JP2806878B2 - Resin molding method and apparatus therefor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding method and an apparatus therefor, and more particularly to a method and an apparatus for separating unnecessary resin generated in a resin sealing step of a semiconductor pellet from a resin-sealed lead frame assembly.

[0002]

2. Description of the Related Art Referring to FIG.
A conventional technique disclosed in Japanese Patent Application Laid-Open Publication No. H10-26095 will be described. A resin-sealed lead frame assembly 10 having a sealing resin portion 11 in which a semiconductor pellet is sealed and a lead frame portion 12 connecting the same is transferred in the X direction (horizontal direction) as shown by an arrow 14, and An upper roller 50 which rotates around a central axis 52 by an arrow 51 as shown by an arrow 54 and has a flange 58, and a lower roller 60 which rotates around a central axis 62 by a shaft 61 as shown by an arrow 64 and has a concave portion 63. And the pressing force is generated by the flange 58 of the upper roller in the Z direction (vertical direction) which is the direction orthogonal to the X direction which is the transfer direction, and the pressing force by the flange eliminates the need for the end of the lead frame in the width direction. Resin 15
Are separated from the resin-sealed lead frame assembly 10. Here, the position of the center axis 52 of the upper roller in the X direction (X-axis coordinate) is the same as the position of the center axis 62 of the lower roller in the X direction (X-axis coordinate). That is, the center axis 52 of the upper roller is located directly above the center axis 62 of the lower roller.

[0003] Next, referring to FIG.
The prior art disclosed in Japanese Patent Publication No. 0 will be described. The sealing resin portion 11 and the lead frame portion 1 are rotated by a shaft 71 around a central axis 72 as shown by an arrow 74 and in contact with the periphery of one roller 70 having a projection 73.
2 is bent upward from the lower side as shown by an arrow 14 to change the direction, whereby the unnecessary resin 15 is separated and removed by the projection 73.

[0004]

In the prior art shown in FIG. 6, when a pressing force for separating unnecessary resin from a resin-sealed lead frame assembly is applied, the resin-sealed lead frame assembly is moved in the opposite direction. There is a problem that the lead frame is undesirably deformed by separating the unnecessary resin since the lead frame is not supported.

On the other hand, in the prior art shown in FIG. 7, a long so-called hoop frame feed mechanism is stretched with a constant tension, and unnecessary resin is separated by a reaction force generated between the tension and a pressing force of a roller. Since it is a technology, there is a problem that unnecessary resin cannot be separated for a short lead frame cut and formed to a predetermined length. Further, since the tension of the resin-sealed lead frame assembly is used as described above, there is also a problem that the setting and management of the pressing force becomes difficult, so that easy separation cannot be performed.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an undesired resin for a lead frame without applying an undesired stress to the lead frame without deforming the lead frame. For example, in a process of transferring a resin-sealed lead frame assembly, and at the same time, can be easily separated and removed.

[0007]

A feature of the present invention is that a semiconductor pellet placed on a predetermined portion of a lead frame is sealed with a resin to provide a sealing resin portion of a semiconductor device. And forming a resin-sealed lead frame assembly having a lead frame portion outside the sealing resin portion, and removing unnecessary resin generated when sealing with the resin. A resin molding method for separating from an assembly, comprising: a die roller for supporting the resin-sealed lead frame assembly; and a punch roller for applying a pressing force to the unnecessary resin .
Multiple protrusions on the outer surface that apply pressing force to unnecessary resin
Are arranged at equal intervals in the circumferential direction, and the die roller
Unnecessary resin separated by the pressing force of the projections
Are arranged at equal intervals in the circumferential direction.
Cage, and the resin sealing the lead frame assembly of the central axis of the Ponchirora so arranged at a predetermined amount a position displaced in the advancing direction of the resin sealing the lead frame assembly with respect to the central axis of the Dairora by the Ponchirora and Dairora There is a resin molding method for separating the unnecessary resin . Alternatively, the feature of the present invention is that
Semiconductor pellets placed in fixed locations are sealed with resin and
By providing the sealing resin portion of the conductor device, the sealing resin portion is provided.
And a lead frame portion outside the sealing resin portion.
Form the configured resin-sealed lead frame assembly and
Unnecessary resin generated when sealing with the above resin is sealed with the resin.
Resin molding method for separating lead frame assembly
In supporting the resin-sealed lead frame assembly
Die roller, and a
And a punch roller.
The resin-sealed lead frame with respect to the center axis of the die roller.
At a position displaced by a predetermined amount in the direction of travel of the
A plurality of rows of the sealing resin portions are arranged in a width direction of the resin-sealed lead frame assembly, and a plurality of positioning pins of the punch roller are inserted into feed holes of a lead frame of the resin-sealed lead frame assembly, respectively. Resin molding method for separating the unnecessary resin at the side end in the width direction
It is in.

