JP2780380B2 - Composite metal laminate sheet and method of using the same - Google Patents
Composite metal laminate sheet and method of using the sameInfo
- Publication number
- JP2780380B2 JP2780380B2 JP1250221A JP25022189A JP2780380B2 JP 2780380 B2 JP2780380 B2 JP 2780380B2 JP 1250221 A JP1250221 A JP 1250221A JP 25022189 A JP25022189 A JP 25022189A JP 2780380 B2 JP2780380 B2 JP 2780380B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- composite metal
- layer
- laminated
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、複合金属積層シ−トに関するものである。
また本発明は該複合金属積層シ−トを用いてラミネ−ト
コイルおよび回路基板を製造する該積層シ−トの使用方
法に関するものである。Description: TECHNICAL FIELD The present invention relates to a composite metal laminated sheet.
The present invention also relates to a method of using the laminated sheet for manufacturing a laminate coil and a circuit board using the composite metal laminated sheet.
（Ｉ）有機高分子フィルムに金属箔を積層して、金属
積層シ−トを得ることは広く知られている。これらは、
有機高分子フィルムに接着剤を塗布して金属箔と貼り合
わせたものである。(I) It is widely known that a metal foil is laminated on an organic polymer film to obtain a metal laminated sheet. They are,
An adhesive is applied to an organic polymer film and bonded to a metal foil.
（II）また、この金属積層シ−ト上にエッッチングな
どの方法で回路を形成したり、有機高分子フィルム上に
直接、導体の回路を印刷、メッキなどの方法で形成して
回路基板を得ることも広く知られている。(II) Also, a circuit board is obtained by forming a circuit on the metal laminated sheet by a method such as etching, or forming a circuit of a conductor directly on an organic polymer film by a method such as printing or plating. It is also widely known.
（III）さらに、金属積層シ−トを巻回、裁断してラ
ミネ−トコイルを得ることも、特開昭63−188906号公報
などで知られている。(III) Further, winding and cutting a metal laminated sheet to obtain a laminate coil is also known from Japanese Patent Application Laid-Open No. 63-188906.
［発明が解決しようとする課題］ （Ｉ）の方法は、極薄の有機高分子フィルムに適用し
ようとすると、接着剤塗布時の塗り斑やフィルムのしわ
などの問題があった。また、金属箔と貼り合わせる時に
も、フィルムが切れたりしわになったりして、６μｍ程
度以下のフィルムに適用することは事実上困難であっ
た。[Problems to be Solved by the Invention] When the method (I) is applied to an ultra-thin organic polymer film, there are problems such as spots on application of an adhesive and wrinkling of the film. Further, when the film is bonded to a metal foil, the film is cut or wrinkled, and it is practically difficult to apply the film to a film having a thickness of about 6 μm or less.
（II）の回路基板においても、スティフネスを下げ曲
げ特性を改良するために、基体層として極薄の有機高分
子フィルムを用いることが要求されるが、上記の理由か
ら困難であった。In the circuit board of (II), too, it is required to use an ultra-thin organic polymer film as the base layer in order to reduce the stiffness and improve the bending characteristics, but it has been difficult for the above reasons.
（III）のラミネートコイルにおいても、該コイルは
もともとコイル部品の小型化を目的に作られたものであ
り、さらなる外形寸法の小型化を図る上で、絶縁層とし
ての基本層に極薄の有機高分子フィルムを用いることが
要求されるが、これも上記の理由から困難であった。In the laminated coil of (III), the coil was originally made for the purpose of reducing the size of the coil component. In order to further reduce the external dimensions, an extremely thin organic layer was used as the insulating layer. It is required to use a polymer film, but this is also difficult for the above reason.
［発明の目的］ 本発明の目的は、上記のような欠点を解消し、６μｍ
程度以下の極薄の有機高分子フィルムを基体層として用
いているにもかかわらずその後の加工が極めて容易な複
合金属積層シ−トを提供することにある。[Object of the Invention] An object of the present invention is to solve the above-mentioned disadvantages and to provide a 6 μm
An object of the present invention is to provide a composite metal laminate sheet which is extremely easy to process even though an extremely thin organic polymer film having a thickness of about or less is used as a base layer.
