JPS58199531A - Gate cutting method for molded lead frame - Google Patents

Gate cutting method for molded lead frame

Info

Publication number
JPS58199531A
JPS58199531A JP8262682A JP8262682A JPS58199531A JP S58199531 A JPS58199531 A JP S58199531A JP 8262682 A JP8262682 A JP 8262682A JP 8262682 A JP8262682 A JP 8262682A JP S58199531 A JPS58199531 A JP S58199531A
Authority
JP
Japan
Prior art keywords
gate
lead frame
runner
roller
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8262682A
Other languages
Japanese (ja)
Inventor
Hiroshi Kawada
博史 川田
Hideo Sakamoto
英男 坂本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8262682A priority Critical patent/JPS58199531A/en
Publication of JPS58199531A publication Critical patent/JPS58199531A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • B29C45/382—Cutting-off equipment for sprues or ingates disposed outside the mould
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To cut a gate without damaging a lead frame in high working efficiency by applying bending force to the end of the gate by pressing the upper surface of a roller package. CONSTITUTION:A lead frame 1, to which a runner 4 and a gate 5 are adhered, is supported in such a manner that the gate 5 is disposed on the upper flat surface of a projection 2 and the rubber 4 is disposed on the bottom of the recess groove 19, and is placed on a lower die 18 substantially horizontally. A runner retainer 17 which is projected from the lower surface of a substrate 7 is pressed on the upper surface of the runner 4 to hold the runner 4 therebetween. Then, a roller bar 15 drops, and a roller 16 pressed the upper surface of a package 2. At this time the lead frame 1 is inclined with the end of the gate 5 as a fulcrum, and bending force is applied to the end. In this manner, the runner 4 and the gate 5 are cut at the coupling part of the package 2. The lead frame 1 which is isolated from the gate 5 is dropped into the groove 22 and arranged.

Description

【発明の詳細な説明】 （ａ）　　発明の技術分野 本発明は多数のＩＣチップが並列搭載されたリードフレ
ームのそれぞれのＩＣチップをパツケーリードフレーム
成型品のゲート切断方法に係る。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a gate cutting method for a lead frame molded product, in which each IC chip of a lead frame on which a large number of IC chips are mounted in parallel is cut.

（ｂ）　　技術の背景 長尺メタルリボンから打抜かれたリードフレームにＩＣ
チップを多数並列搭載せしめ、それぞれのＩＣチップを
例えばエポキシ樹脂、シリコン樹脂などでトランスファ
モールドしてパッケージ封止する方法は、作業効率が高
く、低価格刺止であるので広く行われている。(b) Technical background An IC is mounted on a lead frame punched from a long metal ribbon.
A method in which a large number of chips are mounted in parallel and each IC chip is sealed in a package by transfer molding with, for example, epoxy resin or silicone resin is widely used because it is highly efficient and inexpensive.

このようなリードフレームにパッケージが成型された一
例を第１図に示す。第１図の（イ）は全体の平面図、（
ロ）は（イ）の一部の拡大図、（ハ）は（ロ）の部分の
斜視図である。An example of a package molded onto such a lead frame is shown in FIG. Figure 1 (a) is the overall plan view, (
B) is an enlarged view of a part of (A), and (C) is a perspective view of the part of (B).

第１図において、並列して対をなすリードフレーム１が
多数対所望にモールド型（図示せず）向配列されており
、モールドをの中心部に予熱投入されたタブノット状の
モールド樹脂は、毛−ルドブレスのプランジャーにて押
圧され、溶融状態となシ、円形のカール６部分から放射
状のランナー４′部、ランチ４′部に連結し対を外すリ
ードフ部に抑流され、リードフレーム１上に所望に配列
されるパッケージ２に対応して設けられたキャビティ内
へそれぞれゲート５を経て圧入されて成型されパッケー
ジ２を形成する。In FIG. 1, a large number of parallel lead frames 1 are arranged in a desired direction toward a mold (not shown), and tab-knot-shaped mold resin is preheated into the center of the mold. - It is pressed by the plunger of the lead breath, becomes molten, and flows from the circular curl 6 part to the radial runner 4' part and the launch 4' part, and is restrained by the lead leaf part from which the pair is removed, and the flow is suppressed on the lead frame 1. The packages 2 are press-fitted into cavities provided corresponding to the packages 2 arranged in a desired manner through the respective gates 5 and molded to form the packages 2.

