatus increases. For this reason, in this example, the conventional problem is solved by using a multilayer flexible substrate and pulling out the drain line only on one side.

  FIG. 17A is a back (bottom) view of the multilayer flexible substrate FPC1 for driving the gate driver, and FIG. 17B is a front (top) view. FIG. 15A is a back (bottom) view of the multilayer flexible substrate FPC2 for driving the drain driver, and FIG. 15B is a front (top) view. 21A is a cross-sectional view taken along the line AA ′ in FIG. 15A, FIG. 21B is a cross-sectional view taken along the line BB ′, and FIG. 21C is a cross-sectional view taken along the line CC ′. It is. Note that the ratio of the dimension in the thickness direction to the planar direction in FIG. 21 is exaggerated, unlike the actual dimension.

  FIG. 18 is a schematic wiring diagram showing the connection relationship between the signal wiring in the multilayer flexible substrate FPC and the input signal to the driving IC on the transparent insulating substrate SUB1. The signal wiring in the multilayer flexible substrate FPC includes a second wiring group perpendicular to the first wiring group parallel to one side of the transparent insulating substrate SUB1. The first wiring group is a common wiring group that supplies a common signal between the driving ICs, and the second wiring group is a wiring group that supplies signals necessary for each driving IC. For this reason, at least, the partial FSL is composed of one conductor layer. Further, the partial FML is composed of at least two conductor layers, and it is necessary to electrically connect the first wiring group and the second wiring group with a through hole. In this example, it is necessary to shorten the short side length of the partial FML to a length that does not touch the end of the lower deflection plate when bent.

That is, as shown in FIG. 21, three or more conductor layers, for example, in this example, eight portions of the conductor layers L1 to LML8 are provided in parallel with one side of the liquid crystal display element PNL. By mounting peripheral circuit wiring and electronic components, even if the number of data lines increases, it can be handled by increasing the number of layers while maintaining the board outline. The conductor layer L1 is for component pads and ground, L2 is for gradation reference voltage V _ref , for 5 volt (3.3 volt) power supply, L3 is for ground, L4 is for data signal, clock CL2, for clock CL1, and L5 is the first L6 is for the gradation reference voltage _Vref , L7 is for the data signal, and L8 is for the 5 volt (3.3 volt) power source.

  The connection between the conductor layers is electrically connected through the through hole VIA (see FIG. 23A). The conductor layers L1 to L8 are formed of copper CU wiring, but the copper layer CU is provided in a portion of the conductor layer L5 connected to the input terminal wiring Td (see FIGS. 19 and 20) to the driving IC of the liquid crystal display element PNL. Gold plating AU is further applied on the upper nickel base Ni. Therefore, the connection resistance between the output terminal TM and the input terminal wiring Td can be reduced. Between each conductor layer L1-8, the intermediate | middle layer which consists of polyimide films BFI is interposed as an insulating layer, and each conductor layer is fixed by adhesive layer BIN. The conductor layer is covered with an insulating layer except for the output terminal TM. However, in the multilayer wiring portion FML, a solder resist SRS is applied to the uppermost layer and the lowermost layer in order to ensure insulation. Furthermore, an insulating silk material SLK was pasted on the outermost surface side.

  The advantage of the multilayer flexible board is that the conductor layer L5 including the connection terminal portion TM necessary for COG mounting can be formed integrally with other conductor layers, and the number of parts is reduced.

  Moreover, since it becomes a hard part with few deformation | transformation by comprising by the part FML of the conductor layer of 3 layers or more, the positioning hole FHL can be arrange | positioned in this part. Further, even when the multilayer flexible substrate is bent, it can be bent with high reliability and accuracy without causing deformation in this portion. Further, as will be described later, a mesh-like conductor pattern ERH (see FIG. 23A) provided with a large number of solid or fine holes MASH having a diameter of 200 μm can be arranged on the surface layer L1, and the remaining two or more conductor layers can be arranged. In addition, it is possible to perform wiring of a conductor pattern for component mounting or peripheral wiring.

  Further, the protruding portion FSL does not need to be a single-layer L5 conductor layer, and the protruding portion FSL can be formed of two conductor layers. In this configuration, when the pitch of the input terminal wiring Td to the driving IC is narrowed, the pattern of the terminal wiring Td and the connection terminal portion TM is formed in a staggered pattern in a plurality of wiring groups, and the anisotropic conductive film When the connection terminal portion TM in the first conductor layer is pulled out, the wiring group in one row is connected to the second conductor layer in the other layer through the through hole VIA. In addition, when a part of the peripheral wiring is disposed on the second conductor layer in the protruding portion FSL, the configuration of the two conductor layers is effective.

  Thus, by constituting the projecting portion FSL with two or less conductor layers, heat conduction is good and pressure can be uniformly applied during thermocompression bonding with a heat tool, and the connection terminal portion TM and the terminal wiring Td Electrical reliability can be improved. Further, even when the multilayer flexible substrate is bent, the bending can be performed with high accuracy without applying bending stress to the connection terminal portion TM. In addition, since the projecting portion FSL portion is translucent, the pattern of the conductor layer can be observed from the upper surface side of the multilayer flexible substrate, so that there is an advantage that pattern inspection such as connection state can be performed from the upper surface side. Note that JT2 in FIG. 15 is a convex part for electrically connecting the drain side flexible board FPC2 and the interface circuit board PCB, and CT4 is a flexible board FPC2 and interface circuit board PCB provided at the tip of the convex part JT. Is a flat type connector for electrical connection.

  FIG. 16A is an enlarged detailed view of a portion J in FIG. 15A, and FIG. 16B is a side view showing a mounted and folded state of the multilayer flexible substrate FPC2.

In FIG. 16 (a), P _X is called end wavelength of the wavy polyimide film BFI, P _Y wave height (amplitude × 2 wave), P ₁ is a mountain line of a straight line (wave connecting the mountain each other wave ), _{P 2} is referred to as linear (wave trough line connecting each other wave trough), LY2 is referred to as length (connecting length of the connection portion of the lower transparent glass substrate SUB1 of the multilayer flexible substrate FPC 2), LY1 multilayer the length between the mountain line P ₁ of the connecting portion and the wave of the lower transparent glass substrate SUB1 of the flexible substrate FPC 2.

