JP2762448B2 - Manufacturing method of multilayer ceramic electronic component - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic electronic component such as a multilayer varistor widely used for electric products such as a video tape recorder, a liquid crystal television, and OA equipment. In addition, the present invention can be widely used in manufacturing multilayer ceramic electronic components such as multilayer ceramic substrates, multilayer ceramic capacitors, multilayer piezoelectric elements, and the like.

2. Description of the Related Art In recent years, in the field of electronic components, with miniaturization of circuit components, further miniaturization and higher performance of laminated varistors and the like are desired.

FIG. 7 is a diagram showing a cross section of a part of the laminated varistor. In FIG. 7, 1 is a varistor layer, 2 is an internal electrode,
3 is an external electrode. The internal electrodes 2 are alternately connected to two external electrodes 3.

First, the thinning of the varistor layer will be described. It is very difficult to make this varistor layer thinner. First, a method for manufacturing a laminated varistor will be briefly described. Here, a method for manufacturing a ceramic raw sheet will be described first. The ceramic raw sheet used when manufacturing this laminated varistor is made by dissolving a metal oxide powder such as ZnO which becomes a varistor layer in a solvent such as xylene or the like with a resin such as polyvinyl butyral, polyvinyl alcohol or polyacryloid. After uniformly dispersing in a vehicle and turning it into a slurry, the film is continuously formed at a high speed using a casting method (solution casting) as a ceramic raw sheet having a thickness of tens to several tens of microns. . The casting method used herein refers to a method in which a metal or an organic film such as a polyethylene terephthalate film (hereinafter, referred to as a PET film) is used as a support, and the slurry is uniformly spread on the support using a doctor blade or the like. It is applied to a film thickness and the solvent in the slurry is evaporated by hot air drying or natural drying to obtain a ceramic green sheet.

Then, when manufacturing the laminated varistor, after cutting the ceramic green sheet to a predetermined size, the electrodes are printed on the ceramic green sheet, and a plurality of ceramic green sheets including the printed ceramic green sheet are printed. Are manufactured through the steps of lamination, pressure bonding, cutting, and firing.

Here, in order to make the varistor layer thinner, it is necessary to make the ceramic green sheet thinner. However, as the ceramic raw sheet becomes thinner, pinholes and the like are more likely to be generated in the ceramic raw sheet. For this reason, the yield of the laminated varistor is rapidly reduced due to the thinning of the ceramic raw sheet. Similarly, both the electrode ink and the ceramic raw sheet have a vehicle in which a resin is dissolved in a solvent. Therefore, when the electrode ink is printed on the ceramic raw sheet, the solvent in the electrode ink dissolves the resin of the ceramic raw sheet. For this reason, the electrode ink printed on the ceramic green sheet erodes the ceramic green sheet, causes swelling, and tends to cause a short circuit. This will be described below with reference to FIG.

FIG. 8 is a view showing a state in which electrode ink is printed on a raw ceramic sheet by a screen printing method.
In FIG. 8, 4 is a screen frame, 5 is a screen,
6 is an electrode ink, 7 is a squeegee, 8 is a table, 9 is a base film, 10 is a ceramic raw sheet, and 11 is an electrode ink printed on the ceramic raw sheet 10. In FIG. 8, an electrode ink 6 is passed through a screen 5 stretched over a screen frame 4 and a squeegee 7 fixes a ceramic raw sheet 10 on the surface of a base film 9 fixed on a base 8.
Printed on top. At this time, the printed electrode ink 11 soaks into the raw ceramic sheet 10 and short-circuits are likely to occur.

On the other hand, by changing the type, amount, etc. of the resin in the ceramic green sheet, erosion, a combination with less swelling is being studied, but when the thickness of the ceramic green sheet is reduced to, for example, 30 microns or less, erosion, Few combinations do not swell. In addition, the combination of ceramic raw sheets that are less likely to erode and swell also causes the ink to dry too quickly when printing the electrode ink, resulting in poor workability during printing and cracking during the drying process after printing the electrode ink. Phenomena, or cracks occur when the pressed laminate is sintered, and it is difficult to obtain a practical combination.

Further, in the conventional laminating method, when the layers are multi-layered, partial thickness unevenness or a level difference occurs due to a difference in the number of partial laminations in the internal electrodes. Due to the unevenness due to the unevenness in thickness, it is not possible to form a laminate having a uniform thickness as a laminated varistor, which causes problems such as delamination (delamination) and cracks (cracks).

