JPH03112641A - Composite metal laminated sheet and usage thereof - Google Patents
Composite metal laminated sheet and usage thereofInfo
- Publication number
- JPH03112641A JPH03112641A JP25022189A JP25022189A JPH03112641A JP H03112641 A JPH03112641 A JP H03112641A JP 25022189 A JP25022189 A JP 25022189A JP 25022189 A JP25022189 A JP 25022189A JP H03112641 A JPH03112641 A JP H03112641A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- composite metal
- laminated
- film
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 74
- 239000002184 metal Substances 0.000 title claims abstract description 74
- 239000002131 composite material Substances 0.000 title claims abstract description 43
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- 239000011888 foil Substances 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 238000004804 winding Methods 0.000 claims abstract description 13
- 238000010030 laminating Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 28
- 229920000620 organic polymer Polymers 0.000 claims description 16
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 239000005001 laminate film Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 76
- 239000010408 film Substances 0.000 description 47
- 239000004734 Polyphenylene sulfide Substances 0.000 description 20
- 229920000069 polyphenylene sulfide Polymers 0.000 description 20
- 229920000139 polyethylene terephthalate Polymers 0.000 description 11
- 239000005020 polyethylene terephthalate Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 229920006332 epoxy adhesive Polymers 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- 239000012787 coverlay film Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920006269 PPS film Polymers 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、複合金属積層シートに関するものである。ま
た本発明は該複合金属積層シートを用いてラミネートコ
イルおよび回路基板を製造する該積層シートの使用方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a composite metal laminate sheet. The present invention also relates to a method of using the composite metal laminate sheet for manufacturing a laminate coil and a circuit board using the composite metal laminate sheet.
（Ｉ）有機高分子フィルムに金属箔を積層して、金属積
層シートを得ることは広く知られている。(I) It is widely known to obtain a metal laminated sheet by laminating a metal foil on an organic polymer film.
これらは、有機高分子フィルムに接着剤を塗布して金属
箔と貼り合わせたものである。These are organic polymer films coated with an adhesive and bonded to metal foil.
（ＩＩ）また、この金属積層シート上にエツチングなど
の方法で回路を形成したり、有機高分子フィルム上に直
接、導体の回路を印刷、メツキなどの方法で形成して回
路基板を得ることも広く知られている。(II) It is also possible to obtain a circuit board by forming a circuit on this metal laminated sheet by a method such as etching, or by directly forming a conductor circuit on an organic polymer film by a method such as printing or plating. widely known.
（ｍ）さらに、金属積層シートを巻回、裁断してラミネ
ートコイルを得ることも、特開昭６３−１８８９０６号
公報などで知られている。(m) Furthermore, it is also known to obtain a laminate coil by winding and cutting a metal laminate sheet, as disclosed in JP-A-63-188906.
［発明が解決しようとする課題］
（Ｉ）の方法は、極薄の有機高分子フィルムに適用しよ
うきすると、接着剤塗布時の塗り斑やフィルムのしわな
どの問題があった。また、金属箔と貼り合わせる時にも
、フィルムが切れたりしわになったりして、６μｍ程度
以下のフィルムに適用することは事実上困難であった。[Problems to be Solved by the Invention] When the method (I) is applied to an extremely thin organic polymer film, there are problems such as coating spots and wrinkles in the film when applying the adhesive. Furthermore, when bonding with metal foil, the film may be cut or wrinkled, making it practically difficult to apply it to films of about 6 μm or less.
（ＩＩ）の回路基板においても、スティフネスを下げ曲
げ特性を改良するために、基体層として極薄の有機高分
子フィルムを用いることが要求されるが、上記の理由か
ら困難であった。In the circuit board (II) as well, in order to reduce stiffness and improve bending properties, it is required to use an extremely thin organic polymer film as the base layer, but this has been difficult for the reasons mentioned above.
（ｍ）のラミネートコイルにおいても、該コイルはもと
もとコイル部品の小型化を目的に作られたものであり、
さらなる外形寸法の小型化を図る上で、絶縁層としての
基体層に極薄の有機高分子フィルムを用いることが要求
されるが、これも上記の理由から困難であった。Even in the laminated coil (m), the coil was originally made for the purpose of miniaturizing the coil parts,
In order to further reduce the external dimensions, it is required to use an extremely thin organic polymer film for the base layer as an insulating layer, but this has also been difficult for the reasons mentioned above.
［発明の目的コ
本発明の目的は、上記のような欠点を解消し、６μｍ程
度以下の極薄の有機高分子フィルムを基体層として用い
ているにもかかわらずその後の加工が極めて容易な複合
金属積層シートを提供することにある。[Purpose of the Invention] The purpose of the present invention is to solve the above-mentioned drawbacks and to provide a composite material that is extremely easy to process even though an extremely thin organic polymer film of approximately 6 μm or less is used as the base layer. The purpose of the present invention is to provide a metal laminated sheet.
