JP2002196333A - Liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the damage of a case and a fluorescent tube even when a light transmission plate which is a heavy constituent member of a backlight is moved in a liquid crystal display device by vibration or impact. SOLUTION: The liquid crystal display device is provided with a liquid crystal element and the backlight for irradiating one surface of the liquid crystal display element with light. The backlight has the light transmission plate GLB opposed to one surface of the liquid crystal display element, the fluorescent tube opposed to the side surface of one side of the light transmission plate GLB and the case MCA housing the light transmission plate GLB and the fluorescent tube In the corner parts where the one side and the other pair of sides crossing the one side of the light transmission plate GLB are adjacent to each other, the light transmission plate GLB is linearly chamfered in the direction oblique to the one side. In the case MCA, supporting frames PJ respectively extended along the side surfaces of the other pair of sides of the light transmission plate GLB are formed and provided with linearly shaped oblique parts respectively formed along the chamfered parts of the light transmission plate GLB in the corner part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a liquid crystal display device having a liquid crystal display element and a flexible circuit board for driving the liquid crystal display element.

[0002]

2. Description of the Related Art For example, in a liquid crystal display element of an active matrix type liquid crystal display device, a liquid crystal on one of two transparent insulating substrates made of glass or the like, which are disposed opposite to each other with a liquid crystal layer interposed therebetween. On the layer side surface, the x
A gate line group extending in the direction and arranged in the y direction, and a drain line group extending in the y direction and insulated from the gate line group and arranged in the x direction are formed.

Each region surrounded by the group of gate lines and the group of drain lines becomes a pixel region, and the pixel region includes, for example, a thin film transistor (T) as a switching element.
FT) and a transparent pixel electrode.

When a scanning signal is supplied to the gate line, the thin film transistor is turned on, and a video signal from the drain line is supplied to the pixel electrode via the turned on thin film transistor.

It is to be noted that not only each drain line of the drain line group, but also each gate line of the gate line group is extended to the periphery of the transparent insulating substrate to form external terminals. A plurality of driving ICs (semiconductor integrated circuits) constituting the video driving circuit and the gate scanning driving circuit which are connected to each other are externally mounted around the transparent insulating substrate. That is, a plurality of tape carrier packages (TCPs) each mounting these driving ICs are externally provided around the substrate.

However, since the transparent insulating substrate has a configuration in which a TCP on which a driving IC is mounted is externally mounted, a gate line group and a drain of the transparent insulating substrate are formed by these circuits. The area occupied by a region (usually called a frame) between the outline of the display region formed by the intersection region with the line group and the outline of the outer frame of the transparent insulating substrate increases, and the liquid crystal display This is contrary to the desire to reduce the external dimensions of the module.

Therefore, in order to solve such a problem as much as possible, that is, in response to a demand to increase the density of the liquid crystal display element and to reduce the outer shape of the liquid crystal display module as much as possible, TCP components are not used. There has been proposed a configuration in which an image driving IC and a gate scanning driving IC are directly mounted on a transparent insulating substrate. Such a mounting method is called a flip chip method or a chip-on-glass (COG) method.

Although not a known example, the same applicant has applied to the flip-chip type liquid crystal display device.
Prior application for module mounting method (Japanese Patent Application No. 6-2)
56426).

[0009]

The liquid crystal display device (that is, the liquid crystal display module) has, for example, two substrates separated by a predetermined gap so that the surfaces on which a transparent electrode for display and an alignment film are laminated face each other. A transparent insulating substrate made of glass or the like is overlapped, and both substrates are bonded together with a sealing material provided in a frame shape (a square shape) in the vicinity of the peripheral portion between the two substrates, and provided on a part of the sealing material. A liquid crystal display element (ie, a liquid crystal display panel, LCD: liquid crystal) comprising a liquid crystal sealed inside the sealing material between the two substrates from the liquid crystal filling opening, which is a cutout portion, and a polarizing plate provided outside the two substrates. A liquid crystal display), a backlight disposed below the liquid crystal display element to supply light to the liquid crystal display element, a liquid crystal driving circuit board disposed outside the outer periphery of the liquid crystal display element, and a backlight. Receiving light, and the lower case is molded article for holding, each member was housed, and a display window spaced metal shield case or the like.

[0010] In recent years, with the progress of the information-oriented society, information processing devices such as personal computers and word processors in which a liquid crystal display device is incorporated as a display unit are desired to be portable, such as notebook-sized devices. It has been desired to reduce the external dimensions and enlarge the display area.

In a flip-chip type liquid crystal display device in which a driving IC chip is mounted on one of two superposed transparent insulating substrates constituting a liquid crystal display device, an electric signal to the driving IC is electrically connected. The input is configured to be supplied via a multilayer flexible substrate. The multi-layer flexible substrate has one end electrically and mechanically connected to the end of the substrate by an anisotropic conductive film, the middle portion being bent, and the other end surrounding the screen of the liquid crystal display module. Opposite surface (or the same surface) of the substrate on which the driving IC is mounted for the purpose of reducing the so-called frame size
Is folded back to the side. Conventionally, the connection portion of a multilayer flexible substrate with a transparent insulating substrate is composed of a base film and wiring.
Layers and bent parts are three layers of base film, wiring and cover film, and the parts that become two to three layers are concentrated in stress by the hardness of the cover film, and folded in the shape of "ku" Bending, there is a problem that the wiring of the multilayer flexible substrate running in the direction perpendicular to the bending line is broken,
Reliability was low.

An object of the present invention is to suppress the occurrence of disconnection of a flexible board for signal input whose one end is connected to an end of a transparent insulating substrate of a liquid crystal display element and the other end is folded back on the lower or upper surface of the substrate. Another object of the present invention is to provide a liquid crystal display device capable of improving reliability.

[0013]

In order to achieve the above object, the present invention provides a liquid crystal display device, wherein one end is connected to an end of a liquid crystal display element,
In a liquid crystal display device having a flexible circuit board whose intermediate portion is folded and the other end is disposed below or above the end of the liquid crystal display element, the end of the film of the flexible circuit board extends along a folding line direction. It is characterized by being formed in a shape having peaks and valleys, such as wavy or sawtooth shapes.

Also, a flip-chip type liquid crystal display element having a driving IC chip mounted on one of the two transparent insulating substrates with a liquid crystal layer interposed therebetween, and one end of the liquid crystal display element A liquid crystal display device having a flexible circuit board connected to an end of the liquid crystal display element, the intermediate portion is folded near the outside of the end side, and the other end is disposed below or above the end of the liquid crystal display element. An end portion of the film of the flexible circuit board is formed in a wavy or sawtooth shape along a bending line direction.

Further, the flexible circuit board has a substantially rectangular multilayer wiring portion and a plurality of projecting portions projecting from the multilayer wiring portion and arranged at predetermined intervals. It is characterized by bending.

Further, the protruding portion has one or two conductor layers.

The length from the one end of the flexible circuit board to the wavy or saw-toothed ridge of the end of the film is the connection length of the flexible circuit board with the transparent insulating substrate, for example, 1.75 mm + The cutting error of the transparent insulating substrate made of glass is within 0.3 to 0.5 mm.

Further, the length of the bent portion of the flexible circuit board is (thickness of the transparent insulating substrate × circumferential ratio) / 2.
It is characterized by being. For example, the thickness of the transparent insulating substrate made of glass is about 0.7 to 1.1 mm.

The distance between the wavy or saw-toothed peaks and valleys is constant, and (thickness of the transparent insulating substrate × pi) 率 2 mm.

The length between adjacent corrugated or saw-toothed peaks is constant and about 1 mm.

Further, the flexible circuit board is a circuit board for driving a drain line.

Further, the upper surface of the flexible circuit board and the lower surface of the one substrate are bonded with a double-sided tape.

According to the present invention, in the flexible board for signal input, one end of which is connected to the end of the transparent insulating substrate of the liquid crystal display element and the other end of which is folded back on the lower or upper surface of the substrate, the end of the film is bent. Along the direction, it was formed into a shape with peaks and valleys such as wavy and sawtooth shapes,
It is possible to disperse the stress concentration at the end of the film at the bent portion, to provide a good radius at the bent portion, to suppress the occurrence of disconnection, and to improve the reliability.

[0024]

Embodiments of the present invention will be described below in detail with reference to the drawings. In the drawings described below, those having the same functions are denoted by the same reference numerals, and the description thereof will not be repeated.

<< Overall Configuration of Liquid Crystal Display Module >> FIG.
3 is an exploded perspective view of the liquid crystal display module MDL.

SHD is a shield case (also called a metal frame) made of a metal plate, WD is a display window, SPC1
4 are insulating spacers, FPC1 and 2 are folded multilayer flexible circuit boards (FPC1 is a gate side circuit board, FPC2 is a drain side circuit board), PCB is an interface circuit board, and ASB is an assembled liquid crystal display with a drive circuit board. A liquid crystal display element (also referred to as a liquid crystal display panel) in which a driving IC is mounted on one of two superposed transparent insulating substrates, GC1 and G
C2 is a rubber cushion, PRS is a prism sheet (2
), SPS is a diffusion sheet, GLB is a light guide plate, RFS is a reflection sheet, MCA is a lower case (mold case) formed by integral molding, LP is a fluorescent tube, LPC is a lamp cable, and LCT is a connection for an inverter. Connector, G
B is a rubber bush that supports the fluorescent tube LP, and the members are stacked in a vertical arrangement as shown in the figure to assemble the liquid crystal display module MDL.

FIG. 2 is a completed view of the liquid crystal display module MDL, which is a front view, a front side view, a right side view, and a left side view of the liquid crystal display element PNL viewed from the front side (ie, the upper side, the display side). .

FIG. 3 is a view showing the completed assembly of the liquid crystal display module MDL, and is a rear view of the liquid crystal display element as viewed from the rear side (lower side).

The module MDL includes a lower case MCA,
It has two kinds of storage and holding members for the shield case SHD.