また本発明の他の目的は、上記複合金属積層シ−トを
用いて、極薄の有機高分子フィルムを基体層とした回路
基板およびラミネートコイルを効率的に製造する該積層
シ−トの使用方法を提供することにある。Another object of the present invention is to use the composite metal laminate sheet to efficiently manufacture a circuit board and a laminate coil using an ultra-thin organic polymer film as a base layer. It is to provide a method.
本発明は、上記の目的を達成するために、（１）有機
高分子フィルムからなる支持体層の少なくとも片面に、
厚さが0.2μｍ〜６μｍでかつ該支持体層よりも薄い有
機高分子フィルムからなる基体層が該支持体層と剥離可
能な密着力をもって密着されてなる積層フィルムの基体
層側に、金属箔を積層してなる複合金属積層シ−トとし
たものである。In order to achieve the above object, the present invention provides (1) at least one surface of a support layer comprising an organic polymer film,
A metal foil is provided on the base layer side of a laminated film in which a base layer made of an organic polymer film having a thickness of 0.2 μm to 6 μm and thinner than the support layer is adhered to the support layer with a peelable adhesive force. To form a composite metal laminate sheet.
本発明は、また（２）第１項記載の複合金属積層シ−
トの金属層側に接着剤を塗布した後、接着剤の塗布され
た該複合金属積層シ−トから支持体層を剥離して除去す
ることによって、塗布シ−トを得る工程に続いて、該塗
布シ−トを巻回した後、巻回軸に垂直に細幅に裁断する
ことによりラミネ−トコイルを製造することを特徴とす
る複合金属積層シ−トの使用方法、（３）第１項記載の
複合金属積層シートの金属層側に接着剤を塗布した後、
接着剤の塗布された該複合金属積層シ−トから支持体層
を剥離して除去することによって、塗布シ−トを得る工
程に続いて、該塗布シ−ト細幅にスリットした後、巻回
することりよりラミネートコイルを製造することを特徴
とする複合金属積層シ−トの使用方法である。The present invention also provides (2) the composite metal laminate sheet according to item (1).
After applying an adhesive to the metal layer side of the sheet, the support layer is peeled off and removed from the composite metal laminated sheet to which the adhesive has been applied, thereby obtaining a coated sheet. (3) A method of using a composite metal laminated sheet, wherein a laminating coil is manufactured by winding the coated sheet and then cutting it into a narrow width perpendicular to the winding axis. After applying an adhesive to the metal layer side of the composite metal laminated sheet according to the item,
Following the step of obtaining a coated sheet by peeling and removing the support layer from the composite metal laminated sheet to which the adhesive has been applied, slitting the coated sheet to a narrow width and then winding This is a method for using a composite metal laminated sheet, which is characterized in that a laminated coil is manufactured by turning.
本発明は、さらに（４）第１項記載の複合金属積層シ
ートの金属箔をエッチングして所望の電気回路を形成し
て中間回路基板を得た後、該中間回路基板から支持体層
を剥離して除去することにより回路基板を製造すること
を特徴とする複合金属層シ−トの使用方法である。The present invention further provides (4) a method of forming a desired electric circuit by etching the metal foil of the composite metal laminated sheet according to the item (1) to obtain an intermediate circuit board, and then peeling the support layer from the intermediate circuit board. And using the composite metal layer sheet to manufacture a circuit board.
本発明における支持体層とは、極薄の基体層を剥離さ
れるまでの間、機械的に保護する有機高分子フィルムか
らなる層で、該有機高分子はフィルム形成性能を持つも
ので上記の条件を満たすものなら特に限定されないが、
機械的特性に優れたものが好ましい。また基体層が２軸
延伸フィルムである場合は基体層と共に２軸延伸できる
ことが好ましい。支持体層の厚みは基体層より厚いこと
が必須である。基体層より薄い支持体層では、加工工程
中で基体層を保護する役割を果たせない。支持体層の厚
みは、６μｍ以上が、基体層の保護効果の点で好まし
い。The support layer in the present invention is a layer composed of an organic polymer film that protects mechanically until the ultrathin substrate layer is peeled off, and the organic polymer has a film-forming performance and There is no particular limitation as long as it meets the conditions,
Those having excellent mechanical properties are preferred. When the base layer is a biaxially stretched film, it is preferable that the base layer can be biaxially stretched together with the base layer. It is essential that the thickness of the support layer is larger than the thickness of the base layer. A support layer that is thinner than the base layer cannot serve to protect the base layer during the processing step. The thickness of the support layer is preferably 6 μm or more from the viewpoint of the protective effect of the base layer.