また本発明の他の目的は、上記複合金属積層シートを用
いて、極薄の有機高分子フィルムを基体層とした回路基
板およびラミネートコイルを効率的に製造する該積層シ
ートの使用方法を提供することにある。Another object of the present invention is to provide a method of using the composite metal laminate sheet for efficiently manufacturing a circuit board and a laminate coil having an ultra-thin organic polymer film as a base layer using the composite metal laminate sheet. There is a particular thing.
本発明は、上記の目的を達成するために、（１）有機高
分子フィルムからなる支持体層の少なくとも片面に、厚
さが０．２μｍ〜６μｍでかつ該支持体層よりも薄い有
機高分子フィルムからなる基体層が該支持体層と剥離可
能な密着力をもって密着されてなる積層フィルムの基体
層側に、金属箔を積層してなる複合金属積層シートとし
たものである。In order to achieve the above object, the present invention provides (1) an organic polymer having a thickness of 0.2 μm to 6 μm and thinner than the support layer on at least one side of a support layer made of an organic polymer film; A composite metal laminate sheet is obtained by laminating a metal foil on the base layer side of a laminate film in which a base layer made of a film is adhered to the support layer with peelable adhesion.
本発明は、また（２）第１項記載の複合金属積層シート
の金属層側に接着剤を塗布した後、接着剤の塗布された
該複合金属積層シートから支持体層を剥離して除去する
ことによって、塗布シートを得る工程に続いて、該塗布
シートを巻回した後、巻回軸に垂直に細幅に裁断するこ
とによりラミネートコイルを製造することを特徴とする
複合金属積層シートの使用方法、（３）第１項記載の複
合金属積層シートの金属層側に接着剤を塗布した後、接
着剤の塗布された該複合金属積層シートから支持体層を
剥離して除去することによって、塗布シートを得る工程
に続いて、該塗布シートを細幅にスリットした後、巻回
することによりラミネートコイルを製造することを特徴
とする複合金属積層シートの使用方法である。The present invention also provides (2) applying an adhesive to the metal layer side of the composite metal laminate sheet described in item 1, and then peeling and removing the support layer from the composite metal laminate sheet coated with the adhesive. Use of a composite metal laminated sheet characterized in that, following the step of obtaining a coated sheet, the coated sheet is wound and then cut into narrow widths perpendicular to the winding axis to produce a laminated coil. Method, (3) by applying an adhesive to the metal layer side of the composite metal laminate sheet according to item 1, and then peeling and removing the support layer from the composite metal laminate sheet coated with the adhesive, This method of using a composite metal laminate sheet is characterized in that, following the step of obtaining a coated sheet, the coated sheet is slit into narrow widths and then wound to produce a laminate coil.
本発明は、さらに（４）第１項記載の複合金属積層シー
トの金属箔をエツチングして所望の電気回路を形成して
中間回路基板を得た後、該中間回路基板から支持体層を
剥離して除去することにより回路基板を製造することを
特徴とする複合金属積層シートの使用方法である。The present invention further provides (4) etching the metal foil of the composite metal laminate sheet described in item 1 to form a desired electric circuit to obtain an intermediate circuit board, and then peeling off the support layer from the intermediate circuit board. This is a method of using a composite metal laminate sheet, characterized in that a circuit board is manufactured by removing the composite metal laminate sheet.
本発明における支持体層とは、極薄の基体層を剥離され
るまでの間、機械的に保護する有機高分子フィルムから
なる層で、該有機高分子はフィルム形成能を持つもので
上記の条件を満たすものなら特に限定されないが、機械
的特性に優れたものが好ましい。また基体層が２軸延伸
フイルムである場合は、基体層と共に２軸延伸できるこ
とが好ましい。支持体層の厚みは基体層より厚いことが
必須である。基体層より薄い支持体層では、加工工程中
で基体層を保護する役割を果たせない。支持体層の厚み
は、６μｍ以上が、基体層の保護効果の点で好ましい。The support layer in the present invention is a layer consisting of an organic polymer film that mechanically protects the extremely thin base layer until it is peeled off. It is not particularly limited as long as it satisfies the conditions, but those with excellent mechanical properties are preferred. Further, when the base layer is a biaxially stretched film, it is preferable that the film can be biaxially stretched together with the base layer. It is essential that the support layer is thicker than the base layer. A support layer that is thinner than the base layer cannot serve to protect the base layer during processing steps. The thickness of the support layer is preferably 6 μm or more from the viewpoint of protecting the base layer.
