JP2802811B2 - Electronic component lead processing equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION The present invention relates to, for example, an improvement in an external lead processing device for a resin-encapsulated molded product of a semiconductor element and other electronic components.

[Conventional technology]

Examples of a lead processing device (working die) for bending external leads of the electronic component into a required shape in order to mount the electronic component on a substrate or the like include, for example, a main body obtained by sealing and molding an electronic component with resin. There is a known type including a mold package) and a support mechanism for supporting the external leads thereof, and a lead bending mechanism for bending the external leads supported by the support mechanism to a required angle (for example, a special package). No. 54-10266, etc.).

In this type of lead processing device, after a pre-processing step of cutting unnecessary portions such as tie bars in a sealed lead frame, each external lead is sequentially transferred to a required lead shape while transferring the entire lead frame. In general, a so-called progressive die structure in which bending processing is performed up to is performed.

In addition, when bending the external lead, the bending force is transmitted to the main body side to prevent microcracks from being generated in the main body. It is customary to clamp to a high pressure state.

[Problems to be solved by the invention]

Although the above-mentioned main body is warped or distorted due to the shrinkage action of the resin, the above-described clamp pressure of the external lead is applied as a force for correcting such a warp of the main body, and therefore, Even if the lead is bent in a predetermined shape, if the pressure is removed, the main body will return to the original shape due to warping and distortion, so the external lead after the bending is A predetermined bent shape cannot be obtained in relation to the main body, and there is a problem that, for example, a problem such as floating of the external lead occurs and connection during mounting becomes impossible.

In order to eliminate such adverse effects, after bending each of the external leads, only the main body is clamped to make each external lead free, and in this state, the tip of each external lead is brought into a predetermined state. Modification to a bent shape has been performed (for example, JP-A-63-278262).

By the way, in the case where the tip of each of the external leads is modified into a predetermined bent shape, as described above, the clamping pressure on the main body may not be too large to correct a warp or the like of the main body. Also, the force must be at least a force that can securely lock the main body so as not to hinder the bending process of the tip of each external lead.

Therefore, the present invention, when modifying the tip of each of the external leads to a predetermined bent shape, without applying excessive clamping pressure to the body, securely locks the body, An object of the present invention is to provide a lead processing device for an electronic component that can efficiently perform bending of the tip of each external lead.

It is another object of the present invention to provide a molded product (product) of this type having high quality and high reliability.

[Means for solving the problem]

An electronic component lead processing apparatus according to the present invention includes a lead clamp mechanism that clamps a base of each external lead protruding outside a main body that seals an electronic component, and an external component that is clamped through the lead clamp mechanism. A lead bending mechanism for bending the lead into a predetermined shape, a main body clamping mechanism for clamping the main body after the lead is bent, and a tip portion of each external lead supported in a free state through the main body clamping mechanism in a predetermined bending shape. There is a lead processing device for electronic parts equipped with a lead bending repair mechanism to repair
The main body clamping mechanism is provided so as to clamp at least three or more points on both front and back surfaces of the main body.

(Operation)

According to the present invention, at least three or more points on both front and back surfaces of the main body can be clamped by the main body clamping mechanism.

Therefore, since an excessive clamping pressure is not applied to the main body, not only the correcting action of the warp or the like on the main body can be surely prevented, but also the main body is securely locked and each external lead is provided. The tip can be bent efficiently and reliably.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

1 to 3 show the main parts of a lead processing apparatus according to the present invention. FIG. 1 shows the lead clamping mechanism and lead bending mechanism, and FIGS. 2 and 3 show the main body clamping mechanism. And a lead bending modification mechanism, respectively.

4 to 6 show the main body clamping means.

Note that the lead clamp (first
The lead frame sealed with a resin material before performing the step (see the figure) is subjected to the following pre-processing steps in advance.

That is, a tie bar cutting step for cutting and removing tie bars between leads in a sealed lead frame, a lead cutting step for cutting and separating the ends of external leads from side rails, and a resin for cutting and removing unnecessary solidified resin around the main body and each lead. Unnecessary portions of the sealed lead frame are cut and removed by a cutting process or the like, and each of the external leads is in a state of being separately protruded from the main body (sealed molded body of the electronic component). The stopped lead frame and the main body are connected and integrated via a tab lead (pinch portion).

Also, with the machining device comprises a structure of progressive die as described above, the the processing device, clamping the base portion 2 ₁ of the outer leads 2 projecting from the outside of the main body 1 to seal the electronic component a lead clamping mechanism 3 to a lead bending mechanism 4 bending the respective outer leads 2 of clamping via the lead clamp mechanism 3 into a predetermined shape, the body clamp mechanism 5 for clamping the body 1 ₁ after bending the lead, the through the body clamping mechanism 5 is provided s lead bending concealment mechanism 6 Togaotto retouch the tip 2 ₂ of the outer leads 2 that is supported in a free state in a predetermined bent shape.