本発明において、基体層とは、最終的に金属層と積層
された形で残る有機高分子フィルム層で、該有機高分子
はフィルム形成能を持つもので上記の条件を満たすもの
なら特に限定されないが、誘電特性、機械的特性、耐熱
性に優れたものが好ましい。好ましい基体層の例として
は、ポリエチレンテレフタレ−ト、ポリエチレンナフタ
レ−トなどのポリエステル、ポリフェニレンスルフィド
もしくはポリフェニレンスルフィドケトンもしくはこれ
らの共重合体または／および混合物、ポリエ−テルエ−
テルケトンなどを挙げることができる。誘電特性、耐熱
性の点で、ポリフェニレンスルフィドもしくはポリフェ
ニレンスルフィドケトンもしくはこれらの共重合体また
は／および混合物がより好ましい。該基体層の厚さは、
支持体層より薄く、0.2〜6.0μｍの範囲であることが必
要である。さらに、回路基板の場合にはスティフネス低
減の点から0.5〜６μｍ、ラミネ−トコイルの場合、小
型化などの点で0.2〜2.0μｍの範囲がより好ましい。ま
た、該基体層は２軸配向フィルムであることが好まし
い。In the present invention, the base layer is an organic polymer film layer that is finally left in a form laminated with a metal layer, and the organic polymer is not particularly limited as long as it has a film forming ability and satisfies the above conditions. However, those having excellent dielectric properties, mechanical properties, and heat resistance are preferable. Examples of preferred substrate layers include polyesters such as polyethylene terephthalate and polyethylene naphthalate, polyphenylene sulfide or polyphenylene sulfide ketone or copolymers and / or mixtures thereof, polyether ethers.
Terketone and the like can be mentioned. In terms of dielectric properties and heat resistance, polyphenylene sulfide, polyphenylene sulfide ketone, or a copolymer or a mixture thereof is more preferable. The thickness of the substrate layer is
It needs to be thinner than the support layer and in the range of 0.2 to 6.0 μm. Further, in the case of a circuit board, the range is preferably 0.5 to 6 μm from the viewpoint of reducing stiffness, and in the case of a laminating coil, the range is preferably 0.2 to 2.0 μm in terms of size reduction. Further, the base layer is preferably a biaxially oriented film.
本発明において積層フィルムとは、上記の支持体層の
少なくとも片面に上記基体層が剥離可能な密着力で密着
されたフィルムである。支持体層の厚みTsを、基体層の
厚みTpに対して、1.1Tp＋0.9≦Ts≦3.3Tp＋2.7の関係を
満たすようにするのが好ましい。また、積層フィルム全
体な厚みが6.2μｍ以上が好ましい。支持体層と誘電体
層の剥離力（剥離角180度、剥離速度200mm/minで測定し
た剥離力）は0.3〜5g/cm（より好ましく0.4〜3g/cm）の
範囲が高速剥離性の点で好ましい。In the present invention, the laminated film is a film in which the base layer is adhered to at least one surface of the support layer with a peelable adhesive force. It is preferable that the thickness Ts of the support layer is set to satisfy the relationship of 1.1 Tp + 0.9 ≦ Ts ≦ 3.3 Tp + 2.7 with respect to the thickness Tp of the base layer. Further, the total thickness of the laminated film is preferably 6.2 μm or more. The peeling force (peeling force measured at a peeling angle of 180 degrees and a peeling speed of 200 mm / min) between the support layer and the dielectric layer is in the range of 0.3 to 5 g / cm (more preferably 0.4 to 3 g / cm) in terms of high-speed peelability. Is preferred.