The HLD is four mounting holes provided for mounting the module MDL as a display unit on an information processing device such as a personal computer or a word processor. A mounting hole HLD of the shield case SHD is formed at a position corresponding to the mounting hole MH of the lower case MCA (see FIGS. 10 and 11) (see FIG. 2). Fix and implement. In the module MDL, a backlight inverter is arranged in the MI section, and power is supplied to the backlight BL via the connection connector LCT and the lamp cable LPC. Signals from the main computer (host) and necessary power are supplied to the controller unit and the power supply unit of the liquid crystal display module MDL via the interface connector CT1 located on the back of the module.

In FIG. 2, regarding the maximum external dimensions of the shield case SHD of the module MDL, the length W in the horizontal (long side) direction is 275.5 ± 0.5 mm, and the length W in the vertical (short side) direction is long. The height H is 199 ± 0.5 mm, the thickness T is 8 ± 0.5 mm, and the width X1 from the effective pixel portion AR to the upper frame of the shield case SHD is 5.25 mm.
The width X2 to the lower frame is 9.25 mm, the width Y to the left frame
1 is 16.5 mm, the width Y2 to the right frame is 5.5 mm,
The width Y3 of the wide portion near the corner portion up to the right frame is 7.5.
mm.

FIG. 29 shows the TF according to the embodiment shown in FIG.
It is a block diagram which shows the TFT liquid crystal display element of a T liquid crystal display module, and the circuit arrange | positioned in the outer peripheral part. Although not shown, in this example, the drain drivers IC _{1 to} IC _M
And the gate drivers IC _{1 to} IC _N are chip-on with a drain-side lead line DTM and a gate-side lead line GTM formed on one transparent insulating substrate of the liquid crystal display element and an anisotropic conductive film or an ultraviolet curable resin. -Glass mounting (COG mounting). In this example, the present invention is applied to a liquid crystal display element having 800 × 3 × 600 effective dots (pixel size in the vertical and horizontal directions = 307.5 μm) of the XGA specification. Therefore, on the transparent insulating substrate of the liquid crystal display element, a drain driver IC having 240 outputs is placed on one long side in 10 lines.
(M = 10) and six (N = 6) gate driver ICs with 101 outputs and 100 outputs on the short side are mounted by COG. A drain driver section 103 is disposed below the liquid crystal display element, a gate driver section 104 is provided on the left side, and a controller section 10 is provided on the same left side.
1. The power supply unit 102 is arranged. Controller unit 101
And the power supply unit 102, the drain driver unit 103, and the gate driver unit 104, respectively,
They are interconnected by 1 and 2. The controller unit 1
01 and the power supply unit 102 are arranged on the back side of the gate driver unit 104.

The specific configuration of each component will now be described with reference to FIGS.
FIG. 28 shows each member in detail.

<< Metal Shield Case SHD >>
An upper surface, a front side surface, a right side surface, and a left side surface of the shield case SHD are shown. FIG. 1 is a perspective view of the shield case SHD viewed from obliquely above.

Shield case (metal frame) SHD
Is manufactured by punching and bending a single metal plate by a press working technique. WD is the liquid crystal display element P
An opening that exposes the NL to the field of view is shown, and is hereinafter referred to as a display window.

Reference numeral NL denotes fixing claws (total 12) between the shield case SHD and the lower case MCA, and reference numeral HK denotes fixing hooks (total 6).
It is provided integrally with the HD. The fixing claws NL shown in FIGS. 1 and 2 are stored in a shield case SHD with the driving circuit-equipped liquid crystal display element ASB sandwiched between spacers SPC in a state before being bent, and then bent inward to lower sides. Square fixing recess NR provided in case MCA
(See each side view in FIG. 10) (see FIG. 3 for the folded state). The fixing hooks HK are respectively fitted to fixing protrusions HP (see the side view in FIG. 10) provided on the lower case MCA. Thereby, the shield case SHD for holding and storing the liquid crystal display element ASB and the like with a drive circuit
And the lower case MCA for holding and storing the light guide plate GLB, the fluorescent tube LP and the like are firmly fixed. Further, thin and long rectangular rubber cushions GC1, G4 are provided around four edges that do not affect the display on the lower surface of the liquid crystal display element PNL.
C2 (also referred to as a rubber spacer; see FIG. 1) is provided. Further, since the fixing claw NL and the fixing hook HK can be easily removed (just extend the bending of the fixing claw NL and remove the fixing hook HK), disassembly and assembly of the two members are easy, so repair is easy. , The fluorescent tube L of the backlight BL
Exchange of P is also easy. In this embodiment, as shown in FIG. 2, one side is mainly fixed by a fixing hook HK,
Since the opposite side is fixed by the fixing claws NL, it is possible to disassemble only by removing a part of the fixing claws NL without removing all the fixing claws NL. Therefore, repair and replacement of the backlight are easy.

The CSP is a through hole, and the relative position between the shield case SHD and other parts is accurately set by inserting the shield case SHD into the through hole CSP and mounting it on a pin that is fixed and erected during manufacturing. It is for doing.
The insulating spacers SPC1 to SPC4 are coated with an adhesive on both surfaces of the insulating material, so that the shield case SHD and the liquid crystal display element ASB with a drive circuit can be reliably fixed with the spacing between the insulating spacers. When the module MDL is mounted on an application product such as a personal computer, the through-hole CSP can be used as a reference for positioning.

<< Insulating Spacer >> As shown in FIGS. 1, 26 to 28, the insulating spacer SPC is a shield case SHD.
In addition to ensuring insulation between the liquid crystal display element ASB with the drive circuit and the liquid crystal display element ASB with the drive circuit, the position accuracy with the shield case SHD and the liquid crystal display element ASB with the drive circuit and the shield case S
Fix to HD.

<< Multilayer Flexible Substrates FPC1, 2 >> FIG. 4 shows a liquid crystal display device with a drive circuit board on which a gate-side flexible substrate FPC1 and a drain-side flexible substrate FPC2 before bending are mounted on the outer periphery of the liquid crystal display device PNL. It is a front view.

FIG. 5 shows an interface circuit board PCB.
FIG. 5 is a rear view of the liquid crystal display device with a drive circuit board of FIG.

FIG. 6 shows a state in which the shield case SHD is placed below and the flexible substrates FPC1 and FPC2 and the interface circuit substrate PCB are mounted.
2 and the liquid crystal display element PNL is shielded with the shield case S.
It is a rear view of the state stored in HD.

4 are the driving IC chips on the vertical scanning circuit side and the lower ten are driving IC chips on the video signal driving circuit side, and are anisotropic conductive films (ACF2 in FIG. 24).
Chip on a transparent insulating substrate using
On-glass (COG) mounting. In the conventional method,
A tape carrier package (TCP) on which a driving IC chip is mounted by a tape automated bonding method (TAB) is connected to a liquid crystal display element PNL using an anisotropic conductive film. In COG mounting, direct drive I
Since C is used, the above-described TAB process is not required, and the process is shortened. Since a tape carrier is not required, there is also an effect of cost reduction. Further, the COG mounting is suitable as a mounting technique for the high definition and high density liquid crystal display element PNL. That is, in this example, 800 × 3 × 6 as the SVGA panel
A TFT liquid crystal display module with a 12.1 inch screen size of 00 dots was designed. Therefore, the size of each of the red (R), green (G), and blue (B) dots is 307.5 μm.
m (gate line pitch) × 102.5 μm (drain line pitch), and one pixel includes red (R), green (G),
A combination of three blue (B) dots forms a 307.5 μm square. Therefore, the drain line lead-out DTM is set to 80
If the number of lines is 0 × 3, the lead line pitch will be 100 μm or less, which is below the connection pitch limit of currently available TCP mounting. On the other hand, in the COG mounting, although it depends on the material such as an anisotropic conductive film to be used, the driving I
It can be said that the minimum value that can be currently used is about 70 μm in the pitch of the bump BUMP (see FIG. 24) of the C chip and about 50 μm square in the intersection area with the underlying wiring. For this reason, in this example,
Drain driver ICs were arranged in a line on one long side of the liquid crystal display element PNL, and a drain line was drawn out on one long side. Therefore, the bump BUMP of the driving IC chip
(Refer to FIG. 24) The pitch can be designed to be about 70 μm and the crossing area with the underlying wiring can be designed to be about 50 μm square, and the connection with the underlying wiring can be more highly reliable. Gate line pitch is 30
The gate line lead GTM is drawn out on one short side because it is sufficiently large as 7.5 μm. However, when the definition is further increased, the gate line lead G G is drawn on two opposing short sides.
It is also possible to extract TM alternately.

In the method in which the drain line or the gate line is alternately drawn, as described above, the connection between the lead line DTM or GTM and the output side BUMP of the driving IC becomes easy, but the peripheral circuit substrate is connected to the liquid crystal display element PNL. It is necessary to arrange them on the outer peripheral portions of the two long sides facing each other, which causes a problem that the outer dimensions are larger than in the case of single-side drawing. In particular, when the number of display colors increases, the number of data lines of display data increases, and the outermost shape of the information processing apparatus increases. For this reason, in this example, the conventional problem is solved by using a multilayer flexible substrate and extracting the drain line to only one side.

FIG. 17A shows the back surface (lower surface) of the multilayer flexible substrate FPC1 for driving the gate driver.
FIG. 2B is a front (top) view. FIG. 15 (a)
FIG. 7B is a back (lower) view of the multilayer flexible substrate FPC2 for driving the drain driver, and FIG. 21A is a cross-sectional view taken along the line AA ′ of FIG. 15A, FIG. 21B is a cross-sectional view taken along the line BB ′, and FIG. 21C is a cross-sectional view taken along the line CC ′. It is.
The ratio of the dimension in the thickness direction and the dimension in the plane direction in FIG. 21 is exaggerated, unlike the actual dimension.

FIG. 18 is a schematic wiring diagram showing the connection relationship between the signal wiring in the multilayer flexible substrate FPC and the input signal to the driving IC on the transparent insulating substrate SUB1. The signal wiring in the multilayer flexible substrate FPC is a transparent insulating substrate S
There is a first wiring group parallel to one side of UB1 and a second wiring group perpendicular to one side of UB1. The first wiring group is a common wiring group for supplying a common signal between the driving ICs, and the second wiring group is
This is a wiring group for supplying a signal necessary for C. For this reason, at least the partial FSL is composed of one conductor layer. Further, the partial FML is composed of at least two conductor layers, and it is necessary to electrically connect the first wiring group and the second wiring group with through holes. In this example, it is necessary to reduce the length of the short side of the portion FML to a length that does not touch the edge of the lower deflection plate when bent.

