JP2774623B2 - Inner lead bonding apparatus and inner lead bonding method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to, for example, TAB (Tape Automated Bonding).
The present invention relates to an inner lead bonding apparatus and an inner lead bonding method adopting a method.

(Prior Art) Generally, as shown in FIG. 2, TAB (Tape Automated
An inner lead bonding apparatus 1 employing a bonding method is known. That is, the inner lead bonding apparatus 1 is a cine-film-like film carrier 2.
From the supply reel 4 driven by the supply motor 3, passes through a predetermined position on the apparatus, and is wound on a take-up reel 6 driven by the take-up motor 5.

Further, the inner lead bonding apparatus 1 has a plurality of guide rollers 7,..., 8a, 8b and sprockets 9a, 9b as guide members. Then, the film carrier 2 is brought into contact with the loader side such that the film surface of the film carrier 2 is brought into contact with the guide rollers 7..., 8a, 8b and the sprockets 9a, 9b while passing the bonding mechanism 10 substantially horizontally. It is made to travel on the transport path 11 between the unloader.

Then, the inner lead bonding apparatus 1 uses the bonding mechanism 10 to attach a semiconductor chip (IC pellet) to the inner lead (finger lead) of the film carrier 2.
Join 12

That is, the inner lead bonding apparatus 1 guides the film carrier 2 by the tape guide 13 in the bonding mechanism unit 10 and temporarily stops the inner lead having the lead pattern formed on the film carrier 2 by the bonding mechanism unit 10. Then, the bonding tool 14, which is heated and kept at a high temperature, is lowered, and the inner lead is pressed down by the bonding tool 14.

Then, the inner lead bonding apparatus 1 presses the inner lead on the electrode of the semiconductor chip 12 placed on the bonding stage 15 and positioned with respect to the inner lead, and joins the inner lead and the electrode. Is mounted on the film carrier 2. By running the film carrier 2, the semiconductor chip 12 subjected to the inner lead bonding is transported to the take-up reel 6 side, and the inner leads are sequentially supplied to the bonding mechanism unit 10.

In FIG. 2, reference numeral 16 denotes a spacer tape. The spacer tape 16 is wound around the supply reel 4 and the take-up reel 6 so as to overlap with the film carrier 2. In each of the reels 4 and 6, the circling film carrier 2 overlaps and deforms the inner lead. This is to prevent the occurrence of such a situation. The spacer tape 16 is drawn out of the supply reel 4 in a direction different from that of the film carrier 2, and is guided by spacer tape guide rollers 17 to reach the take-up reel 6.

(Problems to be Solved by the Invention) By the way, in the conventional inner lead bonding apparatus 1 as described above, the film carrier 2 and the spacer tape
16 is in contact with various guide rollers and sprockets, and static electricity may be generated due to friction or the like when the film carrier 2 or the spacer tape 16 runs.

When the amount of static electricity becomes excessive, or when an object or person carrying static electricity approaches the inner lead bonding apparatus 1, the static electricity causes dust or dirt on the joint between the semiconductor chip 12 and the inner lead. In some cases, dust or the like may adhere to the semiconductor chip 12 to cause defective bonding, or the circuit of the semiconductor chip 12 may be broken.

An object of the present invention is to provide an inner lead bonding apparatus and an inner lead bonding method that can prevent occurrence of bonding failure, circuit destruction, and the like due to static electricity.

[Structure of the Invention] (Means and Actions for Solving the Problems) The invention according to claim 1 is an invention in which a film carrier travels through a guide member and a semiconductor chip is bonded to an inner lead formed on the film carrier. An inner lead bonding apparatus comprising a non-contact type electrostatic detection device and a control unit for controlling a bonding operation based on an output of the electrostatic detection device.

According to the invention of claim 2, a plurality of guide members for guiding the transport of the film carrier are arranged on a transport path on which the film carrier is transported, and a bonding mechanism is disposed in the middle of the transport path, and the guide mechanism is provided via the guide member. In the inner lead bonding method for manufacturing a semiconductor device by bonding a semiconductor chip to the film carrier conveyed through the conveyance path via the bonding mechanism, a non-contact type electrostatic detection device may be used to attach the film carrier to the film carrier. An inner lead bonding method is characterized in that a semiconductor device is manufactured by detecting an amount of charged static electricity and controlling a bonding operation based on the detection result.

According to a third aspect of the present invention, a plurality of guide members for guiding the transport of the film carrier are disposed on a transport path on which the film carrier is transported, and a bonding mechanism is disposed in the middle of the transport path, and the guide mechanism is provided via the guide member. In the inner lead bonding method of manufacturing a semiconductor device by bonding a semiconductor chip to the film carrier conveyed through the conveyance path via the bonding mechanism, the semiconductor chip is formed by a non-contact type electrostatic detection device. Manufacturing a semiconductor device by detecting the amount of static electricity charged on a spacer tape that is wound upon being superimposed on the film carrier when winding the bonded film carrier, and controlling the bonding operation based on the detection result; Inner lead bonding method Located in.