FIG. 9 is a cross-sectional view of a multilayer varistor when multi-layered. Here, it can be understood that the thickness B of the peripheral portion (the number of laminated internal electrodes 2 is small) is smaller than the thickness A of the central portion of the laminated varistor (the number of laminated internal electrodes 2 is large).

FIG. 10 is a diagram for explaining a difference in thickness between a central portion and a peripheral portion with respect to the number of layers. Here, the thickness of the green ceramic sheet used was 20 microns, and the thickness of the internal electrodes was 4 microns. FIG. 10 shows that when the number of layers exceeds 10 layers, the difference in thickness between the central portion and the peripheral portion exceeds 20 microns, that is, exceeds the thickness of the ceramic green sheet used.

Traditionally, several approaches have been taken to address this problem. In particular, with respect to the thinning of the varistor layer (or ceramic layer), the thinning of the ceramic layer, that is, the varistor layer, will be described by taking an example filed with respect to a multilayer ceramic capacitor. First, JP 52
JP-A-135050 and JP-A-52-133553 propose a method in which a stepped portion, that is, a peripheral portion, is inserted with a ceramic raw sheet newly removed by an amount corresponding to an internal electrode, and after laminating, a method of sintering is proposed. . However, it is necessary to remove several hundred or more ceramic raw sheets by this method with high precision, for example, in a size of 3.5 × 1.0 mm. In particular, the ceramic raw sheet alone, due to its thinness and softness,
It can hardly be handled mechanically. For example,
Even if it can be handled, it is difficult to cut out by punching or the like with high accuracy.

Similarly, as disclosed in Japanese Patent Application Laid-Open No. 61-102719, there is also a method of manufacturing a laminated ceramic capacitor in which both a ceramic raw sheet and an electrode sheet are punched out and sequentially laminated, but this also has a problem in mass productivity. . For example,
Punching a large number at a time is more disadvantageous in terms of cost and accuracy than printing. Further, when the thickness of the electrode sheet is set to 5 μm or less, the physical strength of the electrode sheet may not be able to withstand punching and handling.

In Japanese Patent Application Laid-Open No. 52-135051, an internal electrode ink is first applied onto a ceramic raw sheet, and a dielectric ink (or ceramic ink) is applied to the remaining portion where the internal electrode ink is applied. There has been proposed a method of stacking, pressing, and firing the internal electrode ink at different take-out positions. However, in this case, there remains a problem that the solvent contained in the newly printed dielectric ink attacks the lower laminate. For this reason, as the ceramic raw sheet is thinner, short-circuit and withstand voltage characteristics are more likely to be deteriorated.

Further, as a method not using a solvent in the electrode ink, there is an electrode forming method as disclosed in Japanese Patent Application Laid-Open No. 53-51458. There is also a method by an electroless plating method using an activating paste as disclosed in Japanese Patent Application Laid-Open No. 57-102166.However, in order to perform electrode formation using an electroless plating technique, a ceramic raw sheet is converted into a plating solution. A new problem arises from immersion.

In addition, as in Japanese Patent Application Laid-Open No. 53-42354, it has been considered that a ceramic raw sheet is partially punched or processed into a concave shape, but this is not practical.

Japanese Patent Application Laid-Open No. 56-94719 is the same, and is intended to form a ceramic green sheet at a position of a step formed on a laminate, and it is difficult to think that mass productivity is good.

Several other methods have been proposed to prevent the solvent in the electrode ink from adversely affecting the raw ceramic sheet.

For example, as disclosed in JP-A-56-106244, there is a method in which only electrodes are first formed on a base film by printing, and then a ceramic green sheet is formed thereon by a casting method. Also, as disclosed in Japanese Patent Publication No. 40-19975, a method of obtaining a ceramic unsintered thin film with electrodes by applying an electrode paint, drying and then continuously applying a dielectric slurry and peeling the slurry from the support. There is. However, when the film thickness of the ceramic electrode-embedded ceramic raw sheet made by these methods is reduced to about 5 to 20 microns, the mechanical strength is extremely reduced, so that it can no longer be handled by itself. For this reason, it was not possible to reduce the thickness to less than 20 microns.