That is, as shown in FIG. 21, three or more conductor layers, for example, in this example, eight portions of the conductor layers L1 to 8 are provided in parallel to one side of the liquid crystal display element PNL. By mounting peripheral circuit wiring and electronic components on this portion, even if the number of data lines increases, the number of layers can be increased while maintaining the outer shape of the substrate. The conductor layer L1 is for component pads and ground, L2 is for gradation reference voltage V _ref , 5 volt (3.3 volt) power supply, L3 is for ground, L4 is for data signal, clock CL2, clock CL1, L5
Denotes a second wiring group, a lead wiring, L6 denotes a gradation reference voltage _Vref , L7 denotes a data signal, and L8 denotes a 5 volt (3.3 volt) power supply.

The connection between the conductor layers is made by a through hole VIA (FIG. 2).
3 (a)). Conductor layer L
Although 1 to 8 are formed of copper CU wiring, input terminal wiring Td to the drive IC of the liquid crystal display element PNL (FIGS. 19 and 20)
In the portion of the conductor layer L5 to be connected to the copper layer CU, a gold plating AU is further applied on the nickel base Ni on the copper CU.
Therefore, the connection resistance between the output terminal TM and the input terminal wiring Td can be reduced. Between the conductor layers L1 to L8, an intermediate layer made of a polyimide film BFI is interposed as an insulating layer, and the conductor layers are fixed by an adhesive layer BIN. The conductor layer is covered with an insulating layer except for the output terminal TM. However, in the multilayer wiring portion FML, the solder resist SRS is applied to the uppermost and lowermost layers to secure insulation. Further, an insulating silk material SLK was stuck on the outermost surface side.

The advantage of the multilayer flexible substrate is that the conductor layer L5 including the connection terminal portion TM necessary for COG mounting is provided.
Can be integrally formed with other conductor layers, thereby reducing the number of parts.

In addition, by forming a portion FML of three or more conductor layers, a hard portion with little deformation can be provided, and a positioning hole FHL can be arranged in this portion. Also, when bending the multilayer flexible substrate, reliable and accurate bending can be performed without deformation at this portion. Further, as will be described later, a solid or 200 mm diameter
A mesh-shaped conductor pattern ERH (see FIG. 23 (a)) provided with a large number of fine holes MESH having a thickness of μm can be arranged on the surface layer L1, and the remaining two or more conductor layers can be used as conductor patterns for component mounting and peripheral wiring. Wiring can be performed.

Further, the protruding portion FSL does not need to be a single-layer L5 conductor layer, and the protruding portion FSL may be composed of two conductor layers. In this configuration, when the pitch of the input terminal wiring Td to the drive IC becomes narrow, the terminal wiring Td
d and the pattern of the connection terminal portion TM are formed in a staggered pattern in a plurality of rows of wiring groups, and each of them is electrically connected by an anisotropic conductive film or the like, and the connection terminal portion TM in the first conductor layer is formed.
When pulling out, the wiring group in one column is connected to the second conductive layer of another layer via the through hole VIA, or a part of the peripheral wiring is arranged on the second conductive layer in the protruding portion FSL. In this case, the configuration of the two conductor layers is effective.

As described above, by forming the projecting portion FSL with two or less conductor layers, heat conduction is good and pressure can be uniformly applied during thermocompression bonding with a heat tool. The electrical reliability of the wiring Td can be improved. Also, when bending a multilayer flexible substrate,
Accurate bending can be performed without applying bending stress to the connection terminal portion TM. Further, since the protruding portion FSL is translucent, the pattern of the conductor layer can be observed from the upper surface side of the multilayer flexible substrate, so that there is an advantage that the pattern inspection such as the connection state can be performed from the upper surface side. In addition,
JT2 in FIG. 15 is a drain-side flexible substrate FPC
A projection for electrically connecting the circuit board 2 to the interface circuit board PCB, and a flexible board FPC2 and an interface circuit board P4 provided at the tip of the projection JT.
This is a flat type connector for electrically connecting the CB.

FIG. 16A is an enlarged detailed view of a portion J in FIG. 15A, and FIG. 16B is a side view showing a mounted state and a folded state of the multilayer flexible substrate FPC2.

[0053] In FIG. 16 (a), _{P X} is the wavelength of the polyimide film BFI end wavy, _{P Y} wave height (amplitude × 2 wave), _{P 1} is a straight line (wave crests connecting mountains each other wave referred to as line), P ₂ is referred to as linear (wave trough line connecting each other wave trough), LY2 is referred to as length (connecting length of the connection portion of the lower transparent glass substrate SUB1 of the multilayer flexible substrate FPC 2), LY1 is the length between the connection portion and mountain line P ₁ of the wave of the lower transparent glass substrate SUB1 of the multilayer flexible substrate FPC 2.

The drain side flexible substrate FPC2 is
As shown in FIG. 16B, one end has a liquid crystal display element PNL.
It is connected to the terminals of the ends of the drain lines of the lower transparent glass substrate SUB1 (Td in FIG. 19, 20) via an anisotropic conductive film ACF, folded back at an intermediate portion of the height P _Y outside of the end edges , A multilayer wiring portion FML at the other end is disposed below an end portion of the lower transparent glass substrate SUB1, and a double-sided tape BAT is provided.
Is attached to the lower surface of the lower transparent glass substrate SUB1. The numbers 1 to 45 assigned to the output terminal TM in FIG. 16A are the numbers 1 assigned to the terminals Td in FIGS.
45, and are electrically connected via the anisotropic conductive film ACF1. Figure 16 (a) _{P D} is output TM
At a pitch of 0.41 mm. In this example, the end of a polyimide film (cover film) BFI made of a polyimide resin, which is an insulating layer of the flexible substrate FPC2, is formed in a wavy (or sawtooth) shape along the folding line direction. For example, the wavelength P _X = 0.6 mm, the wave height P _Y = 0.6 to 1 mm, the waviness radius (R) of the wave is 0.3 mm, the connection length LY2 = 1.75 mm, LY1 =
0.3 to 0.5 mm. Lower transparent glass substrate SUB
1 and the length from the end portion of the connected flexible circuit board FPC2 to mountain lines _{P 1,} the connection length between the lower transparent glass substrate SUB1 of the flexible substrate FPC2 LY2 = 1.75
mm + glass cutting error of transparent glass substrate SUB1.
It is within 3 to 0.5 mm. In addition, the flexible substrate F
The length of the bent portion of the PC2 is the thickness of the transparent glass substrate SUB1 (0.7 to 1.1 mm) × circumference π ÷ 2 = 1.7 to
1.1 mm. During the length of the bending portion, there is a mountain lines P ₁ and valley P ₂ waves. Further, in this example, the length of the flexible substrate FPC2 is 263.42 ± 0.5 m.
m, the width including the multilayer wiring portion FML and the protruding portion FSL is 8.7 mm, the width of the multilayer wiring portion FML is 5 mm, the width of the protruding portion FSL is 3.7 mm, and the frame ground pad F
The center line interval between GP and FGP (see FIG. 15B) is 4
7.76 mm, the length of the long side of the rectangular part provided with the connector CT4 at the tip of the convex part JT2 is 22 mm, and FIG.
, The center line interval of the output terminals TM numbered 1 and 45 is 18.04 mm, the center line interval of the outermost terminal of the connector CT4 is 14.5 mm, and the total thickness of the multilayer is about 350 to
400 μm.

As described above, in this example, one end of the flexible substrate FPC2 is connected to the end of the transparent glass substrate SUB1 of the liquid crystal display element and the other end is folded back on the lower surface (or upper surface) of the substrate SUB1. Since the end of the polyimide film BFI of the protruding portion FSL is formed in a wavy shape (or a shape having peaks and valleys such as a sawtooth shape) along the bending line direction, the bent portion at the end of the polyimide film BFI is formed. Disperse stress concentration,
A good radius can be formed at the bent portion, the occurrence of disconnection can be suppressed, and the reliability can be improved.

In this example, the conductor layer of the gate-side flexible substrate FPC1 has three layers, and L1 is V _dg (10
V), V _sg (5V), V _ss (ground), L2 is a lead wiring, clock CL3, FLM, V _dg (10
V), L3 is V _EG (-10 to -7V), V _EE (-
14 V), V _SG (5 V), and common voltage V _com . The length of the flexible board FPC1 is 172.
3 mm, the width including the multilayer wiring portion FML and the protruding portion FSL is 7.25 mm, and the width of the multilayer wiring portion FML is 4.5 m.
m, the width of the protruding portion FSL is 2.75 mm, the width of the electrical connection means JN1 is 5.5 mm, the length is 9.6 mm, and the center line interval between the outermost output terminals TM of the protruding portion FSL is 11.5 mm.
mm, and the total thickness of the multilayer is 273 μm.

The alignment marks ALMG (FIG. 17A) and ALMD (FIG. 16) on the flexible substrate
(A) will be described.

The flexible substrate F shown in FIGS.
In the PCs 1 and 2, the length of the output terminal TM is usually designed to be about 2 mm in order to secure connection reliability. However, the long sides of the flexible substrates FPC1 and FPC2 are 170 to 264 m.
m, the position shift including slight rotation in the long axis direction may cause a position shift between the input terminal wiring Td and the output terminal TM, resulting in a connection failure. Liquid crystal display element P
The alignment between the NL and the flexible boards FPC1, 2
After inserting the opening holes FHL opened at both ends of each substrate into the fixing pins, the input terminal wiring Td and the output terminal TM can be joined at several places. However, in this example, in order to further improve the alignment accuracy, the alignment mark ALM is used.
G and ALMD were provided two for each protruding portion FSL.