本発明に用いる積層フィルムの製造方法は、周知の任
意の方法が用い得る。基体層としてポリフェニレンスル
フィドフィルムを用いる場合を例にとると、支持体層の
原料ポリマ（例えばポリエステル樹脂）と基体層の原料
となるポリフェニレンスルフィドをそれぞれ別々の押出
機に供給して、それぞれのポリマの融点以上で溶融し、
二種の溶融体をポリマ管内あるいは口金内部で合流させ
て積層状態とし、これを口金から押出し、冷却固化せし
めて、未配向のポリエステルの片面もしくは両面に、未
配向で非晶状態のポリフェニレンスルフィド層が積層さ
れた積層フィルムを得る。ついで、該積層フィルムを該
ポリフェニレンスルフィドのガラス転移点以上、120℃
以下の温度で二軸延伸し、さらに200℃以上（好ましく
は、240℃以上）、ポリフェニレンスルフィドの融点以
下の温度で熱処理することによる。As a method for producing the laminated film used in the present invention, any known method can be used. Taking the case where a polyphenylene sulfide film is used as the base layer as an example, the raw material polymer (for example, polyester resin) of the support layer and the polyphenylene sulfide that is the raw material of the base layer are supplied to separate extruders, respectively, and each polymer is supplied. Melting above the melting point,
The two types of melts are merged in a polymer tube or a die to form a laminated state, which is extruded from the die, and cooled and solidified. To obtain a laminated film. Next, the laminated film was heated at a temperature equal to or higher than the glass transition point of the polyphenylene sulfide at 120 ° C.
The biaxial stretching is performed at the following temperature, and the heat treatment is further performed at a temperature of 200 ° C. or higher (preferably 240 ° C. or higher) and the melting point of polyphenylene sulfide or lower.
該積層フィルムの基体層側に、金属箔を積層して本発
明の複合金属積層シ−トを得る。金属層の形成方法とし
ては、積層フィルムの基体層側に接着剤を塗布して金属
箔と貼り合わせる方法が適用できるが、これに限定され
ない。金属箔とは１μｍ以上の厚みを有する金属シ−ト
で、積層後、他の層を全て除去した時自己支持性である
ものをいう。金属箔の材料は特に問わないが、銅、アル
ミニウム、黄銅、鉄およびこれらを主成分とする合金が
好ましい。A metal foil is laminated on the substrate layer side of the laminated film to obtain a composite metal laminated sheet of the present invention. As a method for forming the metal layer, a method in which an adhesive is applied to the base layer side of the laminated film and bonded to a metal foil can be applied, but is not limited thereto. A metal foil is a metal sheet having a thickness of 1 μm or more, which is self-supporting when all other layers are removed after lamination. The material of the metal foil is not particularly limited, but copper, aluminum, brass, iron and alloys containing these as main components are preferable.
該複合金属積層シ−トからラミネ−トコイルを得る方
法が、２通りある、両者とも金属積層シ−トの金属箔側
に接着剤を塗布した後、接着剤の塗布された該複合金属
積層シ−トから支持体層を剥離して除去する工程を経
て、塗布シートを得る。第１の方法は該工程に続いて、
該塗布シ−トを巻回した後、巻回軸に垂直に細幅に裁断
してラミネートコイルとする。裁断前に接着剤を硬化せ
しめ、0.1〜5mmの厚さに裁断するのが好ましい。第２の
方法は、まず該塗布シ−トを細幅にスリップした後、巻
回してラミネートコイルとする。スリット幅は１〜5mm
が好ましい。There are two methods for obtaining a laminate coil from the composite metal laminated sheet. In both cases, an adhesive is applied to the metal foil side of the metal laminated sheet, and then the composite metal laminated sheet to which the adhesive is applied is applied. A coated sheet is obtained through a step of peeling and removing the support layer from the substrate. A first method follows the step,
After winding the coated sheet, it is cut into a narrow width perpendicular to the winding axis to obtain a laminated coil. It is preferable to cure the adhesive before cutting and cut to a thickness of 0.1 to 5 mm. In a second method, the coated sheet is first slipped to a narrow width and then wound to form a laminated coil. Slit width is 1-5mm
Is preferred.
