JP2847122B2 - Electronic component lead processing method and apparatus - Google Patents

Description

The present invention relates to, for example, a method of processing external leads in a resin-sealed molded product of a semiconductor element and other electronic components, and a lead processing for performing the method. It relates to improvement of the device.

[Conventional technology]

2. Description of the Related Art In order to mount an electronic component on a substrate or the like, an external lead of the electronic component has been conventionally bent into a required shape.

In this conventional lead processing apparatus (processing die), for example, as shown in FIG. 5, a base 3 of an external lead 2 projecting outside a main body (mold package) 1 in which an electronic component is resin-sealed. Upper and lower dies 4 and 5 for clamping the upper die 4, an upper punch 6 disposed beside the upper die 4, and a lower die 5.
And a lead bending surface 7 formed on the upper surface of the substrate.

In this apparatus, the base 3 of the external lead is clamped by the upper and lower dies 4 and 5, and in this state, the punch 3 is brought into contact with the upper surface of the external lead of the upper punch 6 and the punch is lowered (pushed). By doing so, the external lead 2 is provided so that it can be bent along the shape of the bent surface 7 described above. In this type of lead processing device, after a pre-processing step of cutting unnecessary portions such as tie bars in a sealed lead frame, each external lead is sequentially transferred to a required lead shape while transferring the entire lead frame. A so-called progressive die structure is employed, and the lead frame is usually plated with solder or the like.

[Problems to be solved by the invention]

By the way, the above-described conventional lead processing method and apparatus have the following problems.

That is, as shown in FIG. 5, when the external lead 2 is bent downward by the upper punch 6, both surfaces of the lead are rubbed against the punch 6 and the lead bending surface 7 of the lower die 5. Therefore, the solder plating applied to both sides of the external lead is peeled off, so-called plating whiskers 9 as shown in FIG. 6 are generated, and both sides of the lead are damaged.

Therefore, there is a serious problem that such peeling or damage of the plating of the external lead significantly lowers the quality and reliability of this kind of product, and the occurrence of plating whiskers transfers the lead frame to the next process side. At this time, there is an adverse effect such as dropping and adversely affecting the transfer mechanism or the like, or causing various types of molding failure.

Further, in order to prevent the above-mentioned external leads from being peeled off by plating, the external leads are reciprocated in the horizontal direction, which is slightly obliquely upward toward the base side of the clamped external leads. When a bending force is applied to the distal end portion of the external lead toward the base portion thereof, the distal end portion of the external lead is supported via the slide plate. Japanese Patent Application Laid-Open No. 2-284454 proposes to reduce the frictional action between the tip of the external lead and the side of the lead bending surface (7) by horizontally moving in the bending direction. Gazette). In this case, through the slide plate provided on the lead bending surface, the external lead can be horizontally moved in the bending direction in a state where the tip of the external lead is supported. As compared with the case where no slide plate is provided, there is an advantage that the frictional action between the distal end portion of the external lead and the bent side of the lead can be reduced. However, the bending of the external lead is based on the cooperative action of the pressing force of the punch (pressing member) applied downward to the upper surface side of the external lead and the horizontal movement of the tip of the external lead. In particular, since the rubbing action between both the upper surface side of the external lead and the punch cannot be eliminated, it is possible to reliably prevent the peeling of the plating of the external lead due to the rubbing action. There is a technical problem that cannot be done.

An object of the present invention is to provide a lead processing method and a processing apparatus capable of efficiently preventing plating peeling and damage on both surfaces of the external leads as described above in a bending step of each external lead. It is assumed that.

It is another object of the present invention to provide a molded product (product) of this type having high quality and high reliability.

[Means for solving the problem]

The lead processing method of an electronic component according to the present invention includes: a lead clamping step of clamping a base of an external lead protruding outside a main body for sealing an electronic component; A preliminary lead bending step of abutting the distal end working surface of the punch and then pushing the punch leading end operating surface while rotating to the head side of the external lead to bend the external lead to a required angle with its base as a fulcrum; and Contacting the other surface of the tip of the external lead bent in the preliminary lead bending step with the tip working surface of a bending die provided so as to pivot toward the base of the external lead with a pivot as a fulcrum; The tip working surface of the punch is further pushed while rotating, and the lead bending force by the punch working surface is applied between the base of the external lead and the tip thereof. A lead bending step of bending the external lead into a predetermined shape by adding the external lead to a predetermined shape. The surface is rotated toward the base of the external lead with the pivot as a fulcrum.