The input of the gate driver driving IC is as follows.
There are a total of 24, and each is electrically connected to the output terminal TM. The pitch PG of the terminals TM is about 500 μm. The alignment mark ALMG is positioned in the vicinity of the 24 terminals TM to each drive IC, and the alignment accuracy with the input terminal wiring Td pattern is improved and inspection after connection is performed. In this example, in order to improve connection reliability, a dummy line is provided at a position adjacent to the 20 input terminals TM, and a square-shaped alignment mark ALMG is formed by pattern connection with the dummy line. A square painted pattern on the opposing transparent substrate SUB1 (drain side,
(See 9 and 20 ALCs) so that they just fit within the square.

As shown in FIGS. 19 and 20, there are a total of 45 inputs to the drain driver drive IC.
Electrical connection is made to the numbers 1 to 45 of the output terminal TM shown in FIG. The pitch PD of the terminal TM is about 410 μm. In this example, the alignment mark AL shown in FIG.
MD is a dummy line NC (terminal numbers 2 and 44) adjacent to the 41 input terminals TM for improving connection reliability.
Place. Further, on the outside thereof, a counter electrode (numbers 1 and 45) shown in FIG. 16A for supplying the voltage _Vcom to the common transparent pixel electrode COM inside the transparent insulating substrate SUB2, which is a counter electrode of the liquid crystal capacitance Clc. ) Is placed. Thus, the common voltage is applied from the conductive beads or paste to the common transparent pixel electrode CO on the transparent insulating substrate SUB2 through the wiring Td pattern on the transparent insulating substrate SUB1.
M.

The alignment mark ALMD is a terminal (numbers 1 and 45) electrically connected to this electrode COM.
The pattern is connected to a square fill pattern ALD (see FIG. 20) on the transparent substrate SUB1.
Further, in this example, a joint pattern (not shown) for connecting to the gate driver substrate FPC1 at the lower end of the drain driver substrate FPC2 in FIG.
Is provided.

Next, the shape of the conductor layer portion FSL having two or less layers will be described.

In this example, the protruding length of the portion FSL composed of a single-layer or two-layer conductor wiring is a bent portion (FIG. 16).
(See (a)), it was about 3.7 mm. However, in a structure that is not bent, the portion FSL can be further shortened.

The projecting shape of the portion FSL was a convex shape separated for each driving IC. Thus, the thermal expansion flexible substrate in the longitudinal direction at the time of thermocompression bonding of a heat tool, the pitch P _G and P _D are changed in the terminal TM, it can prevent a phenomenon in which peeling or poor connection occurs between the connection terminals Td. That is, by the convex shape separated for each drive IC, it is possible to the thermal expansion amount corresponding to the length of the pitch P _G and P _D cycle also each driver IC shift up to the terminal TM. In this example, the flexible substrate has a convex shape separated into ten parts in the major axis direction.
This amount of thermal expansion can be reduced to about 1/10, which contributes to the relaxation of the stress on the terminal TM, and the reliability of the liquid crystal module MDL against heat can be improved.

As described above, the alignment mark AL
By providing the MG and the ALMD and making the protruding shape of the portion FSL into a convex shape separated for each driving IC, even if the number of connection wirings and the number of display data increase, the connection reliability is ensured with high accuracy. The peripheral drive circuit can be reduced.

Next, three or more conductor layer portions FML will be described.

Chip capacitors CHG and CHD are mounted on the conductor layer portions FML of the FPCs 1 and 2. That is, in the gate-side substrate FPC1, the ground potential Vss
(0 volts) and the power supply Vdg (10 volts) or between the power supply Vsg (5 volts) and the power supply Vdg, six chip capacitors CHG are soldered. Further, in the drain-side substrate FPC2, the ground potential Vss and the power supply V
A total of ten chip capacitors CHD are soldered between dd (5 volts or 3.3 volts) or between the ground potential Vss and the power supply Vdd. These capacitors CHG and CHD are for reducing noise superimposed on the power supply line.

In this example, these chip capacitors CH
D was soldered to only one surface conductor layer L1 and was designed so as to be located entirely under the transparent insulating substrate SUB1 after bending. Therefore, it is possible to mount a power supply noise smoothing capacitor on the substrates FPC1 and FPC2 while keeping the thickness of the liquid crystal module MDL constant.

Next, a method for reducing high-frequency noise generated from the information processing apparatus will be described.

Since the metal shield case SHD side is the front side of the liquid crystal module MDL and the front side of the information processing equipment, the generation of EMI (Electro Magnetic Interference) noise from this surface is not applied to the external equipment. Causes major environmental problems.

For this reason, in this example, the surface layer L1 of the conductor layer portion FML is covered with a solid or mesh pattern ERH of a DC power source as much as possible. FIG. 23 (a)
Is a plane (front, top) showing the surface conductor layer pattern configuration of the multi-layer wiring portion FML in a part of FIG.
FIG. The mesh MESH includes a large number of holes having a diameter of about 300 μm formed in the surface conductor layer L1. The mesh pattern ERH covers almost the entire surface except for the through holes VIA and the capacitor component CHD.

Further, as shown in FIG. 15B, the pattern FGP in which the pattern ERH is exposed from the solder resist SRS is arranged at five places on the drain-side substrate FPC2,
A frame ground HS (FIG. 1,
14) via the ground FG of the shield case SHD
F (see FIG. 2) is soldered to reduce EMI noise. That is, as in this example, when the circuit board is divided into a plurality, if at least one portion of the drive circuit board is connected to the frame ground in terms of direct current, no electrical problem occurs, In the high frequency region, if the number of the portions is small, the generation potential of unnecessary radiated radio waves causing EMI increases due to reflection of electric signals and fluctuation of the potential of the ground wiring due to a difference in characteristic impedance of each drive circuit board, and the like. . In particular, an active matrix module M using thin film transistors
Since DL uses a high-speed clock, it is difficult to take measures against EMI. To prevent this, the ground wiring (AC ground potential) is connected to the common frame (that is, the shield case SHD) having a sufficiently low impedance at at least one location, in this example, five locations, on the drain driver substrate FPC2. Through the frame ground HS,
Since the ground wiring in the high-frequency region is strengthened, the electric field intensity of the radiation is significantly improved in the five cases of the present embodiment as compared with the case where the shield case SHD is connected at only one place as a whole.

<< Frame Ground HS >> FIG. 14 (a)
Is a front side view of a metal thin plate HS for taking a frame ground (hereinafter, referred to as a frame ground), (b) is a rear view, (c) is a side view, (d) is (a), (b) A
It is an enlarged detail view of a part, a B part, a C part, and a D part.

The structure of the frame ground HS is shown in FIG.
4, the positional relationship between the frame ground HS and other members is shown in FIG. 1, and the positional relationship after the installation of the frame ground HS is shown in FIGS.

As a measure against EMI, a so-called frame ground HS for taking a so-called frame ground is provided by forming a single thin metal plate having a thickness of 0.2 mm, which is thinner than the thickness of the shield case SHD, at 90 degrees in the direction of extension. It consists of a folded, elongated first sheet metal HSB and a second sheet metal HSH which are perpendicular to each other. From the thin metal sheet HSB, a convex portion JT extends on the same plane as the thin metal sheet HSB and downward. As shown in FIG. 14A, five convex portions JT are provided at regular intervals in the direction in which the thin metal plate HSH extends, and the ground FGF of the metal shield case SHD is provided.
(FIG. 2) are electrically and mechanically connected by soldering. The HIS2 is composed of five frame ground pads FGP provided on the surface of the drain-line driving flexible substrate FPC2 at regular intervals in the direction of its extension.
(See FIG. 15 (b)) and five parts are electrically and mechanically connected by soldering. Hole H adjacent to each solder joint HIS2
An OLE is provided. Due to the presence of the hole HOLE, the heat capacity at the time of soldering can be reduced, and the soldering between the soldering portion HIS2 and the frame ground pad FGP can be performed well. Note that a cutout may be provided instead of the hole HOLE. HIS1 is an insulating material stuck on a thin metal plate HSH, and covers the metal surface other than the soldered portion HIS2 to prevent a short circuit with other components. Both surfaces of the soldering portion HIS2 and the convex portion JT are solderable surfaces, and the other surfaces are coated with rust preventive. Further, a chip component (FIGS. 4, 15, 22) mounted on the flexible substrate FPC2 is provided on the thin metal plate HSH.
(A) CHD of 26: cutout DN that is connected to the power supply line and accommodates power supply noise removal chip capacitor)
T is provided.

As shown in FIGS. 1, 26, and 28, one end of the flexible substrate FPC2 is connected to the upper surface end of the lower transparent glass substrate SUB1 of the liquid crystal display element PNL, and the intermediate portion near the outside of the end. It is folded back, and the other end is arranged below the lower surface of the end of the lower transparent glass substrate SUB1. The frame ground HS having the metal thin plate HSB and the metal thin plate HSH which are perpendicular to each other is connected to the flexible board FPC2.
The metal thin plate HSH is disposed below the flexible substrate FPC2 disposed below the end of the lower transparent glass substrate SUB1, and the ground line is electrically connected to the metal shield case SHD. Metal sheet HSH
Is electrically and mechanically connected to the frame ground pad (FGP in FIGS. 4, 6, 15, and 22 (a)) of the flexible board FPC2 by the solder SLD2. 26 and 28, the metal thin plate HSB is arranged along the inner side surface of the shield case SHD, and its convex portion JT is connected to the ground FG of the shield case.
F (see FIG. 2) and the solder SLD1 electrically and mechanically.