As shown in FIG. 16B, the drain-side flexible substrate FPC2 has anisotropic conductivity at one end of the drain line terminal (Td in FIGS. 19 and 20) at the end of the lower transparent glass substrate SUB1 of the liquid crystal display element PNL. Connected via the film ACF, folded back at the middle part of the wave height P _Y outside the edge, the multilayer wiring part FML at the other end is arranged below the edge part of the lower transparent glass substrate SUB1, and the double-sided tape BAT Is attached to the lower surface of the lower transparent glass substrate SUB1. The numbers 1 to 45 given to the output terminals TM in FIG. 16A correspond to the numbers 1 to 45 given to the terminals Td in FIGS. 19 and 20, and the anisotropic conductive film ACF1 is interposed therebetween. Electrically connected. _{P D} in FIG. 16 (a) at a pitch of the output terminals TM, is 0.41 mm. In this example, an end portion of a polyimide film (cover film) BFI made of a polyimide resin which is an insulating layer of the flexible substrate FPC2 is formed in a wave shape (or a sawtooth shape) along the folding line direction. For example, the wavelength P _X = 0.6 mm, the wave height P _Y = 0.6 to 1 mm, the wave undulation radius (R) is 0.3 mm, the connection length LY2 = 1.75 mm, and LY1 = 0.3 to 0.5 mm. is there. The length from the end portion of the flexible substrate FPC2 connected to the lower transparent glass substrate SUB1 to mountain line _{P 1} is the connection length LY2 = 1.75 mm + the transparent glass substrate SUB1 of the lower transparent glass substrate SUB1 of the flexible substrate FPC2 The cutting error of the glass is within 0.3 to 0.5 mm. The length of the bent portion of the flexible substrate FPC2 is the thickness of the transparent glass substrate SUB1 (0.7 to 1.1 mm) × circumferential ratio π / 2 = 1.7 to 1.1 mm. During the length of the bending portion, there is a mountain lines P ₁ and valley P ₂ waves. In this example, the length of the flexible substrate FPC2 is 263.42 ± 0.5 mm, the width including the multilayer wiring portion FML and the protruding portion FSL is 8.7 mm, the width of the multilayer wiring portion FML is 5 mm, and the protruding portion FSL. Is 3.7 mm, the center line distance between the frame ground pads FGP and FGP (see FIG. 15B) is 47.76 mm, and the length of the long side of the rectangular portion provided with the connector CT4 at the tip of the projection JT2 16 mm, the center line spacing of the output terminals TM numbered 1 and 45 is 18.04 mm, the center line spacing of the outermost terminal of the connector CT4 is 14.5 mm, and the total thickness of the multilayer is about It is 350-400 micrometers.

  Thus, in this example, in the flexible substrate FPC2 for signal input in which one end is connected to the end of the transparent glass substrate SUB1 of the liquid crystal display element and the other end is folded back to the lower surface (or upper surface) of the substrate SUB1, Since the end of the polyimide film BFI of FSL is formed in a wave shape (or a shape having a crest and a trough such as a sawtooth shape) along the fold line direction, stress concentration at the end of the polyimide film BFI at the fold is performed. It is possible to disperse and provide a good radius at the bent portion, to suppress the occurrence of disconnection, and to improve the reliability.

In this example, the gate-side flexible board FPC1 has three conductor layers, L1 is for V _dg (10V), V _sg (5V), V _ss (ground), L2 is a lead wiring, clocks CL3, FLM, V _dg (10V) for, L3 is _{V EG (-10~-7V),} V EE (-14V), V SG (5V), which is used for the common voltage _{V com.} The length of the flexible substrate FPC1 is 172.3 mm, the width including the multilayer wiring portion FML and the protruding portion FSL is 7.25 mm, the width of the multilayer wiring portion FML is 4.5 mm, and the width of the protruding portion FSL is 2.75 mm. The width of the electrical connection means JN1 is 5.5 mm, the length is 9.6 mm, the distance between the center lines of the outermost output terminals TM of the protruding portion FSL is 11.5 mm, and the total thickness of the multilayer is 273 μm.

  The alignment marks ALMG (FIG. 17A) and ALMD (FIG. 16A) on the flexible substrate will be described.

  In the flexible substrates FPC1 and FPC2 shown in FIGS. 15 to 17, the length of the output terminal TM is usually designed to be about 2 mm in order to ensure connection reliability. However, since the long sides of the flexible substrates FPC1 and FPC2 are as long as 170 to 264 mm, misalignment including slight rotation in the long axis direction causes misalignment between the input terminal wiring Td and the output terminal TM, resulting in poor connection. there is a possibility. The alignment between the liquid crystal display element PNL and the flexible substrates FPC1 and FPC2 is performed by inserting the opening holes FHL opened at both ends of each substrate into the fixing pins and then aligning the input terminal wiring Td and the output terminal TM at several places. Can do. However, in this example, in order to further improve the alignment accuracy, two alignment marks ALMG and ALMD are provided for each protruding portion FSL.

  There are a total of 24 inputs of the gate driver driving IC, and each is electrically connected to the output terminal TM. The pitch PG of the terminals TM is about 500 μm. The alignment mark ALMG is positioned in the vicinity of the 24 terminals TM to each drive IC, and the alignment accuracy with the input terminal wiring Td pattern is improved and inspection after connection is performed. In this example, in order to improve connection reliability, a dummy line is provided at a position adjacent to the 20 input terminals TM, and a square alignment mark ALMG is connected to the dummy line in a pattern. The square fill pattern (on the drain side, but refer to ALC in FIGS. 19 and 20) on the opposing transparent substrate SUB1 is aligned so as to be exactly within the square shape.

As shown in FIGS. 19 and 20, there are a total of 45 inputs for the drain driver driving IC, which are electrically connected to numbers 1 to 45 of the output terminal TM shown in FIG. The pitch PD of the terminals TM is about 410 μm. In this example, the alignment mark ALMD shown in FIG. 16A is provided with dummy lines NC (terminal numbers 2 and 44) for improving connection reliability adjacent to the 41 input terminals TM. Further, on the outer side, a terminal (numbers 1 and 45) shown in FIG. 16A is provided to supply a voltage _Vcom to the common transparent pixel electrode COM which is a counter electrode of the liquid crystal capacitor Clc and is inside the transparent insulating substrate SUB2. ) Is arranged. Thus, the common voltage is supplied from the conductive beads or paste to the common transparent pixel electrode COM on the transparent insulating substrate SUB2 through the wiring Td pattern on the transparent insulating substrate SUB1.

  The alignment mark ALMD is pattern-connected to terminals (numbers 1 and 45) electrically connected to the electrode COM, and is aligned with the square fill pattern ALD (see FIG. 20) on the transparent substrate SUB1. Further, in this example, a joint pattern (not shown) for connecting to the gate driver substrate FPC1 is provided at the lower end of the drain driver substrate FPC2 in FIG.

  Next, the shape of the conductor layer portion FSL having two or less layers will be described.

  The protruding length of the portion FSL made of single-layer or two-layer conductor wiring is about 3.7 mm because a bent portion (see FIG. 16A) is provided in this example. However, in the structure which is not bent, the partial FSL can be further shortened.

The protruding shape of the partial FSL was a convex shape separated for each driving IC. Thus, the thermal expansion flexible substrate in the longitudinal direction at the time of thermocompression bonding of a heat tool, the pitch P _G and P _D are changed in the terminal TM, it can prevent a phenomenon in which peeling or poor connection occurs between the connection terminals Td. That is, by the convex shape separated for each drive IC, it is possible to the thermal expansion amount corresponding to the length of the pitch P _G and P _D cycle also each driver IC shift up to the terminal TM. In this example, the convex shape is divided into 10 parts in the major axis direction of the flexible substrate, and this thermal expansion amount can be reduced to about 1/10, and the stress to the terminal TM can be reduced. Contributes to improving the reliability of the liquid crystal module MDL against heat.

  As described above, the alignment marks ALMG and ALMD are provided, and the protruding shape of the partial FSL is a protruding shape separated for each driving IC, so that even if the number of connection wirings or the number of display data increases, the connection can be made accurately. The peripheral drive circuit can be reduced while ensuring reliability.

  Next, the conductor layer portion FML having three or more layers will be described.

  Chip capacitors CHG and CHD are mounted on the conductor layer portions FML of the FPCs 1 and 2. That is, in the gate-side substrate FPC1, six chip capacitors CHG are soldered between the ground potential Vss (0 volt) and the power source Vdg (10 volts) or between the power source Vsg (5 volts) and the power source Vdg. Further, in the drain side substrate FPC2, a total of ten chip capacitors CHD are soldered between the ground potential Vss and the power supply Vdd (5 volts or 3.3 volts) or between the ground potential Vss and the power supply Vdd. These capacitors CHG and CHD are for reducing noise superimposed on the power supply line.

