JP2696888B2 - Manufacturing method of multilayer ceramic electronic component - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic electronic component such as a multilayer ceramic capacitor widely used for electric products such as a video tape recorder, a liquid crystal television, and OA equipment. In addition, the present invention can be widely used when manufacturing multilayer ceramic electronic components such as multilayer ceramic substrates, multilayer varistors, and multilayer piezoelectric elements.

2. Description of the Related Art In recent years, in the field of electronic components, with the increase in the density of circuit components, further miniaturization and higher performance of multilayer ceramic capacitors and the like have been desired. Here, a multilayer ceramic capacitor will be described as an example.

FIG. 7 is a diagram showing a cross section of a part of the multilayer ceramic capacitor. In FIG. 7, 1 is a ceramic dielectric layer, 2 is an internal electrode, and 3 is an external electrode. The internal electrodes 2 are alternately connected to two external electrodes 3.

In recent years, the chipping of electronic components has been remarkable, and miniaturization of such a multilayer ceramic capacitor is desired as described above. In this multilayer ceramic capacitor, a mere reduction in area directly leads to a decrease in electric capacity. For this reason, high capacitance must be achieved at the same time as miniaturization of the multilayer ceramic capacitor.

As a method for increasing the capacitance of the multilayer ceramic capacitor, in addition to increasing the dielectric constant of the dielectric, it has been considered to reduce the thickness of the dielectric layer and increase the number of layers of the dielectric layer and the internal electrodes.

First, the thickness reduction of the dielectric layer will be described. It is very difficult to make this dielectric thinner. First, a method for manufacturing a multilayer ceramic capacitor will be briefly described. here,
First, a method of manufacturing a ceramic green sheet will be described. The ceramic raw sheet used in manufacturing this multilayer ceramic capacitor is a vehicle made by dissolving a resin such as polyvinyl butyral, polyvinyl alcohol, and polyacryloid in a solvent such as xylene, etc. After uniformly dispersing it into a slurry and turning it into a slurry, it is continuously cast at high speed (solution casting).
To form a film as a ceramic green sheet having a thickness of several tens of microns to several tens of microns. The casting method used herein refers to a method in which a metal or an organic film such as a polyethylene terephthalate film (hereinafter, referred to as a PET film) is used as a support, and the slurry is uniformly spread on the support using a doctor blade or the like. It is applied to a film thickness and the solvent in the slurry is evaporated by hot air drying or natural drying to obtain a ceramic green sheet.

Then, in the case of manufacturing a multilayer ceramic capacitor, the ceramic green sheet is then cut into a predetermined size, electrodes are printed on the ceramic green sheet, and a plurality of ceramic green sheets including the printed ceramic green sheet are printed. The sheet is produced through the steps of lamination, pressure bonding, cutting, and firing.

Here, in order to make the dielectric layer thinner, it is necessary to make the ceramic raw sheet thinner. However, as the ceramic raw sheet is made thinner, pinholes and the like are more likely to be generated in the ceramic raw sheet. . For this reason, the yield of the multilayer ceramic capacitor is rapidly reduced due to the thinning of the ceramic green sheet. In addition, due to the solvent contained in the electrode ink, the electrode ink printed on the raw ceramic sheet erodes the raw ceramic sheet, swells, and tends to cause a short circuit. This is described below in the eighth.
This will be described with reference to the drawings.

FIG. 8 is a view showing a state in which electrode ink is printed on a ceramic raw sheet by a screen printing method. In FIG. 8, 4 is a screen frame, 5 is a screen, 6 is an electrode ink, 7 is a squeegee, 8 is a table, 9 is a base film, 10 is a ceramic raw sheet, and 11 is printed on the ceramic raw sheet 10. Electrode ink. 8th
In the figure, an electrode ink 6 is printed by a squeegee 7 on a ceramic raw sheet 10 on a surface of a base film 9 fixed on a base 8 through a screen 5 stretched on a screen frame 4. At this time, the printed electrode ink 11
Are dyed in the ceramic raw sheet 10 and short-circuits are likely to occur.

