JP2667468B2 - Carrier tape transfer device, inner lead bonding device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to a carrier tape transport device for transporting a carrier tape pressed onto the surface of a semiconductor chip component, and a transport of the carrier tape. The present invention relates to an inner lead bonding apparatus having the apparatus.

(Prior Art) In recent years, as shown in FIG. 3, so-called inner lead bonding, in which inner leads 2 provided on the surface of a carrier tape 1 are bonded to electrode portions 4 of a semiconductor chip 3, has become widespread. . In other words, this inner lead bonding is performed after the inner leads 2 provided on the cine film-shaped carrier tape 1 and the electrode portions 4 of the semiconductor chip 3 placed below the carrier tape 1 are opposed to each other and aligned. The semiconductor chip 3 is thermally welded to the inner leads 2 by simultaneously applying pressure to the inner leads 2 and the electrode portions 4 by a heated high-temperature bonding tool 5. Here, reference numerals 6... In the figure denote positioning holes opened at the crimping positions of the respective semiconductor chips 3.

Although not shown, the carrier tape 1 is mounted on a transporting device while being wound on a supply reel, and is guided to pass between the bonding tool 5 and the semiconductor chip 4 before welding. It is wound on a take-up reel. And the traveling route of the carrier tape 1 includes
Dancer roller for applying tension to the carrier tape 1,
Various other rollers, sprockets, tape guides, and the like are arranged. The carrier tape 1 supplied from the supply reel is guided by the rollers, sprockets, and other guide members, and is wound on a take-up reel.

Further, when the carrier tape 1 is wound around the cores of both reels or is guided to run on the various rollers, sprockets, tape guides, etc., the carrier tape 1 is curved on the reels, rollers, etc., that is, It is in contact with the running surface while bending.

By the way, in recent years, the IC size has been increased in accordance with the improvement in the yield of IC manufacturing. For this reason, for example, a piece having a size of 10 mm or more has been frequently used. However, in the case of inner lead bonding of such a large-sized semiconductor chip, when the carrier tape 1 is curved with a small radius of curvature in the path from the bonding to the winding on the winding reel, as shown in FIG. In some cases, the inner lead 2 may come into contact with the edge 3a of the semiconductor chip 3, or the inner lead 2 may be broken. In other words, when the radius of curvature is small, the carrier tape 1 guided for traveling sharply curves. On the other hand, the semiconductor chip 3 does not bend, and the inner leads 2 are pressed toward the carrier tape 1. . Accordingly, the pressing force deforms the inner lead 2, and the inner lead 2 may come into contact with the edge 3 a of the semiconductor chip 3 or the inner lead 2 may be broken.

(Problems to be Solved by the Invention) As described above, in the related art, the carrier tape is sharply curved, and thereby the inner leads crimped on the semiconductor chip come into contact with the edge portion of the semiconductor chip, or the inner leads are not bent. Was sometimes broken.

SUMMARY OF THE INVENTION An object of the present invention is to prevent these product defects caused by a sharp curvature of a carrier tape.

[Configuration of the invention]

(Means and Actions for Solving the Problems) In order to achieve the above object, the present invention provides a guide member that guides the carrier tape while curving the tape, by changing the radius of curvature R of the tape running surface to R ≧ 部 材 icosθ + (a− b)｝ / sinθ i: Lead length a: 1/2 of the length of the semiconductor chip in the transport direction b: Distance from the end of the semiconductor chip to the junction between the inner lead and the semiconductor chip h: Curved carrier tape And the inner lead having the carrier tape conveying device formed so as to have a height θ: tan ^-1 (h / b) of the bump of the inner lead caused by the above-described process. A bonding apparatus is obtained.

By doing so, the present invention makes it possible to moderate the curvature of the carrier tape, prevent the contact between the inner lead and the edge portion of the semiconductor chip, the breakage of the inner lead, and the like, and improve the yield rate. is there.

Embodiment An embodiment of the present invention will be described below with reference to the drawings.
In the description, the same parts as those described in the section of the prior art are designated by the same reference numerals.

FIG. 1 shows an embodiment of the present invention (an embodiment applied to a carrier tape conveying device of an inner lead bonding device). In the drawing, reference numeral 1 denotes a synthetic resin or the like, and one side thereof is substantially constant. This is a cine film carrier tape having inner leads 2 provided at intervals. The carrier tape 1 is led downward, for example, from a supply reel 8 driven by a supply-side motor 7, and comes into contact with a curved surface formed on the outer periphery of the first fixed roller 9, that is, a part of the tape running surface 10. Curved. Next, the carrier tape 1 reaches the supply-side dancer roller 11 arranged below the first fixed roller 9 and contacts the tape running surface 12 formed on the outer periphery of the dancer roller 11 to be curved,
It reaches the second fixed roller 13 arranged above. Here, the dancer roller 11 is adapted to slide as shown by an arrow A in the figure so that the carrier tape 1 can always be tensioned.

Further, the carrier tape 1 is curved in contact with the tape running surface 14 formed on the outer periphery of the second fixed roller 13, and then runs in a substantially horizontal state to reach the first sprocket 15 and the sprocket 15 In contact with the tape running surface 16 and is obliquely curved downward. In addition, the carrier tape 1 has feed holes (not shown) formed continuously at regular intervals.
Are provided, and the feed dogs 15a formed on the outer circumference of the sprocket 15 are inserted into the feed holes.