Therefore, in the configuration of the multilayer varistor as described above,
In a method for manufacturing a laminated varistor that prints electrodes on a ceramic raw sheet, the ceramic raw sheet erodes and swells due to the solvent contained in the electrode ink.
As the ceramic raw sheet becomes thinner, it becomes easier to short-circuit. On the other hand, in the method for manufacturing a laminated varistor in which electrodes are embedded in a ceramic raw sheet and the electrode-embedded ceramic raw sheet is used, there is a limit to thinning by using the electrode-embedded ceramic sheet peeled from a support. . In addition, when the varistor layer and the internal electrode are multi-layered in particular, there is a problem that a step caused by the internal electrode between the central portion and the peripheral portion of the laminated varistor cannot be removed.

In view of the above problems, the present invention produces a laminated varistor having an extremely thin varistor layer and a multi-layered varistor layer by embedding an electrode in a ceramic green sheet, because the electrode is dried, the short circuit hardly occurs. Even when used, the steps generated by the internal electrodes between the central part and the peripheral part of the laminated varistor are reduced, and even thin ceramic raw sheets of about 20 microns or less can be handled while maintaining the mechanical strength and transferred. Means for Solving the Problems In order to solve the above problems, a method for manufacturing a multilayer ceramic electronic component of the present invention comprises forming a dried electrode. 10% by weight or more of 40% thermoplastic resin after drying on the support
After applying a slurry of ceramics blended so as to cover the electrodes, the ceramic slurry is dried to form an electrode-embedded ceramic raw sheet on the support, and then the electrode-embedded ceramics Without peeling the raw sheet from the support, after thermocompression bonding on the release surface of the previously laminated electrode-embedded ceramic raw sheet, only the support is separated and the electrode-embedded ceramic raw sheet is laminated in multiple layers. It is provided with such a configuration.

Effect of the Invention According to the present invention, the above-described configuration reduces the occurrence of erosion, swelling, and short-circuiting of the ceramic raw sheet due to the solvent contained in the electrode ink due to the drying of the electrode. Even when it is used in the manufacture of a ceramic substrate, embedding the electrode in the ceramic raw sheet makes it possible to reduce the level difference caused by the electrode. Further, after the ceramic raw sheet having the electrodes embedded therein is thermocompression-bonded onto another ceramic raw sheet or another electrode without peeling from the support, only the support is peeled off, and the electrode embedded ceramic green sheet is peeled off. The sheet will be transferred.

Example Hereinafter, a method for manufacturing a laminated varistor and a method for laminating the same according to one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 and FIG. 2 are views for explaining the state of laminating the electrode-embedded raw ceramic sheets in the first embodiment of the present invention. In FIGS. 1 and 2, reference numeral 20 denotes a base, reference numerals 21 and 21a denote base films, reference numeral 22 denotes a ceramic green laminate, reference numerals 23 and 23a denote electrodes, reference numeral 24 denotes a ceramic raw sheet, and reference numeral 25 denotes a ceramic raw sheet with embedded electrodes. 23a and a raw ceramic sheet 24. 26 is a heater, 27 is a hot plate, 28 is a transferred electrode, 29 is a transferred ceramic raw sheet with embedded electrodes, 30 is a transferred raw ceramic sheet with embedded electrodes, and the transferred electrode 28 and the transferred ceramic It is composed of a raw sheet 29. Arrows indicate the direction in which the hot platen 27 moves.

First, a description will be given with reference to FIG. First, a hot platen 27 heated by a heater 26 is placed on the side of the base film 21a on which the electrode-embedded ceramic raw sheet 25 is not formed. On the other hand, on the side of the base film 21a on which the electrode-embedded ceramic raw sheet 25 is formed, the base film 21 and the ceramic raw laminate 22 fixed on the table 20 are placed. At this time, the electrodes 23 are formed on the surface of the ceramic green laminate 22 by an appropriate method such as transfer or printing. Here, the electrode 23 does not necessarily need to be formed on the surface of the ceramic green laminate 22. Next, from the state shown in FIG.
The electrode-embedded ceramic raw sheet 25 formed on the surface of the base film 21a is heated and pressed on the surface of the ceramic raw laminate 22 by 27.

Next, a description will be given with reference to FIG. This FIG.
FIG. 4 is a view after the electrode embedded ceramic raw sheet 25 shown in the figure has been transferred. That is, as shown in FIG. 2, the electrode embedded ceramic raw sheet 25 on the base film 21a is transferred to the surface of the ceramic raw laminate 22 by the hot platen 27,
As a result, a transferred electrode-embedded ceramic raw sheet 30 composed of the transferred electrode 28 and the transferred ceramic raw sheet 29 is formed.

