JPS5844791A - Device for positioning circuit board - Google Patents
Device for positioning circuit boardInfo
- Publication number
- JPS5844791A JPS5844791A JP56142834A JP14283481A JPS5844791A JP S5844791 A JPS5844791 A JP S5844791A JP 56142834 A JP56142834 A JP 56142834A JP 14283481 A JP14283481 A JP 14283481A JP S5844791 A JPS5844791 A JP S5844791A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- positioning
- locking bodies
- warpage
- moving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は回路基板の位置決めと回路基板の反りの矯正と
を、回路基板の面に沿った方向及び板厚方向に往復動自
在な係止体によって行なえるようにした回路基板の位置
決め装置に関する。混成集積回路のｌ！ｌＩ造シスデシ
ステムては％回路基板に部品が高＠度に配置されるため
、各１揚において回路基板の正確な位置決めが要求され
る。また、回路基板は通常フェノール樹脂やエポキシ樹
脂によって成形されるため完全な平板に成形゛すること
が困難であり、多くの回路基板には多少の反りがある。DETAILED DESCRIPTION OF THE INVENTION The present invention is capable of positioning a circuit board and correcting warpage of the circuit board using a locking body that can reciprocate in the direction along the surface of the circuit board and in the thickness direction. The present invention relates to a circuit board positioning device. l of hybrid integrated circuits! In an industrial system, components are arranged at a high density on a circuit board, so accurate positioning of the circuit board is required for each lift. Further, since circuit boards are usually molded from phenol resin or epoxy resin, it is difficult to mold them into a perfect flat plate, and many circuit boards have some degree of warpage.
このため谷工機においては上記位置決めと共に回路基板
の反りの矯正を行なう必要がある。ところが、従来の位
置決め装置においては上記位置決めと反りの矯正とを別
々の機構によって行なっていたため、装置の構造が複雑
となっていた。また従来一部においては、回路基板を真
空ポンプで吸着してその位置決めと反りの矯正とを同時
に行なえるようにした位置決め装置も使用されてはいた
が、この装置には次のような欠陥がある。即ち、回路基
板に孔が設けられている場合にはこの孔から空気が人っ
て真空ポンプの吸着力が低下し、正確な位置決めかで紮
なくなる。そしてこの吸着力の低下を防止するためには
、回路基板が載置されるテーブルの吸引孔のうち、−路
基板の孔と連通ずる吸引孔を１つずつ閉基板によって閉
塞しなければならず、その作業が非常に煩鑵であった・
また、これと同様のことは大きさの異なる回路基板を位
置決めする場合にも生じ、回路基板のＪＡ遺−樵を変更
する度に上述のような煩憾な作業を強いられていた。ま
た、回路基板の反りが大きい場合には回路基板の吸着面
に一関が生じ、この−関から空気が人って同じように真
空ポンプの吸着力が低下する。従って回路基板の反りが
大きい場合のその矯正に対して全く役に立たず、また位
置決めも行なえなくなるという欠陥を有していた。この
ため、従来の位置決め装置を例えば回路基板に対する接
着用樹脂の印刷工程に用いた場合、基板が印刷中に動い
てしまって接着用樹脂が正確な位置に印刷されないこと
が多く、不要品発生の原因となっていた。Therefore, in Tani Koki, it is necessary to correct the warpage of the circuit board in addition to the above-mentioned positioning. However, in conventional positioning devices, the positioning and warp correction are performed by separate mechanisms, resulting in a complicated structure. In addition, some positioning devices have been used in the past that can simultaneously position the circuit board and correct warpage by suctioning the circuit board with a vacuum pump, but this device has the following flaws: be. That is, if a hole is provided in the circuit board, air may escape through the hole, reducing the suction force of the vacuum pump and making accurate positioning difficult. In order to prevent this drop in adsorption force, of the suction holes in the table on which the circuit board is placed, the suction holes that communicate with the holes in the circuit board must be closed one by one with a closed board. , the work was extremely tedious.