The carrier tape 1 is in a horizontal state in contact with the tape running surface 18 of the tape guide 17 having an open center. The bonding tool 5 is disposed above the opening 19 of the tape guide 17, and the tip of the bonding tool 5 faces the portion of the carrier tape 1 guided by the opening 19. The semiconductor chip 3 is provided below the bonding tool 5 with the carrier tape 1 interposed therebetween. Then, after positioning the inner leads 2 of the carrier tape 1 and the semiconductor chips 3 so as to face each other, a predetermined position of the carrier tape 1 is pressed by a heated bonding tool 5 for a certain period of time, and the electrodes of the semiconductor chips 3 (shown in FIG. Is welded to the inner lead 2. Note that the semiconductor chip 3 may be heated in advance.

Further, the carrier tape 1 in which the semiconductor chip 3 is pressure-bonded to its lower surface is placed on the tape running surface of the second sprocket 20.
And then bends in contact with each tape running surface 25, 26, 27 formed on each of the third fixed roller 22, the winding-side dancer roller 23, and the fourth fixed roller 24. And is taken up by the take-up reel 29 driven by the take-up motor 28. Here, 30 in FIG.
Is a spacer tape.

As described above, the carrier tape 1 is composed of the two reels 8, 29,
It travels while being guided by various rollers and guide members such as both sprockets 15 and 20. Furthermore, the radius of curvature of each tape running surface (12, 14, 16, etc.) formed on each of these guide members is set to 50 mm or more.

That is, when each part of the curved portion of the carrier tape 1 is set as shown in FIG. 2, the radius of curvature R of the tape running surface of the guide member (or the curved portion of the carrier tape 1) is R ≧ {icosθ + (Ab) ｂ / sin θ.

Here, i: lead length a: 1/2 of the length of the semiconductor chip 3 corresponding to the running direction of the carrier tape 1 b: from the end of the semiconductor chip 3 to the junction between the inner lead 2 and the semiconductor chip 3 Distance h: bump height of the inner lead 2 caused by the bending of the carrier tape 1 θ: tan ⁻¹ (h / b), and the inner lead 2 extends in the tangential direction of the curved carrier tape 1. It is assumed that bumps will occur.

Then, make each part an average size, that is, a = 5mm, b
= 0.2mm, h = 0.02mm, i = 0.5mm, the radius of curvature R
Of about 50 mm is obtained. That is, when the value of the radius of curvature R is 50 mm or more, the inner lead 2 and the semiconductor chip 3 do not come into contact with each other, and the inner lead 2 does not contact the semiconductor chip 3.
It is not pressed by. The inner lead 2 is not deformed, and the inner lead 2 does not contact the edge portion 3a of the semiconductor chip 3 or the inner lead 2 does not break. Therefore, by setting the radius of curvature of each of the tape running surfaces (12, 14, 16 and the like) to 50 mm or more, product defects due to the above-mentioned contact or breakage are significantly reduced, and the yield rate is increased.

The present invention is not limited to the above embodiments as long as the electronic components are formed into a tape carrier, and may be applied to, for example, an inspection device for performing an electrical inspection and a sealing device for performing resin sealing. Is possible. In addition to forming the radius of curvature of the guide member after bonding as described above as in the above embodiment, the present invention can be applied to the radius of curvature of the guide member provided before the bonding position. There is no particular problem.

〔The invention's effect〕

As described above, according to the present invention, the curvature of the carrier tape becomes gentle, so that the contact between the inner lead and the edge portion of the semiconductor chip and the breakage of the inner lead can be prevented, and the yield rate can be improved. There is an effect that can be.

[Brief description of the drawings]

1 and 2 show an embodiment of the present invention.
FIG. 1 is a schematic view showing a traveling path (traveling path) of a carrier tape used in an inner lead bonding apparatus.
FIGS. 3 and 4 are schematic views for explaining mathematical expressions in the embodiment, and FIGS. 3 and 4 are views showing a conventional example. FIG. 3 is a partially longitudinal front view showing a state of inner lead bonding. The figure is also a front view showing a state where a product defect has occurred. 1 ... Carrier tape, 2 ... Inner lead, 3 ... Semiconductor chip.

Claims (6)

(57) [Claims] 1. A carrier tape conveying apparatus for traveling and guiding a carrier tape having an inner lead bonded to a semiconductor component, wherein a curvature of the carrier tape traveling surface of a guide member for traveling and guiding the carrier tape while bending the carrier tape. The radius R is calculated as follows: R ≧ {icosθ + (ab)} / sinθ i: Lead length a: 1/2 of the length in the semiconductor chip transport direction b: Distance between the semiconductor chip end and the inner lead and the semiconductor chip A carrier tape transport device characterized in that the distance to the joint is h: the height of the inner lead bumps caused by the carrier tape being curved, θ: tan ^-1 (h / b). 2. The carrier tape transporting device according to claim 1, wherein the radius of curvature R is R ≧ 50 mm. 3. The carrier according to claim 1, wherein the guide member is provided on a carrier tape running path after at least the inner lead and the semiconductor component are bonded. Tape transport device. 4. In an inner lead bonding apparatus for guiding a carrier tape on which leads are formed while curving the semiconductor tape and bonding a semiconductor component to the inner lead, a guide member for guiding the traveling while curving the carrier tape is provided. The curvature radius R of the running surface of the carrier tape of the guide member is expressed as follows: R ≧ {icosθ + (ab)} / sinθ i: Length of lead a: 1/2 of length of semiconductor chip in transport direction b: Semiconductor The distance from the chip end to the junction between the inner lead and the semiconductor chip. H: The height of the bump of the inner lead generated when the carrier tape is curved. Θ: tan ^-1 (h / b) An inner lead bonding apparatus. 5. The inner lead bonding apparatus according to claim 4, wherein the radius of curvature R is R ≧ 50 mm. 6. The inner member according to claim 4, wherein the guide member is provided on a carrier tape running path after at least the inner lead and the semiconductor component are bonded. Lead bonding equipment.