The aforementioned lead clamping mechanism 3, the stripper 3 ₂ arranged with the die 3 ₁ disposed below the top of the die
When the spring 3 ₃ and the die 3 ₁ and the stripper 3 ₂ accommodating portion of the main body 1 formed on the surface facing the 3 ₄ and which presses against the stripper die 3 _1, is projected to the outside of the body 1 clamping means 3 _{5.3 6} such projections or an external lead made of protrusions for engaging to securely clamp the said site to the base 2 ₁ of each outer lead is provided that.

Further, the lead bending mechanism 4, the curved surface 4 for a punch 4 ₁ arranged vertically movable on the side surface of the stripper 3 _2, predetermined lead formed on the lower surface of the punch 4 ₁ bending the
_2, corresponding to the shape of the curved surface 4 ₂ and a curved surface 4 ₃ etc. for bending leads formed on the upper surface of the die 3 _1.

Accordingly, the main body 1 is set at a predetermined position of the housing part 3 ₄ described above to clamp the base portion 2 ₁ of the respective outer lead in the external lead clamping means 3 _{5.3 6,} thereafter, the punch 4 ₁ described above depressing, respective outer leads 2 its base 2 ₁
Except will be bent in a shape corresponding to the curved surface 4 _{2.4 3} in the punch and die as described above. In addition, since the figure shows the case of lead bending in a surface mount type product abbreviated as a flat package, the bending shape of each of the above-described external leads 2 is obtained by bending the external lead 2 at an angle of about 90 degrees. by bending the tip 2 ₂ outwardly at an angle of approximately 90 degrees, and a tip portion 2 ₂ so as to form a flat shape. The bent shape of each external lead 2 obtained by the lead clamp mechanism 3 and the lead bending mechanism 4 can be set arbitrarily, and the bent shapes obtained by the two mechanisms 3 and 4 are set in advance. It has a predetermined shape. However, as described above, the return since warp or distortion of the body 1 during a read clamp is corrected, to the body 1 is original shape upon removal of the clamping pressure has been added to the base 2 ₁ of external leads for which will, as a result, lead bending each external lead passed through the processing, in particular, the bent shape the distal end 2 ₂ no longer matches the predetermined shape described above.

The aforementioned body clamp mechanism 5, a die 5 _1, 5 ₂ disposed facing vertically, a spring 5 ₃ to press against the lower die 5 ₂ at the top of the die 5 _1, both said die 5 ₁ - 5 is formed on the _second opposing surface protruding body clamping means 5 ₄ such engaged on the front and rear clamping surfaces of the body 1 is provided.

The main body clamping means is provided corresponding to four corners on the front and back surfaces of the main body as shown in FIG. 4 and three predetermined parts on the front and back surfaces of the main body as shown in FIG. It is.

The main body clamping means can be appropriately changed in accordance with the shape of the main body. However, the main body clamping means is provided at at least three points on both front and back surfaces of the main body and presses the main body evenly. It is arranged so that it can be clamped.

Further, as shown in FIG.
Body clamping means 5 comprising an upper die 5 ₅ advance and retreat slidably engaging pin member 5 ₍₆₎ provided from the elastic engagement member that is pushed toward the die 5 _second lower by the elasticity of the spring 5 _{7 8} may be adopted.

Furthermore, the body clamp means described above, the protruding body clamping means 5 _4, or may it be adopted only any one of the body clamping means 5 ₈ made of an elastic engaging member, both said body clamp The means may be appropriately combined and configured (see FIG. 6).

Clamping pressure by the body clamping means 5 ₄ - 5 ₈ described above is not able to correct the warpage or the like to the main body 1 ₁ is clamped by said means, thereby the body reliably engaged in position It is set as a force that can be done. Therefore, the main body is securely locked by the clamp mechanism 5, and at this time, each external lead 2 is supported in a free state.

Further, the lead bending adjustment mechanism 6 includes a punch ₆₁ disposed vertically movably in the side surface of the die 5 ₁ of the upper described above, rotatably shaft to the fixed holder 6 ₂ provided in the lower portion of the punch 6 ₁ and a rotary roller 6 ₃ etc. obtained by instrumentation.

The lower surface of the punch ₆₁ and the joining face 6 ₄ is provided to the distal end portion 2 ₂ of the upper surface of the outer lead which is formed by the lead bending mechanism 4, also, the rotating rollers 6 ₃ bonding surface of the punch 6 ₄ while being disposed in a lower position, as will be described later, is provided so as to come into contact with the lower surface of the lead tip 2 ₂ guided between the joint surface 6 ₄ and the rotary roller 6 _3.