このようにパッケージ２がトランスファモールドされ所
定に多数並列搭載されたリードフレーム１はゲート５の
細幅断面をなす端末部５′がパッケージ２に連結されて
いるので、ゲート５．ランナ４，４’、カール６によっ
て、すべてのリードフレーム１が一体化連結した状態で
モールド型から取り出される。In the lead frame 1 on which the packages 2 are transfer-molded and mounted in parallel in a predetermined number in this way, the end portion 5' of the gate 5 having a narrow cross section is connected to the package 2, so that the gate 5. All the lead frames 1 are removed from the mold in an integrally connected state by the runners 4, 4' and the curls 6.

（ｅ）　　従来技術と問題点 リードフレーム１よりゲート５，２ンナ４，４′などを
取り外し、リードフレーム１を整理するには、従来は手
にてリードフレーム１とランナ４を持ち、折シ曲げてゲ
ート５の端末部５′を切断している。(e) Prior art and problems In order to remove the gates 5, 2 runners 4, 4', etc. from the lead frame 1 and organize the lead frame 1, conventionally, the lead frame 1 and the runners 4 were held in hand, and the folding paper was used. The terminal portion 5' of the gate 5 is cut by bending.

しかし、このよう々切断方法は非能率的であるばかシで
なく、リードフレーム１を損傷せしめる恐れがある。However, such a cutting method is not only inefficient, but also may damage the lead frame 1.

（ｄ）　　発明の目的 本発明の目的は上記従来の問題点に鑑み、作業能率が良
く、かつリードフレームを損傷することノナイリードフ
レーム成型品のゲート切断方法を提供することにある。(d) Purpose of the Invention In view of the above-mentioned conventional problems, it is an object of the present invention to provide a gate cutting method for a non-metal lead frame molded product, which has good work efficiency and prevents damage to the lead frame.

（ｅ）　　発明の構成 この目的を達成するために本発明は、下ダイにてゲート
部分を支持し、下グイおよびランナ押えにてランナを挾
持してリードフレームをほぼ水平に支持せしめた後に、
先端にローラが装着されたバーを降下せしめ、該ローラ
をノくツケージの上面に押圧して該ゲートの端末部に曲
げ力を附加して該リードフレームと該ゲート、該ランナ
とを分離切断する方法であって、モールドプレスのアン
ロード装置と連結することにより特に効果が犬なるもの
である。(e) Structure of the Invention In order to achieve this object, the present invention supports the gate part with the lower die, supports the runner with the lower guide and the runner holder, and supports the lead frame almost horizontally.
A bar with a roller attached to its tip is lowered, and the roller is pressed against the top surface of the gate cage to apply bending force to the end of the gate to separate and cut the lead frame, gate, and runner. The method is particularly effective when coupled to the unloading device of the mold press.

（ｆ）　　発明の実施例 ゛以下、図示実施例を参照して本発明について詳細に説
明する。なお、全図を通じて同一符号は同一対象物を示
す。(f) Embodiments of the Invention The present invention will be described in detail below with reference to illustrated embodiments. Note that the same reference numerals indicate the same objects throughout the figures.

３− 第２図は本発明の一実施例の構成を示すもので（イ）は
平面図、（ロ）は（イ）の点ＩＭ−Ｍ部分の側面図。3- FIG. 2 shows the configuration of an embodiment of the present invention, in which (a) is a plan view and (b) is a side view of the point IM-M portion of (a).

（ハ）は要所を示す斜視図である。(C) is a perspective view showing key points.

同図において、７はアンローダ装置の一部に組込まれた
基板で、下方に配列して突出したバー１５の下方に例え
ば図示してない磁石によシリードフレーム１を吸着し、
図示してないモールド型の下部より下ダイ１８の上部に
ランナ４，４′　が耐着したリードフレーム１を適宜の
手段（例えばレール上の移動）にて運搬、載置するもの
でおる。In the same figure, reference numeral 7 denotes a board incorporated in a part of the unloader device, and the serial lead frame 1 is attracted to the lower side of the bars 15 which are arranged and protrude downward, using a magnet (not shown), for example.
The lead frame 1 with the runners 4, 4' attached thereto is transported and placed on the upper part of the lower die 18 from the lower part of a mold (not shown) by appropriate means (for example, moving on rails).

基板７の中心線上に装着され鉛直軸心方向に作動する油
圧シリンダ８の上端には、油圧シリンダ８の上下運動に
より、油圧シリンダ８０両側で基板７の中心線に並行し
て基板７の上部に枢支設置された２本の駆動軸１０をそ
れぞれ回動せしめる２個のレバー９が連結されている。At the upper end of a hydraulic cylinder 8 that is mounted on the center line of the board 7 and operates in the vertical axis direction, a vertical movement of the hydraulic cylinder 8 causes a hydraulic cylinder 8 to move in parallel to the center line of the board 7 on both sides of the board 7. Two levers 9 are connected to each other to rotate two pivotally mounted drive shafts 10, respectively.