Further, the lead processing apparatus for an electronic component according to the present invention includes a lead clamp mechanism for clamping both front and back surfaces of an external lead protruding outside a main body for sealing the electronic component, and a lead clamp mechanism disposed on a side portion of the lead clamp mechanism. A lead bending mechanism comprising a punch and a bending die provided therein, wherein the punch abuts on one surface of a clamped external lead tip, and thereafter, the external lead tip The bending die is provided so as to be pushed and bent while rotating to the base side with the base as a fulcrum, and the bending die is rotated to the base side of the clamped external lead with a pivot as a fulcrum. And abuts against the other surface of the distal end of the clamped external lead, and then, in this state, while rotating toward the base side of the clamped external lead. With the movement of the punch to be dynamic, and is characterized in that is provided so as to move while rotating to the base side of the external leads.

Further, the lead processing apparatus for an electronic component according to the present invention is characterized in that the tip of the lead bending die is provided with a rotary roller having a joining surface to a tip of an external lead. .

(Operation)

ADVANTAGE OF THE INVENTION According to this invention, at the time of the bending process of an external lead, the front-end | tip part of this external lead and the rubbing of the punch and die for lead bending can be prevented reliably.

That is, according to the present invention, the bending force of the punch and the bending die on the external lead is rotated and moved to the base side of the clamped external lead by the punch and the bending die. Since it is added to the external lead, the rubbing action between the two is completely
Alternatively, it can be eliminated to such an extent that it can be completely ignored. Therefore, in any of the preliminary lead bending step of the external lead by the punch, the bending die contacting step to the other surface of the external lead tip, and the lead bending step by the continuous punch and bending die, Since the frictional action between the outer lead and the bending die does not substantially occur, it is possible to reliably prevent the exfoliation of the tip of the external lead and its damage.

Further, according to the present invention, by rotating the tip of the lead bending die with a rotating roller to be joined to the external lead (claim 3), the friction between the two can be more reliably prevented. is there. That is, as described above, at the time of bending the external lead, both the external lead and the punch and the bending die are in contact with each other in a point or line contact state. If there is a slight rubbing action between the tip of the external lead and the bending die due to the length and shape of the punch, or the strength of the bending force of the punch, etc. The rotating roller provided at the tip of the die can also prevent such rubbing action between the two.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

1 to 3 show the main parts of a processing apparatus for performing the method of the present invention. FIG. 1 shows the lead clamping step, and FIGS. 2 and 3 show the lead bending step. Each is shown.

Note that the lead frame sealed with a resin material in the method of the present invention has been subjected to the following pretreatment process in advance.

A tie bar cutting step for cutting and removing tie bars between leads of a sealed lead frame; a lead cutting step for cutting and separating external lead tips from side rails; and a resin for cutting and removing unnecessary solidified resin around the main body and each lead. Unnecessary portions of the sealed lead frame are cut and removed by a cutting process or the like, and the respective external leads are in a state of being protruded from the main body, respectively, and the sealed lead frame and the main body are pinched. It is in a state of being connected and integrated through the part.

The processing apparatus has a progressive die structure as described above, and the processing apparatus includes a main body 1 for sealing an electronic component.
A lead clamp mechanism 10 for clamping each external lead 2 protruding from the outside and a lead mechanism 11 for bending each external lead 2 clamped via the lead clamp mechanism 10 into a predetermined shape are provided.