Further, a similar problem occurs when positioning circuit boards of different sizes, and the above-mentioned troublesome work is forced every time the JA size of the circuit board is changed. In addition, if the circuit board is highly warped, a gap will be formed on the suction surface of the circuit board, and if air flows through this gap, the suction force of the vacuum pump will be reduced in the same way. Therefore, it has the disadvantage that it is completely useless for correcting a large degree of warpage of the circuit board, and also makes it impossible to perform positioning. For this reason, when a conventional positioning device is used, for example, in the process of printing adhesive resin on a circuit board, the board often moves during printing and the adhesive resin is not printed in the correct position, resulting in the generation of unnecessary items. It was the cause.
本発明は上述の如き欠陥を是正すべ〈発明するに至った
ものであって、その目的は多数の孔があいた回路基板や
反りの大きな回路基板、良には大きざの異なる回路基板
であっても簡単かつ正確に位置決めでき、また反りの矯
正も確実に行ない得る回路基板の位置決め装置を提供す
ることにある。The present invention has been developed to correct the above-mentioned defects, and its purpose is to manufacture circuit boards with many holes, circuit boards with large warpage, and even circuit boards with different sizes. To provide a positioning device for a circuit board, which can easily and accurately position a circuit board, and can also reliably correct warpage.
また、本発明の他の目的は回路基板の位置決めと反りの
矯正とを共通の憬構によって達成できるよう番として、
回路基板の位置決め装置を構造的にシンプルなものとし
、そのコストを低下させることにある。Another object of the present invention is to provide a system in which the positioning of the circuit board and the correction of warpage can be achieved by a common clamping mechanism.
To make a circuit board positioning device structurally simple and to reduce its cost.
以下本発明を回路基板に対する接着用樹脂の印刷装置に
適用した一実施例を図面に基づいて詳述する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a printing apparatus for adhesive resin on a circuit board will be described below in detail with reference to the drawings.
第１図は位置決め装置の縦断側面図を示したものであっ
て、基台（１）上には数本の支持柱（２）が立設されて
いる。そしてこれら支持柱（２）によって印刷台１３）
が水平に支持されている。印刷台（３）の上面（４）は
略完全な平面とされ、この上面（４）に回路基板（５）
が載置される。そして回路基板（５）の上面に印刷スク
リーン（至）を重ね、スキージ＠とスクレーパ（至）の
往復動によって接着用樹脂（至）を回路基板（５）の上
面に印刷するよう構成されている。印刷台（３）と基台
（１）との間には自直な案内棒（６）が前後左右に畝本
設けられ、これら案内棒（６）の上下両Ｉｓ部は印刷台
（３）と基台（１）とに夫々固定されている。また、印
刷台（３）と基台（１）との間には水平な昇降台（７）
が設けられ、この昇降台（７）の前後左右には上記案内
棒（６）が挿通される貫通孔（８）が設けられている。FIG. 1 shows a longitudinal side view of the positioning device, in which several support columns (2) are erected on a base (1). And by means of these supporting columns (2) the printing table 13)
is supported horizontally. The top surface (4) of the printing table (3) is almost completely flat, and a circuit board (5) is placed on this top surface (4).
is placed. Then, the printing screen (1) is stacked on the top surface of the circuit board (5), and the adhesive resin (1) is printed on the top surface of the circuit board (5) by reciprocating motion of the squeegee and the scraper (5). . A vertical guide rod (6) is provided with ridges on the front, back, left and right between the printing table (3) and the base (1), and both the upper and lower Is portions of these guide rods (6) are connected to the printing table (3). and a base (1), respectively. In addition, there is a horizontal lifting platform (7) between the printing table (3) and the base (1).
A through hole (8) into which the guide rod (6) is inserted is provided at the front, rear, left and right sides of the elevator platform (7).