（図では油圧シリンダ８が２個であるのでレバー９は４
個である） 基板７の上方でリードフレーム１に対応する位４− ヤ のメ状の枝部の下面には、基板７を遊貫して下方に突出
した下先端にローラー６が装着されたローラバー１５が
所望数配設され、それぞれのローラー６が所望のパッケ
ージ２の上面に圧接可能の如くに構成されている。(In the figure, there are two hydraulic cylinders 8, so there are four levers 9.
A roller 6 is attached to the lower end of the meso-shaped branch at the position above the substrate 7 corresponding to the lead frame 1, which extends freely through the substrate 7 and protrudes downward. A desired number of roller bars 15 are disposed, and each roller 6 is constructed so as to be able to press against the upper surface of a desired package 2.

２列に配設されたローラ保持板１４の、それぞれの列の
上方を水平に貫通する如くに抑圧軸１２が架設され、押
圧軸１２のローラ保持板１４に対応する位置には押圧ロ
ーラー３がそれぞれ嵌着されている。それぞれの駆動軸
１０のそれぞれの端部に一端が固着され、他端がそれぞ
れの押圧軸１２のそれぞれの端部に固着されたレバー１
１（計４個）が、駆動軸１０の回動運動を押圧軸１２の
上下運動に変換せしめている。したがって油圧シリンダ
８が上昇すると、この上昇力はレバー９．駆動軸１０．
レバー１１．押圧軸１２を経て抑圧口のローラ保持板１
４の上面を押圧し、ローラ保持＠　１４　、即ちローラ
バー１５を降下せしめる。また、ローラ保持板１４と基
板７との間には圧縮コイルばねが装着されているので、
油圧シリンダ８が降下するとローラバー１５は上昇する
。A suppression shaft 12 is installed so as to horizontally pass through the upper part of each row of roller holding plates 14 arranged in two rows, and a pressure roller 3 is provided at a position of the pressing shaft 12 corresponding to the roller holding plate 14. Each is fitted. A lever 1 having one end fixed to each end of each drive shaft 10 and the other end fixed to each end of each pressing shaft 12.
1 (four in total) convert the rotational movement of the drive shaft 10 into the vertical movement of the pressing shaft 12. Therefore, when the hydraulic cylinder 8 rises, this rising force is applied to the lever 9. Drive shaft 10.
Lever 11. The roller holding plate 1 of the suppression opening is passed through the pressing shaft 12.
4 to lower the roller holding @ 14 , that is, the roller bar 15 . Furthermore, since a compression coil spring is installed between the roller holding plate 14 and the substrate 7,
When the hydraulic cylinder 8 descends, the roller bar 15 rises.

基板７によって搬出されたカール４，４′付のリードフ
レーム１のそれぞれの下部には下ダイ１８が配設されて
いる。それぞニュの下ダイ１８の中心線上の上部には幅
が相対向するパッケージ２の距離にほぼ等しい平面視帯
状の凸部２０が設けられ、凸部２０の中心部にはランナ
４が嵌入される凹溝１９が形成されている。凸部２０の
上面は、ゲート５の下面の形状に合わせて所望に加工さ
れ、ゲート５を支え、かつ凹溝１９の底部はランナ４の
下面を支える寸法に加工されている。A lower die 18 is disposed at the bottom of each of the lead frames 1 with curls 4, 4' carried out by the substrate 7. A band-shaped convex portion 20 whose width is approximately equal to the distance between the opposing packages 2 in plan view is provided at the upper part of the center line of each lower die 18, and the runner 4 is fitted into the center of the convex portion 20. A concave groove 19 is formed. The upper surface of the convex portion 20 is machined as desired to match the shape of the lower surface of the gate 5 to support the gate 5, and the bottom of the groove 19 is dimensioned to support the lower surface of the runner 4.

凸部２０の両側は所望に斜傾した斜面２１となシ、さら
に斜面２１の両性側には幅がリードフレーム１の幅よシ
やや大きめの溝２２が設けられている。Both sides of the convex portion 20 are provided with slopes 21 that are inclined as desired, and grooves 22 whose width is slightly larger than the width of the lead frame 1 are provided on both sides of the slopes 21.