本発明において、基体層とは、最終的に金属層と積層さ
れた形で残る有機高分子フィルム層で、該有機高分子は
フィルム形成能を持つもので上記の条件を満たすものな
ら特に限定されないが、誘電特性、機械的特性、耐熱性
に優れたものが好ましい。好ましい基体層の例としては
、ポリエチレンテレフタレート、ポリエチレンナフタレ
ートなどのポリエステル、ポリフェニレンスルフィドも
しくはポリフェニレンスルフィドケトンもしくはこれら
の共重合体または／および混合物、ポリエーテルエーテ
ルケトンなどを挙げることができる。In the present invention, the base layer is an organic polymer film layer that ultimately remains in a laminated form with a metal layer, and the organic polymer is not particularly limited as long as it has film-forming ability and satisfies the above conditions. However, those with excellent dielectric properties, mechanical properties, and heat resistance are preferable. Examples of preferred base layers include polyesters such as polyethylene terephthalate and polyethylene naphthalate, polyphenylene sulfide or polyphenylene sulfide ketone or copolymers and/or mixtures thereof, polyether ether ketone, and the like.
誘電特性、耐熱性の点で、ポリフェニレンスルフィドも
しくはポリフェニレンスルフィドケトンもしくはこれら
の共重合体または／および混合物がより好ましい。該基
体層の厚さは、支持体層より薄く、０．２〜６．０μｍ
の範囲であることが必要である。さらに、回路基板の場
合にはスティフネス低減の点から０．５〜６μｍ１ラミ
ネートコイルの場合、小型化などの点で０．２〜２．０
μｍの範囲がより好ましい。また、該基体層は２紬配向
フイルムであることが好ましい。From the viewpoint of dielectric properties and heat resistance, polyphenylene sulfide, polyphenylene sulfide ketone, or copolymers and/or mixtures thereof are more preferred. The thickness of the base layer is thinner than the support layer, and is 0.2 to 6.0 μm.
It is necessary to be within the range of . Furthermore, in the case of circuit boards, from the viewpoint of stiffness reduction, in the case of 0.5 to 6 μm1 laminated coil, from the viewpoint of miniaturization, 0.2 to 2.0 μm.
A range of μm is more preferred. Moreover, it is preferable that the base layer is a 2-pongee oriented film.
本発明において積層フィルムとは、上記の支持体層の少
なくとも片面に上記基体層が剥離可能な密着力で密着さ
れたフィルムである。支持体層の厚みＴｓを、基体層の
厚みＴｐに対して、１．ＩＴｐ＋０．９≦Ｔｓ≦３，３
Ｔｐ＋２．７の関係を満たすようにするのが好ましい。In the present invention, the laminated film is a film in which the base layer is adhered to at least one side of the support layer with peelable adhesion. The thickness Ts of the support layer is 1. ITp+0.9≦Ts≦3,3
It is preferable to satisfy the relationship Tp+2.7.
また、積層フィルム全体の厚みが６．２μｍ以上が好ま
しい。Moreover, the thickness of the entire laminated film is preferably 6.2 μm or more.
支持体層と誘電体層の剥離力（剥離角１８０度、剥離速
度２００ ｍｍ／ｎ＋ｉｎで測定した剥離力）は０゜３
〜５ｇ／ｃｍ（より好ましくは０．４〜３ｇ／ｃｍ）の
範囲が高速剥離性の点で好ましい。The peeling force between the support layer and the dielectric layer (peeling force measured at a peeling angle of 180 degrees and a peeling speed of 200 mm/n+in) was 0°3.
A range of 5 g/cm (more preferably 0.4 to 3 g/cm) is preferable from the viewpoint of high-speed releasability.
本発明に用いる積層フィルムの製造方法は、周知の任意
の方法が用い得る。基体層としてポリフェニレンスルフ
ィドフィルムを用いる場合を例にとると、支持体層の原
料ポリマ（例えばポリエステル樹脂）と基体層の原料と
なるポリフェニレンスルフィドをそれぞれ別々の押出機
に供給して、それぞれのポリマの融点以上で溶融し、二
種の溶融体をポリマ管内あるいは口金内部で合流させて
積層状態とし、これを口金から押出し、冷却固化せしめ
て、未配向のポリエステルの片面もしくは両面に、未配
向で非晶状態のポリフェニレンスルフィド層が積層され
た積層フィルムを得る。ついで、該積層フィルムを該ポ
リフェニレンスルフィドのガラス転移点以上、１２０℃
以下の温度で二軸延伸し、さらに２００℃以上（好まし
くは、２４０℃以上）、ポリフェニレンスルフィドの融
点以下の温度で熱処理することによる。Any well-known method can be used for manufacturing the laminated film used in the present invention. For example, when a polyphenylene sulfide film is used as the base layer, the raw material polymer for the support layer (for example, polyester resin) and the polyphenylene sulfide as the raw material for the base layer are supplied to separate extruders, and each polymer is The two melts are melted above the melting point and are combined inside the polymer tube or the nozzle to form a laminated state, which is extruded from the nozzle, cooled and solidified, and is applied to one or both sides of the unoriented polyester. A laminated film in which crystalline polyphenylene sulfide layers are laminated is obtained. Then, the laminated film is heated at 120° C. above the glass transition point of the polyphenylene sulfide.