On the other hand, by changing the type, amount, etc. of the resin in the ceramic green sheet, erosion, a combination with less swelling is being studied, but when the thickness of the ceramic green sheet is reduced to, for example, 30 microns or less, erosion, Few combinations do not swell. In addition, the combination of ceramic raw sheets that are less likely to erode and swell also causes the ink to dry too quickly when printing the electrode ink, resulting in poor workability during printing and cracking during the drying process after printing the electrode ink. Phenomena, or cracks occur when the pressed laminate is sintered, and it is difficult to obtain a practical combination.

For this reason, practically, the dielectric layers and the internal electrodes are multilayered. However, in the conventional laminating method, when the layers are multi-layered, a partial thickness unevenness or a step due to a partial difference in the number of laminated layers in the internal electrode occurs. Due to the unevenness due to the unevenness in thickness, it is not possible to stack a uniform thickness as a multilayer ceramic capacitor, which causes problems such as delamination (delamination) and cracks (cracks).

FIG. 9 is a cross-sectional view of the multilayer ceramic capacitor when multi-layered. Here, it can be seen that the thickness B of the peripheral portion (the number of laminated internal electrodes 2 is small) is smaller than the thickness A of the central portion (the number of laminated internal electrodes 2 is large) of the multilayer ceramic capacitor.

FIG. 10 is a diagram for explaining a difference in thickness between a central portion and a peripheral portion with respect to the number of layers. Here, the thickness of the green ceramic sheet used was 20 microns, and the thickness of the internal electrodes was 4 microns. FIG. 10 shows that when the number of layers exceeds 10 layers, the difference in thickness between the central portion and the peripheral portion exceeds 20 microns, that is, exceeds the thickness of the ceramic green sheet used.

Traditionally, several approaches have been taken to address this problem. First, JP-A-52-135050 and JP-A-52-133553 disclose a method in which a ceramic raw sheet newly removed by an amount corresponding to an internal electrode is interposed in a step portion or a peripheral portion, and after laminating, it is fired. Has been proposed. However, according to this method, it is necessary to remove several hundred or more ceramic raw sheets with high precision, for example, in a size of 3.5 × 1.0 mm. In particular, a single ceramic raw sheet cannot be mechanically handled due to its thinness and softness. Even if it can be handled, it is difficult to cut out by punching or the like with high accuracy.

Similarly, as disclosed in Japanese Patent Application Laid-Open No. 61-102719, there is also a method of manufacturing a laminated ceramic capacitor in which both a ceramic raw sheet and an electrode sheet are punched out and sequentially laminated, but this also has a problem in mass productivity. . For example,
Punching a large number at a time is more disadvantageous in terms of cost and accuracy than printing. Further, when the thickness of the electrode sheet is set to 5 μm or less, the physical strength of the electrode sheet may not be able to withstand punching and handling.

In JP-A-52-135051, first, an internal electrode ink is applied on a ceramic raw sheet, and a dielectric ink is applied to the remaining portion where the internal electrode ink is applied,
There has been proposed a method in which the position of taking out the internal electrode ink is changed, and the weight of the ink is stacked, pressed, and fired. But,
In this case, there remains a problem that the underlying laminate is attacked by the solvent contained in the newly printed dielectric ink. For this reason, as the ceramic raw sheet is thinner, short-circuit and withstand voltage characteristics are more likely to deteriorate.

Further, as a method not using a solvent in the electrode ink, there is an electrode forming method as disclosed in Japanese Patent Application Laid-Open No. 53-51458. There is also a method by an electroless plating method using an activating paste as disclosed in Japanese Patent Application Laid-Open No. 57-102166.However, in order to perform electrode formation using an electroless plating technique, a ceramic raw sheet is converted into a plating solution. A new problem arises from immersion.

In addition, as in Japanese Patent Application Laid-Open No. 53-42353, it has been considered that a ceramic raw sheet is partially punched or processed into a concave shape, but this is not practical.

JP-A-56-94719 is the same,
It is intended to form a ceramic green sheet at the location of the step formed on the laminate, and it is unlikely that mass productivity is good.

Several other methods have been proposed to prevent the solvent in the electrode ink from adversely affecting the raw ceramic sheet.