Further, the above lead clamp mechanism 10 is die 10 ₁ - 10 ² vertically are provided to clamp the base portion 3 of the outer leads 2 projecting from the outside of the main body 1, further, the opposing of both die on the surface, receiving portion 10 ₃ of the body 1 is provided, therefore, as shown in FIG. 1, the accommodation portion 10 ₃ a body 1
The base 3 of the external lead is held in the upper and lower dies
It is provided to be able to perform the clamping process of the external lead to be clamped by 10 _{1.10 2.}

The lead bending mechanism 11 includes an upper punch 12 provided on the side of the lead clamp mechanism 10 and a bending die 13 provided below the punch. The lower end working surface 12 ₁ of the punch 12 is connected to both dies 10 ₁ and 10 _2.
By contacting with the upper surface of the distal end portion 8 of the external lead clamped by (see FIG. 1), and then descending (pushing) while rotating toward the base 3 side of the external lead,
The external lead 2 is provided so that a preliminary lead bending step of bending the external lead 2 downward with the base 3 as a fulcrum can be performed (see FIG. 2). Further, the bending die 13 is the upper end working surface 13 ₂ side as a fulcrum pivot 13 ₁ of the lower is provided rotatably, and, in its normal state, the bending die
Together provided so as to push the upper working surface 13 ₂ side to the lower die 10 and _second outer side by the required elasticity of the elastic member 13 ₃ is interposed between the lower die 10 ₂ at 13 and the lead clamp mechanism the stopper 13 ₄ provided on the side of the lower die 10 ₂
Accordingly, the upper end working surface 13 ₂ of the external lead tip 8
(See FIG. 1).

The predetermined position upper working surface 13 ₂ of the bending die described above can be locked is pivoted outward, as shown in Figure 2,
Refers to positions Setto at lower working surface 12 ₁ of the upper punch lower surface of the outer lead tip 8 which is bent downward (This predetermined position is freely changed arrangement position of the stopper 13 ₄ It can be modified / changed as needed.) Therefore, it is possible by the rotation drop of the upper punch 12, the step to be brought into contact with the upper end working surface 13 ₂ of the die bending the lower surface of the outer lead tip 8 through the above-mentioned preliminary lead bending step. Further, in this state, when the upper punch 12 is further rotated drops and bending working force of the punch lower working face 12 ₁ to the external lead 2 is applied between the base 3 of the outer leads and the distal end 8 The external lead 2 is bent downward at its base 3 and its distal end 8 side is bent outward substantially horizontally so as to be employed in a surface mount type product abbreviated as a flat package. A lead bending step for obtaining the lead bending shape of FIG.

However, in the lead bending step described above, the bending upper working surface 13 ₂ of the die, through the external lead tip 8, the lower die 10 based on the rotation lowering action of the punch 12
Power will be applied in _two directions. Therefore, upper end working surface 13 _2, the lower die 10 ₂ against the elasticity of the elastic member 13 ₃ while maintaining the state where brought into contact with the lower surface of the outer lead tip 8
It is turned in the direction. That is, for this round operation, as described above, in accordance with the rotation lowering action of the upper punch 12 is brought into contact with the lower end working surface 12 ₁ and the external lead tip 8 and the tip lower surface of the pachi bending upper working surface 13 ₂ of the die will be pivoted substantially simultaneously external lead base 3 side (see FIG. 3). Therefore, at this time, because there is no a friction cooperation between both the upper working surface 13 ₂ of the die bottom plate and the bending of the outer lead tip 8, the peeling of solder plating which is applied to the tip lower surface and its It can prevent surface damage.

After the above-described steps are performed, a pinch cutting step of cutting and separating a pinch portion connecting the sealed lead frame and each body is performed, whereby each product is removed from the sealed lead frame. Can be individually separated from each other.

The configuration in which the upper end portion of the bending die 13 is bonded to the lower surface of the outer lead tip 8, the rotating roller 14 having a connecting circumferential surface 14 ₁ of the external lead tip lower surface rotatably to JikuSo ( (See FIG. 4). In this case, since the outer lead tip 8 and the bending die 13 are joined via the rotating roller 14, the peeling and damage of the plating on the lower face of the outer lead tip caused by the joining action between the two can be more efficiently performed. This can be prevented well and reliably.

The present invention is not limited to the above-described embodiment, and can be appropriately and arbitrarily changed and selected as needed without departing from the spirit of the present invention.