以上の如く構成された下グイ１８上に、基板７によって
運搬されて来たランナ４，４′付のそれぞれのリードフ
レーム１は、ゲート５が凸部２０の上平面でランナ４が
凹溝１９の底部でそれぞれ支持されて、はぼ水平に下ダ
イ１８上に載置される。図示してない機構によシ基板７
が下降し、基板７の下面に突出したランナ押え１７がラ
ンナ４の所望の上面を押圧してランナ４を挾持した後に
、基板７の下降は停止する。つぎに油圧シリンダ８が作
動し、ローラバー１５が下降し、ローラー６がバック”
−ジ２の上面を押圧する。パッケージ２の下方の下ダイ
１８は逃げているのでパッケージ２即ちリードフレーム
１は、ゲート５の端末部５′を支点として斜傾され、端
末部５′に曲げ力が附加され、端末部５′部分の断面積
は極めて小さいので、ゲート５はパッケージ２との結合
部である端末部５′にて切断される。ゲート５と分離さ
れたリードフレーム１は、それぞれ溝２２内に落下１１
１’ｌｌｌ”：ｌ： し整理される。Each lead frame 1 with the runners 4 and 4' carried by the substrate 7 is placed on the lower guide 18 configured as described above, with the gate 5 on the upper surface of the convex portion 20 and the runner 4 on the concave groove 19. are placed on the lower die 18 in a nearly horizontal manner. Board 7 due to a mechanism not shown
is lowered, and after the runner presser 17 protruding from the lower surface of the substrate 7 presses the desired upper surface of the runner 4 and clamps the runner 4, the lowering of the substrate 7 is stopped. Next, the hydraulic cylinder 8 is activated, the roller bar 15 is lowered, and the roller 6 is moved back.
- Press the top surface of the cage 2. Since the lower die 18 below the package 2 has escaped, the package 2, that is, the lead frame 1, is tilted with the terminal portion 5' of the gate 5 as a fulcrum, and a bending force is applied to the terminal portion 5'. Since the cross-sectional area of the portion is extremely small, the gate 5 is cut at the terminal portion 5', which is the joint portion with the package 2. The lead frame 1 separated from the gate 5 falls into the groove 22 11.
1'llll":l: Organized.

このように、すべてのリードフレーム１を油圧シリンダ
８の作動によシー斉に、かつ容易にゲー７− ト５（ランナ４，４’）と分離切断することが出来る。In this manner, all the lead frames 1 can be simultaneously and easily separated from the gates 5 (runners 4, 4') by the operation of the hydraulic cylinders 8.

また、パッケージ２をローラ１６が押圧する時にパッケ
ージ２の上面とロー２１６とは摺動運動をするが、ロー
ラ１６が転勤するのでパッケージ２の上面を損傷するこ
とがない。Further, when the roller 16 presses the package 2, the upper surface of the package 2 and the row 216 slide, but since the roller 16 moves, the upper surface of the package 2 is not damaged.

ローラ１６はすべてのパッケージ２に対応して装着する
必要はなく、例えば２つとび、あるいは４つとびなど適
宜の箇所に装着すれば良く、またランナ押え１７もせい
ぜいリードフレーム１個につき２〜３個装着すれば良い
ものである。It is not necessary to install rollers 16 corresponding to all packages 2, and it is sufficient to install rollers 16 at appropriate locations such as every two or four packages, and the number of runner presses 17 is at most 2 to 3 per lead frame. It is sufficient to install them individually.

なお、本笑施例はモールドプレスのアンローダ装置に連
結せしめたものであるが、アンローダ装置で連結せずと
も本発明のゲート切断方法が適用出来ることは言うまで
もない。In this embodiment, the gate is connected to an unloader of a mold press, but it goes without saying that the gate cutting method of the present invention can be applied without connecting with an unloader.

（ｇ）　　発明の詳細 な説明したように本発明は、多数個数シのリードフレー
ムのパッケージのモールド成型の俵工程に適用するゲー
ト切断方法であって作業能率が良く、リードフレームな
どを損傷するおそれがな８− ローダ装置などと連結して実用上ですぐれた効果がある
。(g) Detailed Description of the Invention As described above, the present invention is a gate cutting method that is applied to the bale process of molding a package of a large number of lead frames, which has good work efficiency and eliminates the risk of damaging lead frames, etc. Gana 8- It has excellent practical effects when connected to a loader device, etc.