In this embodiment, the ground line of the drain-line driving flexible board FPC2 and the metal shield case SHD having sufficiently low impedance are electrically connected via the frame ground HS made of a thin metal plate. Thus, a stable ground line can be supplied, and the ground line in a high frequency region can be strengthened. Therefore, since the influence of noise that enters from outside or is generated inside can be eliminated, stable display quality can be obtained, and generation of harmful radiated radio waves that cause EMI can be suppressed. Also, compared to a technique in which a part of the upper surface or side surface of the shield case SHD is cut away and a claw formed integrally with the shield case SHD is bent and connected to the ground line of the circuit board, the connection workability is better and the bending direction is required. The space can be reduced, the dimensions of the frame portion and the thickness of the liquid crystal display module MDL can be reduced, and the liquid crystal display module MDL and the information processing device (FIG. 35,
36) is advantageous for thinning, miniaturization, and enlargement of the screen. In this example, the circuit board electrically connected to the shield case SHD via the frame ground HS is the drain line driving flexible substrate FPC2, and the gate line scanning driving flexible substrate FPC1 has the frame ground. However, this is because the clock input to the drain-side flexible substrate FPC2 is fast and noise is easily generated, and the clock input to the gate-side flexible substrate FPC1 is slow and noise is unlikely to occur.
Further, since a plurality of frame ground pads FGP are provided at intervals in the direction of extension of the flexible substrate FPC2, the potentials of the power supply and the ground become more stable.
Impedance matching can be better achieved than when the shield case SHD is connected at one point. Further, by taking the frame ground at a portion far from the signal input side of the circuit board, the ground can be further stabilized, and the effect of the flexible board as an antenna can be prevented.

<< Interface Circuit Board PCB >> FIG.
5A is a back (lower) view of an interface circuit board PCB having functions of a controller unit and a power supply unit;
(B) is a partial front lateral side view and a lateral side view of the mounted hybrid integrated circuit HI, and (c) is a front (top) view of the interface circuit board PCB.

In this embodiment, a six-layer multilayer printed circuit board made of a glass epoxy material was used as the substrate PCB. Although a multi-layer flexible substrate can be used, this portion did not employ a bent structure, so that a relatively low-cost multi-layer printed circuit board was used.

All the electronic components are mounted on the lower surface side of the substrate PCB, which is the back side when viewed from the information processing apparatus. One integrated circuit element TCON is arranged on a substrate for a display control device. The integrated circuit element TCON is not housed in a package, and is formed by mounting an integrated circuit IC directly on a printed circuit board in a ball grid array. The interface connector CT1 is located substantially at the center of the board, and further includes a plurality of resistors, capacitors, and high-frequency noise removing circuit components EMI.

The hybrid integrated circuit HI is configured such that a part of the circuit is hybrid-integrated, and a plurality of integrated circuits and electronic components mainly for forming a power supply are mounted on the upper and lower surfaces of a small circuit board. One is mounted on the interface circuit board PCB. As shown in the figure,
The leads of the hybrid integrated circuit HI are formed long, and a plurality of electronic components EP including TCON and the like are also mounted on the circuit board PCB between the circuit board PCB and the hybrid integrated circuit HI.

Further, means JN1 for electrically connecting gate driver board FPC1 to interface circuit board PCB is provided.
, The connector CT3 is used in this example.

The reason why the connector CT3 is used is that even if the number of pixels and the number of display colors are increased and the pitch between the wirings is narrowed, the electrical connection with the flexible substrate FPC1 can be made with high reliability.

The upper surface of the substrate PCB is on the front side when viewed from the information processing apparatus, and is in the direction in which the potential at which EMI noise is radiated most is high. For this reason, in this example, FIG.
As shown in (c), the multilayer surface conductor layer is almost entirely covered with a ground solid or mesh pattern ERH. FIG. 23 (b) shows a mesh pattern E
It is the upper surface (front) figure which expanded RH. Under the solder resist SRS, a mesh pattern ERH of a copper conductor is formed so as to cover the entire surface except for the through holes VIA. This pattern ERH can reduce EMI noise radiation by being electrically connected to the ground pattern GND on the lower surface of the substrate PCB. Note that the ground pattern GN
D is the ground GND of the board PCB and the shield case S
HD ground FGN and connector C
By soldering to the ground coming from T1, it is connected to the ground on the main body side.

In this example, the length of the interface circuit board PCB is 172.3 mm and its width is 13.1 mm.

As described above, the flexible substrate FPC
In both 1 and 2, the surface conductor layer of the substrate is covered with the pattern ERH, and the outer peripheral portions of the two sides of the liquid crystal display element PNL are all fixed at DC potential, effectively reducing EMI noise radiation from the inside of the substrate. Can be done.

FIG. 27A is a cross-sectional view taken along the line CC ′ of FIG. 2, and FIG. 27B is a cross-sectional view taken along the line DD ′.

As shown in FIG. 27, the transparent glass substrate SU
When viewed from a direction perpendicular to the planes B1 and SUB2, the interface circuit board PCB is overlapped with the liquid crystal display element PNL, and is disposed below the lower surface of the lower transparent insulating substrate SUB1. The gate driver flexible substrate FPC1 has one end directly and mechanically connected to the transparent glass substrate SUB1 of the liquid crystal display element PNL. Unlike the drain side, the gate driver flexible substrate FPC1 has almost the entire width of the interface circuit board PCB without bending. Superimposed on top. As described above, by partially overlapping the interface circuit board PCB with the liquid crystal display element PNL and further arranging the gate driver circuit board FPC1 on the interface circuit board PCB, the width and area of the frame portion can be reduced. The external dimensions of a liquid crystal display device and an information processing device such as a personal computer or a word processor incorporating the liquid crystal display device as a display portion can be reduced. The surface of the interface circuit board PCB on which the mesh pattern ERH shown in FIG. 25C is formed is attached and fixed to the lower surface of the lower transparent glass substrate SUB1 by a double-sided tape BAT. The length of the interface circuit board PCB of this example is 172.3 mm and the width is 13.1 m.
m. The conductor layer is composed of six layers L1 to L6, L1 is for component pad, L2 is for signal and ground, L3 is for signal, L4 and L5 are for power supply, L6 is for ground, and mesh pattern ERH is formed. Have been.

<< Liquid crystal display element ASB with drive circuit board >>
Next, the liquid crystal display element ASB with a drive circuit board will be described.

As shown in FIG. 26A, a drain driver flexible substrate FPC2 is bent and bonded to the surface of the transparent insulating substrate SUB1 opposite to the pattern forming surface. Polarizers POL1 and POL2 are located slightly (about 1 mm) outside the effective pixel area AR, from which about 1 to 1
The end of the FML of the substrate FPC2 is located at a distance of 2 mm.
The distance from the edge of the transparent insulating substrate SUB1 to the tip of the protrusion of the bent portion of the FPC 2 is as small as about 1 mm, and compact mounting is possible. Therefore, in the present example, the distance from the effective pixel area AR to the tip of the protrusion of the bent portion of the substrate FPC2 was about 7.5 mm.

Next, a method of bending and mounting a flexible substrate will be described.

FIG. 22 is a perspective view showing a method of bending and mounting a multilayer flexible substrate. The connection between the drain driver substrate FPC2 and the gate driver substrate FPC1 is made by a flat connector CT4 provided as a joiner at the tip of a convex portion JT2 formed of a flexible substrate integrated with the FPC2.
To be electrically connected to the connector CT2 of the interface board PCB shown in FIG.

Next, the double-sided tape BAT is attached to the surface of the flexible printed circuit board FPC2 where no component is mounted on the conductor layer portion FML.
(See FIGS. 28, 26, and 5), and bent at the conductor layer portion BNT using a jig.

The width of the used double-sided tape BAT is 3 mm, and the length is 160 to 240 mm.
It suffices if adhesiveness can be ensured, and a short shape may be attached at several places. Further, the double-sided tape BAT may be pasted on the transparent insulating substrate SUB1 side in advance.

As described above, the multilayer flexible substrate FPC2 can be accurately bent by using the jig, and can be bonded to the surface of the transparent insulating substrate SUB1.

<< Rubber Cushion GC >> Rubber Cushion G
C1,2 are shown in FIGS. 1, 6, 26 (b), 27 (b). The rubber cushions GC1 and GC are connected to the liquid crystal display element PN.
The lower transparent glass substrate SUB1 of L is disposed, via a prism sheet PRS, between a lower surface of an end portion around a frame of the lower transparent glass substrate SUB1 and a lower case MCA for storing the backlight BL. By using the elasticity of the rubber cushions GC1, 2 to push the shield case SHD toward the inside of the device, the fixing hook HK is hooked on the fixing projection HP, and the fixing claw NL is bent, so that the fixing hook NL is bent. When inserted, each fixing member functions as a stopper, the shield case SHD and the lower case MCA are fixed, the entire module is firmly held integrally, and other fixing members are unnecessary. Therefore, assembling is easy and manufacturing costs can be reduced. In addition, the mechanical strength is high, the vibration and shock resistance is high, and the reliability of the device can be improved. The rubber cushions GC1 and GC2 have an adhesive on one side and are attached to a predetermined portion of the substrate SUB2.

<< Backlight BL >> FIG. 7 is a front view of the backlight BL, and FIG. 8 is a front view of the backlight BL when the prism sheet PRS and the diffusion sheet SRS are removed from the backlight BL of FIG. . FIG. 9 is a front view of a backlight BL similar to FIG. 8 showing another configuration example.

A side light type backlight BL for illuminating the liquid crystal display element PNL from the back includes one cold cathode fluorescent tube LP, a lamp cable LPC of the fluorescent tube LP, and a fluorescent tube LP.
And two rubber bushes GB holding the lamp cable LPC, a light guide plate GLB, a diffusion sheet SPS disposed in contact with the entire upper surface of the light guide plate GLB, a reflection sheet RFS disposed on the entire lower surface of the light guide plate GLB, and a diffusion sheet. SPS
Prism sheets P arranged in contact with the entire upper surface of the prism sheet
RS.

After the fluorescent tube LP is placed on the reflective sheet LP, the reflective sheet LS is rounded and bent by 180 degrees, and the end of the light guide plate G is formed by a double-sided tape BAT having an adhesive material.
It is adhered to the lower surface of the end of the LB (see FIG. 26A).

<< Diffusion Sheet SPS >> Diffusion Sheet SPS
Is mounted on the light guide plate GLB, diffuses light emitted from the upper surface of the light guide plate GLB, and uniformly irradiates the liquid crystal liquid crystal display element PNL with light.