Another feature of the present invention is a resin-sealed lead frame set formed by sealing a semiconductor pellet mounted on a predetermined portion of a lead frame with a resin and providing a sealing resin portion of a semiconductor device. In a resin molding apparatus for separating unnecessary resin generated when sealing with a resin from a three-dimensional structure, a die roller for supporting the resin-sealed lead frame assembly as a pair of rollers for separating the unnecessary resin; And a punch roller for applying a pressing force to the outer surface of the punch roller.
Multiple protrusions that apply pressing force at equal intervals in the circumferential direction.
Are arranged on the outer peripheral surface of the die roller.
Multiple recesses for storing unnecessary resin separated by pressing force
A resin molding apparatus which is arranged at equal intervals in a circumferential direction, and is arranged at a position where a center axis of the punch roller is displaced by a predetermined amount in a traveling direction of the resin-sealed lead frame assembly with respect to a center axis of the die roller. It is in. Or book
Another feature of the invention is that it is
Semiconductor device by sealing the semiconductor pellet
Resin-sealed lead foil formed by providing a resin part
Unnecessary when sealing the frame assembly with the resin
In a resin molding device that separates
The resin sealing lead as a pair of rollers for separating resin
A die roller supporting the frame assembly and the unnecessary resin
A punch roller for applying a pressing force to the
The center axis of the punch roller with respect to the center axis of the die roller.
A predetermined amount changes in the direction of travel of the resin-sealed lead frame assembly.
Is arranged to position the position, and the same with the timing belt and gear from the drive unit the Ponchirora and Dairora are interlocked synchronously are resin-molded instrumentation rotation angle to one another
It is in the place.

According to the method for separating unnecessary resin and the molding apparatus of the present invention, by providing the sealing resin portion of the semiconductor device which is linearly transferred by the above means, the sealing resin portion and the sealing resin are provided. When pressing the unnecessary resin adhered to the resin-sealed lead frame assembly having the lead frame portion outside the portion in a direction orthogonal to the transfer direction of the resin-sealed lead frame assembly, the pressing force by the punch roller is reduced. Since the resin-sealed lead frame assembly is supported by the die roller before or at the same time from the opposite direction in which the pressing force acts, a load exceeding the elastic limit does not act on the resin-sealed lead frame assembly. Further, since the tension of the resin-sealed lead frame assembly is not used, a predetermined pressing force can be applied regardless of the length of the resin-sealed lead frame assembly.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

It should be noted that FIG.
5 to FIG. 5 and the prior art FIGS. 6 and 7 described above, the direction perpendicular to the X direction on the same horizontal plane is the Y direction, and the direction perpendicular to this horizontal plane, that is, the direction perpendicular to the horizontal plane is the Z direction. .

FIG. 1 is a front view showing an embodiment of the resin molding method and apparatus of the present invention. FIG. 1 is an overall view of only the configuration of the main part, and the parts related to the lead frame transport mechanism and the lead frame transport such as rails and sprockets are omitted.

A space between a sealing resin portion 11 and a sealing resin portion 11 of a semiconductor device in which semiconductor pellets whose electrodes are connected to inner leads of a lead frame and are mounted on predetermined portions of a lead frame, for example, islands, are sealed with resin. The resin-sealed lead frame assembly 10 includes the lead frame connecting portion 12 to be connected. The connection portion 12 of the lead frame is a portion of the lead frame outside the sealing resin portion 11, and includes outer leads of the semiconductor device, an outer frame in which a feed hole is formed, and the like. Unnecessary resin 15 which is unnecessary resin due to the runners and gates of the mold when sealing with the above resin and which must be separated and removed.
Are adhered to the resin-sealed lead frame assembly 10.