次に複合金属積層シ−トから回路基板を得る方法につ
いて述べる。まず、複合金属積層シ−トの金属箔に電気
回路を形成して中間回路基板を得る。回路の形成法とし
ては回路膜様をエッチングによって形成する。次に該中
間回路基板から支持体層を剥離して除去することによっ
て回路基板を得る。中間回路基板から支持体層を剥離し
て除去する前に、ハンダ付けやボンディングなどによる
部品の実装、他の回路との電気的接続、カバーレイフィ
ルムの貼り合わせなどの工程を実施することが好まし
い。Next, a method of obtaining a circuit board from a composite metal laminate sheet will be described. First, an electric circuit is formed on the metal foil of the composite metal laminate sheet to obtain an intermediate circuit board. As a method of forming a circuit, a circuit film is formed by etching. Next, a circuit board is obtained by peeling and removing the support layer from the intermediate circuit board. Before peeling and removing the support layer from the intermediate circuit board, it is preferable to carry out steps such as mounting of parts by soldering or bonding, electrical connection with other circuits, bonding of a coverlay film, and the like. .
また、支持体の両面に基体層を設けた積層フィルムを
用いる場合、片側の基体層を全く使用せずに支持体の一
部とみなすこともできるが、両方の基体層にそれぞれ金
属箔を積層して両面複合金属積層シ−トを形成すること
もできる。When a laminated film having a substrate layer provided on both sides of the support is used, it can be regarded as a part of the support without using the substrate layer on one side at all. Thus, a double-sided composite metal laminate sheet can be formed.
［発明の効果］ 本発明は上記のような構成としたことにより、従来、
極薄のフィルムを基体層とする金属積層シ−トなどの製
造を試みた時に生じていた、種々の欠点が解消され、６
μｍ程度以下の極薄の有機高分子フィルムを基体層とし
ながら、その後の加工が極めて容易で、極薄のフィルム
を基体層とする回路基板、ラミネ−トコイルの製造が可
能になった。[Effect of the Invention] The present invention has the above-described configuration,
Various drawbacks that have occurred when attempting to produce a metal laminated sheet or the like using an extremely thin film as a base layer have been solved.
Subsequent processing is extremely easy while using an ultra-thin organic polymer film of about μm or less as a base layer, and a circuit board and a laminating coil using an ultra-thin film as a base layer can be manufactured.
本発明の方法によって製造されたラミネ−トコイル
は、極薄のフィルムを基体層としているため、線占率
（全体積中、導体が占める割合）が極めて高く、体積の
割に性能がよい。また、本発明の方法によって製造され
た回路基板は、そのままでスティフネスが極めて低く、
可動部分に適している。また、金属板など熱伝導率の高
いベ−スに貼れば、放熱性の優れた回路基板となる。The laminating coil manufactured by the method of the present invention has a very high linear occupation ratio (the ratio of the conductor in the total volume) since the ultrathin film is used as the base layer, and has good performance for the volume. Further, the circuit board manufactured by the method of the present invention has extremely low stiffness as it is,
Suitable for moving parts. Also, if it is attached to a base having a high thermal conductivity such as a metal plate, a circuit board having excellent heat radiation properties can be obtained.
以下、実施例によって、本発明の実施態様を説明す
る。Hereinafter, embodiments of the present invention will be described with reference to examples.
実施例１ （１）積層フィルムの製造 ポリフェニレンスルフィド（以下、PPSと略称する）
に平均粒径0.4μｍの酸化ケイ素微粉末0.4重量％を均一
に分散せしめた組成物と、ポリエチレンテレフタレ−ト
（以下、RETと略称する）とを、別々の押出し機に供給
して、300℃で溶融し、口金内で三つの流れが合流する
構造の三層複合用口金の、外側の二層にPPSを、中心層
にPETをそれぞれ供給し、PPS/PET/PPSの三層積層状態で
シ−ト状に押出し、冷却ドラムに巻付けて急冷固化せし
めて、未延伸三層積層シ−トとした。Example 1 (1) Production of laminated film Polyphenylene sulfide (hereinafter abbreviated as PPS)
Then, a composition obtained by uniformly dispersing 0.4% by weight of silicon oxide fine powder having an average particle size of 0.4 μm and polyethylene terephthalate (hereinafter abbreviated as RET) were supplied to separate extruders to obtain Melting at ℃, the three layers merge in the die, PPS is supplied to the outer two layers and PET is supplied to the center layer, and the three layers of PPS / PET / PPS are laminated. Then, it was extruded in a sheet form, wound around a cooling drum and rapidly cooled and solidified to obtain an unstretched three-layer laminated sheet.