Biaxial stretching is performed at the following temperature, and further heat treatment is performed at a temperature of 200° C. or higher (preferably 240° C. or higher) and lower than the melting point of polyphenylene sulfide.
該積層フィルムの基体層側に、金属箔を積層して本発明
の複合金属積層シートを得る。金属層の形成方法として
は、積層フィルムの基体層側に接着剤を塗布して金属箔
と貼り合わせる方法が適用できるが、これに限定されな
い。金属箔とは１μｍ以上の厚みを有する金属シートで
、積層後、他の層を全て除去した時自己支持性であるも
のをいう。金属箔の材質は特に問わないが、銅、アルミ
ニウム、黄銅、鉄およびこれらを主成分とする合金が好
ましい。A metal foil is laminated on the base layer side of the laminated film to obtain a composite metal laminated sheet of the present invention. As a method for forming the metal layer, a method of applying an adhesive to the base layer side of the laminated film and bonding it to the metal foil can be applied, but the method is not limited thereto. Metal foil is a metal sheet having a thickness of 1 μm or more, which is self-supporting when all other layers are removed after lamination. The material of the metal foil is not particularly limited, but copper, aluminum, brass, iron, and alloys containing these as main components are preferable.
該複合金属積層シートからラミネートコイルを得る方法
が、２通りある。両者とも金属積層シートの金属箔側に
接着剤を塗布した後、接着剤の塗布された該複合金属積
層シートから支持体層を剥離して除去する工程を経て、
塗布シートを得る。There are two methods for obtaining a laminate coil from the composite metal laminate sheet. In both cases, after applying an adhesive to the metal foil side of the metal laminate sheet, the support layer is peeled off and removed from the adhesive-coated composite metal laminate sheet.
Obtain a coating sheet.
第１の方法は該工程に続いて、該塗布シートを巻回した
後、巻回軸に垂直に細幅に裁断してラミネートコイルと
する。裁断前に接着剤を硬化せしめ、０．１〜５ｍｍの
厚さに裁断するのが好ましい。In the first method, following this step, the coated sheet is wound and then cut into narrow pieces perpendicular to the winding axis to form a laminated coil. It is preferable to cure the adhesive before cutting, and then cut to a thickness of 0.1 to 5 mm.
第２の方法は、まず該塗布シートを細幅にスリットした
後、巻回してラミネートコイルとする。スリット幅は１
〜５ｍｍか好ましい。In the second method, the coated sheet is first slit into narrow widths and then wound to form a laminated coil. The slit width is 1
~5 mm is preferred.
次に複合金属積層シートから回路基板を得る方法につい
て述べる。まず、複合金属積層シートの金属箔に電気回
路を形成して中間回路基板を得る。Next, a method for obtaining a circuit board from a composite metal laminate sheet will be described. First, an electric circuit is formed on the metal foil of the composite metal laminate sheet to obtain an intermediate circuit board.
回路の形成法としては回路模様をエツチングによって形
成する。次に該中間回路基板から支持体層を剥離して除
去することによって回路基板を得る。The circuit pattern is formed by etching. Next, a circuit board is obtained by peeling and removing the support layer from the intermediate circuit board.
中間回路基板から支持体層を剥離して除去する前に、ハ
ンダ付けやボンディングなどによる部品の実装、他の回
路との電気的接続、カバーレイフィルムの貼り合わせな
どの工程を実施することが好ましい。Before peeling and removing the support layer from the intermediate circuit board, it is preferable to carry out steps such as mounting components by soldering or bonding, electrically connecting with other circuits, and laminating a coverlay film. .
また、支持体の両面に基体層を設けた積層フィルムを用
いる場合、片側の基体層を全く使用せずに支持体の一部
とみなすこともできるが、両方の基体層にそれぞれ金属
箔を積層して両面複合金属積層シートを形成することも
できる。In addition, when using a laminated film with base layers on both sides of the support, the base layer on one side can be considered as part of the support without using it at all, but metal foil can be laminated on both base layers. It is also possible to form a double-sided composite metal laminate sheet.