昇降台（７）の略中矢部の下面には、基台（１）上に取
り付けられた当直駆動用エアシリンダ（９）のピストン
ロッド（９麿）が連結され、昇降台（７）はこのエアシ
リンダ１９１の駆動により案内棒（６）に案内されつつ
昇降移動するよう・ に構成されている。The piston rod (9) of the on-duty driving air cylinder (9) mounted on the base (1) is connected to the lower surface of the approximately middle arrow part of the lifting table (7), and the lifting table (7) It is configured to move up and down while being guided by a guide rod (6) by driving the air cylinder 191.
昇降台（７）上には、第１図及び第２図に示すように６
本の固定ビンＱ（１−ａａと２本の移動ピン（１３Ｑ４
）が夫々垂直に設けられている。６本の固定ビン０１〜
ａりはその下熾部が昇降台（７）に植設され、上端部は
印刷台（３）に設けられたビン孔四〜ａηに夫々挿通さ
れて印刷台（３）の上面（４）上に突出している。そし
て第２図に示すように、印刷台（７）番こ載置された回
路基板（５）の右側部（５ａ）に固定ビン四とαυの上
端部周囲が当接され、下ＩＩ ＩＢ （５ｂ）に固定ビ
ンαりの上４部周面が当接されるように構成されている
。また移動ピンＱｌ （１４１はその下４ｇが昇降台（
７）に設けられた案内＃Ｉ（ハ）に摺動自在に重合され
、上端部は印刷台（３）に案内１１１！（至）と平行に
設けられた長孔＠＠に夫々挿通されて印刷台（３）の上
面（４）上に突出している。On the lifting platform (7), there are 6
Book fixed bin Q (1-aa and two moving pins (13Q4)
) are provided vertically. 6 fixed bins 01~
The lower part of the a-ri is planted in the lifting table (7), and the upper end is inserted into the bottle holes 4 to aη provided in the printing table (3), respectively, so that the upper surface (4) of the printing table (3) protrudes above. Then, as shown in FIG. 2, the upper end of the fixing bin 4 and αυ are brought into contact with the right side (5a) of the circuit board (5) placed on the printing table (7), and the lower II IB ( 5b) is configured so that the upper four circumferential surfaces of the fixed bottle α are brought into contact with it. In addition, the moving pin Ql (141 has a lifting platform (4g) below it (
7) is slidably superimposed on the guide #I (c) provided in the printing table (3), and the upper end is guided to the printing table (3) 111! (to) are inserted into elongated holes provided in parallel with each other and protrude above the upper surface (4) of the printing table (3).
長孔（至）額は帛２図に示すように夫々回路基板（５）
の左１１１部（５Ｃ）及び上側部（５ｄ）に対して直角
とされ、かつ夫々の一４１１部（２６ａＪ（２７ｂ）は
回路基板（５）の下側。As shown in Figure 2, the elongated holes are connected to the circuit board (5).
The left 111 part (5C) and the upper part (5d) are at right angles to each other, and each 1411 part (26aJ (27b) is the lower side of the circuit board (5).
に鴫出している。そして移動ピン０１ Ｑ４１の中間部
には、昇降台（７）上に取り付けられた２つの水平駆動
。It's pouring out. In the middle of the moving pin 01 Q41, there are two horizontal drives attached to the lifting platform (7).
用エアシリンダ（至）（至）のピストンロッド（２８１
）Ｃ２９１）が夫々連結され、移動ピンｕｓ （１４）
が第２図で左右方向及び上下方向に往復移動するよう構
成されている。即ち、水平駆動用エアシリンダＣ２１＠
を夫々往動させることにより、回路基板（５）の左右両
側部（５ａＸ５ｃ）及びＥ下両側部（５ｂ）（５ｄ）を
固定ピン四〜α２と移動ピンＯ１ａ４）の夫々の上端部
によって完全に挾むことができるように構成されている
。なお、固定ビンαりと移動ピン（１３ａ４）の上端部
には回転自在な滑りローラ（至）が夫々挿入されている
。Piston rod (281) of the air cylinder (to) (to) for
) C291) are connected respectively, and the moving pin us (14)
is configured to reciprocate in the left-right direction and up-down direction in FIG. That is, horizontal drive air cylinder C21@
By moving the left and right sides (5aX5c) of the circuit board (5) and the lower both sides (5b) and (5d) of E completely by the upper ends of the fixed pins 4 to α2 and the movable pins O1a4), respectively. It is configured so that it can be pinched. Note that rotatable sliding rollers are inserted into the upper ends of the fixed bin α and the movable pin (13a4), respectively.