このシ−トをロ−ル間で100℃で長手方向に3.6倍延伸
し、次いで、テンタ内で幅方向に100℃で3.3倍横延伸
し、さらに同一テンタ内で250℃で５秒間定長熱処理し
て、さらに除冷して、両表層のPPS層（基体層）の厚さ
がそれぞれ1.0μｍ、中心のPET層（支持体）の厚さが５
μｍ、PPS層とPET層の間の剥離力が1g/cmの三層積層フ
ィルム（積層フィルムＡとする）を作った。この表層の
PPSは二軸配向している。This sheet is stretched 3.6 times in the longitudinal direction at 100 ° C. between the rolls, and then horizontally stretched 3.3 times in the tenter at 100 ° C. in the width direction. After heat treatment and further cooling, the thickness of the PPS layers (substrate layers) on both surfaces was 1.0 μm each, and the thickness of the central PET layer (support) was 5 μm.
A three-layer laminated film (hereinafter referred to as laminated film A) having a thickness of 1 μm and a peel force between the PPS layer and the PET layer of 1 g / cm was prepared. Of this surface
PPS is biaxially oriented.
（２）複合金属積層シ−トの製造 積層フィルムＡの片側のPPS層上に、コロナ放電処理
を施した後、グラビアコ−タ−でエポキシ系接着剤を10
g/m2（固形分）の目付で塗布、乾燥した。このコロナ放
電処理時、および接着剤のコ−ティング時に、PETを支
持体とする計７μｍ厚の積層フィルムは、一体として吸
うことができ、しわの発生、塗布斑、フィルム切れなど
のトラブルは全くみられなかった。次に、厚さ17μｍの
圧延銅箔を上記接着剤層を介して積層フィルムと重ね合
わせて、80℃の加熱プレスロ−ルを通し、さらに80℃で
３日間硬化して、複合金属積層シ−ト（複合金属積層シ
−トＡとする）を製造した。(2) Manufacture of composite metal laminate sheet After subjecting the PPS layer on one side of the laminated film A to a corona discharge treatment, an epoxy adhesive was applied with a gravure coater.
It was applied and dried with a basis weight of g / m 2 (solid content). At the time of the corona discharge treatment and the coating of the adhesive, a laminated film having a total thickness of 7 μm using PET as a support can be sucked as a single piece, and there is no trouble such as generation of wrinkles, coating unevenness, and film breakage. I didn't see it. Next, a rolled copper foil having a thickness of 17 μm is overlapped with the laminated film via the above adhesive layer, passed through a heating press roll at 80 ° C., and further cured at 80 ° C. for 3 days to form a composite metal laminated sheet. (Composite metal laminated sheet A) was manufactured.
（３）ラミネ−トコイルの製造（その１） 上記複合金属積層シ−トＡの銅箔上に、エポキシ系接
着剤を5g/m2（固形分）の目付けで塗布、乾燥した。該
シ−トからPET層と残る片側のPPS層を一体として剥離し
て除去しながら、塗布した金属積層シ−トを直径5mmの
円柱状巻芯の周りに100回巻回し、その状態で150℃で１
日間硬化せしめた。巻芯を抜き去って、巻回軸に垂直方
向に1mmの厚さにスライスして絶縁フィルムが厚さわず
か１μｍのPPSフィルムからなるラミネ−トコイルを製
造した。該ラミネ−トコイルの製造時のPET層と残る片
側のPPS層を一体として剥離する工程において、フィル
ム切れなどのトラブルは全くなく、極めてスムーズに剥
離できた。また、ラミネート工程およびスライス工程で
もしわや座屈などのトラブルはなかった。(3) Production of Laminate Coil (Part 1) An epoxy-based adhesive was applied onto the copper foil of the composite metal laminated sheet A at a basis weight of 5 g / m 2 (solid content) and dried. While peeling and removing the PET layer and the remaining PPS layer as one body from the sheet, the coated metal laminated sheet is wound 100 times around a cylindrical core having a diameter of 5 mm. 1 in ° C
Cured for days. The core was removed and sliced in a direction perpendicular to the winding axis to a thickness of 1 mm to produce a laminated coil made of a PPS film having an insulating film of only 1 μm in thickness. In the step of integrally peeling off the PET layer and the remaining PPS layer at the time of manufacturing the laminate coil, there was no trouble such as film breakage, and the peeling was extremely smooth. Also, there were no problems such as wrinkles and buckling in the laminating step and the slicing step.