【図面の簡単な説明】[Brief explanation of drawings]

第１図はパッケージがモールド成型されたリードフレー
ムの（イ）は平面図、（ロ）は（イ）の一部の拡大図、
（ハ）は（ロ）の部分斜視図、第２図は本発明の一実施
例の構成を示す（イ）は平面図、（ロ）は（イ）の点線
Ｍ−Ｍ部分の側面図、（ハ）は要所を示す斜視図である
。 図中、１はリードフレーム、２はパッケージ、３はリー
ド、４．４′はランナ、５はゲート、５′は端末部、７
は基板、８は油圧シリンダ、９．１１はレバー、１２は
押圧軸、１３は押圧ローラ、１４はローラ保持板、１５
はローラバー、１６はローラ、１７はランナ押え、１８
は下ダイ、１９は凹溝、２０は凸部を示す。 竿１図 （イノ （ａ〕 Ｆ／図 （ハノ １７図 （イノ （ハラFigure 1 shows (a) a plan view of the lead frame on which the package is molded, (b) an enlarged view of a part of (a),
(C) is a partial perspective view of (B), FIG. 2 shows the configuration of an embodiment of the present invention, (A) is a plan view, (B) is a side view of the dotted line M-M portion of (A), (C) is a perspective view showing key points. In the figure, 1 is a lead frame, 2 is a package, 3 is a lead, 4.4' is a runner, 5 is a gate, 5' is a terminal part, and 7
is a substrate, 8 is a hydraulic cylinder, 9.11 is a lever, 12 is a pressing shaft, 13 is a pressing roller, 14 is a roller holding plate, 15
is a roller bar, 16 is a roller, 17 is a runner presser, 18
19 indicates a lower die, 19 indicates a groove, and 20 indicates a convex portion. Rod figure 1 (Ino (a)) F/ figure (Hano figure 17 (Ino (hara)

Claims (1)

【特許請求の範囲】[Claims] 多数のパッケージがモールド成型され並列搭載され、ゲ
ートの端末部が該パッケージと連結して該ゲートおよび
ランナが耐着したリードフレームにおいて、下ダイにて
該ゲートを支持し、下グイおよびランチ押えにて該ラン
ナを挾持して骸リードフレームをほぼ水平に支持せしめ
た後に、先端にローラが装着されたバーを降下せしめ、
該ローラを該パッケージの上面に押圧して該ゲートの端
末部に曲げ力を附加することにより該リードフレームよ
り該ゲートおよびランナを切落すことを特徴とするリー
ドフレーム成型品のゲート切断方法。A large number of packages are molded and mounted in parallel, and the end of the gate is connected to the package, and the gate and runner are attached to the lead frame.The lower die supports the gate, and the lower die and the launch holder are attached to the lead frame. After holding the runner and supporting the skeleton lead frame almost horizontally, lowering the bar with a roller attached to the tip,
A method for cutting a gate of a molded lead frame product, comprising cutting off the gate and runner from the lead frame by pressing the roller against the upper surface of the package and applying bending force to the end portion of the gate.
JP8262682A 1982-05-17 1982-05-17 Gate cutting method for molded lead frame Pending JPS58199531A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8262682A JPS58199531A (en) 1982-05-17 1982-05-17 Gate cutting method for molded lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8262682A JPS58199531A (en) 1982-05-17 1982-05-17 Gate cutting method for molded lead frame

Publications (1)

Publication Number Publication Date
JPS58199531A true JPS58199531A (en) 1983-11-19

Family

ID=13779652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8262682A Pending JPS58199531A (en) 1982-05-17 1982-05-17 Gate cutting method for molded lead frame

Country Status (1)

Country Link
JP (1) JPS58199531A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59120415A (en) * 1982-12-27 1984-07-12 Nec Corp Removing device of runner and gate
NL1003288C2 (en) * 1996-06-06 1997-12-10 Fico Bv Device for separating at least one injection part from at least one encapsulated electronic component.
CN103895166A (en) * 2014-04-11 2014-07-02 昆山市兴凯胜精密模具有限公司 Automatic dismantling and separating fixture for products

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59120415A (en) * 1982-12-27 1984-07-12 Nec Corp Removing device of runner and gate
JPH0354046B2 (en) * 1982-12-27 1991-08-19
NL1003288C2 (en) * 1996-06-06 1997-12-10 Fico Bv Device for separating at least one injection part from at least one encapsulated electronic component.
WO1997046364A1 (en) * 1996-06-06 1997-12-11 Fico B.V Device for separating of at least one gate of at least one moulded electronical component
CN103895166A (en) * 2014-04-11 2014-07-02 昆山市兴凯胜精密模具有限公司 Automatic dismantling and separating fixture for products

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