次に上記・構成に係る位置決め装置の作動状況を第６図
及び嬉４図を参照してｖ４明する。Next, the operating status of the positioning device according to the above-mentioned configuration will be explained with reference to FIG. 6 and FIG. 4.
先ず、回路基板（５）を固定ビン４１１− ｕ２と移動
ビン（１１１に囲まれた印刷台（３）の上（ｊｉ（４）
に装置する。次に水平駆動用エアシリンダ四を往−させ
て回路基１１（５１ｏ上１１＝ｉｌ（５ｄ）と下１１
％ （５ｂ）を移動ビニ／Ｑ４）と固定ビン働とによっ
て挾む。その後に別の水平駆動用エアシリンダ（至）を
往動させて第３１１に示すように回路基板（５）の左側
部（５ｃ）と右側部（５ｍ）を移動ビンａ１と固定ビン
αＩＱυとによって挾む。これによって回路基板（５）
の上下両側ＩＩ （５ｂＸ５ｄ）及び左右両肯部（５ｍ
）（５ｃ）に固定ビンａの一輪と移動ビンＣＩＩα◆が
夫夫圧着され、回路基板（５）の正確な位置決めがなさ
れる。なおこの位置決めがなされたときに、上記ピンＱ
（１−ａＪの上端部は基板（５）の上面よりも突出した
状態にあり、下降のためのストロークを有している。そ
してこのとき固定ビンａａと移動ビン０３０４の上端部
には滑りローラ（至）が取り付けられているので、回路
基１［（５）に無理な力が作用せず、スムーズにして正
確な位置決めを成し得る。また、回路基＊ （５）の大
きさが大小様々な場合であっても、移動ビンｕｓ ｕ４
の水平４！＠動ストロークを大きくしておくだけでその
位１決めを簡単に成し得％従来のよ □うなロフトの変
更に伴う煩雑な作業が全く必要ないＯ
次に垂直駆動用エアシリンダ（９）を社−させて第４図
に示すように昇降台（７）を降下させ′る。すると固定
ピン四〜（ｌりと移動ビン仏３＆４は［ｇｌ回路基板５
）を圧着したまま降下するから、回路基板（５）の上下
両側ｉｊ （５ｂ）Ｃ５ｄ） 及び左右両側５（５ａＸ
５ｃ）は固定ビアＱ（１〜α湯及び移動ビンｔ１３ （
１４）との摩擦により印刷台（３）に押し付けられる。First, place the circuit board (5) on the printing table (3) surrounded by the fixed bin 411-u2 and the movable bin (111) (ji(4)).
equipment. Next, the horizontal drive air cylinder 4 is moved forward and the circuit board 11 (51o upper 11 = il (5d) and lower 11
% (5b) is sandwiched by a moving bin/Q4) and a fixed bin function. After that, another horizontal drive air cylinder (to) is moved forward to move the left side (5c) and right side (5m) of the circuit board (5) by moving bin a1 and fixed bin αIQυ as shown in No. 311. Sandwich. This will allow the circuit board (5)
Both upper and lower sides II (5bX5d) and both left and right sides (5m
) (5c), one ring of the fixed bin a and the movable bin CIIα◆ are pressed together, and the circuit board (5) is accurately positioned. Note that when this positioning is done, the above pin Q
(The upper end of 1-aJ is in a state of protruding from the upper surface of the board (5) and has a downward stroke.At this time, the upper ends of fixed bin aa and movable bin 0304 are provided with sliding rollers. (to) is attached, no unreasonable force is applied to the circuit board 1 [(5), and smooth and accurate positioning can be achieved. Even in various cases, mobile bin us u4
Horizontal 4! ＠By simply increasing the motion stroke, you can easily achieve the desired result. □There is no need for the complicated work associated with changing the loft as in the conventional method. Next, install the vertical drive air cylinder (9). Then, lower the lifting platform (7) as shown in FIG. Then, fixing pins 4~(l) move bottle Buddhas 3 & 4 [gl circuit board 5
) will descend with the circuit board (5) crimped, so the upper and lower sides of the circuit board (5) ij (5b)C5d) and the left and right sides 5 (5aX
5c) is the fixed via Q (1 to α hot water and the moving bottle t13 (
14) and is pressed against the printing table (3).