  In this example, these chip capacitors CHD are designed so as to be soldered only to one surface conductor layer L1 and positioned under the transparent insulating substrate SUB1 after being bent. Therefore, the capacitor for smoothing the power supply noise can be mounted on the substrates FPC1 and FPC2 while keeping the thickness of the liquid crystal module MDL constant.

  Next, a method for reducing high frequency noise generated from the information processing apparatus will be described.

  Since the metal shield case SHD side is the front side of the liquid crystal module MDL and is the front side of the information processing equipment, the generation of EMI (Electro Magnetic Interference) noise from this face is large in the usage environment for external equipment. Cause problems.

  For this reason, in this example, the surface layer L1 of the conductor layer portion FML is covered with a solid or mesh pattern ERH of the DC power source as much as possible. FIG. 23A is a plan (front, top) view showing a surface conductor layer pattern configuration of a multilayer wiring portion FML portion in a part of FIG. 15B. The mesh MESH is composed of a large number of holes having a diameter of about 300 μm formed in the surface conductor layer L1, and the mesh pattern ERH covers almost the entire surface except for the through holes VIA and the capacitor parts CHD.

  Further, as shown in FIG. 15B, the pattern FGP in which the pattern ERH is exposed from the solder resist SRS is arranged at five locations on the drain side substrate FPC2, and a frame ground HS made of a metal thin plate described later (FIGS. 1 and 14). The EMI noise is reduced by soldering to the ground FGF (see FIG. 2) of the shield case SHD. That is, as in this example, when the circuit board is divided into a plurality of parts, electrical problems do not occur as long as at least one of the drive circuit boards is connected to the frame ground in terms of direct current. If there are few locations in the high-frequency region, the potential for generating unnecessary radiated radio waves that cause EMI increases due to reflection of electrical signals due to differences in the characteristic impedance of each drive circuit board, and fluctuation of the potential of the ground wiring. . In particular, in an active matrix type module MDL using thin film transistors, it is difficult to take measures against EMI because a high-speed clock is used. In order to prevent this, the ground wiring (AC ground potential) is connected to the common frame (that is, the shield case SHD) having a sufficiently low impedance at at least one location in the drain driver substrate FPC2, in this example, five locations. Since the ground wiring in the high frequency region is strengthened by passing through the frame ground HS, compared to the case where only one place is connected to the shield case SHD as a whole, the case of the five places in this embodiment is greatly increased in the electric field intensity of radiation. There was an improvement.

《Frame Ground HS》
14A is a front side view of a thin metal plate (hereinafter referred to as frame ground) HS for taking a frame ground, FIG. 14B is a rear view, FIG. 14C is a side view, and FIG. FIG. 4 is an enlarged detail view of A part, B part, C part, and D part of (b).

  The structure of the frame ground HS is shown in FIG. 14, the positional relationship with other members of the frame ground HS is shown in FIG. 1, and the positional relationship after the installation of the frame ground HS is shown in FIGS.

  In order to prevent EMI, the frame ground HS for taking a so-called frame ground was obtained by bending a thin thin metal plate having a thickness of 0.2 mm thinner than the thickness of the shield case SHD at 90 degrees along its extension direction. It consists of an elongated first metal sheet HSB and a second metal sheet HSH that are perpendicular to each other. From the metal thin plate HSB, the convex portion JT extends in the same plane as the metal thin plate HSB and in the downward direction. As shown in FIG. 14A, five protrusions JT are provided at regular intervals in the extending direction of the thin metal plate HSH, and soldered to the ground FGF (FIG. 2) of the metal shield case SHD. It is a part that is electrically and mechanically connected. The HIS 2 is electrically and mechanically soldered to the frame ground pad FGP (see FIG. 15B) provided on the surface of the drain line driving flexible substrate FPC2 with a predetermined interval in the extending direction. There are five parts that are connected to each other. A hole HOLE is provided adjacent to each solder connection portion HIS2. Due to the presence of the hole HOLE, the heat capacity during soldering can be reduced, and the soldering portion HIS2 and the frame ground pad FGP can be soldered well. Note that a cutout may be provided instead of the hole HOLE. HIS1 is an insulating material affixed on the thin metal plate HSH, and covers the metal surface except for the soldering portion HIS2 to prevent short circuit with other components. Both surfaces of the soldering portion HIS2 and the convex portion JT are solderable surfaces, and the other surfaces are coated with rust prevention. Further, the metal thin plate HSH is a notch DNT in which a chip component (CHD: chip capacitor for power supply noise removal connected to the power supply line) mounted on the flexible substrate FPC2 is accommodated (FIGS. 4, 15, 22 (a) and 26). Is provided.

  As shown in FIGS. 1, 26 and 28, one end of the flexible substrate FPC2 is connected to the upper surface end portion of the lower transparent glass substrate SUB1 of the liquid crystal display element PNL, and the intermediate portion is folded in the vicinity of the outer side of the end side. The other end is disposed below the lower surface of the end portion of the lower transparent glass substrate SUB1. The frame ground HS having the metal thin plate HSB and the metal thin plate HSH perpendicular to each other electrically connects the ground line of the flexible substrate FPC2 and the metal shield case SHD. The metal thin plate HSH is the lower transparent glass substrate SUB1. The solder connection portion HIS2 of the thin metal plate HSH is disposed below the flexible substrate FPC2 disposed on the lower side of the end of the FGP of the frame ground pad of the flexible substrate FPC2 (FIGS. 4, 6, 15, and 22 (a)). And the solder SLD2 are electrically and mechanically connected. Further, as shown in FIGS. 26 and 28, the thin metal plate HSB is disposed along the inner side surface of the shield case SHD, and its convex portion JT is electrically connected by the ground FGF (see FIG. 2) of the shield case and the solder SLD1. And mechanically connected.

  In this example, the ground line of the flexible substrate FPC2 for driving the drain line and the metal shield case SHD having a sufficiently low impedance are electrically connected via the frame ground HS made of a thin metal plate, so that the stable as described above. The ground line in the high frequency region can be strengthened. Therefore, since it is possible to eliminate the influence of noise that enters from the outside or is generated inside, stable display quality can be obtained, and generation of harmful radiation waves that cause EMI can be suppressed. Also, compared to the technique of bending a claw formed integrally by cutting out a part of the upper surface or side surface of the shield case SHD and connecting it to the ground line of the circuit board, the connection workability is better and the bending direction is required. Space can be reduced, which is advantageous for reducing the frame portion and thickness of the liquid crystal display module MDL, and making the liquid crystal display module MDL and information processing apparatus (FIGS. 35 and 36) thinner, smaller, and larger. In this example, the circuit board electrically connected to the shield case SHD via the frame ground HS is the drain line driving flexible board FPC2, and the gate line scanning driving flexible board FPC1 has a frame ground. However, this is because the clock input to the drain-side flexible board FPC2 is fast and is likely to generate noise, and the clock input to the gate-side flexible board FPC1 is slow and is unlikely to generate noise. By providing a plurality of pads FGP with an interval in the direction of extension of the flexible substrate FPC2, the potential of the power supply and the ground becomes more stable. Therefore, the impedance matching is better than the connection with the shield case SHD at one point. I can take it. In addition, taking the frame ground at a portion far from the signal input side of the circuit board can stabilize the ground more and prevent the effect of the flexible board as an antenna.

<< Interface circuit board PCB >>
FIG. 25A is a back surface (bottom surface) view of the interface circuit board PCB having the functions of the controller unit and the power supply unit, and FIG. 25B is a partial front side view and a side view of the mounted hybrid integrated circuit HI. ) Is a front (top) view of the interface circuit board PCB.