<< Prism Sheet PRS >> The prism sheet PRS is placed on the diffusion sheet SPS, and the lower surface is a smooth surface and the upper surface is a prism surface. The prism surface is composed of, for example, a plurality of grooves each having a V-shaped cross-section arranged in parallel to each other (in other words, a large number of triangular prisms are arranged in parallel). The prism sheet PRS can improve the brightness of the backlight BL by collecting light diffused from the diffusion sheet SPS over a wide angle range in the normal direction of the prism sheet PRS. Therefore, the power consumption of the backlight BL can be reduced, and as a result, the module M
The DL can be reduced in size and weight, and the manufacturing cost can be reduced. In addition, the prism sheet PRS is 2
When two sheets are used, the two sheets are overlapped so that the extending directions of the grooves of the two prism sheets PRS are orthogonal to each other.

<< Diffusion Sheet SPS and Prism Sheet PR
Fixing method of S >> Diffusion sheet SPS as optical sheet and 2
At each side edge of each of the two prism sheets PRS, two fixing small holes whose positions coincide with each other when the sheets are installed are provided. Correspondingly, pin-shaped projections MPN are provided integrally with the case MCA at both ends of one side of the lower case MCA manufactured by molding.
Note that, as shown in FIG. 8, one convex portion MPN is provided on each of the one side of the lower case MCA, on the upper and lower sides of the inverter storage portion MI of the backlight BL. When the diffusion sheet SPS and the prism sheet PRS are installed, after projecting the projections MPN through these small holes, the projections M
The sleeves SLV through which the protrusions penetrate are fitted into the distal ends of the PNs, and the diffusion sheet SPS and the two prism sheets PRS are fixed. The sleeve SLV is made of an elastic material such as silicon rubber, for example, and the inner diameter of the hole of the sleeve SLV is smaller than the outer diameter of the convex portion MPN, so that the sleeve SLV is hard to fall off.

Further, in this example, in order to further improve the accuracy of position fixing, at least one small hole is provided at another end of the optical sheet, and is integrated with another end of the case. The small hole is made to penetrate the provided pin-shaped convex part. FIG. 11 shows a planar relative positional relationship between the case MCA and the transparent insulating substrate SUB1 and the circuit board PCB.
On the side opposite to the backlight BL, an additional small hole of the optical sheet is passed through a pin-shaped convex portion MPN integrally provided at one end of the case, and a total of three small holes are formed. Fix the position with high accuracy. The additional small holes and the pin-shaped convex portions MPN are further provided below the transparent insulating substrate SUB1.
It is arranged inside the outer periphery of the transparent insulating substrate SUB1 to reduce the outer shape of the liquid crystal module. Pin-shaped convex part MPN
Is located at a position that does not overlap with the circuit board PCB disposed below the gate-side flexible substrate FPC1, and thus can be provided integrally with the case MCA without increasing the thickness of the liquid crystal module.

With this configuration, when the diffusion sheet SPS and the prism sheet PRS of the backlight are installed,
The workability is good, and the position is automatically determined by the combination of the projection MPN and the small hole, so that the positioning can be performed accurately and easily. Furthermore, one predetermined sheet can be easily attached and detached, only a defective sheet can be replaced, and reproduction (repair) of sheets can be easily performed. As a result, manufacturing time can be reduced, workability can be improved, and costs can be reduced.

<< Reflective Sheet RFS >> Reflective Sheet RFS
Is disposed below the light guide plate GLB, and reflects light emitted from the lower surface of the light guide plate GLB toward the liquid crystal liquid crystal display element PNL.

<< Lower Case MCA >> FIG. 10 is a front view, front side view, rear side view, right side view, left side view, and FIG. 11 of the lower case MCA. Part B, C
Part, D part (that is, the corner part of the lower case MCA)
FIG.

Lower case M formed by molding
CA stands for fluorescent tube LP, lamp cable LPC, light guide plate G
It is a holding member such as LB, that is, a backlight storage case, and is made by integrally molding a single mold with a synthetic resin. Since the lower case MCA is firmly united with the metal shield case SHD by the action of each fixing member and the elastic body, the shock resistance and heat shock resistance of the module MDL can be improved, and the reliability can be improved.

On the bottom surface of the lower case MCA, a large opening MO occupying more than half the area of the surface is formed in the central portion excluding the peripheral frame portion. Thereby, after assembling the module MDL, the liquid crystal display element PNL
And a rubber cushion GC1 between the lower case MCA and
2 (see FIGS. 26 (b) and 27 (b)), the bottom surface of the lower case MCA bulges due to the force vertically applied to the bottom surface of the lower case MCA from the upper surface to the lower surface. Can be prevented and the maximum thickness can be suppressed. Therefore, it is not necessary to increase the thickness of the lower case in order to suppress swelling, and the thickness of the lower case can be reduced, so that the module MDL can be reduced in thickness and weight.

MCL shown in FIG. 10 is a heat-generating component of the interface circuit board PCB.
The notch (connector CT) provided in the lower case MCA at a location corresponding to the mounting portion such as the power supply circuit (DC-DC converter DD) which is a hybrid IC shown in (a) and (b).
1 includes a notch for connection). As described above, by providing the cutout without covering the heat generating portion on the circuit board PCB with the lower case MCA, the heat radiation of the heat generating portion of the interface circuit board PCB can be improved. That is, at present, in order to improve the performance of a liquid crystal display device using a thin film transistor TFT and improve the ease of use, it is required to increase the number of gradations and to use a single power supply. A circuit for realizing this requires large power consumption, and if the circuit means is to be compactly mounted, the circuit will be mounted at a high density, and heat generation will be a problem. Therefore, by providing the notch MCL in the lower case MCA corresponding to the heat generating portion, it is possible to improve the high-density mountability and compactness of the circuit. In addition, the display control integrated circuit element TCON is considered to be a heat-generating component, and the lower case MCA above this may be cut away.

MH in FIG. 10 are four mounting holes for mounting the module MDL to an application device such as a personal computer. The metal shield case SHD also has a mounting hole HLD corresponding to the mounting hole MH of the lower case MCA, and is fixed and mounted on an applied product using screws or the like.

The rubber bush GB holding the fluorescent tube LP and the lamp cable LPC is fitted into a storage portion MG formed so that the rubber bush GB fits exactly, and the fluorescent tube LP is stored in a non-contact manner with the lower case MCA. It is stored in the unit ML.

MB in FIGS. 10 and 11 is a holding portion of the light guide plate GLB, and PJ is a positioning portion. ML is fluorescent tube LP
Is a storage portion for the rubber bush GB. M
C1 to C4 are storage portions for the lamp cables LPC1 and LPC2.

<< Storing of Light Guide Plate GLB in Lower Case MCA >> In this example, the positioning portion (support frame) PJ of the lower case MCA for storing and holding the light guide plate GLB of the backlight is prevented. did.

FIG. 12A is a front view showing a light guide plate GLB and a corner portion of a positioning portion PJ of a lower case MCA for housing and holding the light guide plate GLB, and FIG. 12B is a front view showing a conventional light guide plate GLB. A front view showing how the force is applied when the module MDL is dropped on the lamp side at the corner of the part PJ, and FIG. 14C is a front view showing how the force is applied at the corner of the positioning part PJ by the light guide plate GLB of this example. FIG.

As shown in FIG. 12A, the light guide plate GLB
The four corners are chamfered to form a linear diagonal part, and the positioning part P corresponds to the diagonal part of the light guide plate GLB.
A straight diagonal portion is also provided at the corner of J. Conventionally, as shown in (b), since the corner of the light guide plate GLB is a right angle and the corner of the positioning part PJ is also a right angle, it is weak against the force F in the side direction (y direction) of the light guide plate GLB. When the light guide plate GLB, which is a particularly heavy member among the components of the module, moves in the liquid crystal display module due to vibration or impact, the positioning portion PJ may be damaged and the lamp LP may be broken. However, in this example, since the diagonal portions are provided at each corner of the light guide plate GLB and the positioning portion PJ, as shown in FIG.
Force according to J F are two directional components f _x, is decomposed into f _y, equal or two of x as force, it can be reduced as the power of the y component, therefore, in recent years, small width and thinness The impact on the positioning portion PJ of the lower case MCA, which tends to become less, is reduced, and damage to the positioning portion PJ can be prevented.
Improves impact resistance and reliability.

<< Arrangement Position of Cold Cathode Fluorescent Tube LP >> FIG. 26
As shown in FIG. 26A, in the module MDL, the elongated fluorescent tube LP has a space under the drain-side flexible substrate FPC2 and the drain-side drive IC mounted on one of the long sides of the liquid crystal display element PNL (FIG. 26). reference)
Are located in As a result, the external dimensions of the module MDL can be reduced.
L can be reduced in size and weight, and the manufacturing cost can be reduced.

That is, as shown in FIGS. 7 to 9, the cold cathode fluorescent lamp LP of the backlight BL is arranged on the long side of the liquid crystal display module MDL and below the display.
That is, as shown in FIGS. 35 and 36, when the liquid crystal display module MDL is incorporated as a display unit in an information processing device such as a personal computer or a word processor, the cold cathode fluorescent tube L
It is arranged so that P is below the long side of the display section.
LPC2 is a high-side lamp cable to which a high voltage of about 1100 V is applied, and LPC1 is a ground voltage-side lamp cable. The example shown in FIGS.
In the inverter storage section MI in the display section.
As will be described later in detail, the lamp cable LPC1 is wired along the left and upper two sides of the liquid crystal display module MDL, the lamp cable LPC2 is wired along one right side, and the two lamp cables LPC1, 2 , From the upper right. On the other hand, in the example shown in FIG. 9, the inverter IV can be arranged in the keyboard of the information processing apparatus, and the lamp cable LPC1 is connected to the left of the liquid crystal display module MDL.
The lamp cables LPC1 and LPC2 are wired along the upper and right sides, and both lamp cables LPC1 and LPC2 extend from the lower right.