For example, the arrangement of the two dies and the punch and the bending die may be configured to be upside down from the configuration shown in the embodiment, or may be configured to be arranged in the horizontal direction.

Further, in the embodiment, the case where each external lead is protruded in two directions from the main body is illustrated, but the present invention can be applied to the case where each external lead is protruded in four directions of the main body. You can do it.

〔The invention's effect〕

ADVANTAGE OF THE INVENTION According to this invention, in the bending process of an external lead, it has the outstanding practical effect which can prevent plating peeling of the external lead front-end | tip part and its damage efficiently and reliably.

In particular, since peeling of the plating (generation of plating whiskers) on both surfaces of the tip portion of the external lead can be reliably prevented, there is an effect that the above-described conventional adverse effects can be surely eliminated.

Therefore, the present invention has an excellent effect of providing a method and an apparatus for processing a lead of an electronic component, which can surely prevent peeling of the plating of the external lead tip and its damage, and high quality. And an excellent effect of being able to provide a molded article of this kind having high reliability.

[Brief description of the drawings]

1 to 3 are partially cutaway front views showing a main part of a lead processing apparatus according to the present invention. FIG. 1 shows a step of clamping an external lead, and FIG. FIG. 3 shows the lead bending process. It should be noted that only the right half thereof is shown for symmetry. FIG. 4 shows another embodiment and is a partially cutaway front view showing the upper end of a bending die. FIG. 5 is a partially cutaway front view showing a main part of a conventional lead processing apparatus. FIG. 6 is a perspective view showing a distal end portion of an external lead formed by a conventional processing apparatus. Explanation of numerals] 1 ...... body 2 ...... external leads 3 ...... base 8 ...... tip 9 ...... Mekkihige 10 ...... lead clamp mechanism 10 ₁ ...... on the die 10 ₂ ...... under die 10 ₃ ...... accommodated Section 11 Lead bending mechanism 12 Punch 12 ₁ Bottom working surface 13 Bending die 13 ₁ Axis 13 ₂ … Top working surface 13 ₃ … Elastic material 13 ₄ … Stopper 14 Rotation Roller 14 ₁ …… Peripheral surface

Claims (3)

(57) [Claims] A lead clamping step of clamping a base of an external lead protruding outside a main body for sealing an electronic component; and a front end working surface of a punch contacting one surface of the external lead clamped in the lead clamping step. Then, a preliminary lead bending step of rotating the punch tip working surface toward the base side of the external lead while pushing it to bend the external lead to a required angle with the base as a fulcrum; Contacting the other surface of the tip of the external lead bent by the step with the tip working surface of a bending die provided so as to rotate toward the base side of the external lead with a pivot as a fulcrum; The surface is further rotated and pushed to apply the lead bending force by the punch tip working surface between the base of the external lead and the tip thereof. A lead bending step of bending a lead of the bending die into a predetermined shape, wherein, at the time of the lead bending step, the tip working surface of the bending die is rotated with the rotation of the punch tip working surface. A method of processing a lead of an electronic component, comprising rotating the external lead to a base side with the pivot as a fulcrum. 2. A lead clamp mechanism for clamping both front and back surfaces of an external lead protruding outside of a main body for sealing an electronic component, and a punch and a bending die disposed on a side of the lead clamp mechanism. An electronic component lead processing device provided with a lead bending mechanism, wherein the punch abuts one surface of the clamped external lead tip, and thereafter,
The distal end portion of the external lead is provided so as to be pushed and bent while rotating toward the base portion with the base portion as a fulcrum, and the bending die is provided with the external lead clamped with a pivot as a fulcrum. While being provided so as to rotate to the base side, it comes into contact with the other surface of the tip of the clamped external lead, and then moves in this state while rotating to the base side of the clamped external lead. An electronic component lead processing apparatus provided so as to move while rotating to the base side of the external lead in accordance with the movement of a punch. 3. The electronic component lead processing apparatus according to claim 2, wherein a rotating roller having a joining surface to the external lead distal end is mounted on the distal end of the lead bending die.