For example, as disclosed in JP-A-56-106244, there is a method in which only electrodes are first formed on a base film by printing, and then a ceramic green sheet is formed thereon by a casting method. Also, as disclosed in Japanese Patent Publication No. 40-19975, a method of obtaining a ceramic unsintered thin film with electrodes by applying an electrode paint, drying and then continuously applying a dielectric slurry and peeling the slurry from the support. There is. However, when the film thickness of the ceramic electrode-embedded ceramic raw sheet made by these methods is reduced to about 5 to 20 microns, the mechanical strength is extremely reduced, so that it can no longer be handled by itself. For this reason, it was not possible to reduce the thickness to less than 20 microns.

Therefore, in the structure of the multilayer ceramic capacitor as described above, in the method of manufacturing a multilayer ceramic capacitor in which electrodes are printed on a ceramic green sheet, the ceramic green sheet is formed by a solvent contained in the electrode ink. Erosion and swelling occur, and the thinner the ceramic raw sheet, the more likely it is to cause a short circuit. On the other hand, in a method for manufacturing a laminated ceramic capacitor using electrodes embedded in a ceramic raw sheet and using the electrode-embedded ceramic raw sheet, there is a limit to thinning by using the electrode embedded ceramic sheet peeled off from a support. Was. In addition, in the case where the dielectric layers and the internal electrodes are multi-layered, there is a problem that a step caused by the internal electrodes cannot be removed between the central portion and the peripheral portion of the multilayer ceramic capacitor. .

The present invention has been made in view of the above-described problems, and in that the electrodes are polymerized or hardened, so that the electrodes are not eroded by the ceramic raw sheet. By being embedded in the ceramic green sheet, the electrode is hardly corroded, so that even when it is used for manufacturing a multilayer ceramic capacitor having a multilayered dielectric layer and internal electrodes, the multilayer ceramic capacitor can be formed between the central portion and the peripheral portion. It is an object of the present invention to provide a method for manufacturing a laminated ceramic electronic component which can reduce a step generated by an internal electrode and can handle and transfer a thin ceramic green sheet of about 20 microns or less while maintaining mechanical strength.

Means for Solving the Problems In order to solve the above-mentioned problems, the method for producing a multilayer ceramic electronic component of the present invention comprises, on a support on which a polymerized or cured electrode is formed, a thermoplastic resin which is dried after drying.
After applying a dielectric slurry blended to be not less than 40% by weight and not more than 40% by weight, the dielectric slurry is dried,
After making an electrode-embedded ceramic raw sheet on the support, without peeling the electrode-embedded ceramic raw sheet from the support, after thermocompression bonding on another ceramic raw sheet or another electrode, Only the support is peeled off, and the electrode-embedded ceramic raw sheet is transferred onto the other ceramic raw sheet or another electrode.

Action The present invention has the above-described configuration, in which the electrodes are polymerized or cured, so that the ceramic raw sheet erodes and swells due to the solvent contained in the electrode ink.
Shorting is reduced, and the electrode is hardly attacked by the solvent contained in the dielectric slurry.Even when used when manufacturing a multilayer ceramic capacitor having a multilayer structure, by embedding the electrode in a ceramic raw sheet, The step generated by the electrodes can be reduced. Further, after the ceramic raw sheet having the electrodes embedded therein is thermocompression-bonded onto another ceramic raw sheet or another electrode without peeling from the support, only the support is peeled off, and the electrode embedded ceramic green sheet is peeled off. The sheet will be transferred.

EXAMPLES Hereinafter, a method for manufacturing a multilayer ceramic capacitor and a method for laminating the same according to one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 and FIG. 2 are views for explaining the state of laminating the electrode-embedded raw ceramic sheets in the first embodiment of the present invention. In FIGS. 1 and 2, reference numeral 20 denotes a base, reference numerals 21 and 21a denote base films, reference numeral 22 denotes a ceramic green laminate, reference numerals 23 and 23a denote electrodes, reference numeral 24 denotes a ceramic raw sheet, and reference numeral 25 denotes a ceramic raw sheet with embedded electrodes. 23a and a raw ceramic sheet 24. 26 is a heater, 27 is a hot plate, 28 is a transferred electrode, 29 is a transferred ceramic raw sheet with embedded electrodes, 30 is a transferred raw ceramic sheet with embedded electrodes, and the transferred electrode 28 and the transferred ceramic It is composed of a raw sheet 29. Arrows indicate the direction in which the hot platen 27 moves.