Therefore, first, joining the joining face 6 ₄ of the punch to each external lead tip 2 ₂ of the upper surface which is supported in a free state via the body clamping mechanism 5 described above (see FIG. 2). Next, in this state, the upper and lower dies 5 _1, 5 ₂ and this clamped body 1 ₁ and the punch ₆₁ is simultaneously moved downward, external leads tip 2 ₂ The joining face 6 ₄ punch while being guided between the rotating rollers 6 _3, between the both persons, in particular, retouching effect on the tip 2 ₂ is performed (third
See figure). Therefore, by adjusting the gap between the joining face 6 ₄ and the rotary roller 6 ₃ punches mentioned above, is modification, in particular, given that the external leads tip 2 ₂ of bent shape, as shown in FIG. 1 Can be formed to have the same or substantially the same shape as the bent shape.

That is, after the lead bending retouching process, in particular, the shape bent at the tip 2 _two external leads, since those are modification after the body has returned to normal, regardless of the shape of the warp of the body, Since the external leads are formed into a predetermined bent shape, it is possible to prevent adverse effects such as lifting of each external lead. Further, at the time of lead bending retouching effect described above, the upper surface of the external leads tip 2 ₂ is only pressed by the joining face 6 ₄ of the punch, also, the lower surface of the tip portion 2 ₂ The rotating rollers 6 ₃ since it is intended to be joined, it may tip portion 2 ₂ and the punch ₆₁ and a friction cooperation between rotating rollers 6 ₃ efficiency, and, taking place smoothly, plating of the respective outer leads 2 peeling and damage such as Can be prevented.

After the above-described lead bending modification step is performed, the sealed lead frame is cut and separated by the above-described pinch portion connecting the main body and the sealed lead frame, whereby the sealed lead is removed. Each product can be separated from the frame individually.

The present invention is not limited to the above-described embodiments, and can be appropriately and arbitrarily changed and selected as needed without departing from the spirit of the present invention.

For example, in the embodiment, the case where each external lead is protruded in two directions from the main body is shown, but the present invention can be applied to the case where each external lead is protruded in four directions of the main body. You can do it.

〔The invention's effect〕

According to the present invention, when the distal end portion of each external lead is modified into a predetermined bent shape, the main body is securely locked without applying excessive clamping pressure to the main body, and the external lead It is possible to provide an electronic component lead processing apparatus capable of efficiently performing bending of a portion.

In addition, this provides an excellent practical effect that a molded article of this type having high quality and high reliability can be provided.

[Brief description of the drawings]

1 to 3 show a main part of a lead processing apparatus according to the present invention. FIG. 1 is a partially cutaway vertical sectional view showing a lead clamping mechanism and a lead bending mechanism in the apparatus.
FIG. 3 and FIG. 3 are both partially cutaway longitudinal sectional views showing the main body clamping mechanism and the lead bending adjusting mechanism. FIG. 4 is a partially cutaway perspective view showing the main body clamping means. FIGS. 5 and 6 are a partially cutaway perspective view and a partially cutaway vertical sectional view, respectively, showing a configuration example of another main body clamping means. [Explanation of Symbols] 1 Body 1 ₁ Body 2 External lead 2 ₁ Base 2 ₂ Tip 3 Lead clamp mechanism 3 ₁ Die 3 ₂ Stripper 3 ₃ Spring 3 ₄ … Accommodation part 3 ₅ …… External lead clamp means 3 ₆ …… External lead clamp means 4 …… Lead bending mechanism 4 ₁ …… Punch 4 ₂ …… Curved surface 4 ₃ …… Curved surface 5 …… Main body clamp mechanism 5 ₁ … Die 5 ₂ … Die 5 ₃ … Spring 5 ₄ …… Main body clamping means 5 ₅ …… Die 5 ₆ …… Engaging pin member 5 ₇ …… Spring 5 ₈ …… Main body clamping means 6 …… Lead bending adjustment mechanism 6 ₁ …… Punch 6 ₂ …… Fixed holder 6 ₃ …… Rotating roller 6 ₄ …… Connection surface

Continuation of front page (72) Inventor Koichi Kawamura 90-3, Shichiku-Kitadaimoncho, Kita-ku, Kyoto-shi, Kyoto (56) References JP-A-63-278262 (JP, A) JP-A-61-236146 (JP, A) JP-A-64-27250 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 23/50 B21D 5/01

Claims (1)

(57) [Claims] 1. A lead clamp mechanism for clamping a base of each external lead projecting outside a main body for sealing an electronic component, and a lead for bending each external lead clamped through the lead clamp mechanism into a predetermined shape. A bending mechanism, a main body clamping mechanism for clamping the main body after bending the lead, and a lead bending modifying mechanism for modifying the tip of each external lead supported in a free state through the main body clamping mechanism into a predetermined bending shape. An electronic component lead processing apparatus comprising: a main body clamping mechanism, wherein the main body clamping mechanism is provided so as to clamp at least three or more points on both front and back surfaces of the main body. Lead processing equipment.