JPH01226137A - Manufacture of electronic component of laminated ceramic - Google Patents

Abstract

PURPOSE:To suppress the occurrence of unevenness produced due to internal electrodes by a method wherein ceramic slurry is applied to a carrier by using a doctor blade or the like which has orderly unevenness and dried to produce an electrode burying ceramic green sheet and the ceramic green sheet is replicated onto the other ceramic green sheet. CONSTITUTION:Ceramic slurry whose composition contains thermoplastic resin with a content after drying not less than 10wt.% and not higher than 40wt.% is applied to a carrier 21 on which dried electrodes 20 are formed and dried to produce an electrode burying ceramic green sheet 24. After the electrode burying ceramic green sheet 24 is bonded to the other ceramic green sheet 28 by thermocompression bonding without being removed from the carrier 21, the carrier 21 only is removed to transcript the electrode burying ceramic green sheet 24 onto the other ceramic green sheet 28.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing multilayer ceramic electronic components such as multilayer ceramic capacitors that are widely used in electrical products such as video tape recorders, liquid crystal televisions, and OM equipment. In addition, it can be widely used in manufacturing multilayer ceramic component parts such as multilayer ceramic substrates, stacked varistors, multilayer piezoelectric elements, etc.

BACKGROUND OF THE INVENTION In recent years, in the field of electronic components, as the density of circuit components has increased, there has been a desire for smaller stacked ceramic capacitors and the like to have higher performance. Here, a multilayer ceramic capacitor will be explained as an example.

FIG. 10 is a cross-sectional view of a part of a multilayer ceramic capacitor. In FIG. 10, 1 is a ceramic dielectric layer, 2 is an internal voltage, and 3 is an external layer. The inner mold 2 is alternately connected to two outer electrodes 3 and read.

Recently, electronic components have become increasingly chip-based, and as mentioned above, miniaturization of such multilayer ceramic capacitors is also desired. In this multilayer ceramic capacitor,
Merely reducing the area to 1-type) directly leads to a decrease in electrical capacity. For this reason, it is necessary to make multilayer ceramic capacitors smaller and at the same time increase their capacitance.

As a method for increasing the capacitance of multilayer ceramic capacitors, the dielectric material has a high dielectric permittivity (blocking pond), the dielectric layer is thinned,
Multi-layering of dielectric materials and one internal conductor is being considered.

First, thinning of the dielectric layer will be explained. If this dielectric becomes thinner, it will be extremely iC,! Yes. First, a method for manufacturing a multilayer ceramic capacitor will be briefly explained. First, a method for manufacturing a ceramic green sheet will be described. The raw ceramic sheets used in the production of multilayer ceramic capacitors are made by dissolving gold dredging powder, which serves as a dielectric, in a mixture of resins such as polyvinyl butyral, polyvinyl alcohol, and polyacryloids (such as xylene). After uniformly dispersing it in the prepared vehicle and making it into a slurry, it is continuously cast at high speed (fusion casting) to form a raw ceramic sheet with a thickness of 10-10 microns to several tens of microns. imitate The casting method used here is a metal or polyethylene terephthalate film (hereinafter referred to as PIT film).
Using an organic film such as , etc. as a support, apply the slurry on two of these supports to a uniform thickness using a doctor blade, etc., dry the mixture in the slurry with warm air, and dry naturally.
It is then evaporated to form a green ceramic sheet.

When producing multi-layer ceramic capacitors, this ceramic raw sheet is then cut to a predetermined size, and then a layer of heavy metal is printed on the ceramic raw sheet, and a plurality of ceramic capacitors including this printed ceramic raw sheet are cut. Ceramic raw sheets were crimped with hot sauce, cut, and fired.

Here, in order to make the dielectric layer thinner, it is necessary to make the raw ceramic sheet thinner, but the thinner the raw ceramic sheet is, the more likely it is that pinholes will occur in the raw ceramic sheet. . For this reason, the yield of multilayer ceramic capacitors decreases rapidly due to the thinning of the raw ceramic sheet. Also, in the same way as electric ink and ceramic green sheet, the vehicle is made by dissolving resin in a solvent. For this reason, when electrode/electrode ink is printed on a green ceramic sheet, the shavings in the electrode ink dissolve the fingers of the green ceramic sheet. Therefore, the electrolyte ink printed on the green ceramic sheet erodes the green ceramic sheet, causes swelling, and makes short circuits more likely to occur.