  In this example, the substrate PCB is a 6-layer multilayer printed circuit board made of a glass epoxy material. Although a multilayer flexible substrate can be used, since this portion does not employ a folding structure, a multilayer printed substrate having a relatively low price is used.

  All electronic components are mounted on the lower surface side of the substrate PCB, which is the back surface side when viewed from the information processing apparatus. For the display control device, one integrated circuit element TCON is arranged on the substrate. The integrated circuit element TCON is not housed in a package, and is formed by mounting an integrated circuit IC directly on a printed circuit board in a ball grid array. The interface connector CT1 is located substantially at the center of the substrate, and further includes a plurality of resistors, capacitors, and circuit components EMI for removing high frequency noise.

  Further, the hybrid integrated circuit HI is configured by integrating a part of the circuit in a hybrid manner and mounting a plurality of integrated circuits and electronic components mainly for forming a power supply on the upper and lower surfaces of a small circuit board. One is mounted on the PCB. As shown in the drawing, the leads of the hybrid integrated circuit HI are formed long, and a plurality of electronic components EP including TCON are mounted on the circuit board PCB between the circuit board PCB and the hybrid integrated circuit HI.

  In this example, the connector CT3 is used for the electrical connection between the gate driver board FPC1 and the interface circuit board PCB via the electrical connection means JN1.

  The reason for using the connector CT3 is that it can be electrically connected to the flexible substrate FPC1 with high reliability even when the number of pixels and the number of display colors increase and the pitch between wirings becomes narrow.

  The upper surface of the substrate PCB is the surface side when viewed from the information processing apparatus, and is the direction in which the potential at which EMI noise is most radiated is high. For this reason, in this example, as shown in FIG. 25C, the multi-layered surface conductor layer is almost entirely covered with a ground solid or mesh pattern ERH. FIG. 23B is an enlarged top (front) view of the mesh pattern ERH. A copper conductor mesh pattern ERH is formed under the solder resist SRS except for the through-hole VIA portion. The pattern ERH can reduce EMI noise radiation by being electrically connected to the ground pattern GND on the lower surface of the substrate PCB. The ground pattern GND is connected to the ground on the main body side by connecting the ground GND of the substrate PCB and the ground FGN of the shield case SHD and soldering to the ground coming from the connector CT1.

  In this example, the interface circuit board PCB has a length of 172.3 mm and a width of 13.1 mm.

  As described above, in the flexible substrates FPC1 and FPC2, the surface conductor layer of the substrate is covered with the pattern ERH, and the outer peripheral portions of the two sides of the liquid crystal display element PNL are all fixed with a DC potential, effectively EMI noise radiation from the can be reduced.

  27A is a cross-sectional view taken along the line CC ′ of FIG. 2, and FIG. 27B is a cross-sectional view taken along the line DD ′.

  As shown in FIG. 27, when viewed from the direction perpendicular to the surfaces of the transparent glass substrates SUB1 and SUB2, the interface circuit board PCB is overlaid with the liquid crystal display element PNL and disposed below the lower surface of the lower transparent insulating substrate SUB1. Has been. Further, one end of the gate driver flexible substrate FPC1 is directly and mechanically connected to the transparent glass substrate SUB1 of the liquid crystal display element PNL, and unlike the drain side, the entire width of the gate driver flexible substrate FPC1 is almost the same as that of the interface circuit board PCB. It is overlaid on top. Thus, the width and area of the frame portion can be reduced by partially overlapping the interface circuit board PCB with the liquid crystal display element PNL and further arranging the gate driver circuit board FPC1 on the interface circuit board PCB. The external dimensions of an information processing device such as a liquid crystal display element and a personal computer or a word processor incorporating the liquid crystal display element as a display portion can be reduced. Note that the interface circuit board PCB has a surface on which the mesh pattern ERH shown in FIG. 25C is formed attached to the lower surface of the lower transparent glass substrate SUB1 with a double-sided tape BAT, and is fixed. Further, the interface circuit board PCB of this example has a length of 172.3 mm and a width of 13.1 mm. The conductor layer consists of six layers L1 to L6, L1 is for component pads, L2 is for signals and ground, L3 is for signals, L4 and L5 are for power supply, L6 is for ground, and mesh pattern ERH is formed Has been.

<< Liquid Crystal Display Element ASB with Drive Circuit Board >>
Next, the liquid crystal display element ASB with a drive circuit board will be described.

  As shown in FIG. 26A, the drain driver flexible substrate FPC2 is bent and bonded to the surface opposite to the pattern formation surface of the transparent insulating substrate SUB1. Polarizers POL1 and POL2 are located slightly outside the effective pixel area AR (about 1 mm), and the end of the FML of the substrate FPC2 is located about 1 to 2 mm away therefrom. The distance from the end of the transparent insulating substrate SUB1 to the protruding tip of the bent portion of the FPC 2 is as small as about 1 mm, and compact mounting is possible. Therefore, in this example, the distance from the effective pixel area AR to the protruding tip of the bent portion of the substrate FPC2 is about 7.5 mm.

  Next, a flexible substrate bending mounting method will be described.

  FIG. 22 is a perspective view showing a method for bending and mounting a multilayer flexible substrate. The drain driver substrate FPC2 and the gate driver substrate FPC1 are connected by using a flat connector CT4 provided at the tip of the convex portion JT2 made of a flexible substrate integral with the FPC2 as a joiner, and bent to form an interface substrate shown in FIG. Electrically connected to the connector CT2 of the PCB.

  Next, a double-sided tape BAT (see FIGS. 28, 26, and 5) is attached to the surface of the flexible substrate FPC2 where the component layer part FML is not mounted at all, and is bent at the conductor layer part BNT using a jig.

  The width of the used double-sided tape BAT is 3 mm and is a long and narrow shape having a length of 160 to 240 mm. However, it is only necessary to ensure adhesiveness, and a short shape may be attached at several places. Further, the double-sided tape BAT may be previously pasted on the transparent insulating substrate SUB1 side.

  As described above, using the jig, the multilayer flexible substrate FPC2 can be bent with high accuracy and bonded to the surface of the transparent insulating substrate SUB1.

<< Rubber Cushion GC >>
The rubber cushions GC1 and GC2 are shown in FIGS. 1, 6, 26 (b) and 27 (b). The rubber cushions GC1 and GC2 are disposed via a prism sheet PRS between the lower surface of the periphery of the frame of the lower transparent glass substrate SUB1 of the liquid crystal display element PNL and the lower case MCA that houses the backlight BL. . By using the elasticity of the rubber cushions GC1 and GC2 to push the shield case SHD toward the inside of the apparatus, the fixing hook HK is caught on the fixing protrusion HP, and the fixing claw NL is bent to enter the fixing recess NR. When inserted, each fixing member functions as a stopper, the shield case SHD and the lower case MCA are fixed, the entire module is firmly held together, and no other fixing member is required. Therefore, assembly is easy and manufacturing cost can be reduced. Further, the mechanical strength is high, the vibration shock resistance is high, and the reliability of the apparatus can be improved. The rubber cushions GC1 and GC2 have an adhesive material on one side and are attached to predetermined locations on the substrate SUB2.

<< Backlight BL >>
7 is a front view of the backlight BL, and FIG. 8 is a front view of the backlight BL when the prism sheet PRS and the diffusion sheet SRS are removed from the backlight BL of FIG. FIG. 9 is a front view of a backlight BL similar to FIG. 8 showing another configuration example.