A punch roller 20 having projections 23 disposed around the periphery at a predetermined pitch for applying a pressing force to an unnecessary resin 15 to be separated from the resin-sealed lead frame assembly 10; The die frame 30 includes a die roller 30 for supporting the lead frame assembly 10. The punch roller 20 is displaced by an amount A in the traveling direction of the resin-sealed lead frame assembly 10 with respect to the die roller 30, and is configured by a pair of rollers.

That is, as shown by the arrow 14, the resin-sealed lead frame assembly 10 is linearly transferred in the X direction, which is one direction of the horizontal plane.

A punch roller 20 having a plurality of projections 23 projecting at equal intervals from an outer peripheral surface 26
Is rotated as shown by an arrow 24, and the die roller 30 having a plurality of recesses 33 that enter the inside at equal intervals from the outer peripheral surface 36 is rotating around the central axis 32 as shown by an arrow 34. .

The X of the central axis 22 of the punch roller 20
Direction position 22X (line 22X indicating the X coordinate of the punch roller center axis) is the position 32X of the center axis 32 of the die roller 30 in the X direction (line 32 indicating the X coordinate of the die roller center axis).
X), it is shifted by a dimension A in the transport direction of the resin-sealed lead frame assembly 10.

By transferring the resin-sealed lead frame assembly 10 to be separated from the unnecessary resin between the pair of rollers 20 and 30 as described above, the transfer amount of the resin-sealed lead frame assembly 10 can be adjusted. Although it is necessary to obtain the rotation angle of the roller, the method includes the method of synchronizing the feed mechanism of the resin-sealed lead frame assembly 10 and the rotation mechanism of the roller with a gear or a timing belt, or the method of forming the lead frame. A method of synchronizing the feed amount of the resin-sealed lead frame assembly 10 with the rotation angle of the roller by transferring the resin-sealed lead frame assembly 10 while the feed protrusion of the roller is inserted into the feed hole. However, the method is not particularly limited in the present invention.

In any case, the positional relationship of the resin-sealed lead frame assembly 10 does not deviate from the protrusion 23 of the punch roller 20 and the recess 33 of the die roller 30, and the protrusion 23 allows the unnecessary resin 15 to be selectively applied. , And the resin-sealed lead frame assembly 10 is reliably supported from below by the die roller 30.

The punch roller 20 with respect to the die roller 30
Is not a value uniquely determined, but the size of the sealing resin portion 11 of the semiconductor device, the pitch between the sealing resin portions,
The optimum value is determined by the position and shape of the unnecessary resin 15 and the required pressing force, the diameter of each roller, and the like, but the resin sealing lead is determined by the pressing force mainly in the vertical direction (Z direction). The amount of displacement A that separates the unnecessary resin 15 without applying undesirably large stress to the frame assembly 10 is determined by the protrusion 23 of the punch roller 20.
Is set such that the resin-sealed lead frame assembly 10 is supported from below by the die roller 30 when the pressing force is applied.

The punch roller 20 and the die roller 30 are preferably made of a material such as SK-3 or SKD-11 in consideration of workability, and are preferably subjected to a nitriding heat treatment on the surface in consideration of wear resistance.

The punch roller 20 has, for example, a diameter (diameter of the outer peripheral side surface 26) of 132 mm, and a protrusion 23 having a height of 2 mm and a tip width of 0.7 mm from the outer peripheral surface 26 is formed at an angle of 18 degrees from the center axis. Projected at intervals.

On the other hand, the diameter (diameter of the outer peripheral side surface 36) of the die roller 30 is, for example, 132 mm, and a concave portion 33 having a depth of 5 mm and a width of 1.5 mm from the outer peripheral surface 36 is formed at an angle of 18 degrees from the central axis. Formed and arranged inside at intervals.

The sealing resin portions 11 of the semiconductor device have, for example, a length (dimension in the X direction) of 2 mm and are arranged on the lead frame at a pitch of 3.2 mm in the X direction.

The semiconductor device is MM (mini-mold) or SS
Since the resin used for a small package such as P is relatively high in hardness, it is practical to set the displacement A to 2 to 6 mm. However, in the case of an IC having elasticity in comparison with this, if the same roller as that of the MM or SSP is used, the displacement amount A is 8 to 1
It is about 0 mm. In addition, when the diameter of the roller is large (for example, when the pitch of the feed holes is large and when the thickness of the hoop frame is large), the dimension A is large in order to obtain the pushing stroke of the projection.