FIGS. 3 and 4 show a modification of the first embodiment, in which a ceramic green sheet formed on a base film 21b is provided on the surface of a ceramic green laminate 22 on which electrodes 23 are formed. 24A shows a state in which 24a is heated and pressed to form a transferred ceramic raw sheet 29a, and then the electrode embedded ceramic raw sheet 25 is heated and pressed. Here, the first
By repeating the steps shown in FIGS. 2 and 3 and the steps shown in FIGS. 3 and 4, multiple layers can be stacked.

Next, a more detailed description will be given. First, an electrode ink using palladium powder was prepared as an electrode ink for forming an electrode. It consists of 50.0 parts by weight of 0.3 micron particle size palladium powder and ethyl cellulose as resin.
To 5.0 parts by weight and 0.1 part by weight of the dispersant, butyl carbitol was added as a solvent so as to obtain an appropriate viscosity, and then 3
The mixture was sufficiently dispersed using this roll mill, butyl carbitol was added again on a three-roll mill, and the mixture was diluted while being dispersed until the viscosity became 100 poise.

Next, as a base film 21a for the electrode 23a (and the ceramic raw sheet 24), a film width of 200 mm,
Film thickness 75 microns, center core diameter 3 inches, length about
Using a 100-meter roll-shaped polyethylene terephthalate film (hereinafter referred to as a PET film), the electrode ink was spaced at regular intervals by screen printing using a 400-mesh stainless screen with an emulsion thickness of 10 microns. While printing continuously. here,
The shape of the electrode was 3.5 × 1.0 mm. Then, drying of the electrode ink after printing is about 12
A far-infrared belt furnace heated to 5 ° C. was connected to evaporate the solvent in the electrode ink, and this was used as an electrode 23a.

Next, how to make a ceramic slurry will be described. First, 6.0 parts by weight of a polyvinyl butyral resin (BL-2 butyral resin manufactured by Sekisui Chemical Co., Ltd.) was added to a resin solution consisting of 0.6 parts by weight of dibutyl phthalate, 25.0 parts by weight of ethyl alcohol, and 36.0 parts by weight of toluene, to obtain a particle size of 1: 1. It was added together with 31.0 parts by weight of a varistor powder mainly composed of micron ZnO and stirred well. Next, this was put into a polyethylene bottle, zirconia beads were added, and mixed and dispersed until an appropriate dispersion state was obtained. Next, after preliminary filtration of this, 10
Pressure filtration using a micron membrane filter,
A ceramic slurry was used.

Next, this ceramic slurry was continuously applied to the base film 21a on which the electrode 23a was formed using an applicator. Next, this was dried to obtain an electrode-embedded ceramic raw sheet 25, and the film thickness was measured with a micrometer. As a result, the film thickness of the ceramic raw sheet 25 was 18 microns.

Next, a method of manufacturing a laminated varistor using the ceramic raw sheet 25 with embedded electrodes will be described. First, a ceramic green laminate 22 having a thickness of 200 μm and having no electrodes formed thereon was fixed together with the base film 21 on the table 20 shown in FIG. As shown in FIGS. 3 and 4, the necessary number of laminated ceramic raw sheets 25 with electrodes were transferred thereon. Here, the transfer is performed using a hot platen 27 from the side of the base film 21a under the conditions of a temperature of 180 ° C. and a pressure of 15 kilograms per square centimeter, and after transferring the electrode embedded ceramic raw sheet 25, the base film 21a is peeled off. went. This is done by transferring the ceramic raw sheet 24a as shown in FIG. 3 and then displacing the electrodes (23, 23a) thereon by a fixed pitch as shown in FIG. The sheet is placed on a base film 21 using a hot platen 27.
Transfer was performed by heating from the a side.

Hereinafter, this is repeated so that the electrodes are alternately shifted as shown in FIG. 7, so that the electrodes have 31 layers. And
Finally, to prevent warpage during firing and increase mechanical strength,
A ceramic green sheet having no electrode formed thereon was transferred to a thickness of 200 microns. The laminate obtained in this way is referred to as 2.4
After cutting into a chip of × 1.6 mm, it was baked at 1250 ° C. for 1 hour.

For comparison, as a conventional method, the same electrode was directly formed on a ceramic green sheet having the same composition and thickness as described above as an internal electrode by a screen printing method as shown in FIG.
A ceramic green sheet was transferred thereon so as to have the same thickness, and the following steps were repeated. The conditions such as pressure, cutting, and firing during lamination were all the same as described above.

Here, the number of samples was n = 100. Next, an external electrode was formed using a usual method.