［発明の効果］
本発明は上記のような構成としたことにより、従来、極
薄のフィルムを基体層とする金属積層シートなどの製造
を試みた時に生じていた、種々の欠点が解消され、６μ
ｍ程度以下の極薄の有機高分子フィルムを基体層としな
がら、その後の加工が極めて容易で、極薄のフィルムを
基体層とする回路基板、ラミネートコイルの製造が可能
になった。[Effects of the Invention] By having the above-described structure, the present invention eliminates various drawbacks that have conventionally occurred when attempting to manufacture a metal laminate sheet using an ultra-thin film as a base layer. 6μ
It has become possible to manufacture circuit boards and laminate coils using an ultra-thin organic polymer film with a thickness of about m or less as the base layer, with subsequent processing being extremely easy.
本発明の方法によって製造されたラミネートコイルは、
極薄のフィルムを基体層としているため、線心率（全体
積中、導体が占める割合）が極めて高く、体積の割に性
能がよい。また、本発明の方法によって製造された回路
基板は、そのままでスティフネスが極めて低く、可動部
分に適している。The laminated coil manufactured by the method of the present invention is
Since the base layer is an extremely thin film, the core ratio (the proportion of the conductor in the total volume) is extremely high, and the performance is good considering the volume. Further, the circuit board manufactured by the method of the present invention has extremely low stiffness as it is, and is suitable for use as a moving part.
また、金属板など熱伝導率の高いベースに貼れば、放熱
性の優れた回路基板となる。Additionally, if it is attached to a base with high thermal conductivity, such as a metal plate, it becomes a circuit board with excellent heat dissipation.
〔実施例コ 以下、実施例によって、本発明の実施態様を説明する。[Example Hereinafter, embodiments of the present invention will be described with reference to Examples.
実施例１
（１）積層フィルムの製造
ポリフェニレンスルフィド（以下、ＰＰＳと略称する）
に平均粒径０．４μｍの酸化ケイ素微粉末０．４重量％
を均一に分散せしめた組成物と、ポリエチレンテレフタ
レート（以下、ＰＥＴと略称する）とを、別々の押出し
機に供給して、３００℃で溶融し、口金内で三つの流れ
が合流する構造の三層複合用口金の、外側の二層にＰＰ
Ｓを、中心層にＰＥＴをそれぞれ供給し、Ｐ Ｐ Ｓ／
Ｐ ＥＴ／Ｐ Ｐ Ｓの三層積層状態でシート状に押出
し、冷却ドラムに巻付けて急冷固化せしめて、未延伸三
層積層シートとした。Example 1 (1) Production of laminated film Polyphenylene sulfide (hereinafter abbreviated as PPS)
0.4% by weight of silicon oxide fine powder with an average particle size of 0.4μm
A composition in which PET is uniformly dispersed and polyethylene terephthalate (hereinafter abbreviated as PET) are supplied to separate extruders and melted at 300°C. PP on the outer two layers of the layer composite cap
S and PET are supplied to the center layer, respectively, and P P S/
The PET/PPS three-layer laminated state was extruded into a sheet, wound around a cooling drum, and rapidly solidified to obtain an unstretched three-layer laminated sheet.
このシートをロール間で１００℃で長手方向に３．６倍
延伸し、次いで、テンタ内で幅方向に１００℃で３．３
倍横延伸し、さらに同一テンタ内で２５０℃で５秒間定
長熱処理して、さらに徐冷して、画表層のＰＰＳ層（基
体層）の厚さがそれぞれ１．０μｍ１中心のＰＥＴ層（
支持体）の厚さが５μｍ、ＰＰＳ層とＰＥＴ層の間の剥
離力が１ｇ／ｃｍの三層積層フィルム（積層フィルムＡ
とする）を作った。この表層のＰＰＳは二軸配向してい
る。This sheet was stretched 3.6 times in the longitudinal direction at 100°C between rolls, and then stretched 3.6 times in the width direction at 100°C in a tenter.
The PPS layer (substrate layer) of the image surface layer has a thickness of 1.0 μm and the center PET layer (
A three-layer laminated film (laminated film A
) was created. The PPS in this surface layer is biaxially oriented.