Next, the present invention will be described in detail with reference to FIGS.

FIGS. 2 and 3 are partially enlarged views showing the operation of separating unnecessary resin according to the embodiment of the present invention.
The operation is illustrated in chronological order in the order of (B) → FIG. 3 (A) → FIG. 3 (B).

Incidentally, for convenience of illustration, the die roller 30
The illustration of the support of the resin-sealed lead frame assembly 10 is omitted, and only the support of the sealing resin portion 11 of the semiconductor device is shown.

The outline of the method for separating unnecessary resin according to the present invention is as follows.
As shown in FIGS. 2 and 3, when the resin-sealed lead frame assembly 10 is transferred between the punch roller 20 and the die roller 30, each of the rollers is reduced in the transfer amount of the resin-sealed lead frame assembly 10. The resin is rotated synchronously, and the unnecessary resin is pressed and separated by the pressing force of the projection in the vertical direction (Z direction) as a main component.

Hereinafter, the mechanism of the unnecessary resin separating method will be described step by step with reference to the drawings.

First, referring to FIG.
0, the pressing force of the unnecessary resin 15a (15) by the protrusions 23a (23) is completed on the resin-sealed lead frame assembly 10 transferred between the die roller 30 and the unnecessary resin 15
a (15) is hereinafter referred to as a resin-sealed lead frame assembly 10
Recess 3 so as not to hinder the transfer of the rollers and the rotation of each roller.
Separately drop into 3 and store.

Further, the projections 23b (23) do not contact the unnecessary resin 15b (15) before separation, and therefore no pressing force acts.

Therefore, the unnecessary resin 15b (15) is also supported by the die roller 30.
Is not perfect.

Next, FIG. 2B shows a state in which the resin-sealed lead frame assembly 10 has been further transferred. The transfer of the resin-sealed lead frame assembly 10 causes each roller to rotate periodically at the same angle, so that the protrusions 23b (23)
Is in contact with the unnecessary resin 15b (15) from above.
Due to the further transfer of the resin-sealed lead frame assembly 10, the tip of the projection 23 b (23) is displaced leftward and downward with the rotation of the punch roller 20, and the unnecessary resin 15 b (1
Apply a pressing force to 5).

FIG. 3A shows a state immediately after the unnecessary resin 15b (15) is separated from the resin-sealed lead frame assembly 10 by the pressing force of the projection 23b (23). The unnecessary resin 15b (15) after the separation is completed is the protrusion 23b (2
It is pushed downward by the pressing force of 3) and stored in the concave portion 33.

If the relative displacement between the punch roller 20 and the die roller 30 is inappropriate, the gap between the resin-sealed lead frame assembly 10 and the die roller 30 at the time when the pressing force by the projections 23b (23) is applied. There is a small gap, and the resin-sealed lead frame assembly 10 is displaced downward by the pressing force against the unnecessary resin 15b (15). However, if the displacement is within the elastic limit of the lead frame, there is no particular problem. Absent.

Next, FIG. 3B shows the unnecessary resin 15b (15).
Is completed, and is in the process of being transferred to separate the unnecessary resin 15 (15). The protrusion 23a (23), which has completed the pressing of the unnecessary resin 15a (15), is displaced upward without contacting the sealing resin portion 11 of the semiconductor device.

The separated unnecessary resin 15a (1)
5) is a position rotated by 90 degrees or more in terms of the rotation angle of the die roller 30 while being stored in the concave portion 33, that is, the concave portion 3
When the opening 3 faces downward, it falls below the recess 33.

As described above with reference to FIGS. 2A to 3B, unnecessary resin 15 adhered to the resin-sealed lead frame assembly 10 is continuously and resin-sealed in the process of transferring the unnecessary resin 15. The frame assembly 10 can be separated and removed without giving any stress.

Next, another embodiment of the present invention will be described with reference to the drawings. FIG. 4 is an overall view showing another embodiment of the present invention, and FIG. 5 is a view of the KK part of FIG. In FIGS. 4 and 5, the same or similar parts as those in FIGS. 1 to 3 are denoted by the same reference numerals, and a duplicate description will be omitted as much as possible.