By observing the fine structure of the varistor thus manufactured with a scanning electron microscope, the presence or absence of delamination and short circuit was confirmed.

 The results are shown in Table 1 below.

As described above, it can be seen that the use of the method for manufacturing a laminated varistor according to the present invention significantly improves both the occurrence rate of short-circuit and the occurrence rate of delamination as compared with the conventional method. Here, when investigating the causes of the occurrence of short-circuits in the present invention, it was considered that most of them were caused by pinholes in the ceramic green sheet. At the same time, in the present invention, since the electrodes are embedded in the ceramic raw sheet, the difference in thickness between the central portion and the peripheral portion of the laminated varistor has been greatly improved, which reduces the occurrence rate of delamination. Was speculated.

Further, the non-linear index α and the varistor voltage Vth of the varistor of the present invention were measured by ordinary methods, and both were superior to those of the conventional method.

Here, the ceramic raw sheet portion of the electrode-embedded ceramic raw sheet used in the present invention has a heat transfer property due to the property of the polyvinyl chillal resin contained therein. In addition, the transferability due to the heat is due to the polyvinyl butyral resin (hereinafter, referred to as “polyvinyl butyral”) contained in the green ceramic sheet.
The smaller the amount of PVB resin, the lower the transferability. On the contrary, the larger the amount of PVB resin contained, the better the transferability. PV contained in the ceramic raw sheet used here
The resin B contained about 20 g per 100 g of the ceramic powder had good transferability. However, the amount of PVB resin required for transfer here depends on the particle size of the ceramic powder of the slurry raw material, the degree of polymerization and type of the PVB resin, or the temperature at the time of transfer. It is thought to change. When the amount of resin is insufficient, it is necessary to increase the transfer temperature.

Next, with respect to the varistor powder having the particle size used in the experiment, the amount of the resin contained in the ceramic green sheet and the result of the experiment on the transferability of the ceramic green sheet are described in the second section below.
It is shown in the table. Here, the ceramic raw sheet is made of varistor powder, dibutyl phthalate as a plasticizer, and
It was made of PVB resin, and the transferability when the weight percentage of the PVB resin contained therein was changed was examined. Here, the amount of dibutyl phthalate added to the green ceramic sheet was fixed at 10% by weight of the PVB resin. The transferability of the ceramic green sheet was tested by transferring the ceramic raw sheet with embedded electrodes onto a ceramic green laminate having electrodes formed on the surface as shown in FIG. The transfer was performed by pressing a hot plate heated to a temperature of 180 ° C. from the base film side at a transfer pressure of 15 kilograms per square centimeter. Further, the amount of the PVB resin was represented by% by weight in the raw ceramic sheet.

Next, a laminated varistor was manufactured in the same manner as in the example of Table 1 using the ceramic raw sheet of Table 2. Included in the raw ceramic sheet at this time
Table 3 below shows the relationship between the amount of PVB resin and the rate of delamination.

From Table 3, it can be seen that those having a PVB resin content of about 10 to 40% by weight hardly cause delamination. From the above, it can be seen that a PVB resin content of 10 to 40% by weight, especially about 15% by weight of the raw ceramic sheet has good transferability and less occurrence of delamination.

Here, as a resin having a transfer property such as a PVB resin, there are other thermoplastic resins such as an acrylic resin, a vinyl resin, and a cellulose derivative resin. Also, besides the thermoplastic resin, even for a curable resin or a polymerizable resin, by setting the curing conditions and the polymerization conditions appropriately, for example, by making it a rubber-like resin,
It can be transferred by providing the surface with tackiness and can be used as a resin for a ceramic green sheet.

Further, in the case as shown in FIGS. 3 and 4, the ceramic raw sheet 24a is a non-transferable ceramic raw sheet containing only about 5 parts by weight of resin with respect to 100 parts by weight of the varistor powder. However, the layers can be alternately stacked by using the electrode-embedded sheet having excellent transferability of the present invention.

Next, FIG. 5 is a view for explaining a method of transferring an electrode-embedded raw ceramic sheet using a heat roller in the second embodiment of the present invention. In FIG. 5, reference numeral 31 denotes a heat roller, which is set at a constant temperature by a heater 26a. Then, the electrode embedded ceramic raw sheet 25
Is passed between the ceramic green laminate 22 and the heat roller 31, the electrode-embedded ceramic green sheet 25 is transferred to the surface of the ceramic green laminate 22 to become the transferred electrode-embedded ceramic raw sheet 30. According to this method, the transfer of the electrode-embedded ceramic raw sheet can be continuously performed.