このため印刷台（３）に−置した回路基１［（５）が１
１３図に示すように反っている場合であっても、第４図
で集繊で示すように平板状とされ反りは完全に矯正され
る。よって第１図に示すスキージ＠を回路基板（５）に
押し付けつつ往動させて回路基板（５）の上面に接着用
樹脂−を印刷しても回路基板（５）がずれることがない
。従って回路基［（５）の正確な位置に接着用樹脂囚を
印刷することができる。なお接着用樹脂（至）を印刷す
る場合、スキージ１２Ｊ）のａ復動の邪魔にならないよ
う固定ピン四〜ａりと移動ビンＱｌ ｔ１４）の上４ｓ
は下呻後においては蘂４図に示すように回路基板（５）
の上面と同じ＾さか。Therefore, the circuit board 1 [(5) is 1] placed on the printing table (3).
Even if it is warped as shown in FIG. 13, the warp can be completely corrected by making it into a flat plate shape as shown by the bundled fibers in FIG. 4. Therefore, even if the adhesive resin is printed on the upper surface of the circuit board (5) by moving the squeegee shown in FIG. 1 forward while pressing it against the circuit board (5), the circuit board (5) will not shift. Therefore, the adhesive resin can be printed at a precise position on the circuit board [(5). In addition, when printing the adhesive resin (to), fix the fixing pins 4 to 4 and the top 4s of the movable bottle Ql t14) so that they do not interfere with the return movement of the squeegee 12J).
After lowering the circuit board (5) as shown in Figure 4
Same as the top of ^ upside down.
あるいはそれより％１■機度下がった位置にしておくの
がよい。Alternatively, it is better to set it at a position 1% lower than that.
本発明は上述の如く、回路基板の周ｉｍｓにＩ１ｗＬＯ
係止体をｆｉ接させて回路基板の位置規制をし、上記複
数の係止体を回路基板の周側部に当接さ′せた状態で回
路基板の板厚方向に往動させることにより回路基板の反
りを矯正するように構成しているから、回路基板の位置
決めと反りの矯正とを上記複数の係止□体によって簡単
かつ正確に成し得る。As described above, the present invention provides I1wLO to the ims around the circuit board.
By bringing the locking bodies into fi contact to regulate the position of the circuit board, and by moving the plurality of locking bodies forward in the thickness direction of the circuit board while in contact with the peripheral side of the circuit board. Since the circuit board is configured to correct warpage, positioning of the circuit board and correction of warpage can be easily and accurately performed by the plurality of locking bodies.
また回路基板に多数の孔がおいていたり、回路基板の反
りが大きい場合であってもその位置決め及び反りの矯正
に何ら支障がなく、真空ポンプを用いた位置決め位置に
おいて行なわれていた吸引口の閉塞という煩雑な作業が
不要となり１位置決め作業の能率を格段に向上させるこ
とができる。In addition, even if there are many holes in the circuit board or the circuit board is significantly warped, there is no problem in positioning and correcting the warp, and the suction port, which was previously done at the position using a vacuum pump, The complicated work of blocking is no longer necessary, and the efficiency of one positioning work can be greatly improved.