First, a description will be given with reference to FIG. First, a hot platen 27 heated by a heater 26 is placed on the side of the base film 21a on which the electrode-embedded ceramic raw sheet 25 is not formed. On the other hand, on the side of the base film 21a on which the electrode-embedded ceramic raw sheet 25 is formed, the base film 21 and the ceramic raw laminate 22 fixed on the table 20 are placed. At this time, the electrodes 23 are formed on the surface of the ceramic green laminate 22 by an appropriate method such as transfer or printing. Here, the electrode 23 does not necessarily need to be formed on the surface of the ceramic green laminate 22. Next, from the state shown in FIG.
The electrode-embedded ceramic raw sheet 25 formed on the surface of the base film 21a is heated and pressed on the surface of the ceramic raw laminate 22 by 27.

Next, a description will be given with reference to FIG. This FIG.
FIG. 4 is a view after the electrode embedded ceramic raw sheet 25 shown in the figure has been transferred. That is, as shown in FIG. 2, the electrode embedded ceramic raw sheet 25 on the base film 21a is transferred to the surface of the ceramic raw laminate 22 by the hot platen 27,
As a result, a transferred electrode-embedded ceramic raw sheet 30 composed of the transferred electrode 28 and the transferred ceramic raw sheet 29 is formed.

FIGS. 3 and 4 show a modification of the first embodiment, in which a ceramic green sheet formed on a base film 21b is provided on the surface of a ceramic green laminate 22 on which electrodes 23 are formed. 24A shows a state in which 24a is heated and pressed to form a transferred ceramic raw sheet 29a, and then the electrode embedded ceramic raw sheet 25 is heated and pressed. Here, Figure 1,
By repeating the steps of FIG. 2 and the steps of FIGS. 3 and 4, it is also possible to laminate over multiple layers.

Next, a more detailed description will be given. First, as an electrode ink for forming an electrode, an electrode ink using palladium powder was prepared. As a vehicle for electrode ink,
A linseed oil varnish used as an oxidation polymerization type resin for general letterpress ink and flat plate ink was used. Here, as the vehicle for the prototype ink, No. 3 linseed oil varnish (measured at a temperature of 25 ° C. and a shear rate of 100 sec inverse with a viscosity of 36 poise using a double-cylindrical viscometer under the measurement conditions) was selected. It is. 59% by weight of this No. 3 linseed oil varnish and 1% by weight of a dispersant were added, and 40% by weight of palladium powder having a particle diameter of 0.3 micron was added to 100% by weight. Dispersed and made into ink. The ink thus completed had a viscosity of 50 poise with a double cylindrical viscometer under the measurement conditions of a measurement temperature of 25 ° C. and a shear rate of 100 section inverse.

Next, as a base film 21a for the electrode 23a (and the ceramic raw sheet 24), a film width of 200 mm,
Film thickness 75 microns, center core diameter 3 inches, length about
Using a 100-meter roll-shaped polyethylene terephthalate film (hereinafter referred to as a PET film), the electrode ink was applied at regular intervals by a screen printing method using a 400-mesh stainless steel screen with an emulsion thickness of 10 microns. Printing was performed continuously with a gap. Here, the shape of the electrode was 3.5 × 1.0 mm. And drying by polymerization of the electrode ink after printing,
A far-infrared belt furnace heated to about 125 ° C. was connected next to the printing machine, and the polymerization reaction in the electrode ink was carried out while proceeding, and this was used as an electrode 23a.

Next, how to make a dielectric slurry will be described. First, polyvinyl butyral resin (Sekisui Chemical Co., Ltd., B
L-2 butyral resin) 6.0 parts by weight, dibutyl phthalate
0.6 parts by weight, ethyl alcohol 25.0 parts by weight, toluene 36.
A barium titanate powder having a particle size of 1 micron and 31.0 parts by weight were added to a resin solution consisting of 0 parts by weight, and the mixture was thoroughly stirred. Next, this was put into a polyethylene bottle, zirconia beads were added, and mixed and dispersed until an appropriate dispersion state was obtained. Next, this was temporarily filtered, and then subjected to pressure filtration using a 10-micron membrane filter to obtain a dielectric slurry.