This will be explained below using FIG. 11.

FIG. 11't is a diagram showing printing of electric/non-ink ink on a green ceramic sheet by a screen printing method. In Fig. 11, 4 is a screen frame, 5 is a screen, 6 is an electrode ink, 7 is a squeegee, 8 is a stand, g
jd base film, 1o is ceramic raw sheet, 11
is the electrographic ink marked 111 on the green ceramic sheet 10. In FIG. 11, a base film 9 is fixed on a base 8 by means of a squeegee 7, and an electrographic ink 6 is passed through the entire screen 5 stretched over the screen frame 4.
Marks + and (l are placed on the top surface of the raw ceramic sheet 1o.

At this time, the printed mold ink 11 soaks into the ceramic green sheet 10, making it easy to cause a short circuit.

In response to this, combinations with less erosion and swelling have been studied by changing the size, amount, etc. of the resin in the raw ceramic sheet, but when the thickness of the raw ceramic sheet becomes thinner, for example, 30 microns or less, There are almost no combinations that do not cause erosion and swelling. In addition, a combination of ceramic green sheets that are resistant to erosion and swelling is also printed with heavy carbon ink. Sometimes the ink dries too much, resulting in poor workability during printing; cracks occur in the electrographic ink during the drying process after stamping; and cracks occur when sintering laminates that have been crimped together. etc., and obtain a practical combination! d, aL is in an ugly state.

For this purpose, in practice, the dielectric layer and the internal Ti are multilayered. However, in the conventional lamination method, when multi-layering occurs, local thickness unevenness or step differences occur due to local dipping numbers and stars in the internal mold and sub-layers.

Due to the unevenness caused by this uneven thickness, it is not possible to form a dipping layer with a uniform thickness for a dipping ceramic capacitor, and delamination (separation between layers), cracks, etc. can occur. .

FIG. 12 is a sectional view of a multi-layer ceramic capacitor. Here, the thickness B of the peripheral part (where the number of laminated internal electrodes 2 is small) is greater than the thickness B of the central part (where the number of laminated internal electrodes 2 is large) of the multilayer ceramic capacitor.
It turns out that is small.

FIG. 13 is a diagram showing the difference in thickness between the center part and the peripheral part with respect to the thickness of the product. The thickness of the raw ceramic sheet used here was 20 microns, and the thickness of the internal electrode was 4 microns. As shown in FIG. 13, it can be seen that when the number of laminated layers exceeds 10, the difference in thickness between the center and the periphery exceeds 20 microns, that is, the thickness of the raw ceramic sheet used.

Hitherto, several approaches have been taken to address this problem. First, in JP-A No. 52-135050 and JP-A No. 52-133553, a new ceramic green sheet is inserted in the step part, that is, the peripheral part, from which the inner part of the sheet is removed, and after lamination, it is fired. A method is being proposed.

However, according to this method, it is necessary to carefully remove more than 100 green ceramic sheets to a size of, for example, 3.5 x 1.0 mm. In particular, a raw ceramic sheet alone cannot be mechanically handled due to its thinness and softness. Even if it were possible to handle it, it would be difficult to accurately cut it out by punching or the like.

Similarly, there is a manufacturing method for multilayer ceramic capacitors, as disclosed in Japanese Patent Laid-Open No. 61-102719, in which both raw ceramic sheets and electric sheets are punched and laminated one after another, but this method is also limited in quantity. There is a crest.

For example, punching an unusually large number of times is marked 11i1.
This method is disadvantageous in terms of both cost and accuracy. Furthermore, if the thickness of the electrical sheet is set to 6 microns or less, the physical strength of the electrical sheet will not be evident in punching or handling.