更にまた、回路基板の面に沿った方向への係正入
体の移動ストロークを大きくしておくだけ雫任意の大き
さの回路基板の位置規制と反りの端正とを簡単に成し得
るから、回路のロフトの変更に伴う位置決め装置の６１
１４１作−等が一切不要となり、条横回路の生殖性の同
上に大きく貢献することができる。Furthermore, by increasing the movement stroke of the locking insert in the direction along the surface of the circuit board, it is possible to easily regulate the position of a circuit board of any size and correct warpage. 61 of positioning device due to change of circuit loft
141 production etc. is no longer necessary, and it can greatly contribute to the same reproductive performance of the horizontal circuit.
また、回路基板の位置決めと反りの矯正とを同じ係止体
によって行なうものであるから、位置決め装置を婢造的
にシンプルなものとす、ることができて廉価にして頂租
性の商い位置決め位置を提供するξとができる。In addition, since the positioning of the circuit board and the correction of warpage are performed by the same locking body, the positioning device can be made simple and inexpensive, and the positioning device can be positioned at a low cost. We can provide the position ξ.
従って本発明に係る回路基板の位置決め装置を例えば回
路基板に対する接着用樹脂の印刷工機に用いた場合にあ
っては、多数の九があいた回路基板や反りの大きな回路
基板、更には大きさの為なる回路基板であっても簡単か
つ正確に位置決めでき、また反りの矯正も確実に行ない
得るから、接着用樹脂を回路基板上の所定の位置に正確
に印刷塗布することができる。Therefore, when the circuit board positioning device according to the present invention is used, for example, in a printing machine for adhesive resin for circuit boards, it is necessary to use a circuit board with a large number of holes, a circuit board with a large warp, and even a circuit board with a large number of holes. Even if the circuit board is different, it can be easily and accurately positioned, and warpage can be reliably corrected, so that the adhesive resin can be printed and coated accurately at a predetermined position on the circuit board.
図面は本発明を回路基板に対する接着用樹脂の印刷工場
に適用した一実施例を示したものであって、第１図は回
路基板の位置決め装置の縦断面貴向図、＄２図は同上の
Ｊ１１部の平向図、第６図及び第４図は本装置の作動状
況を説明するための同装置の縦断面図である。
また図面に用いられた符号において、
（５）・・・・・・・・・・・・・・・・・・ 回路基
板ζ９）・・・・・・・・・・・・・・・・・・ −直
駆一用エアシリンダａ唾ＩＸＩＩ・・・・・・・・・・
・・ 固定ピン（係止体）ＱＭＪ・・・・・・・・・・
・・・・・ 移−ピン（係止体）（２）・・・・・・・
・・・・・・・・・・・ 水平駆動用エアシリンダであ
る。
代理人 上膳 −
Ｉ 松材 修The drawings show an embodiment in which the present invention is applied to a printing factory for adhesive resin for circuit boards, and FIG. 1 is a vertical cross-sectional view of a circuit board positioning device, and FIG. The plan view of the J11 section, FIGS. 6 and 4 are longitudinal cross-sectional views of the device for explaining the operating conditions of the device. Also, in the symbols used in the drawings, (5)・・・・・・・・・・・・・・・ Circuit board ζ9)・・・・・・・・・・・・・・・・・-Air cylinder for direct drive IXII・・・・・・・・・・
・・Fixing pin (locking body) QMJ・・・・・・・・・・・・
・・・・・・ Transfer pin (locking body) (2)・・・・・・
・・・・・・・・・・・・ It is an air cylinder for horizontal drive. Agent Jozen - I Osamu Matsuzai
Claims (1)
［動自在なｌｌ数の係止体を配設すると共に、上記係止
体のうち少なくとも１つの係止体を上記回路基板の面に
沿った方向に往復動自在になし、上記係止体のうち少な
くとも１つの係止体を上記回路基板の園に沿った方向に
往動させることにより回路基板の周ａｍに上記複数の係
止体を当接させて回路基板の位置規制をし１．上記複数
の係止体を上記回路基板の局側部に当接させた状態で回
路基板の板厚方向に往動させることにより回路基板の反
りを矯正するように構成したことを特徴とする回路基板
の位置決め装置。To Takayu Shu of the circuit board, a (31