  The sidelight-type backlight BL that illuminates the liquid crystal display element PNL from the back includes one cold cathode fluorescent tube LP, a lamp cable LPC of the fluorescent tube LP, two rubber bushes GB holding the fluorescent tube LP and the lamp cable LPC, Light guide plate GLB, diffusion sheet SPS disposed in contact with the entire upper surface of light guide plate GLB, reflection sheet RFS disposed over the entire lower surface of light guide plate GLB, and two prisms disposed in contact with the entire upper surface of diffusion sheet SPS It is composed of a sheet PRS.

  The reflection sheet LS is placed on the reflection sheet LP, then rolled and bent 180 degrees, and the reflection sheet LS is bonded to the lower surface of the end of the light guide plate GLB with a double-sided tape BAT having an adhesive (FIG. 26 ( a)).

<< Diffusion sheet SPS >>
The diffusion sheet SPS is placed on the light guide plate GLB, diffuses light emitted from the upper surface of the light guide plate GLB, and uniformly irradiates the liquid crystal display element PNL with light.

<< Prism sheet PRS >>
The prism sheet PRS is placed on the diffusion sheet SPS, the lower surface is a smooth surface, and the upper surface is a prism surface. The prism surface is composed of, for example, a plurality of grooves having a V-shaped cross section arranged in parallel straight lines with each other (in other words, a plurality of triangular prisms are arranged in parallel). The prism sheet PRS can improve the brightness of the backlight BL by collecting light diffused from the diffusion sheet SPS over a wide angular range in the normal direction of the prism sheet PRS. Therefore, the power consumption of the backlight BL can be reduced, and as a result, the module MDL can be reduced in size and weight, and the manufacturing cost can be reduced. When two prism sheets PRS are used, the two prism sheets PRS are arranged so as to overlap each other so that the extending directions of the grooves of the two prism sheets PRS are orthogonal to each other.

<< Fixing method of diffusion sheet SPS and prism sheet PRS >>
Two fixing small holes whose positions coincide with each other at the time of installation of the sheets are provided in each side edge portion of the diffusion sheet SPS which is an optical sheet and the two prism sheets PRS. Correspondingly, pin-shaped convex portions MPN are provided integrally with the case MCA at both ends of one side of the lower case MCA manufactured by molding. In addition, as shown in FIG. 8, one convex portion MPN is provided on each of the upper and lower sides of the inverter accommodating portion MI of the backlight BL on the one side of the lower case MCA. When installing the diffusion sheet SPS and the prism sheet PRS, the convex portions MPN are respectively inserted through these small holes, and then, the sleeves SLV through which the convex portions pass are fitted into the tip portions of the convex portions MPN, respectively. And two prism sheets PRS are fixed. The sleeve SLV is made of, for example, an elastic body such as silicon rubber, and the inner diameter of the hole of the sleeve SLV is smaller than the outer diameter of the convex portion MPN, thereby making it difficult for the sleeve SLV to fall off.

  Further, in this example, in order to further improve the accuracy of position fixing, at least one small hole is provided in another side edge of the optical sheet, and the pin is provided integrally with the other side edge of the case. The small holes are made to penetrate through the convex portions. FIG. 11 shows a planar relative positional relationship between the transparent insulating substrate SUB1 and the circuit board PCB and the case MCA. On the side opposite to the backlight BL, one additional small hole of the optical sheet is passed through the pin-shaped convex portion MPN provided integrally at one end of the case, and a total of three small holes are provided. The position is fixed with high accuracy. The additional small holes and pin-shaped convex portions MPN are arranged below the transparent insulating substrate SUB1 and further inside the outer peripheral portion of the transparent insulating substrate SUB1, thereby reducing the outer shape of the liquid crystal module. The pin-shaped convex portion MPN is in a position that does not overlap with the circuit board PCB disposed under the gate-side flexible board FPC1, so that it is integrated with the case MCA without increasing the thickness of the liquid crystal module. Can be provided.

  With such a configuration, when the backlight diffusion sheet SPS and the prism sheet PRS are installed, the workability is good, and the position is automatically determined by the combination of the convex portion MPN and the small hole, so that the positioning is accurate and easy. Can be. Furthermore, one predetermined sheet can be easily detached, only defective sheets can be replaced, and sheets can be easily reproduced (repaired). As a result, manufacturing time can be reduced, workability can be improved, and cost can be reduced.

<< Reflection sheet RFS >>
The reflection sheet RFS is disposed under the light guide plate GLB, and reflects light emitted from the lower surface of the light guide plate GLB toward the liquid crystal display element PNL.

《Lower case MCA》
10 is a front view, a front side view, a rear side view, a right side view, a left side view of the lower case MCA, and FIG. 11 is an A portion, a B portion, a C portion, and a D portion of the front view of FIG. That is, it is an enlarged detailed view of a corner portion of the lower case MCA.

  The lower case MCA formed by molding is a holding member such as a fluorescent tube LP, a lamp cable LPC, and a light guide plate GLB, that is, a backlight storage case, and is made by integrally molding a single mold with synthetic resin. It is done. Since the lower case MCA is firmly united by the action of the metal shield case SHD, each fixing member and the elastic body, the vibration impact resistance and thermal shock resistance of the module MDL can be improved, and the reliability can be improved.

  On the bottom surface of the lower case MCA, a large opening MO occupying an area of more than half of the surface is formed in the central portion excluding the surrounding frame-like portion. Thereby, after the assembly of the module MDL, the lower case is caused by the repulsive force of the rubber cushions GC1 and GC2 (see FIGS. 26 (b) and 27 (b)) between the liquid crystal display element PNL and the lower case MCA. Due to the force applied to the bottom surface of the MCA in the vertical direction from the top surface to the bottom surface, the bottom surface of the lower case MCA can be prevented from swelling and the maximum thickness can be suppressed. Therefore, in order to suppress swelling, it is not necessary to increase the thickness of the lower case, and the thickness of the lower case can be reduced. Therefore, the module MDL can be reduced in thickness and weight.

  The MCL in FIG. 10 is a heat generating component of the interface circuit board PCB, and in this embodiment, the hybrid IC power supply circuit (DC-DC converter DD) shown in FIGS. 5, 24A, and 24B is mounted. This is a notch (including a notch for connecting the connector CT1) provided in the lower case MCA at a location corresponding to the part. In this way, by providing a notch without covering the heat generating part on the circuit board PCB with the lower case MCA, the heat dissipation of the heat generating part of the interface circuit board PCB can be improved. That is, at present, in order to improve the performance of a liquid crystal display device using a thin film transistor TFT and improve the ease of use, there is a demand for multi-gradation and single power supply. A circuit for realizing this consumes a large amount of power, and if circuit means are to be mounted in a compact manner, high-density mounting occurs, and heat generation becomes a problem. Therefore, by providing the lower case MCA with the notch MCL corresponding to the heat generating portion, it is possible to improve the high-density mounting property and compactness of the circuit. In addition, the display control integrated circuit element TCON may be considered as a heat-generating component, and the lower case MCA on the display control integrated circuit element TCON may be cut out.

  MH in FIG. 10 is four attachment holes for attaching the module MDL to an application device such as a personal computer. The metal shield case SHD also has a mounting hole HLD that matches the mounting hole MH of the lower case MCA, and is fixed and mounted on the application product using screws or the like.

  The rubber bush GB holding the fluorescent tube LP and the lamp cable LPC is fitted into the storage portion MG formed so that the rubber bush GB fits exactly, and the fluorescent tube LP is not in contact with the lower case MCA and is in the storage portion ML. It is stored in.