Furthermore, in Japanese Patent Application Laid-Open No. 52-135051, an inner electrode ink is first applied to a green ceramic sheet, and then a dielectric ink is applied to the remaining portion of the green ceramic sheet coated with the inner electrode ink. 1. Coating, stacking the raw ink at different take-out positions, and applying pressure 1. A method of firing has been proposed. However, in this case,
The solvent contained in the newly printed dielectric ink leaves a residue behind while the laminate is immersed. For this reason, the thinner the raw ceramic sheet is, the more likely it is to cause short circuits and deteriorate the crucible voltage characteristics.

In addition, as a method that does not use solvents for train ink,
There is a method for forming an electric shock, such as that disclosed in Japanese Patent No. 3-51458. There is also a method using an electrolytic plating method using an activated paste, as disclosed in JP-A-57-102166;
In order to perform electroplating using electrolytic plating technology, it is necessary to soak the raw ceramic sheet in a plating solution.
A new problem arises.

In addition, it has been considered to partially punch out a raw ceramic sheet or process it into a concave shape, as disclosed in Japanese Patent Application Laid-Open No. 53-42353, but this is not practical.

Furthermore, Japanese Patent Application Laid-Open No. 56-94719 is similar, and attempts to form a green ceramic sheet on the stepped portions of a laminate, and is unlikely to be suitable for mass production.

In addition, several methods have been used to prevent the adverse effects of the solvent in the electrode ink on the green ceramic sheet.

For example, in Japanese Unexamined Patent Publication No. 56-106244, on the top of clothes,
First, print only the favorites on the base film,
Next, there is a method of forming a green ceramic sheet on top of this by a casting method. Furthermore, according to Japanese Patent Publication No. 40-19975, a method for obtaining an unfired ceramic with electrodes by applying an electrode paint, drying it, applying di-Gogi slurry to a continuous ladle, and peeling it off from the support. There is.

However, when the electrode-embedded ceramic raw sheet made by these methods becomes thinner to about 5 to 20 microns, the mechanical strength decreases at the end, so that it can no longer be handled by itself. For this purpose, 20
It was not possible to make the layer thinner than microns. It is still not possible to eliminate the unevenness of the 7C electrodes on the surface (hereinafter simply referred to as 7R) by simply exploding the raw ceramic sheet embedded in the electrode with an applicator, bar coater, doctor blade, etc. Below, Figure 14, Figure 15,
This will be explained using FIGS. 16 and 17.

FIG. 14 shows an example of a method for embedding a single layer in a raw ceramic sheet. In Figure 14, 9
12 is a base film, 12 is an electrode, and 13-i is an applicator, and a coating film thickness of from microns to several tens of microns can be obtained. 14' is dielectric slurry, and applicator 13
is placed inside. 16 is a raw ceramic sheet, 1
6 is an embedded electrode. The arrow indicates the direction of movement of the base film 9 on which the electric fives 12 are formed. Then, the base film 9 on which the 12 layers have been formed is applied to the applicator 13.
A dielectric slurry 14 is applied to the surface to form an electrode 16 embedded between the green ceramic sheet 15 and the base film 9. Here, the base film 9 may be fixed and the applicator 13 may be moved.

FIG. 16 is a side view of the applicator 13 of FIG. 14. In FIG. 15, 17 is a gap, and since a part of the applicator 13 comes into contact with the base film 9, a uniform gap 17 is formed on the base film 9.

Depending on the size of this gap 17, a ceramic raw sheet having a desired thickness can be obtained.

FIG. 16 is a diagram for explaining how a green ceramic sheet is dried by embedding 1 ounce. FIG. 16(m) shows the electric metal 12 formed on the base film 9 fixed on the table 8a. Next, as shown in FIG. 16(B), dielectric slurry 14 is applied to a uniform thickness. FIG. 16(C) shows how the dielectric main slurry 14 dries to become a green ceramic sheet 16. In FIG. 16(C), it can be seen that unevenness is generated on the surface of the raw ceramic sheet 15 due to the embedded one sam 16. In this way, it is extremely difficult to make the surface of the green ceramic sheet 15 flat by simply embedding one box 16.

FIG. 17 shows -gAI in a method of embedding electrobalance into a green ceramic sheet using a doctor blade. In FIG. 17, it is a 1sd doctor blade,
The base film 9 and the electric image 12 are separated from each other by a certain gap. Here, the difference between the doctor blade and the applicator is that in the case of a doctor blade, a gap is maintained without the doctor blade itself directly touching the surface of the base film, whereas in the case of an applicator, a part of the applicator The gap is maintained by contacting the base film surface.