According to a fourth aspect of the present invention, a plurality of guide members for guiding the transport of the film carrier are disposed on a transport path on which the film carrier is transported, and a bonding mechanism is disposed in the middle of the transport path, and the guide mechanism is provided via the guide member. In the inner lead bonding method for manufacturing a semiconductor device by bonding a semiconductor chip to the film carrier conveyed through the conveyance path via the bonding mechanism, a non-contact type electrostatic detection device may be used to attach the film carrier to the film carrier. When winding the film carrier on which the semiconductor chip is bonded and the amount of charged static electricity, the amount of static electricity charged on the spacer tape that is wound by being overlapped with the film carrier is detected,
An inner lead bonding method is characterized in that a semiconductor device is manufactured by controlling a bonding operation based on the detection result.

By doing so, the present invention is to monitor the amount of static electricity by the static electricity detecting device and the control unit, and to prevent the occurrence of bonding failure, circuit destruction, and the like due to static electricity.

(Embodiment) An embodiment of the present invention will be described below with reference to FIG. The same reference numerals are given to the same components as those described in the section of the related art, and the description will be omitted.

FIG. 1 shows an embodiment of the present invention.
This is an inner lead bonding machine that adopts B (Tape Automated Bonding) method. The inner lead bonding apparatus 1 has a supply reel 4 and a take-up reel 6 that are driven to rotate by a supply-side motor 3 and a take-up motor 5, respectively. Then, the inner lead bonding apparatus 1 separates the film carrier 2 and the spacer tape 16 wound on the supply reel 4 in a state of being overlapped with each other, and pulls them out in different directions.

The inner lead bonding apparatus 1 has a plurality of rotatable guide rollers 7,..., 8a, 8b, 17,... And sprockets 9a, 9b on the apparatus. Then, the film carrier 2 and the spacer tape 16 are separated from each other by the guide rollers 7,..., 8a, 8b, 17,.
It is set to contact 9a and 9b.

Further, in the inner lead bonding apparatus 1, the drawing ends of the film carrier 2 and the spacer tape 16 are fixed to the take-up reel 4. Then, by rotating both reels 4 and 6, the film carrier 2 and the spacer tape are rotated.
16 are run in different directions from each other, and then wound on the take-up reel 4 in a state where they are superimposed on each other. Then, the inner lead bonding apparatus 1 holds the film carrier 2
Guide rollers 7, 8a, 8b and sprocket 9a,
9b, the transfer path 11 between the loader side and the unloader side
It is guided to.

In the inner lead bonding apparatus 1, the film carrier 2 is pressed by the tape guide 13 in the bonding mechanism 10, and tension is applied to the film carrier 3 by the tape guide 13. And tape guide 13
This guides the carrier tape 3 while keeping it substantially horizontal.

Then, the inner lead bonding apparatus 1 temporarily stops the inner leads (finger leads) formed on the film carrier 2 below the bonding opening of the tape guide 13, and lowers the bonding tool 14, which has been heated to a high temperature. Then, the semiconductor chip 12 on the bonding stage 15 is mounted on the film carrier 2. By running the film carrier 2, the semiconductor chips (IC pellets) 12 to which the inner lead bonding is performed are conveyed to the take-up reel 6 side, and the inner leads to be next subjected to the inner lead bonding are sequentially bonded. Supply 10

Also, dancer rollers are indicated by 8a and 8b among the guide rollers. The dancer rollers 8a and 8b are mounted on the apparatus so that they can be displaced while keeping the film carrier 2 in contact, and can be slid up and down, for example. The dancer rollers 8a and 8b slide down to press down on the film carrier 2 to increase the tension of the film carrier 2 and slide upward to decrease the tension of the film carrier 2.

Further, reference numerals 21 and 22 in the drawing denote static electricity sensors as static electricity detecting devices. The electrostatic sensors 21 and 22 are arranged so as to face the respective film surfaces of the film carrier 2 and the spacer tape 16. The electrostatic sensors 21 and 22 are located near the film carrier 2 and the spacer tape 16. In contrast, they are separated by a predetermined amount.

Further, the electrostatic sensor 21 on the film carrier side among the electrostatic sensors 21 and 22 is arranged forward of the bonding mechanism 10 in the transport direction. Further, the electrostatic sensor 21 on the film carrier side is provided between a dancer roller 8b provided on the front side in the transport direction with respect to the bonding mechanism 10 and a guide roller 7 provided between the dancer roller 8b and the take-up reel 6. It is located at the site.

The static electricity sensor 21 faces the film surface of the film carrier 2 on which the semiconductor chip 12 is mounted, on the side on which the semiconductor chip 12 is mounted. Then, the amount of static electricity in a portion of the film carrier 2 which is tensioned by the dancer roller 8b and pulled straight without slack is detected.