  10 and 11, MB is a holding part of the light guide plate GLB, and PJ part is a positioning part. ML is a housing portion for the fluorescent tube LP, and MG is a housing portion for the rubber bush GB. MC1 to MC4 are storage units for the lamp cables LPC1 and LPC2.

<< Storage in the lower case MCA of the light guide plate GLB >>
In this example, the positioning portion (support frame) PJ of the lower case MCA that houses and holds the light guide plate GLB of the backlight is prevented from being damaged.

  FIG. 12A is a front view showing the light guide plate GLB and the corner portion of the positioning portion PJ of the lower case MCA that houses and holds the light guide plate GLB, and FIG. 12B shows the positioning portion PJ of the conventional light guide plate GLB. FIG. 5C is a front view showing how force is applied when the module MDL is dropped to the lamp side in the corner portion, and FIG. 5C is a front view showing how force is applied at the corner portion of the positioning portion PJ by the light guide plate GLB of this example. .

As shown in FIG. 12 (a), the four corner portions of the light guide plate GLB are chamfered to provide linear oblique portions, and the corner portions of the positioning portions PJ are also provided corresponding to the oblique portions of the light guide plate GLB. Straight diagonal portions are provided. Conventionally, as shown in (b), since the corner portion of the light guide plate GLB is a right angle and the corner portion of the positioning portion PJ is also a right angle, it is weak against the force F in the side direction (y direction) of the light guide plate GLB. When the light guide plate, which is a particularly heavy member among the components of the module, moves in the liquid crystal display module due to vibration or impact, the positioning portion PJ may be damaged and the lamp LP may be destroyed. However, in this example, since the oblique portion is provided at each corner portion of the light guide plate GLB and the positioning portion PJ, the force F applied to the positioning portion PJ becomes two directional components f _x and f as shown in (c). _{Even if} the resultant force is equal, the force of the two x and y components can be reduced. Therefore, in recent years, the impact applied to the positioning portion PJ of the lower case MCA that tends to be reduced in width and thickness. Is reduced, damage to the positioning portion PJ can be prevented, impact resistance is improved, and reliability is improved.

《Cold cathode fluorescent tube LP placement position》
As shown in FIG. 26A, in the module MDL, the elongated fluorescent tube LP is a space below the drain-side flexible substrate FPC2 and the drain-side driver IC mounted on one of the long sides of the liquid crystal display element PNL (see FIG. 26). Thereby, since the external dimension of module MDL can be made small, module MDL can be reduced in size and weight, and manufacturing cost can be reduced.

  That is, as shown in FIGS. 7 to 9, the cold cathode fluorescent tube LP of the backlight BL is arranged on the long side of the liquid crystal display module MDL and on the display lower side. That is, as shown in FIGS. 35 and 36, when the liquid crystal display module MDL is incorporated as a display unit in an information processing apparatus such as a personal computer or a word processor, the cold cathode fluorescent tube LP is located on the lower side of the long side of the display unit. Is arranged. LPC2 is a high-voltage side lamp cable to which a high voltage of about 1100 V is applied, and LPC1 is a ground voltage side lamp cable. The example shown in FIGS. 7 and 8 is a case where the inverter IV is arranged in the inverter accommodating portion MI in the display portion, and the lamp cable LPC1 is along the two left and upper sides of the liquid crystal display module MDL as will be described in detail later. The lamp cable LPC2 is wired along one right side, and both the lamp cables LPC1 and LPC2 are protruding from the upper right. On the other hand, in the example shown in FIG. 9, the inverter IV can be arranged in the keyboard portion of the information processing apparatus, and the lamp cable LPC1 is wired along the left, top, and right sides of the liquid crystal display module MDL. The cables LPC1 and LPC2 are coming out from the lower right.

  By arranging the cold cathode fluorescent tube LP on the lower side of the display of the liquid crystal display module MDL as described above, even when the inverter IV is arranged in the keyboard portion of the information processing apparatus as shown in FIG. The length of the lamp cable LPC2 on the high-pressure side can be reduced, the impedance that causes the generation of noise and the waveform can be reduced, and the startability of the cold cathode fluorescent tube LP can be improved. When the inverter IV is arranged on the keyboard part side, the width of the display part can be further reduced. Further, as compared with the case where the cold cathode fluorescent tube LP is arranged on the upper side of the display of the liquid crystal display module MDL, the cold cathode fluorescent tube LP is less susceptible to an impact due to the opening and closing of the display unit in FIGS. Also, as shown in FIGS. 35 and 36, the center of the liquid crystal display element PNL (display screen) is shifted upward from the center of the display unit, so that it is difficult for the user to hit the keyboard to see the lower part of the display screen. Can be prevented.

  As is clear from FIGS. 9 to 11 and FIG. 26, the lamp cable LPC1 passes under the light guide plate GLB on the upper side of the display, so that the length in the vertical direction can be reduced.

<< Storing the lamp cable LPC in the lower case MCA >>
In this example, the wiring of the lamp cable LPC is devised for compact mounting and so as not to adversely affect the EMI noise.

  FIG. 26B is a sectional view taken along the line BB ′ of the liquid crystal display module MDL shown in FIG.

  That is, as described above, in FIG. 8, among the two lamp cables LPC, the cable LPC1 on the ground voltage side is attached to the lower case MCA so as to follow the outer shape of the two sides other than the storage portion of the fluorescent tube LP. It is accommodated in the accommodating parts MC4 and MC2 formed of the formed grooves (see FIGS. 10, 26 (b), and 27 (a)). The high voltage side cable LPC2 is shortly wired so as to be close to the portion connected to the inverter (inverter power supply circuit) IV, and is accommodated in the accommodating portion MC1 formed of a groove formed in the lower case MCA (FIG. 10, FIG. 27 (b)). In FIG. 9, the cable LPC1 on the ground voltage side includes storage portions MC4, MC2, MC1 (including grooves formed in the lower case MCA so as to follow the outer shape of the three sides other than the storage portion of the fluorescent tube LP. (See FIG. 10). The high voltage side cable LPC2 is shortly wired so as to be close to the keyboard portion of the information processing apparatus incorporating the inverter IV, and is accommodated in the accommodating portion MC3 including a groove formed in the lower case MCA. Therefore, since only the ground voltage wiring takes a long path, the adverse effect on EMI noise does not change compared to the conventional case. Therefore, as compared with the conventional case where the two lamp cables LPC1 and LPC2 are taken out from one side, as shown in FIG. 26A, there is no lamp cable LPC1 on the fluorescent tube LP side, and the wiring area is reduced. It can be reduced by 1.5-2mm. In this example, as shown in FIG. 26 (b), the lamp cable LPC1 is arranged so as to be positioned on the inner side of the transparent insulating substrate SUB1 and below the light guide plate GLB, thereby achieving a compact design.

  An inverter IV is connected to the leading ends of the lamp cables LPC1 and LPC2. The inverter IV is stored in the inverter storage part MI or in the keyboard part of an information processing apparatus such as a personal computer or a word processor. As described above, when the module MDL is incorporated into an application product such as a personal computer, the lamp cable LPC does not pass through the outer side surface of the module, and the inverter IV does not protrude outside the module MD. The lamp cable LPC, the rubber bush GB, and the inverter IV can be stored and mounted in a compact manner, and the module MDL can be reduced in size and weight, and the manufacturing cost can be reduced.

  In addition, you may install the installation place of fluorescent tube LP in the short side of the light-guide plate GLB.