[A number of movable locking bodies are disposed, and at least one of the locking bodies is made reciprocally movable in a direction along the surface of the circuit board, and the locking bodies are 1. By moving at least one of the locking bodies forward in a direction along the circumference of the circuit board, the plurality of locking bodies are brought into contact with the periphery of the circuit board to regulate the position of the circuit board.1. A circuit characterized in that the plurality of locking bodies are configured to correct warpage of the circuit board by moving the plurality of locking bodies forward in the thickness direction of the circuit board while in contact with the central side portion of the circuit board. Board positioning device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56142834A JPS5844791A (en) | 1981-09-10 | 1981-09-10 | Device for positioning circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56142834A JPS5844791A (en) | 1981-09-10 | 1981-09-10 | Device for positioning circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5844791A true JPS5844791A (en) | 1983-03-15 |
| JPH0370395B2 JPH0370395B2 (en) | 1991-11-07 |
Family
ID=15324691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56142834A Granted JPS5844791A (en) | 1981-09-10 | 1981-09-10 | Device for positioning circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5844791A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61210700A (en) * | 1985-03-15 | 1986-09-18 | 株式会社東芝 | Mounting of electronic component for circuit board |
| JPH02116547A (en) * | 1988-10-26 | 1990-05-01 | Matsushita Electric Works Ltd | Conveying device of warpage correcting device of printed wiring board |
| JPH02158192A (en) * | 1988-12-10 | 1990-06-18 | Fuji Mach Mfg Co Ltd | Supporting device for positioning printed board |
| JP2002319799A (en) * | 2001-04-23 | 2002-10-31 | Fuji Mach Mfg Co Ltd | Printed board holder, electronic parts mounting system, and method of manufacturing printed circuit board |
| JP2008130365A (en) * | 2006-11-21 | 2008-06-05 | Fujikura Ltd | Electric heater |
| WO2013039080A1 (en) * | 2011-09-16 | 2013-03-21 | 住友重機械工業株式会社 | Substrate manufacturing device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014411A (en) * | 1973-06-11 | 1975-02-15 | ||
| JPS5132122A (en) * | 1974-09-12 | 1976-03-18 | Fujitsu Ltd | |
| JPS5143121U (en) * | 1974-09-27 | 1976-03-30 |
-
1981
- 1981-09-10 JP JP56142834A patent/JPS5844791A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014411A (en) * | 1973-06-11 | 1975-02-15 | ||
| JPS5132122A (en) * | 1974-09-12 | 1976-03-18 | Fujitsu Ltd | |
| JPS5143121U (en) * | 1974-09-27 | 1976-03-30 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61210700A (en) * | 1985-03-15 | 1986-09-18 | 株式会社東芝 | Mounting of electronic component for circuit board |
| JPH0350440B2 (en) * | 1985-03-15 | 1991-08-01 | Tokyo Shibaura Electric Co | |
| JPH02116547A (en) * | 1988-10-26 | 1990-05-01 | Matsushita Electric Works Ltd | Conveying device of warpage correcting device of printed wiring board |
| JPH02158192A (en) * | 1988-12-10 | 1990-06-18 | Fuji Mach Mfg Co Ltd | Supporting device for positioning printed board |
| JP2002319799A (en) * | 2001-04-23 | 2002-10-31 | Fuji Mach Mfg Co Ltd | Printed board holder, electronic parts mounting system, and method of manufacturing printed circuit board |
| JP4546663B2 (en) * | 2001-04-23 | 2010-09-15 | 富士機械製造株式会社 | Printed board holding device and electrical component mounting system |
| JP2008130365A (en) * | 2006-11-21 | 2008-06-05 | Fujikura Ltd | Electric heater |
| WO2013039080A1 (en) * | 2011-09-16 | 2013-03-21 | 住友重機械工業株式会社 | Substrate manufacturing device |
| JPWO2013039080A1 (en) * | 2011-09-16 | 2015-03-26 | 住友重機械工業株式会社 | Board manufacturing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0370395B2 (en) | 1991-11-07 |
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