Next, FIG. 6 is a view for explaining an example of a method for producing a ceramic raw sheet with embedded electrodes. In FIG. 6, 32 is an applicator and 33 is a slurry of ceramics, which is set in the applicator 32. Arrows indicate the direction in which the base film 21a moves. Sixth
In the figure, a base film 2 on which electrodes 23a are formed in advance
1a, the ceramic slurry 33 is applied to the surface by the applicator 32 in which the ceramic slurry 33 is set, and the ceramic raw sheet 25 is formed. here,
The applicator 32 is preferably one that can form a coating film of about 5 to 20 microns. Further, the applicator 32 may be moved while the base film 21a is fixed.

In the present invention, at the time of transfer, heat, light, electron beam,
The transfer may be performed using microwaves, X-rays, or the like. Further, transfer at room temperature is also possible by changing the amount of addition of the type of PVB resin, the type of plasticizer, and the like.

Further, the method of the present invention can be applied not only to the multilayer varistor described in the above embodiment but also to other multilayer ceramic electronic components such as a multilayer ceramic substrate and a multilayer ceramic capacitor.

Effect of the Invention As described above, the present invention provides a support on which a dried electrode is formed, wherein the thermoplastic resin after drying is 10% by weight or more.
After applying a ceramic slurry blended so as to be 40% by weight or less so as to cover the electrode, the ceramic slurry is dried to form an electrode-embedded ceramic raw sheet on the support, and then the electrode embedded Without peeling the ceramic raw sheet from the support,
After thermocompression bonding on the peeling surface of the previously embedded electrode-embedded ceramic raw sheet, by laminating only the support and laminating the electrode-embedded ceramic raw sheet in multiple layers, by drying the electrodes, Improve the yield while reducing the adverse effects of the solvent contained in the electrode ink as much as possible, and without damaging the ceramic raw sheet with the support during handling. A multilayer ceramic electronic component such as a multilayer varistor can be manufactured.

[Brief description of the drawings]

FIGS. 1 and 2 are views for explaining a state of laminating ceramic raw sheets with embedded electrodes according to a first embodiment of the present invention, and FIGS. 3 and 4 are modified examples of the first embodiment. FIG. 5 is a diagram for explaining a method of transferring an electrode-embedded ceramic raw sheet using a heat roller according to the second embodiment of the present invention, and FIG. 6 is a diagram for explaining an electrode embedding in the present invention. FIG. 7 is a view for explaining an example of a method for manufacturing a ceramic green sheet, FIG. 7 is a view showing a part of a laminated varistor in a cross section, and FIG. 9 is a cross-sectional view of a multi-layer varistor when multi-layering is performed, and FIG. 10 is a diagram illustrating a difference in thickness between a central portion and a peripheral portion with respect to the number of layers. 20 …… table, 21,21a, 21b …… base film, 22 …… ceramic raw laminate, 23,23a …… electrode, 24,24a …… ceramic raw sheet, 25 …… electrode embedded ceramic raw sheet,
26: heater, 27: hot platen, 28: transferred electrode, 29
…… Transferred ceramic sheet with embedded electrodes, 30…
… Transferred ceramic raw sheet with embedded electrodes, 31 ……
Heat roller, 32 Applicator, 33 Ceramic slurry.

──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Koji Okuyama 1006 Odakadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. In-company (56) References JP-A-62-65405 (JP, A) JP-A-56-169314 (JP, A) JP-B-40-19975 (JP, B1) (58) Fields investigated (Int. . ⁶ , DB name) H01C 7/02-7/22

Claims (1)

(57) [Claims] 1. A method of manufacturing a multilayer ceramic electronic component by manufacturing a multilayer ceramic electronic component by laminating an electrode-embedded ceramic raw sheet in which electrodes are embedded in a multilayer, comprising a support on which a dried electrode is formed. A ceramic slurry mixed so that the thermoplastic resin content is 10% by weight or more and 40% by weight or less after drying is applied on the body so as to cover the electrodes, and then the ceramic slurry is dried to form a mixture on the support. A ceramic raw sheet with embedded electrodes is formed thereon, and then, without being peeled from the support, the ceramic raw sheet with embedded electrodes is thermocompression-bonded onto the peeled surface of the previously laminated ceramic raw sheet with embedded electrodes. A multilayer ceramic electronic component characterized in that the ceramic raw sheet with embedded electrodes is laminated in multiple layers by peeling off only Manufacturing method.