Also in this embodiment, the punched roller 20 having the flange 28 for applying a pressing force to the unnecessary resin 15 to be separated from the resin-sealed lead frame assembly 10 and the resin-sealed lead And a die roller 30 for supporting the frame assembly 10. In this embodiment, the unnecessary resin 15 located at the side end of the lead frame in the width direction (Y direction) of the resin-sealed lead frame assembly 10 is separated.
A pressing force is applied to the unnecessary resin 15 by the flange 28.

The positional relationship between the die roller 30 and the punch roller 20 in the X direction, which is a feature of the present invention, is such that the punch roller 20 moves in the direction of advance of the resin-sealed lead frame assembly 10 relative to the die roller 30 as in the previous embodiment. The amount has been displaced.

By transferring the resin-sealed lead frame assembly 10 to be separated from the unnecessary resin between the pair of rollers, a plurality of feed holes of the connecting portion 12 of the lead frame of the resin-sealed lead frame assembly 10 are formed. Since the positioning pins 27 of the punch roller 20 are engaged with the respective members 17, when the resin-sealed lead frame assembly 10 is transferred by the feed sprocket 43, the transfer amount and the rotation angle of the punch roller 20 are synchronized.

The rotation angles of the die roller 30 and the punch roller 20 are synchronized by the timing belt 42 and the spur gear 41 and are linked.

Elongated resin-sealed lead frame assembly 1
A value of 0 is used to maintain an accurate position with respect to the roller, and is inflected upward along the periphery of the punch roller 20.
This inflection causes a plurality of the positioning pins 27 to enter the feed holes of the lead frame, so that the positioning of the resin-sealed lead frame assembly 10 with respect to the punch roller 20 is reliably performed.

The die roller 30 supports both the connecting portion 12 of the lead frame and the sealing resin portion 11 of the semiconductor device at the same time. attached.

It is preferable that the center of the die roller 30 is located just below the position where the variation A between the die roller 30 and the punch roller 20 applies a pressing force to the unnecessary resin 15.

The punch roller 20 has a clearance with no gap and no stress is applied to the resin-sealed lead frame assembly 10 and suppresses upward displacement due to vibration or the like generated when the unnecessary resin 15 is separated. Thus, the deformation of the connecting portion 12 of the lead frame is prevented, and the pressing force of the punch roller 20 is effectively applied.

[0049]

The first effect is that unnecessary resin can be separated without applying undesired stress to the resin-sealed lead frame assembly, and thus without deforming the lead frame.

The reason is that the resin-sealed lead frame assembly is supported from the opposite direction to the pressing force for separating the unnecessary resin from the lead frame (connecting portion) or the semiconductor device (sealing resin portion). Because.

The second effect is that even in the case of a short lead frame, the unnecessary resin can be easily separated by a pair of rollers in the transfer process.

The reason is that in the unnecessary resin separation process,
This is because the pressing force of a predetermined value for the separation is received by the die roller, so that it is not necessary to limit the length of the lead frame.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of the present invention.

FIG. 2 is a front view showing the operation of the embodiment of the present invention in order.

FIG. 3 is a front view sequentially showing the operation following FIG. 2;

FIG. 4 is a front view showing another embodiment of the present invention.

FIG. 5 is an enlarged cross-sectional view of a portion KK of FIG. 4;

FIG. 6 is a front view showing a conventional technique.

FIG. 7 is a front view showing another conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Resin-sealed lead frame assembly 11 Sealing resin part of semiconductor device 12 Connecting part of lead frame 14 Transfer direction of resin-sealed lead frame assembly 15 (15a, 15b, 15c, 15d) Unnecessary resin 17 Feed hole 20 Punch roller 21 Shaft of punch roller 22 Center axis of punch roller 22X Line indicating X coordinate of punch roller center axis 23 (23a, 23b, 23c, 23d) Projection of punch roller 24 Rotation direction of punch roller 26 Outer peripheral surface of punch roller 27 Positioning pin 28 Flange 30 Die roller 31 Shaft of die roller 32 Center axis of die roller 32X Line indicating X coordinate of center axis of die roller 33 Recess 34 Rotation direction of die roller 36 Rotation direction of die roller 37 Step 41 Spur gear 42 Timing belt 43 Feed sprocket Reference Signs List 50 upper roller 51 upper roller shaft 52 upper roller center axis 54 upper roller rotation direction 58 upper roller flange 60 lower roller 61 lower roller shaft 62 lower roller center axis 63 lower roller recess 64 lower roller rotation direction Reference Signs List 70 roller 71 roller shaft 72 roller center axis 73 roller protrusion 74 roller rotation direction