Even with the doctor blade 18 shown in FIG. 17, the result is as shown in FIG. 16, and it is very difficult to make the surface of the raw ceramic sheet flat.

Problems to be Solved by the Invention Therefore, in the structure of the multilayer ceramic capacitor as described above, in the manufacturing method of the multilayer ceramic capacitor in which one peak is printed on the ceramic green sheet, the ceramic green sheet is printed using the solvent contained in the electrical ink. is eroded,
This causes swelling, and the thinner the raw ceramic sheet becomes, the more likely it is to short-circuit. On the other hand, in a method for manufacturing a multilayer ceramic capacitor using a raw ceramic sheet with embedded electrodes in which the electrodes are embedded,
By peeling off the electrode-embedded ceramic sheet from the support, there is a limit to how thin the layer can be made. Also,
In particular, when multilayering dielectric layers and internal electrodes, there is a problem in that it is impossible to eliminate the step difference caused by the internal electrodes between the center and the periphery of the multilayer ceramic capacitor.

In view of the above-mentioned problems, the present invention provides a multilayer ceramic capacitor with multilayered dielectric layers and internal electrodes, which is difficult to cause short circuits because the electrodes are dry, and the electrodes are embedded in a raw ceramic sheet. Even when using H9K to manufacture multilayer ceramic capacitors, regular unevenness is created on the coated surface when embedding the electrodes in the raw ceramic sheet to prevent the difference in level caused by the internal electrodes between the center and periphery of the multilayer ceramic capacitor. By using a doctor blade or applicator, the unevenness of the electrode can be reduced and applied without damaging the surface of the electrode. The present invention provides a method for manufacturing a laminated ceramic electronic component that can be handled and transferred while maintaining strength.

Means for Solving the Problem In order to solve the problem of the above-mentioned stress, the method for manufacturing a multilayer ceramic electronic component of the present invention includes regularly forming irregularities on the coated surface of the support on which dried electrodes are formed. Using a doctor blade or an applicator, a ceramic slurry containing a thermoplastic resin of 10% by weight or more and 40% by weight or less after drying is applied, and then the ceramic slurry is dried to form the support. A green ceramic sheet with embedded electrodes is made on top, and then the green ceramic sheet with embedded electrodes is thermocompressed onto another green ceramic sheet or another electrode without peeling off from the support, and then only the support is bonded. The present invention has a structure in which the electrode-embedded green ceramic sheet is transferred onto the other ceramic green sheet or another electrode.

Effect of the present invention 1 With the above-described structure, since the electrode is dried, erosion and swelling of the ceramic green sheet due to the solvent contained in the electrode ink and short-circuiting are reduced, and the multi-layered laminated sheet is reduced. Even when used in manufacturing ceramic capacitors, by embedding the electrodes in the raw ceramic sheet, it is possible to reduce the level difference caused by the electrodes. In addition, after thermocompression-bonding a ceramic raw sheet with embedded electrodes onto another ceramic raw sheet or another electrode without peeling it from the support, only the support is peeled off, and the
The water mass inlaid ceramic raw sheet will be transferred.

Furthermore, by using a doctor blade or applicator that has regular irregularities on the application surface when embedding the electrode in the raw ceramic sheet, the application can be done without damaging the electrode surface and reducing the irregularities of the electrode. .

EXAMPLE Hereinafter, a manufacturing method and a laminating method for a laminated ceramic electronic component according to an example of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 are diagrams for explaining how electrode-embedded ceramic raw sheets are laminated in a first embodiment of the present invention. Figure 1, Figure 2, 21, 2
18L is a base film, 24jd ceramic raw sheet, 25. 25& is an embedded electrode, 26 is a stand, 28 is a ceramic raw laminate, 29 is a heater, and 30 is a heat sensation, which is set at a constant temperature by the heater 29. ing. 3
1 is a transferred ceramic raw sheet, and 32 is a transferred electrode. Also, the arrow indicates the direction of movement of heat@30.