By arranging the cold cathode fluorescent lamp LP on the lower side of the display of the liquid crystal display module MDL as described above, even when the inverter IV is arranged on the keyboard of the information processing apparatus as shown in FIG. The length of the lamp cable LPC2 on the high pressure side of the fluorescent tube LP can be shortened, the impedance that causes noise or changes in waveform can be reduced, and the startability of the cold cathode fluorescent tube LP can be improved. When the inverter IV is arranged on the keyboard unit side, the width of the display unit can be further reduced. Further, as compared with the case where the cold cathode fluorescent tubes LP are arranged above the display of the liquid crystal display module MDL, the cold cathode fluorescent tubes LP
6 is less likely to receive an impact due to the opening and closing of the display unit, and the reliability is improved. Further, as shown in FIGS. 35 and 36, the center of the liquid crystal display element PNL (display screen) is shifted upward from the center of the display unit, so that it is difficult for the user to see the lower part of the display screen with his or her hand hitting the keyboard. Can be prevented.

As is clear from FIGS. 9 to 11 and FIG. 26, since the lamp cable LPC1 passes below the light guide plate GLB above the display, the length in the vertical direction can be reduced.

<< Lower Case MC of Lamp Cable LPC
Storage in A> In this example, the wiring of the lamp cable LPC was devised for compact mounting and so as not to adversely affect EMI noise.

FIG. 26B is a sectional view of the liquid crystal display module MDL shown in FIG. 2 taken along the line BB ′.

That is, as described above, in FIG. 8, of the two lamp cables LPC, the cable LPC1 on the ground voltage side is located on the lower side so as to follow the outer shape of the two sides other than the storage portion of the fluorescent tube LP. It is stored in storage portions MC4 and MC2 formed of grooves formed in case MCA (FIGS. 10 and 26).
(B) and FIG. 27 (a)). High voltage side cable LPC2
Is short-circuited so as to be close to a portion connected to the inverter (inverter power supply circuit) IV, and is housed in a housing part MC1 formed of a groove formed in the lower case MCA (FIG. 1).
0, see FIG. 27 (b)). In FIG. 9, the ground voltage side cable LPC1 is provided with storage sections MC4, MC2, MC1 ( (See FIG. 10). The high-voltage side cable LPC2 is shortly wired so as to be close to the keyboard of the information processing device in which the inverter IV is built, and is housed in the housing MC3 formed of a groove formed in the lower case MCA. Therefore, since only the ground voltage wiring takes a long path, the adverse effect on the EMI noise does not change compared to the related art. Therefore, as compared with the conventional case where two lamp cables LPC1 and LPC2 are taken out from one side, as shown in FIG.
There is no lamp cable LPC1 on the fluorescent tube LP side, and the wiring area can be reduced by 1.5 to 2 mm. In this example, as shown in FIG. 26 (b), the lamp cable LPC1 is disposed so as to be located below the light guide plate GLB inside the transparent insulating substrate SUB1 and has a compact design.

An inverter IV is connected to the distal ends of the lamp cables LPC1 and LPC2. Inverter IV
Are stored in the inverter storage MI or in a keyboard of an information processing device such as a personal computer or a word processor. As described above, when the module MDL is incorporated into an application product such as a personal computer, the backlight B does not pass through the outer side of the module or the inverter IV does not protrude outside the module MD.
The L fluorescent tube LP, the lamp cable LPC, the rubber bush GB, and the inverter IV can be compactly stored and mounted, and the module MDL can be reduced in size and weight, and the manufacturing cost can be reduced.

The fluorescent lamp LP is installed at the light guide plate G
It may be installed on the short side of the LB.

The outline of the TFT liquid crystal display module of the present embodiment will be described below.

FIG. 30 shows a TFT liquid crystal display element (panel).
FIG. 3 is a block diagram showing a circuit arranged on the outer periphery of the circuit. The drain driver section 103 is arranged only on the lower side of the TFT liquid crystal display element (TFT-LCD).
A gate driver unit 104, a controller unit 101, and a power supply unit 102 are arranged on a side surface of a liquid crystal display element (TFT-LCD) of XGA specification composed of 3 × 600 pixels.

As described above, the drain driver section 103 is formed by bending and mounting a multilayer flexible substrate, and has a sufficiently compact design.

Controller 101 and power supply 102
Is mounted on a multilayer printed circuit board PCB. The interface board PCB on which the controller unit 101 and the power supply unit 102 are mounted is arranged on the back side of the gate driver unit 104 arranged on the outer periphery of the short side of the liquid crystal element PNL. This is because the width of the information processing apparatus (apparatus) is limited, and it is necessary to reduce the width of the module MDL as a display unit as much as possible.

As shown in FIG. 30, the thin film transistor T
The FT is arranged in an intersection region between two adjacent drain signal lines D and two adjacent gate signal lines G.

A drain electrode of the thin film transistor TFT;
The gate electrodes are connected to a drain signal line D and a gate signal line G, respectively.

Since the source electrode of the thin film transistor TFT is connected to the pixel electrode and a liquid crystal layer is provided between the pixel electrode and the common electrode, a liquid crystal capacitor CLC is equivalently connected to the source electrode of the thin film transistor TFT. Is done.

The thin film transistor TFT becomes conductive when a positive bias voltage is applied to the gate electrode, and becomes non-conductive when a negative bias voltage is applied to the gate electrode.

A storage capacitor Ca is provided between the source electrode of the thin film transistor TFT and the previous gate signal line.
dd is connected.

It should be understood that the source electrode and the drain electrode are originally determined by the bias polarity between them, and in the circuit of this liquid crystal display device, the polarities are inverted during the operation, so that the source electrode and the drain electrode are switched during the operation. . However, in the following description, for convenience, one is fixed as a source electrode and the other is fixed as a drain electrode.

FIG. 33 shows each driver (drain driver, gate driver,
FIG. 2 is a block diagram illustrating a schematic configuration of a common driver and a signal flow.

In FIG. 33, the display control device 201 and the buffer circuit 210 correspond to the controller 101 shown in FIG.
The drain driver 211 is provided in the drain driver section 103 shown in FIG.
Reference numeral 06 is provided in the gate driver unit 104 shown in FIG.

The drain driver 211 includes a data latch unit for display data and an output voltage generation circuit.

Further, a gradation reference voltage generator 208, a multiplexer 209, a common voltage generator 202, a common driver 203, a level shift circuit 207, a gate-on voltage generator 204, a gate-off voltage generator 205 and a DC
-DC converter 212 is provided in power supply unit 102 shown in FIG.

FIG. 32 shows the common voltage applied to the common electrode, the drain voltage applied to the drain, the level of the gate voltage applied to the gate electrode, and the waveform thereof. Note that the drain waveform indicates a drain waveform when displaying black.

FIG. 31 is a diagram showing a flow of display data and a clock signal for the gate driver 206 and the drain driver 211 in the TFT liquid crystal display module of this embodiment. FIG. 34 is a timing chart showing display data input from the main computer to the display control device 201 and signals output from the display control device 201 to the drain and gate drivers.

The display control device 201 receives a control signal (clock, display timing signal, synchronization signal) from the main body computer, and as a control signal to the drain driver 211, a clock D1 (CL1) and a shift clock D2.
(CL2) and display data are generated, and at the same time, a frame start instruction signal FLM, a clock G (CL3) and display data are generated as control signals to the gate driver 206.

The carry output of the previous stage of the drain driver 211 is directly used as the drain driver 211 of the next stage.
Is input to the carry input.

As is apparent from FIG. 34, the shift clock D2 (CL2) of the drain driver is the same as the frequency of the clock signal (DCLK) and the display data input from the main body computer.
The frequency becomes 0 MHz, and EMI measures are important.

<< Information Processing Implementing Liquid Crystal Display Module MDL >> FIGS. 35 and 36 are perspective views of a notebook personal computer or a word processor equipped with the liquid crystal display module MDL. FIG. 35 shows an inverter IV
36 is arranged in the display unit, that is, in the inverter storage unit MI (see FIGS. 7 and 10) of the liquid crystal display module MDL, and FIG. 36 shows a case in which it is arranged in the keyboard unit.

The CO on the liquid crystal display element PNL of the driving IC
By adopting a multi-layered flexible substrate as the G mounting and the peripheral circuit for the drain and gate driver in the outer peripheral portion and employing the bending mounting for the drain driver circuit, the outer size can be greatly reduced as compared with the conventional case. In this example, since the drain driver peripheral circuit mounted on one side can be arranged above the display section above the hinge of the information device, compact mounting is possible.

In the figure, a signal from an information device first goes to a display control integrated circuit element (TCON) from a connector located substantially at the center of a left interface board PCB in FIG. It flows to the driver peripheral circuit. As described above, by using the flip-chip method and the multilayer flexible substrate, the limitation on the outer shape of the information device in the horizontal width can be eliminated, and a small-sized information device with low power consumption can be provided.

<< Plane and Cross-Sectional Structure Near the Driver IC Chip Mounting Portion >> FIG. 19 is a plan view showing a state where the driver IC is mounted on a transparent insulating substrate SUB1 made of, for example, glass. FIG. 2 is a sectional view taken along the line AA.
It is shown in FIG. In FIG. 19, one transparent insulating substrate SUB
2 is indicated by a dashed line, but is positioned above the transparent insulating substrate SUB1 so as to overlap with the sealing pattern SL (see FIG. 19).
Thus, the liquid crystal LC is enclosed including the effective display section (effective screen area) AR. The electrode COM on the transparent insulating substrate SUB1 is a wiring that is electrically connected to the common electrode pattern on the transparent insulating substrate SUB2 via conductive beads, silver paste, or the like. The wiring DTM (or GTM) supplies an output signal from the driving IC to a wiring in the effective display unit AR. The input wiring Td supplies an input signal to the driving IC. The anisotropic conductive film ACF has an elongated shape common to a plurality of driving IC portions arranged in a line, and has an elongated shape common to an ACF2 and an input wiring pattern portion to the plurality of driving ICs. ACF1 is separately attached. As shown in FIG. 24, the passivation films (protective films) PSV1 and PSV cover the wiring portions as much as possible to prevent electrolytic corrosion, and the exposed portions are covered with the anisotropic conductive film ACF1.

Further, the periphery of the side surface of the driving IC is filled with epoxy resin or silicone resin SIL (FIG. 2).
4), protection is multiplexed.

FIG. 32 shows the common voltage applied to the common electrode, the drain voltage applied to the drain, the level of the gate voltage applied to the gate electrode, and the waveform thereof. Note that the drain waveform indicates a drain waveform when displaying black.