Next, this dielectric slurry is used with an abricator,
The coating was continuously applied on the base film 21a on which the electrode 23a was formed. Next, this was dried to obtain an electrode-embedded ceramic raw sheet 25, and the film thickness was measured with a micrometer. As a result, the film thickness of the ceramic raw sheet 25 was 18 microns.

Next, a method of manufacturing a multilayer ceramic capacitor using the electrode-embedded ceramic raw sheet 25 will be described. First, a ceramic green laminate 22 having a thickness of 200 μm and having no electrodes formed thereon was fixed together with the base film 21 on the table 20 shown in FIG. On this, as shown in FIG. 3 and FIG.
25 were transferred. Here, the transfer is performed using a hot platen 27 from the side of the base film 21a at a temperature of 180 ° C. and a pressure of 15 kilograms per square centimeter, and after transferring the electrode-embedded ceramic raw sheet 25, the base film 21a
Was peeled off. This is done by transferring the ceramic raw sheet 24a as shown in FIG. 3 and then displacing the electrodes (23, 23a) thereon by a fixed pitch as shown in FIG. The sheet was transferred by heating from the base film 21b side using a hot platen 27.

Hereinafter, this is repeated so that the electrodes are alternately shifted as shown in FIG. 7, so that the electrodes have 51 layers. And
Finally, to prevent warpage during firing and increase mechanical strength,
A ceramic green sheet having no electrode formed thereon was transferred to a thickness of 200 microns. The laminate obtained in this way is referred to as 2.4
After cutting into a chip of × 1.6 mm, it was baked at 1300 ° C. for 1 hour.

For comparison, as a conventional method, the same electrode was directly formed on a ceramic green sheet having the same composition and thickness as described above as an internal electrode by a screen printing method as shown in FIG.
A ceramic green sheet was transferred thereon so as to have the same thickness, and this was repeated thereafter. The conditions such as pressure, cutting, and firing during lamination were all the same as described above.

Here, the number of samples was n = 100. Next, external electrodes were formed using a usual method, and the occurrence ratio of short circuits was examined. The results are shown in Table 1 below.

As described above, it can be seen that the use of the method for manufacturing a multilayer ceramic capacitor according to the present invention significantly improves both the occurrence rate of short circuit and the occurrence rate of delamination as compared with the conventional method. Here, when investigating the causes of the occurrence of short-circuits in the present invention, it was considered that most of them were caused by pinholes in the ceramic green sheet. At the same time, in the present invention, since the electrodes are embedded in the ceramic green sheet, the difference in thickness between the central portion and the peripheral portion of the multilayer ceramic capacitor has been greatly improved, and this reduces the occurrence of delamination. Was speculated.

Here, the ceramic raw sheet portion of the electrode-embedded ceramic raw sheet used in the present invention has a transfer property due to heat due to the property of polyvinyl butyral resin contained therein. In addition, the transferability due to the heat, the less the polyvinyl butyral resin (hereinafter referred to as PVB resin) contained in the raw ceramic sheet, the worse the transferability, and conversely, the amount of PVB resin contained The larger the number, the better the transferability. As for the PVB resin contained in the raw ceramic sheet used here, the transferability was good when the PVB resin contained about 20 g per 100 g of the ceramic powder. However, the amount of PVB resin required for the transfer here depends on the degree of polymerization of the PVB resin,
Depending on the type, etc., or the temperature during transfer,
It is believed that the amount of resin required for transfer varies. And
If the amount of resin is insufficient, it is necessary to increase the transfer temperature.

Next, with respect to the barium titanate powder having the particle size used in the experiment, the amount of resin contained in the green ceramic sheet and the results of experiments on the transferability of the green ceramic sheet are shown in Table 2 below. Here, the ceramic green sheet is made of barium titanate powder, dibutyl phthalate as a plasticizer, and PVB resin as described above, and the transferability when the weight percentage of the PVB resin contained here is changed. Examined. Here, the amount of dibutyl phthalate added to the green ceramic sheet was fixed at 10% by weight of the PVB resin. The transferability of the ceramic green sheet was tested by transferring the ceramic raw sheet with embedded electrodes onto a ceramic green laminate having electrodes formed on the surface as shown in FIG. In addition, transfer is from the base film side,
With a transfer pressure of 15 kilograms per square centimeter,
This was performed by pressing a hot plate heated to a temperature of 180 ° C.
Further, the amount of the PVB resin was represented by% by weight in the raw ceramic sheet.