（４）ラミネ−トコイルの製造（その２） 上記（２）の複合金属積層シ−トＡの銅箔上に、上記
（３）の条件でエポキシ系の接着剤を塗布し、乾燥し
た。該シ−トからPET層と残る片側のPPS層を一体として
剥離し巻取軸に巻き取ると同時に、塗布した金属積層シ
−トを別の巻取軸に巻き取った。この剥離は極めてスム
ーズに行なえ、フィルム切れなどのトラブルもなかっ
た。該塗布シートを2mm幅に細幅スリットしながら直径7
mmの円柱状巻芯の周りに、温度120℃の加熱ロールにタ
ッチさせながら120回巻回し、さらに、その状態で150℃
で１日間硬化せしめた後、巻芯を抜き取き去って、ラミ
ネートコイルを製造した。スリット工程およびラミネー
ト工程でのシートの切れ、しわ等のトラブルはなかっ
た。(4) Production of Laminate Coil (Part 2) An epoxy adhesive was applied on the copper foil of the composite metal laminated sheet A of (2) under the condition of (3) and dried. From the sheet, the PET layer and the remaining PPS layer on one side were peeled off integrally and wound around a winding shaft, and at the same time, the coated metal laminated sheet was wound around another winding shaft. This peeling was performed extremely smoothly, and there was no trouble such as film breakage. Diameter 7 while slitting the coating sheet to a width of 2 mm.
Wind 120 times around the cylindrical core with a temperature of 120 ° C while touching it with a heating roll.
After curing for one day, the core was removed and a laminated coil was manufactured. There were no problems such as sheet breakage and wrinkles in the slitting and laminating steps.
（５）回路基板の製造 上記複合金属積層シ−トＡの銅箔上に、ドライフィル
ムレジストを100℃でラミネ−トし、該レジストに線幅1
00μｍ、線間100μｍの螺旋模様を焼き付け、エッチン
グによって、螺旋コイル状回路を有する中間回路基板を
形成した。この中間回路基板の銅回路側に、カバ−レイ
フィルムとして上記（２）において積層フィルムＡの片
側のPPS層上に、コロナ放電処理を旋した後、グラビア
コ−タ−でエポキシ系接着剤を5g/m2（固形分）の目付
で塗布、乾燥したフィルムを、接着剤層を介してラミネ
−トし、この積層体のロ−ルを巻き出しながら、銅回路
の両側に厚さ１μｍのPPSフィルムが貼られた回路基板
と、その両側に位置するPET層と残る片側のPPS層を一体
とするフィルム２枚の計３枚に剥離分離してそれぞれ巻
取った。この剥離は極めてスム−ズに行なえ、フィルム
切れなどのトラブルはなかった。(5) Production of circuit board A dry film resist was laminated on the copper foil of the composite metal laminated sheet A at 100 ° C., and a line width of 1 mm was applied to the resist.
An intermediate circuit board having a spiral coil circuit was formed by printing a spiral pattern having a thickness of 00 μm and a line interval of 100 μm and etching the spiral pattern. On the copper circuit side of this intermediate circuit board, as a cover lay film, on one side of the laminated film A in the above (2), a corona discharge treatment was applied on the PPS layer, and then an epoxy adhesive was applied with a gravure coater. A film coated and dried with a basis weight of 5 g / m 2 (solid content) is laminated through an adhesive layer, and while unrolling the roll of the laminate, a 1 μm thick film is formed on both sides of the copper circuit. The circuit board to which the PPS film was affixed, the PET layer located on both sides of the circuit board and the remaining PPS layer on one side were separated into two films, each of which was separated and wound. This peeling was extremely smooth and there was no trouble such as film breakage.
こうして、基体層が厚さわずか１μmPPSフィルムから
なる回路基板（カバ−レイフィルムも厚さ１μｍ）を得
た。In this way, a circuit board (the coverlay film was also 1 μm thick) consisting of a PPS film having a thickness of only 1 μm was obtained.