（２）複合金属積層シートの製造
積層フィルムＡの片側のＰＰＳ層上に、コロナ放電処理
を施した後、グラビアコーターでエポキシ系接着剤をＬ
ｏｇ／ｍ２ （固形分）の目付で塗布、乾燥した。この
コロナ放電処理時、および接着剤のコーティング時に、
ＰＥＴを支持体とする計７μｍ厚の積層フィルムは、一
体として扱うことができ、しわの発生、塗布斑、フィル
ム切れなどのトラブルは全くみられなかった。次に、厚
さ１７μｍの圧延銅箔を上記接着剤層を介して積層フィ
ルムと重ね合わせて、８０℃の加熱プレスロルを通し、
さらに８０℃で３日間硬化して、複合金属積層シート（
複合金属積層シートＡとする）を製造した。(2) Manufacture of composite metal laminate sheet After corona discharge treatment is applied to the PPS layer on one side of laminate film A, epoxy adhesive is applied with a gravure coater.
It was coated at a basis weight of og/m2 (solid content) and dried. During this corona discharge treatment and adhesive coating,
The laminated film with a total thickness of 7 μm using PET as a support could be handled as a single piece, and no problems such as wrinkles, uneven coating, or film breakage were observed. Next, a rolled copper foil with a thickness of 17 μm was laminated with the laminated film via the adhesive layer, and passed through a heated press roll at 80°C.
Further, the composite metal laminate sheet (
A composite metal laminate sheet A) was manufactured.
（３）ラミネートコイルの製造（その１）上記複合金属
積層シー）Ａの銅箔上に、エポキシ系接着剤を５ｇ／ｍ
２ （固形分）の目付けで塗布、乾燥した。該シートか
らＰＥＴ層と残る片側のＰＰＳ層を一体として剥離して
除去しながら、塗布した金属積層シートを直径５ｍｍの
円柱状巻芯の周りに１００回巻回し、その状態で１５０
°Ｃで１日間硬化せしめた。巻芯を抜き去って、巻回軸
に垂直方向に１ｍｍの厚さにスライスして絶縁フィルム
が厚されずか１μｍのＰＰＳフィルムからなるラミネー
トコイルを製造した。該ラミネートコイルの製造時のＰ
ＥＴ層と残る片側のＰＰＳ層を一体として剥離する工程
において、フィルム切れなどのトラブルは全くなく、極
めてスムーズに剥離できた。また、ラミネート工程およ
びスライス工程でもしわや座屈などのトラブルはなかっ
た。(3) Manufacture of laminated coil (Part 1) Apply 5 g/m of epoxy adhesive on the copper foil of above composite metal laminated sheet) A.
It was applied at a basis weight of 2 (solid content) and dried. While peeling and removing the PET layer and the remaining PPS layer on one side from the sheet, the coated metal laminated sheet was wound 100 times around a cylindrical winding core with a diameter of 5 mm, and in that state it was wound for 150 times.
It was cured for 1 day at °C. The winding core was removed and sliced into 1 mm thick slices in the direction perpendicular to the winding axis to produce a laminated coil made of PPS film with no insulating film and only 1 μm thick. P at the time of manufacturing the laminated coil
In the process of peeling off the ET layer and the remaining PPS layer on one side, there were no problems such as film breakage, and the peeling was extremely smooth. Furthermore, there were no problems such as wrinkles or buckling during the laminating process and slicing process.
（４）ラミネートコイルの製造（その２）上記（２）の
複合金属積層シートＡの銅箔上に、上記（３）の条件で
エポキシ系の接着剤を塗布し、乾燥した。該シートから
ＰＥＴ層と残る片側のＰＰＳ層を一体として剥離し巻取
軸に巻き取ると同時に、塗布した金属積層シートを別の
巻取軸に巻き取った。この剥離は極めてスムーズに行な
え、フィルム切れなどのトラブルもなかった。該塗布シ
ートを２ｍｍ幅に細幅スリットしながら直径７ｍｍの円
柱状巻芯の周りに、温度１２０℃の加熱ロールにタッチ
させながら１２０回巻回し、さらに、その状態で１５０
℃で１日間硬化せしめた後、巻芯を抜き去って、ラミネ
ートコイルを製造した。(4) Manufacture of laminated coil (Part 2) An epoxy adhesive was applied on the copper foil of the composite metal laminate sheet A of (2) above under the conditions of (3) above and dried. The PET layer and the remaining PPS layer on one side were peeled off as a unit from the sheet and wound up onto a winding shaft, and at the same time, the coated metal laminated sheet was wound up onto another winding shaft. This peeling process was extremely smooth and there were no problems such as film breakage. The coated sheet was wound 120 times around a cylindrical core with a diameter of 7 mm while slitting it into a 2 mm width, while touching it with a heating roll at a temperature of 120°C, and further, in that state, it was wound for 150 times.
After curing for one day at °C, the core was removed to produce a laminated coil.
スリット工程およびラミネート工程でのシートの切れ、
しわ等のトラブルはなかった。Cutting of sheets during slitting and laminating processes,
There were no problems such as wrinkles.