First, explanation will be given using FIG. 1. First, the electrode 26 embedded in the base film 21 and the ceramic raw sheet 2
The heat sensation 3o heated by the heater 29 is placed on the side where the heat sensation 3o is not formed. On the other hand, the base film 211L fixed on the stand 26 and the ceramic raw laminate 28 are placed on the side of the base film 21 where the embedded electrodes 25 and the ceramic raw sheet 24 are formed. At this time, the electrodes 12sa are formed on the surface of the raw ceramic laminate 28 by an appropriate method such as transfer or printing. Here, the buried electrode 251L does not necessarily need to be formed on the surface of the ceramic raw laminate 28. Next, from the state shown in FIG. 1, the embedded electrode 25 formed on the surface of the base film 21 and the ceramic green sheet 24 are bonded under heat and pressure to the surface of the ceramic green laminate 28 by heat sensation 30.

Next, explanation will be given using FIG. 2. This figure 2 shows the embedded rings 5 to 25 and the ceramic raw sheet 2 shown in figure 1.
4 is a diagram after transferring. That is, as shown in FIG. 2, the electric conductor 26 and the ceramic green sheet 24 embedded on the base film 21 are transferred to the surface of the ceramic green laminate 28 by the thermal embossing 30, and thereby the transferred ceramic green sheet 24 is transferred to the surface of the ceramic green laminate 28. A sheet 31 and transferred electrical support 32 are formed.

Further, FIGS. 3 and 4 show a modification of the first embodiment, in which an embedded electrode 251L is formed on the surface of the ceramic raw laminate 28 on the base film 21. Heat and press the ceramic raw sheet 24&,
After forming the transferred ceramic green sheet) 31 &
A state in which the embedded electrode 25 and ceramic green sheet 24 are bonded under heat and pressure is shown. Here, it is also possible to laminate multiple layers by repeating the steps shown in FIGS. 1 and 2 and the steps shown in FIGS. 3 and 4.

FIG. 6 is a diagram for explaining a method for manufacturing a raw ceramic sheet with embedded electrodes used in a method for manufacturing a laminated ceramic electronic component according to the first embodiment of the present invention. In FIG. 6, 20 is an electrode, 21 is a base film, and 22 is an uneven applicator, which has regular unevenness on the application surface. 23 is a dielectric slurry, and 24 is a green ceramic sheet, which is made by drying the dielectric slurry 23.

Reference numeral 26 indicates an embedded peak, which is embedded between the base film 21 and the raw ceramic sheet 24 . Further, the arrow indicates the direction in which the base film 21 moves. Next, the uneven applicator will be explained in more detail using FIG. 6.

FIG. 6 is a view seen from the direction C in FIG.

In Figure 6, 26+! L is on the stand. As shown in FIG. 6, the uneven applicator 22 is set on the electric wire I2o. Next, a more detailed explanation will be given using FIG. 7.

FIG. 7 is a diagram illustrating how a green ceramic sheet with embedded electrodes dries. Figure 7 (mu) is
The electrode 20 formed on the base film 21 fixed on the stand 26a1 is shown. Next, as shown in Figure 7 (B),
The dielectric slurry 23 is applied with a thickness such that the dielectric slurry 23 has regular irregularities using the uneven applicator 22 according to the present invention. FIG. 7 (q shows how the dielectric slurry 23 dries to become a green ceramic sheet 24. FIG. 7 (C)
It can be seen that unevenness no longer occurs on the surface of the green ceramic sheet 24 due to the embedded electrodes 26.

FIG. 8 shows an example of a method of embedding electrodes in a raw ceramic sheet using a doctor blade having projections and depressions. In FIG. 8h, 27 is an uneven doctor blade, which is set with a constant gap between it and the base film 21 and the electrode 20. Here, the difference between the uneven doctor blade 27 and the uneven applicator 22 is that in the uneven doctor blade 27, the uneven doctor blade 27 itself does not come into direct contact with the surface of the base film 21 and a gap is maintained; In the third embodiment, the gap is maintained by a part of the uneven applicator 22 being in contact with the surface of the base film 21.