The gate-on level waveform (DC) and the gate-off level waveform change in level between -9 to -14 volts, and the gate turns on at 10 volts. The level of the drain waveform (during black display) and the waveform of the common voltage Vcom change between about 0 to 3 volts. For example, in order to change the drain waveform of the black level every horizontal period (1H), the logic processing circuit performs logical inversion on a bit-by-bit basis and inputs the result to the drain driver. The gate off-level waveform operates with substantially the same amplitude and phase as the common voltage Vcom waveform.

FIG. 31 is a diagram showing the flow of display data and clock signals for the gate driver 104 and the drain driver 103 in the TFT liquid crystal display module of this example.

The display control device 101 receives a control signal (clock, display timing signal, synchronization signal) from the main body computer, and as a control signal to the drain driver 103, the clock D1 (CL1) and the shift clock D2.
(CL2) and display data are generated, and at the same time, a frame start instruction signal FLM, a clock G (CL3) and display data are generated as control signals to the gate driver 104.

The carry output at the preceding stage of the drain driver 103 is directly used as the drain driver 103 at the next stage.
Is input to the carry input.

Although the present invention has been described in detail with reference to the embodiments, the present invention is not limited to the above-described embodiments, and it is needless to say that various modifications can be made without departing from the scope of the invention. is there. For example, in the above-described embodiment, an example in which the present invention is applied to an active matrix type liquid crystal display device is described, but the present invention is also applicable to a simple matrix type liquid crystal display device. Further, in the above-described embodiment, an example in which the present invention is applied to a flip-chip type liquid crystal display device is described.

[0155]

As described above, according to the present invention,
One end is connected to the end of the transparent insulating substrate of the liquid crystal display element,
The occurrence of disconnection of the flexible board for signal input whose other end is folded on the lower surface or the upper surface of the substrate can be suppressed, and the reliability can be improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a liquid crystal display module to which the present invention can be applied.

FIG. 2 is a front view, a front side view, a right side view, and a left side view as viewed from the display side after assembly of the liquid crystal display module is completed.

FIG. 3 is a rear view after the assembly of the liquid crystal display module is completed.

FIG. 4 is a front view of a liquid crystal display device with a driving circuit in which a gate-side flexible substrate FPC1 and a drain-side flexible substrate FPC2 before being bent are mounted on an outer peripheral portion of the liquid crystal display device PNL.

5 is a rear view of the liquid crystal display device with a drive circuit board of FIG. 4 on which an interface circuit board PCB is mounted.

FIG. 6 shows a case where the shield case SHD is placed on the lower side, and the flexible substrates FPC1 and FPC2 and the interface circuit substrate PC are provided.
FIG. 11 is a rear view of the state where the flexible substrate FPC2 is folded after mounting B, and the liquid crystal display element PNL with a drive circuit board is housed in a shield case SHD.

FIG. 7 is a front view and a front side view of the backlight BL.

FIG. 8 is a diagram showing a structure of the backlight BL shown in FIG.
It is the front view and front side view of backlight BL when RS and diffusion sheet SRS were removed.

FIG. 9 shows a backlight B similar to FIG. 8 showing another configuration example.
It is the front view and front side view of L.

FIG. 10 is a front view, a front side view, a rear side view, a right side view, and a left side view of the lower case MCA.

11 is an enlarged detailed view of a part A, a part B, a part C, and a part D (that is, a corner part of the lower case MCA) in the front view of FIG. 10;

12A is a front view showing a corner portion of a positioning portion PJ of a lower case MCA for storing and holding the light guide plate GLB and the light guide plate GLB, and FIG. 12B is a front view showing a positioning portion of the conventional light guide plate GLB. FIG. 7C is a front view showing how a force is applied at a corner of the PJ, and FIG. 9C is a front view showing how a force is applied at a corner of the positioning portion PJ by the light guide plate GLB of the present example.

FIGS. 13A and 13B are a front view and a side view of the backlight before bending the reflection sheet LS. FIGS.

14A is a front side view of a thin metal plate (hereinafter, referred to as a frame ground) HS for taking a frame ground, FIG. 14B is a rear view, FIG. 14C is a lateral side view, and FIG. FIG. 2A is an enlarged detailed view of a portion A, a portion B, a portion C, and a portion D of FIG.

FIG. 15A is a back (lower) view of a multilayer flexible substrate FPC2 for driving a drain driver;
(B) is a front (top) view.

16 (a) is an enlarged detailed view of a portion J in FIG. 15 (a),
(B) is a side view showing the mounting state and the folded state of the multilayer flexible substrate FPC2.

FIG. 17A is a back (lower) view of a multilayer flexible substrate FPC1 for driving a gate driver, and FIG.
Is a front (top) view.

FIG. 18 is a schematic wiring diagram showing a connection relationship between signal wiring in a multilayer flexible substrate FPC and input signals to a driving IC on a transparent insulating substrate SUB1.

FIG. 19 is a plan view showing a state where a driving IC is mounted on a transparent insulating substrate SUB1 of the liquid crystal display element.

FIG. 20 is a drain driving IC of the transparent insulating substrate SUB1.
FIG. 4 is a plan view of a main portion around the mounting portion of FIG.

21A is a sectional view taken along the line AA ′ of FIG. 15A, FIG. 21B is a sectional view taken along the line BB ′ of FIG.
(C) is a sectional view taken along the line CC ′.

FIG. 22: Foldable multilayer flexible substrate FPC
Folding mounting method 2 and multilayer flexible substrate FPC
It is a perspective view which shows the connection part of 1 and 2.

FIG. 23 (a) shows a multilayer flexible printed circuit FPC2 3
(B) is a partially enlarged detailed front view of the interface circuit board PCB of FIG. 25 (c), showing meshes fixed to a DC voltage, respectively. FIG. 4 is a view showing a state in which the entire surface is covered with a pattern ERH.

FIG. 24 is a sectional view taken along the line AA in FIG. 19;

25A is a back (lower) view of an interface circuit board PCB having functions of a controller section and a power supply section, FIG. 25B is a partial front and side view of the mounted hybrid integrated circuit HI, and FIG. () Is a front (top) view of the interface circuit board PCB.

26A is a cross-sectional view taken along the line AA ′ of FIG. 2, and FIG. 26B is a cross-sectional view taken along the line BB ′ of FIG.

27A is a cross-sectional view taken along the line CC ′ of FIG. 2, and FIG. 27B is a cross-sectional view taken along the line DD ′.

FIG. 28 is an enlarged detailed view of a main part of FIG. 26 (a) showing a solder connection state of a frame ground HS.

FIG. 29 is a block diagram showing a liquid crystal display element of a liquid crystal display module and circuits arranged around the liquid crystal display element.

FIG. 30 is a block diagram showing an equivalent circuit of a TFT liquid crystal display module.

FIG. 31 is a diagram showing flows of display data and a clock signal from a display control device to a gate and a drain driver in a TFT liquid crystal display module.

FIG. 32 is a diagram showing a common voltage applied to a common electrode, a drain voltage applied to a drain electrode, a level of a gate voltage applied to a gate electrode, and a waveform thereof in a TFT liquid crystal display module.

FIG. 33 is a block diagram showing a schematic configuration of each driver of the TFT liquid crystal display module and a signal flow.

FIG. 34 is a diagram showing a timing chart of display data input from the main body computer to the display control device and signals output from the display control device to the gate and the drain in the TFT liquid crystal display module.

FIG. 35 is a perspective view of a notebook personal computer or a word processor on which a liquid crystal display module is mounted.

FIG. 36 is a perspective view of another notebook personal computer or a word processor on which a liquid crystal display module is mounted.

[Explanation of symbols]

PNL: Liquid crystal display element, SUB1: Lower transparent glass substrate, FPC2: Flexible substrate for driving drain lines, F
ML ... multilayer wiring portion, FSL ... projecting portion, TM ... output terminal, BFI ... polyimide film, P X _... wavelength wavy film, P Y _... wave height (amplitude × 2 waves), the mountain each other of P 1 _... wave linear (mountain line wave) connecting straight line connecting the valleys each other of P 2 _... wave (wave trough line), LY2 ... connecting portion length of the (connecting length), LY1 ... a mountain line P ₁ of the connecting portion and wave Length between, A
LMD: alignment mark, IC: driving IC chip, ACF: anisotropic conductive film, BAT: double-sided tape.

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Masumi 3300 Hayano, Mobara-shi, Chiba F-term in the Electronic Devices Division, Hitachi, Ltd. (Reference) 2H089 HA40 QA02 TA01 TA09 TA18 2H091 FA14Z FA21Z FA23Z FA42Z GA01 GA13 LA02 5G435 AA08 AA14 AA18 BB12 BB15 CC09 EE02 EE05 EE13 EE26 EE32 EE36 EE37 FF08 GG24 KK02

Claims (4)

[Claims] 1. A liquid crystal display device, comprising: a backlight for irradiating one surface of the liquid crystal display device with light; wherein the backlight is a light guide plate facing one surface of the liquid crystal display device; A fluorescent tube facing the side surface on one side, and a case for accommodating the light guide plate and the fluorescent tube, a corner where the one side of the light guide plate and each of the other pair of sides crossing the one side are adjacent to each other In the portion, the frame is chamfered in an oblique direction with respect to the one side, and the case is formed with support frames respectively extending along side surfaces on the other pair of sides of the light guide plate, and in the corner portion, A liquid crystal display device, wherein the support frame is formed with an oblique portion along the chamfered portion of the light guide plate. 2. The light guide plate is chamfered linearly, and
2. The liquid crystal display device according to claim 1, wherein the oblique portions formed on each of the support frames are linear. 3. The fluorescent tube according to claim 1, wherein a rubber bush holding both ends of the fluorescent tube is fitted into a housing formed so as to sandwich the support frame around a periphery of the case along the one side of the light guide plate. 2. The liquid crystal display device according to claim 1, wherein the liquid crystal display device is accommodated in a liquid crystal display. 4. The liquid crystal display device according to claim 1, wherein the case is formed by molding a synthetic resin.