（５）回路基板の製造
上記複合金属積層シートＡの銅箔上に、ドライフィルム
レジストを１００℃でラミネートし、該レジストに線幅
１００μｍ１線間１００μｍの螺旋模様を焼き付け、エ
ツチングによって、螺旋コイル状回路を有する中間回路
基板を形成した。この中間回路基板の銅回路側に、カバ
ーレイフィルムとして上記（２）において積層フィルム
Ａの片側のＰＰＳ層上に、コロナ放電処理を施した後、
グラビアコータ〜でエポキシ系接着剤を５ｇ／ｍ２ （
固形分）の目付で塗布、乾燥したフィルムを、接着剤層
を介してラミネートし、この積層体のロールを巻き出し
ながら、銅回路の両側に厚さ１μｍのＰＰＳフィルムが
貼られた回路基板と、その両側に位置するＰＥＴ層と残
る片側のＰＰＳ層を一体とするフィルム２枚の計３枚に
剥離分離してそれぞれ巻取った。この剥離は極めてスム
ーズに行なえ、フィルム切れなどのトラブルはなかった
。(5) Production of circuit board A dry film resist is laminated on the copper foil of the composite metal laminate sheet A at 100°C, a spiral pattern with a line width of 100 μm and a line spacing of 100 μm is printed on the resist, and etched to form a spiral coil shape. An intermediate circuit board having circuitry was formed. After applying corona discharge treatment to the copper circuit side of this intermediate circuit board on the PPS layer on one side of the laminated film A in (2) above as a coverlay film,
Apply 5g/m2 of epoxy adhesive with a gravure coater (
The coated and dried films were coated and dried with a basis weight of (solid content) and then laminated via an adhesive layer, and as the roll of this laminate was unwound, a circuit board with a 1 μm thick PPS film pasted on both sides of the copper circuit and a Then, the film was peeled and separated into three films in total, consisting of two films that integrated the PET layers located on both sides and the PPS layer on the remaining one side, and each film was wound up. This peeling process was extremely smooth and there were no problems such as film breakage.
こうして、基体層が厚さがわずか１μｍＰＰ５フイルム
からなる回路基板（カバーレイフィルムも厚さ１μｍ）
を得た。In this way, the base layer is a circuit board made of PP5 film with a thickness of only 1 μm (the coverlay film is also 1 μm thick).
I got it.
Claims (4)
も片面に、厚さが０．２μｍ〜６μｍでかつ該支持体層
よりも薄い有機高分子フィルムからなる基体層が該支持
体層と剥離可能な密着力をもって密着されてなる積層フ
ィルムの基体層側に、金属箔を積層してなる複合金属積
層シート。(1) On at least one side of the support layer made of an organic polymer film, a base layer made of an organic polymer film with a thickness of 0.2 μm to 6 μm and thinner than the support layer is removable from the support layer. A composite metal laminate sheet made by laminating a metal foil on the base layer side of a laminate film that is adhered with excellent adhesion.
側に接着剤を塗布した後、接着剤の塗布された該複合金
属積層シートから支持体層を剥離して除去することによ
って、塗布シートを得る工程に続いて、該塗布シートを
巻回した後、巻回軸に垂直に細幅に裁断することにより
ラミネートコイルを製造することを特徴とする複合金属
積層シートの使用方法。(2) After applying an adhesive to the metal layer side of the composite metal laminate sheet according to claim (1), by peeling and removing the support layer from the composite metal laminate sheet coated with the adhesive, A method for using a composite metal laminate sheet, which comprises, following the step of obtaining a coated sheet, winding the coated sheet and then cutting the coated sheet into narrow widths perpendicular to the winding axis to produce a laminate coil.
側に接着剤を塗布した後、接着剤の塗布された該複合金
属積層シートから支持体層を剥離して除去することによ
って、塗布シートを得る工程に続いて、該塗布シートを
細幅にスリットした後、巻回することによりラミネート
コイルを製造することを特徴とする複合金属積層シート
の使用方法。(3) After applying an adhesive to the metal layer side of the composite metal laminate sheet according to claim (1), by peeling and removing the support layer from the composite metal laminate sheet coated with the adhesive, A method for using a composite metal laminate sheet, which comprises, following the step of obtaining a coated sheet, slitting the coated sheet into narrow widths and then winding the slit to produce a laminate coil.