  The outline of the TFT liquid crystal display module of this embodiment will be described below.

  FIG. 30 is a block diagram showing a TFT liquid crystal display element (panel) and circuits arranged on the outer periphery thereof. The drain driver section 103 is disposed only on the lower side of the TFT liquid crystal display element (TFT-LCD), and the XGA specification liquid crystal display element (TFT-LCD) composed of 800 × 3 × 600 pixels is disposed on the side surface portion. A gate driver unit 104, a controller unit 101, and a power supply unit 102 are arranged.

  As described above, the drain driver unit 103 was formed by folding and mounting a multi-layer flexible substrate and was sufficiently compact.

  The controller unit 101 and the power supply unit 102 are mounted on the multilayer printed circuit board PCB. The interface board PCB on which the controller unit 101 and the power supply unit 102 are mounted is disposed on the back side of the gate driver unit 104 disposed on the outer peripheral portion of the short side of the liquid crystal element PNL. This is because there is a restriction on the width of the information processing apparatus (device), and it is necessary to reduce the width of the module MDL as the display unit as much as possible.

  As shown in FIG. 30, the thin film transistor TFT is arranged in an intersection region between two adjacent drain signal lines D and two adjacent gate signal lines G.

  The drain electrode and the gate electrode of the thin film transistor TFT are connected to the drain signal line D and the gate signal line G, respectively.

  Since the source electrode of the thin film transistor TFT is connected to the pixel electrode, and the liquid crystal layer is provided between the pixel electrode and the common electrode, the liquid crystal capacitor CLC is equivalently connected between the source electrode of the thin film transistor TFT.

  The thin film transistor TFT becomes conductive when a positive bias voltage is applied to the gate electrode, and becomes non-conductive when a negative bias voltage is applied to the gate electrode.

  In addition, a storage capacitor Cadd is connected between the source electrode of the thin film transistor TFT and the previous gate signal line.

  It should be understood that the source electrode and the drain electrode are originally determined by the bias polarity between them, and the polarity is inverted during the operation in the circuit of this liquid crystal display device, so that the source electrode and the drain electrode are interchanged during the operation. However, in the following description, for convenience, one is fixed as a source electrode and the other is fixed as a drain electrode.

  FIG. 33 is a block diagram showing a schematic configuration of each driver (drain driver, gate driver, common driver) of the TFT liquid crystal display module of this example and a signal flow.

  33, the display control device 201 and the buffer circuit 210 are provided in the controller unit 101 shown in FIG. 30, the drain driver 211 is provided in the drain driver unit 103 shown in FIG. 30, and the gate driver 206 is the gate driver shown in FIG. The unit 104 is provided.

  The drain driver 211 is composed of a data latch unit for display data and an output voltage generation circuit.

  Further, the gradation reference voltage generation unit 208, the multiplexer 209, the common voltage generation unit 202, the common driver 203, the level shift circuit 207, the gate-on voltage generation unit 204, the gate-off voltage generation unit 205, and the DC-DC converter 212 are shown in FIG. Provided in the power supply unit 102.

  FIG. 32 shows the common voltage applied to the common electrode, the drain voltage applied to the drain, the level of the gate voltage applied to the gate electrode, and the waveform thereof. The drain waveform indicates the drain waveform when black is displayed.

  FIG. 31 is a diagram showing the flow of display data and clock signals for the gate driver 206 and the drain driver 211 in the TFT liquid crystal display module of this example. FIG. 34 is a timing chart showing display data input from the main computer to the display control apparatus 201 and signals output from the display control apparatus 201 to the drain and gate drivers.

  The display control device 201 receives a control signal (clock, display timing signal, synchronization signal) from the main body computer, and uses a clock D1 (CL1), a shift clock D2 (CL2), and display data as control signals to the drain driver 211. At the same time, a frame start instruction signal FLM, a clock G (CL3), and display data are generated as control signals to the gate driver 206.

  Further, the carry output of the previous stage of the drain driver 211 is directly input to the carry input of the drain driver 211 of the next stage.

  As apparent from FIG. 34, the shift clock D2 (CL2) of the drain driver is the same as the frequency of the clock signal (DCLK) and display data input from the main body computer, and the XGA element has a high frequency of about 40 MHz. EMI countermeasures are important.

<< Information processing with LCD module MDL mounted >>
FIGS. 35 and 36 are perspective views of a notebook personal computer or a word processor, respectively, on which the liquid crystal display module MDL is mounted. FIG. 35 shows the case where the inverter IV is arranged in the display unit, that is, the inverter housing part MI (see FIGS. 7 and 10) of the liquid crystal display module MDL, and FIG. 36 shows the case where it is arranged in the keyboard unit.

  Mounting the drive IC on the liquid crystal display element PNL, adopting a multilayer flexible board as the peripheral drain and gate driver peripheral circuit, and bending mounting to the drain driver circuit greatly improves the external shape The size can be reduced. In this example, since the drain driver peripheral circuit mounted on one side can be arranged on the upper side of the display unit above the hinge of the information device, compact mounting is possible.

  First, in the figure, the signal from the information device goes from the connector located at the approximate center of the left interface board PCB to the display control integrated circuit element (TCON), and the display data converted here is the peripheral for the drain driver. It flows to the circuit. As described above, by using the flip chip method and the multilayer flexible substrate, it is possible to eliminate the restriction on the outer width of the information device, and to provide a small-sized information device with low power consumption.

<< Plane and cross-sectional configuration in the vicinity of the driving IC chip mounting portion >>
FIG. 19 is a plan view showing a state in which a driving IC is mounted on a transparent insulating substrate SUB1 made of glass, for example. Furthermore, FIG. 24 shows a cross-sectional view taken along the line AA. In FIG. 19, one transparent insulating substrate SUB2 is indicated by a one-dot chain line, and is positioned above the transparent insulating substrate SUB1, and an effective display portion (effective screen area) AR is defined by the seal pattern SL (see FIG. 19). Including liquid crystal LC. The electrode COM on the transparent insulating substrate SUB1 is a wiring that is electrically connected to the common electrode pattern on the transparent insulating substrate SUB2 side through conductive beads, silver paste, or the like. The wiring DTM (or GTM) supplies an output signal from the driving IC to the wiring in the effective display area AR. The input wiring Td supplies an input signal to the driving IC. The anisotropic conductive film ACF has an elongated shape common to a plurality of driving IC portions arranged in a row and has an elongated shape common to ACF2 and input wiring pattern portions to the plurality of driving ICs. ACF1 is pasted separately. Although the passivation films (protective films) PSV1 and PSV are also shown in FIG. 24, the wiring part is covered as much as possible to prevent electrolytic corrosion, and the exposed part is covered with the anisotropic conductive film ACF1.

  Further, the periphery of the side surface of the driving IC is filled with epoxy resin or silicone resin SIL (see FIG. 24), and the protection is multiplexed.

  FIG. 32 shows the common voltage applied to the common electrode, the drain voltage applied to the drain, the level of the gate voltage applied to the gate electrode, and the waveform thereof. The drain waveform indicates the drain waveform when black is displayed.

  The gate on level waveform (DC) and the gate off level waveform change in level between −9 to −14 volts, and gate on at 10 volts. The drain waveform (when black is displayed) and the common voltage Vcom waveform change in level between about 0 to 3 volts. For example, in order to change the drain waveform of the black level every horizontal period (1H), the logic processing circuit performs logic inversion bit by bit and inputs it to the drain driver. The off-level waveform of the gate operates with substantially the same amplitude and phase as the common voltage Vcom waveform.