Claims (4)
なくとも片面に厚さが0.2μｍ〜６μｍでかつ該支持体
層よりも薄い有機高分子フィルムからなる基体層が該支
持体層と剥離可能な密着力をもって密着されてなる積層
フィルムの基体層側に、金属箔を積層してなる複合金属
積層シ−ト。1. A substrate layer comprising an organic polymer film having a thickness of 0.2 μm to 6 μm and thinner than said support layer on at least one side of a support layer comprising an organic polymer film is peelable from said support layer. A composite metal laminated sheet obtained by laminating a metal foil on the base layer side of a laminated film adhered with a high adhesion.
金属層側に接着剤を塗布した後、接着剤の塗布された該
複合金属積層シ−トから支持体層を剥離して除去するこ
とによって、塗布シ−トを得る工程に続いて、該塗布シ
−トを巻回した後、巻回軸に垂直に細幅に裁断すること
によりラミネートコイルを製造することを特徴とする複
合金属積層シ−トの使用方法。2. An adhesive is applied to the metal layer side of the composite metal laminate sheet according to claim 1, and then the support layer is peeled from the composite metal laminate sheet to which the adhesive has been applied. The step of obtaining a coated sheet by removing the coated sheet is followed by winding the coated sheet, and then cutting the narrowed sheet perpendicularly to the winding axis to produce a laminated coil. To use a composite metal laminate sheet.
金属層側に接着剤を塗布した後、接着剤の塗布された該
複合金属積層シ−トから支持体層を剥離して除去するこ
とによって、塗布シ−トを得る工程に続いて、該塗布シ
−トを細幅にスリットした後、巻回することによりラミ
ネ−トコイルを製造することを特徴とする複合金属積層
シ−トの使用方法。3. After applying an adhesive to the metal layer side of the composite metal laminate sheet according to claim 1, the support layer is peeled off from the composite metal laminate sheet to which the adhesive has been applied. A step of obtaining a coated sheet by removing the coated sheet, slitting the coated sheet to a narrow width, and winding the laminated sheet to produce a laminated coil, wherein -How to use
金属箔をエッチングして所望の電気回路を形成して中間
回路基板を得た後、該中間回路基板から支持体層を剥離
して除去することにより回路基板を製造することを特徴
とする複合金属積層シ−トの使用方法。4. The method according to claim 1, wherein the metal foil of the composite metal laminate sheet is etched to form a desired electric circuit to obtain an intermediate circuit board. A method of using a composite metal laminate sheet, wherein a circuit board is manufactured by peeling and removing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1250221A JP2780380B2 (en) | 1989-09-26 | 1989-09-26 | Composite metal laminate sheet and method of using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1250221A JP2780380B2 (en) | 1989-09-26 | 1989-09-26 | Composite metal laminate sheet and method of using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03112641A JPH03112641A (en) | 1991-05-14 |
| JP2780380B2 true JP2780380B2 (en) | 1998-07-30 |
Family
ID=17204637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1250221A Expired - Fee Related JP2780380B2 (en) | 1989-09-26 | 1989-09-26 | Composite metal laminate sheet and method of using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2780380B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004214278A (en) * | 2002-12-27 | 2004-07-29 | Toyo Metallizing Co Ltd | Metallized film for electronic component |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6360288B2 (en) | 2013-09-04 | 2018-07-18 | Ckd株式会社 | Electromagnetic coil cooling structure and electromagnetic actuator |
| JP6352791B2 (en) * | 2014-12-11 | 2018-07-04 | Ckd株式会社 | Coil sheet, coil, and method of manufacturing coil |
| JP6247629B2 (en) * | 2014-12-11 | 2017-12-13 | Ckd株式会社 | Coil sheet manufacturing method and coil manufacturing method |
| JP6247630B2 (en) * | 2014-12-11 | 2017-12-13 | Ckd株式会社 | Coil cooling structure |
-
1989
- 1989-09-26 JP JP1250221A patent/JP2780380B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004214278A (en) * | 2002-12-27 | 2004-07-29 | Toyo Metallizing Co Ltd | Metallized film for electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03112641A (en) | 1991-05-14 |
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