をエッチングして所望の電気回路を形成して中間回路基
板を得た後、該中間回路基板から支持体層を剥離して除
去することにより回路基板を製造することを特徴とする
複合金属積層シートの使用方法。(4) After etching the metal foil of the composite metal laminate sheet according to claim (1) to form a desired electric circuit to obtain an intermediate circuit board, the support layer is peeled and removed from the intermediate circuit board. A method of using a composite metal laminate sheet, characterized by manufacturing a circuit board by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1250221A JP2780380B2 (en) | 1989-09-26 | 1989-09-26 | Composite metal laminate sheet and method of using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1250221A JP2780380B2 (en) | 1989-09-26 | 1989-09-26 | Composite metal laminate sheet and method of using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03112641A true JPH03112641A (en) | 1991-05-14 |
| JP2780380B2 JP2780380B2 (en) | 1998-07-30 |
Family
ID=17204637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1250221A Expired - Fee Related JP2780380B2 (en) | 1989-09-26 | 1989-09-26 | Composite metal laminate sheet and method of using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2780380B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016115708A (en) * | 2014-12-11 | 2016-06-23 | Ckd株式会社 | Manufacturing method of sheet for coil and manufacturing method of coil |
| JP2016115707A (en) * | 2014-12-11 | 2016-06-23 | Ckd株式会社 | Sheet for coil, coil, and manufacturing method of the same |
| JP2016115709A (en) * | 2014-12-11 | 2016-06-23 | Ckd株式会社 | Cooling structure of coil |
| US10043609B2 (en) | 2013-09-04 | 2018-08-07 | Ckd Corporation | Cooling structure for electromagnetic coil, and electromagnetic actuator |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4958370B2 (en) * | 2002-12-27 | 2012-06-20 | 東レフィルム加工株式会社 | Metalized film for electronic parts |
-
1989
- 1989-09-26 JP JP1250221A patent/JP2780380B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10043609B2 (en) | 2013-09-04 | 2018-08-07 | Ckd Corporation | Cooling structure for electromagnetic coil, and electromagnetic actuator |
| JP2016115708A (en) * | 2014-12-11 | 2016-06-23 | Ckd株式会社 | Manufacturing method of sheet for coil and manufacturing method of coil |
| JP2016115707A (en) * | 2014-12-11 | 2016-06-23 | Ckd株式会社 | Sheet for coil, coil, and manufacturing method of the same |
| JP2016115709A (en) * | 2014-12-11 | 2016-06-23 | Ckd株式会社 | Cooling structure of coil |
| US10121590B2 (en) | 2014-12-11 | 2018-11-06 | Ckd Corporation | Coil sheet production method, and coil production method |
| US10832853B2 (en) | 2014-12-11 | 2020-11-10 | Ckd Corporation | Coil and coil production method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2780380B2 (en) | 1998-07-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4547336B2 (en) | Method for producing flexible laminate | |
| KR101087357B1 (en) | Conductor-clad laminate, wiring circuit board, and processes for producing the same | |
| WO1991004566A1 (en) | Film capacitor and its manufacturing method | |
| JP2780380B2 (en) | Composite metal laminate sheet and method of using the same | |
| JPH05217446A (en) | Protective method of conductive foil, protective conductive-foil aggregate used for said method and protective conductive-foil laminated object | |
| JP2621950B2 (en) | Flexible metal and plastic laminates | |
| JP4958370B2 (en) | Metalized film for electronic parts | |
| JP3080259B2 (en) | Release laminated sheet and method of using the same | |
| WO2001087503A1 (en) | Additive electronic circuits on thermally unstable substrates | |
| JP2621880B2 (en) | Flexible metal plastic laminate | |
| JP2002326308A (en) | Heat-resistant flexible laminated sheet and method for manufacturing the same | |
| JP2010161091A (en) | Support for forming interlayer insulating material | |
| JP4496807B2 (en) | Multi-layer film | |
| JP3643441B2 (en) | Composite release film | |
| JP4643861B2 (en) | Method for producing flexible laminate | |
| JP2011111575A (en) | Substrate for formation of interlayer insulation material | |
| JP2011096847A (en) | Supporting material polyester film for interlayer insulation | |
| JPH0399845A (en) | Laminated polyphenylene sulfide film | |
| JP2892222B2 (en) | Manufacturing method of flexible printed circuit board | |
| JPH0456308A (en) | Manufacture of capacitor element | |
| JP2007136977A (en) | Composite functional film and its manufacturing method | |
| JPH0457310A (en) | Manufacture of metallized film capacitor | |
| JPH0523939B2 (en) | ||
| JPH02123138A (en) | Carrier film for forming transfer printed circuit | |
| JP2768309B2 (en) | Support sheet for producing ceramic sheet and method for producing multilayer ceramic capacitor using the support sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080515 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090515 Year of fee payment: 11 |
|
| LAPS | Cancellation because of no payment of annual fees |