Further, the electrostatic sensor 22 on the spacer tape side is arranged between the supply reel 4 and the take-up reel 6 and is located near the take-up reel 6 side. The electrostatic sensor 22 on the spacer tape side detects the amount of static electricity in a portion of the spacer tape 16 which is pulled straight by the spacer tape guide rollers 17 without any slack.

That is, the inner lead bonding apparatus 1 uses the electrostatic sensors 21 and 22 to move the film rollers 2 and the spacer tape 16 while the guide rollers 7.
, and the amount of static electricity generated by friction with the sprockets 9a and 9b, and the like, and the detection results of the electrostatic sensors 21 and 22 are input to the control unit 23.

Then, the inner lead bonding apparatus 1 monitors the amount of static electricity of the film carrier 2 and the spacer tape 16, and when the amount of static electricity becomes excessive and exceeds a preset value,
The controller 23 issues a command signal to, for example, the supply-side motor 3 and the winding-side motor 5 and the driving unit of the bonding tool 14 to stop the bonding operation. Further, the inner lead bonding apparatus 1 warns that the amount of static electricity has exceeded the set value by, for example, a lamp or a buzzer (not shown).

Therefore, the inner lead bonding apparatus 1
Dust or debris adheres to the junction between the semiconductor chip 12 being transported or the semiconductor chip 12 stored in the take-up reel 6 and the inner lead due to static electricity generated during the movement of the film carrier 2 and the spacer tape 16. As a result, it is possible to prevent the occurrence of a bonding failure and the destruction of the circuit of the semiconductor chip 12.

Further, since the inner lead bonding apparatus 1 detects the amount of static electricity of the film carrier 2 and the spacer tape 16 by the non-contact type electrostatic sensors 21 and 22, for example, the film carrier 2 and the spacer tape are detected by the electrostatic sensors 21 and 22. 16 or the semiconductor chip 12 mounted on the film carrier 2 is not damaged.

Further, both the electrostatic sensors 21 and 22 are connected to the film carrier 2.
And the spacer tape 16 are disposed so as to face the linearly stretched portions, respectively.
The distances between the film carriers 21 and 22 and the film carrier 2 and the spacer tape 16 can be kept substantially constant, and the amount of static electricity can always be accurately detected.

In this embodiment, the number of static sensors is set to two, but the present invention is not limited to this.
For example, the number of static sensors may be set to one or three or more.

[Effects of the Invention] As described above, the present invention can prevent occurrence of bonding failure, circuit destruction, and the like due to static electricity.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing one embodiment of the present invention, and FIG. 2 is a schematic configuration diagram showing a conventional example. 1 inner lead bonding apparatus, 2 tape carrier, 7, 8a, 8a guide roller (guide member),
9a, 9b: Sprocket (guide member), 12: Semiconductor chip, 21, 22: Static sensor (static detection device), 23: Control unit.

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/60 311 H01L 21/60 321

Claims (4)

(57) [Claims] An inner lead bonding apparatus for running a film carrier through a guide member and bonding a semiconductor chip to an inner lead formed on the film carrier. And a control unit for controlling a bonding operation based on an output of the apparatus. 2. A transport path on which a film carrier is transported,
A plurality of guide members for guiding the transport of the film carrier are arranged, and a bonding mechanism is arranged in the middle of the transport path, and the bonding mechanism is disposed on the film carrier transported on the transport path via the guide member. In the inner lead bonding method of manufacturing a semiconductor device by bonding a semiconductor chip, a non-contact type electrostatic detection device detects an amount of static electricity charged on the film carrier, and performs a bonding operation based on the detection result. An inner lead bonding method characterized by controlling and manufacturing a semiconductor device. 3. A transport path on which a film carrier is transported,
A plurality of guide members for guiding the transport of the film carrier are arranged, and a bonding mechanism is arranged in the middle of the transport path, and the bonding mechanism is disposed on the film carrier transported on the transport path via the guide member. In the inner lead bonding method for manufacturing a semiconductor device by bonding a semiconductor chip, a non-contact type electrostatic detection device is used to superimpose the semiconductor chip on the film carrier when winding the bonded film carrier. To detect the amount of static electricity charged on the spacer tape that is wound up.
An inner lead bonding method characterized in that a semiconductor device is manufactured by controlling a bonding operation based on the detection result. 4. A transport path on which a film carrier is transported,
A plurality of guide members for guiding the transport of the film carrier are arranged, and a bonding mechanism is arranged in the middle of the transport path, and the bonding mechanism is disposed on the film carrier transported on the transport path via the guide member. In the inner lead bonding method for manufacturing a semiconductor device by bonding a semiconductor chip, the amount of static electricity charged on the film carrier and the film carrier to which the semiconductor chip is bonded are wound by a non-contact type electrostatic detection device. An inner lead bonding method comprising: detecting an amount of static electricity charged on a spacer tape wound up by being superimposed on the film carrier when taking the film carrier; and controlling a bonding operation based on the detection result to manufacture a semiconductor device. .