Next, a multilayer ceramic capacitor was manufactured in the same manner as in the example of Table 1 using the ceramic raw sheet of Table 2. Table 3 below shows the relationship between the amount of PVB resin contained in the green ceramic sheet and the rate of delamination.

From Table 3, it can be seen that those having a PVB resin content of about 10 to 40% by weight hardly cause delamination. From the above, it can be seen that a PVB resin content of 10 to 40% by weight, especially about 15% by weight of the raw ceramic sheet has good transferability and less occurrence of delamination.

Here, as a resin having a transfer property such as a PVB resin, there are other thermoplastic resins such as an acrylic resin, a vinyl resin, and a cellulose derivative resin. Further, in addition to the thermoplastic resin, a resin that makes the electrode hardly attacked by the solvent contained in the dielectric slurry, that is, a curable resin, a polymerizable resin can be used. By making it rubber-like, it can be transferred by making the surface sticky, and can be used as a resin for a ceramic raw sheet.

Further, in the case as shown in FIG. 3 and FIG. 4, a ceramic raw sheet 24a containing only about 5 parts by weight of resin with respect to 100 parts by weight of barium titanate has no transferability. Even if it is used, it can be laminated by alternately using the electrode-embedded sheet having excellent transferability of the present invention.

Next, FIG. 5 is a view for explaining a method of transferring an electrode-embedded raw ceramic sheet using a heat roller in the second embodiment of the present invention. In FIG. 5, reference numeral 31 denotes a heat roller, which is set at a constant temperature by a heater 26a. When the electrode embedded ceramic raw sheet 25 passes between the ceramic raw laminate 22 and the heat roller 31, the electrode embedded ceramic raw sheet 25
22 is transferred to the surface and becomes the transferred raw ceramic sheet 30 with embedded electrodes. According to this method, the transfer of the electrode-embedded ceramic raw sheet can be continuously performed.

Next, FIG. 6 is a view for explaining an example of a method for producing a ceramic raw sheet with embedded electrodes. In FIG. 3, 32 is an applicator, 33 is a dielectric slurry,
It is set in the applicator 32. Arrows indicate the direction in which the base film 21a moves. In FIG. 6, a dielectric film 33 is applied to the surface of a base film 21a on which an electrode 23a is formed in advance by an applicator 32 on which a dielectric slurry 33 is set to form a ceramic raw sheet 25. Here, the applicator 32 is
Those that can form a coating film of about 20 microns are preferred. Also,
With the base film 21a fixed, the applicator 32
May be moved.

In the present invention, at the time of transfer, heat, light, electron beam,
The transfer may be performed using microwaves, X-rays, or the like. Transfer at room temperature is also possible by changing the type of PVB resin, the type and amount of plasticizer added.

In addition, examples of forming electrodes other than screen printing by polymerization or curing will be described. First, an example of application to a lithographic printing method will be described. First, as an oxidation polymerization type vehicle for lithographic printing, No. 2 linseed oil varnish (measurement temperature
It is also preferable to make the ink in the same manner using 25 ° C., a shear rate of 100 poise at 100 sec inverse), and further increase the viscosity to several hundred poise by adding a rosin-modified phenol resin or the like in order to further improve the printability. The ink produced in this manner is used as a silver salt master or a presensitized plate (commonly known as
PS version).

Furthermore, application to a flexographic printing method is also possible. The flexographic printing method is a type of rubber letterpress printing method, and has a low printing pressure, and therefore has a capability of printing from an aluminum foil of about several microns to a PET film of about 20 to 30 microns. At this time, the viscosity of the electrode ink is 1 to 10
Good to be about poise. Further, the film thickness of the electrode can be adjusted by changing the ratio of the solvent or the metal powder contained in the electrode ink or by using an anilox roller.