  FIG. 31 is a diagram showing the flow of display data and clock signals for the gate driver 104 and the drain driver 103 in the TFT liquid crystal display module of this example.

  The display control device 101 receives a control signal (clock, display timing signal, synchronization signal) from the main body computer, and uses a clock D1 (CL1), a shift clock D2 (CL2), and display data as control signals to the drain driver 103. At the same time, a frame start instruction signal FLM, a clock G (CL3), and display data are generated as control signals to the gate driver 104.

  The carry output of the previous stage of the drain driver 103 is input to the carry input of the drain driver 103 of the next stage as it is.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments and can be variously modified without departing from the gist thereof. For example, in the above-described embodiment, an example is shown in which the present invention is applied to an active matrix liquid crystal display device, but the present invention can also be applied to a simple matrix liquid crystal display device. In the above-described embodiment, an example is shown in which the present invention is applied to a flip-chip liquid crystal display device, but the present invention can also be applied to other types of liquid crystal display devices.

It is a disassembled perspective view of the liquid crystal display module which can apply this invention. FIG. 3 is a front view, a front side view, a right side view, and a left side view seen from the display side after the assembly of the liquid crystal display module is completed. It is a reverse view after the assembly completion of a liquid crystal display module. It is a front view of the liquid crystal display element with a drive circuit which mounted the drain side flexible substrate FPC2 before bending to the outer peripheral part of the liquid crystal display element PNL and the gate side flexible substrate FPC1. FIG. 5 is a back view of the liquid crystal display element with a drive circuit board of FIG. 4 on which an interface circuit board PCB is mounted. In the back view of the state where the shield case SHD is placed below and the flexible boards FPC1 and 2 and the interface circuit board PCB are mounted, the flexible board FPC2 is bent, and the liquid crystal display element PNL with drive circuit board is housed in the shield case SHD. is there. It is the front view and front side view of backlight BL. It is the front view and front side view of backlight BL when the prism sheet PRS and the diffusion sheet SRS are removed from the backlight BL of FIG. It is the front view and front side view of the backlight BL similar to FIG. 8 which shows another structural example. It is a front view, a front side view, a rear side view, a right side view, and a left side view of the lower case MCA. FIG. 11 is an enlarged detail view of an A part, a B part, a C part, and a D part (that is, a corner part of the lower case MCA) in the front view of FIG. 10. (A) is a front view which shows the corner part of positioning part PJ of light guide plate GLB and lower case MCA which accommodates and hold | maintains this light guide plate GLB, (b) is a corner part of positioning part PJ by the conventional light guide plate GLB. (C) is a front view which shows the degree of force application in the corner part of the positioning part PJ by the light guide plate GLB of this example. It is the front view and side view of a backlight before bending reflective sheet LS. (A) is a front side view of a thin metal plate (hereinafter referred to as a frame ground) HS for taking a frame ground, (b) is a rear view, (c) is a lateral side view, and (d) is a side view of (a). It is an enlarged detailed view of A part, B part, C part, and D part. (A) is the back surface (lower surface) figure of multilayer flexible substrate FPC2 for driving a drain driver, (b) is a front (upper surface) figure. FIG. 15A is an enlarged detailed view of a portion J in FIG. 15A, and FIG. 15B is a side view showing a mounted and folded state of the multilayer flexible substrate FPC2. (A) is the back surface (lower surface) figure of multilayer flexible substrate FPC1 for driving a gate driver, (b) is a front (upper surface) figure. It is the wiring schematic diagram which shows the connection relation between the signal wiring in the multilayer flexible substrate FPC and the input signal to the driving IC on the transparent insulating substrate SUB1. It is a top view which shows a mode that drive IC was mounted on the transparent insulation board | substrate SUB1 of a liquid crystal display element. It is a principal part top view of the mounting part periphery of the drain drive IC of transparent insulating substrate SUB1, and cutting-line CT1 vicinity of this board | substrate. 15A is a cross-sectional view taken along the line AA ′ of FIG. 15A, FIG. 15B is a cross-sectional view taken along the line BB ′, and FIG. 15C is a cross-sectional view taken along the line CC ′. It is a perspective view which shows the connection method of the bending mounting method of the multilayer flexible board | substrate FPC2 which can be bent, and multilayer flexible board | substrates FPC1 and 2. FIG. (A) is a front (upper surface) diagram showing a pattern of a surface conductor layer in a partial FML of three or more layers of the multilayer flexible substrate FPC2, and (b) is a partially enlarged detailed front view of the interface circuit board PCB in FIG. 25 (c). FIG. 6 is a diagram showing a state in which the entire surface is covered with a mesh pattern ERH fixed to a DC voltage. It is sectional drawing in the AA cut line of FIG. (A) is a back surface (bottom surface) view of the interface circuit board PCB having functions of a controller unit and a power supply unit, (b) is a partial front side view and a lateral side view of the mounted hybrid integrated circuit HI, and (c) is an interface circuit. It is a front (upper surface) figure of board | substrate PCB. (A) is sectional drawing in the AA 'cutting line of FIG. 2, (b) is sectional drawing in the BB' cutting line. (A) is sectional drawing in CC 'cutting line of FIG. 2, (b) is sectional drawing in DD' cutting line. FIG. 27 is an enlarged detail view of a main part of FIG. 26A showing a solder connection state of the frame ground HS. It is a block diagram which shows the liquid crystal display element of a liquid crystal display module, and the circuit arrange | positioned around it. It is a block diagram which shows the equivalent circuit of a TFT liquid crystal display module. It is a figure which shows the flow of the display data and clock signal from a display control apparatus to a gate and drain driver in a TFT liquid crystal display module. It is a figure which shows the level of the common voltage applied to a common electrode, the drain voltage applied to a drain electrode, the gate voltage applied to a gate electrode, and its waveform in a TFT liquid crystal display module. It is a block diagram which shows the schematic structure of each driver of a TFT liquid crystal display module, and the flow of a signal. It is a figure which shows the timing chart of the signal output from the main body computer to a display control apparatus, and the signal output to a gate and a drain from a display control apparatus in a TFT liquid crystal display module. 1 is a perspective view of a notebook personal computer or a word processor on which a liquid crystal display module is mounted. FIG. 10 is a perspective view of another notebook type personal computer or word processor on which a liquid crystal display module is mounted.

Explanation of symbols

  BL ... back light, LP ... fluorescent tube, MDL ... liquid crystal display module.

Claims (3)

A liquid crystal module used in an openable liquid crystal display device having a display unit and a keyboard unit,
On the display side,
A liquid crystal module having a liquid crystal display element, a light guide that irradiates light to the liquid crystal display element, and a linear light source disposed near one end surface of the light guide,
The linear light source is disposed on the long side of the light guide and on the lower side of the display unit, with the ground side on the left side and the high voltage side on the right side,
An inverter that drives the linear light source disposed on the keyboard side by taking out a ground side lamp cable and a high voltage side lamp cable of the linear light source from the lower right of the liquid crystal module, and the keyboard unit A liquid crystal display module that can be connected at the top right of the screen. In claim 1,
The inverter is on the keyboard part side, and is arranged in a region between the keyboard and the display part in a state where the display part is opened,
The ground-side lamp cable and the high-voltage-side lamp cable are connected on the right side in a region between the keyboard and the display section when the display section is opened with the inverter. . In claim 1 or 2,
The ground side lamp cable and the high voltage side lamp cable are liquid crystal display devices to which a connector for connecting to an inverter arranged on the keyboard side is attached.

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