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/56 B29C 45/02 B29C 45/14 B29C 45/17

Claims (4)

(57) [Claims] 1. A semiconductor pellet mounted on a predetermined portion of a lead frame is sealed with a resin to provide a sealing resin portion of a semiconductor device, whereby the sealing resin portion and a lead frame outside the sealing resin portion are provided. A resin molding method for forming a resin-sealed lead frame assembly having a portion and separating unnecessary resin generated at the time of sealing with the resin from the resin-sealed lead frame assembly. A die roller for supporting the resin-sealed lead frame assembly; and a punch roller for applying a pressing force to the unnecessary resin.
A plurality of projections that apply pressing force at equal intervals in the circumferential direction
Are arranged on the outer peripheral surface of the die roller.
Recesses for storing unnecessary resin separated by pressing force
Are arranged at equal intervals in the circumferential direction, and the punch roller is arranged by disposing a central axis of the punch roller at a position displaced from the central axis of the die roller by a predetermined amount in a traveling direction of the resin-sealed lead frame assembly. And separating the unnecessary resin from the resin-sealed lead frame assembly by a die roller. 2. A lead frame mounted at a predetermined position on a lead frame.
Sealing semiconductor pellets with resin and sealing resin for semiconductor devices
Providing the sealing resin portion and the sealing resin portion outside
Resin sealing configured with a lead frame part
When forming a lead frame assembly and sealing it with the resin
Unnecessary resin generated in the resin-sealed lead frame set
A resin molding method for separating from a three-dimensional structure, comprising:
And a punch roller for applying a pressing force to the unnecessary resin.
And the center axis of the punch roller is
Of the resin-sealed lead frame assembly with respect to the center axis of the
The sealing resin portion is arranged at a position displaced by a predetermined amount in the traveling direction, and the sealing resin portions are arranged in a plurality of rows in a width direction of the resin sealing lead frame assembly , and a plurality of positioning pins of the punch roller are connected to the resin sealing lead frame. A resin molding method, wherein the unnecessary resin is inserted into a feed hole of a lead frame of an assembly to separate the unnecessary resin at a side end in the width direction. 3. A resin-sealed lead frame assembly formed by providing a sealing resin portion of a semiconductor device by sealing a semiconductor pellet mounted on a predetermined portion of a lead frame with a resin, and sealing the semiconductor pellet with the resin. In a resin molding apparatus for separating unnecessary resin generated when stopping, a die roller supporting the resin-sealed lead frame assembly as a pair of rollers for separating the unnecessary resin, and applying a pressing force to the unnecessary resin. A punch roller, and an outer peripheral surface of the punch roller is pressed against unnecessary resin.
A plurality of protrusions that apply pressure are arranged at equal intervals in the circumferential direction
The outer peripheral surface of the die roller is pressed by the projection.
Multiple recesses for storing unnecessary resin separated by pressure
The punch roller is arranged at a position displaced by a predetermined amount in the traveling direction of the resin-sealed lead frame assembly with respect to the center axis of the die roller. Resin molding equipment. 4. A device mounted on a predetermined portion of a lead frame.
Sealing semiconductor pellets with resin and sealing resin for semiconductor devices
Resin-sealed lead frame formed by providing a part
Unnecessary trees generated when sealing the
In a resin molding apparatus for separating fat, the resin sealing is performed as a pair of rollers for separating the unnecessary resin.
A die roller for supporting a lead frame assembly;
Equipped with a punch roller that applies pressing force to unnecessary resin
And the center axis of the punch roller is aligned with the center of the die roller.
The traveling direction of the resin-sealed lead frame assembly with respect to the axis
Resin molding apparatus wherein the Ponchirora and Dairora is that in conjunction with synchronizing the rotation angle from each other by a timing belt and gear from is placed in a predetermined amount displaced position, and the same driver on.