In the present invention, the electrode formed by polymerization or curing can be formed by screen printing, offset printing, dry offset printing, flexographic printing, or the like. In order to improve the printability of each of these various printing methods, rosin-modified phenolic resin, phenolic resin, polyalkyd resin, polyamide resin, xylene resin, petroleum resin, acrylic resin, epoxy resin, etc. are converted into polymerized resins such as linseed oil varnish. Can be mixed and used. Further, as the polymerizable resin, drying oils such as linseed oil, deer oil, safflower oil, soybean oil, dehydrated castor oil and tung oil can be used. These drying oils are made of a mixed glyceride of unsaturated fatty acids such as oleic acid, linoleic acid, and eleostearic acid. If the resin or oil has this unsaturated double bond, use it as a resin for electrodes. Can be. further,
In addition to the oxidation polymerization type resin, it is also possible to form the electrode by polymerization using an ultraviolet polymerization type resin, an electron beam polymerization type resin, a heat polymerization type resin, or microwave.

Further, the method of the present invention can be applied not only to the multilayer ceramic capacitor described in the above embodiment but also to other multilayer ceramic electronic components such as a multilayer ceramic substrate and a multilayer varistor.

Effect of the Invention As described above, the present invention provides a support on which a polymerized or cured electrode is formed, after drying, a thermoplastic resin.
After applying a dielectric slurry blended to be 10% by weight or more and 40% by weight or less, the dielectric slurry is dried to form an electrode embedded ceramic green sheet on the support, and then the electrode embedded ceramic green sheet. Without peeling the sheet from the support, after thermocompression bonding on another ceramic raw sheet or another electrode, only the support is peeled, and the electrode-embedded ceramic raw sheet is the other ceramic raw sheet or By transferring onto other electrodes, the electrodes are dried, so that the adverse effects of the solvent contained in the electrode ink are minimized, and the ceramic raw sheet is handled with the support without being damaged during handling. By embedding the electrodes, the occurrence of unevenness due to the internal electrodes is reduced, and the product A multilayer ceramic electronic component can be manufactured.

[Brief description of the drawings]

FIGS. 1 and 2 are views for explaining a state of laminating ceramic raw sheets with embedded electrodes according to a first embodiment of the present invention, and FIGS. 3 and 4 are modified examples of the first embodiment. FIG. 5 is a diagram for explaining a method of transferring an electrode-embedded ceramic raw sheet using a heat roller according to the second embodiment of the present invention, and FIG. 6 is a diagram for explaining an electrode embedding in the present invention. FIG. 7 is a view for explaining an example of a method for manufacturing a ceramic green sheet, FIG. 7 is a view showing a part of a multilayer ceramic capacitor in a cross section, and FIG. 8 is a screen printing method of electrode ink on a ceramic green sheet in a conventional example. FIG. 9 is a cross-sectional view of a multilayer ceramic capacitor when multiple layers are similarly stacked, and FIG. 10 is a view illustrating a difference in thickness between a central portion and a peripheral portion with respect to the number of stacked layers. A. 20 …… table, 21,21a, 21b …… base film, 22 …… ceramic raw laminate, 23,23a …… electrode, 24,24a …… ceramic raw sheet, 25 …… electrode embedded ceramic raw sheet,
26: heater, 27: hot platen, 28: transferred electrode, 29
…… Transferred ceramic sheet with embedded electrodes, 30…
… Transferred ceramic raw sheet with embedded electrodes, 31 ……
Heat roller, 32 applicator, 33 dielectric slurry.

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Koji Okuyama 1006 Odakadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. In company

Claims (1)

(57) [Claims] 1. A thermoplastic resin comprising at least 10% by weight after drying on a support on which a polymerized or cured electrode is formed.
After applying a dielectric slurry blended so as to be 40% by weight or less, the dielectric slurry is dried to form an electrode-embedded ceramic raw sheet on the support, and then the electrode-embedded ceramic raw sheet is supported. Without peeling from the body, after thermocompression bonding on another ceramic raw sheet or another electrode, only the support is peeled off, and the electrode-embedded ceramic green sheet or the other ceramic raw sheet or the other electrode A method for producing a multilayer ceramic electronic component, wherein the method is performed to transfer the same onto a multilayer ceramic electronic component.