Next, I will explain in more detail. First, as an electrode ink for forming electrodes, an electrode ink using palladium powder was created. This is made by adding butyl calpitol to 60 parts by weight of palladium powder with a particle size of 0.3 microns, 6 parts by weight of ethyl cellulose as a resin, and 0.1 parts by weight of a dispersant to a suitable viscosity. After adding, use a three-roll mill to fully disperse the mixture, and then add butylcarpitol on the three-roll mill again until the viscosity is 10.
It was diluted while being dispersed until it reached 0 poise.

Next, as the base film 21, a film width of 200 mm, a film thickness of 76 microns, and a center core diameter of 3
A roll of polyethylene terephthalate film (hereinafter referred to as PICT film) with a length of approximately 100 meters and an emulsion thickness of 10 microns was placed on top of the polyethylene terephthalate film (hereinafter referred to as PICT film).
The electrode ink was printed continuously at regular intervals by a screen printing method using a mesh stainless steel screen. Here, the shape of the electrode is 3.6×1.
0 mm was used. Then, after printing,
To dry the first ink, the printer was connected to a far-infrared belt furnace heated to about 125° C. to evaporate the solvent in the electric ink, and this was used as electrician 20.

Next, how to prepare the dielectric slurry will be explained. First, polyvinyl butyral (manufactured by Sekisui Chemical Co., Ltd., B
L-2 butyral resin) 6.0 parts by weight, diptyl phthalate 0.6 parts by weight, ethyl alcohol 26.0 parts by weight,
In a resin solution containing 36.0 parts by weight of toluene, a particle size of 1
It was added together with 31.0 parts by weight of micron barium titanate powder and stirred well. Next, this was placed in a polyethylene bottle, zirconia beads were added, and the mixture was mixed and dispersed until an appropriate dispersion shape was obtained. Next, after temporarily filtering this,
Dielectric slurry 23 was obtained by pressure filtration using a 10 micron membrane filter.

Next, this dielectric slurry 23 is applied to the uneven applicator 22.
was used to continuously coat the base film 21 on which the electrodes 2o were formed. Next, this was dried to form a green ceramic sheet 24, and the film thickness of the green ceramic sheet 24 was measured with a micrometer, and the film thickness of the green ceramic sheet 24 was 18 microns.

Next, a method for manufacturing a multilayer ceramic capacitor using this raw ceramic sheet 24 will be described. First, a ceramic raw laminate 28 having a thickness of 200 microns on which no electrodes were formed was fixed together with the base film on the stand 26 shown in FIG. 3. As shown in FIGS. 3 and 4, as many electrode-embedded green ceramic sheets 24 as required to be laminated were transferred thereon.

Here, the transfer was performed using a hot melt 30 from the side of the base film 21 under the conditions of a temperature of 180° C. and a pressure of 16 kilograms per square centimeter.
5 and the raw ceramic sheet 24i, the base film 21 was peeled off.

This involves transferring the raw ceramic sheet 24a as shown in FIG. 3, and then placing electrodes (25°, 25°
) was shifted by a certain pitch, and the next embedded one-arashi 26 and ceramic raw sheet 24 were transferred by heating from the base film 21 IIJ using the hot melt 30.

Thereafter, this process was repeated so that the electric wires were alternately shifted as shown in Figure 10, so that there were 61 layers of electric wires. And finally, we will take measures against sledding at Yaseiji Temple and increase the strength of the precepts.
A raw ceramic sheet was transferred onto which an electrode with a thickness of 20 microns was formed. The thus obtained laminated wood was cut into chips of 2.4 x 1.6 mm, and then fired at 1000° C. for 1 hour.

For comparison, as a conventional method, the same electrodes were directly formed as internal electrodes by screen printing on a raw ceramic sheet having the same composition and thickness as those described above, as shown in FIG.
A green ceramic sheet was transferred onto it so that the film thickness was the same, and this process was then repeated. In addition, the pressure during lamination,
All conditions such as cutting and firing were the same as described above.

Here, the number of samples was n=100. Next, external electrodes were formed using a conventional method, and occurrence of short circuit I was examined. The results are shown in Table 1 below.

<Table 1> As described above, it can be seen that by using the method for manufacturing a multilayer ceramic capacitor according to the present invention, both the short circuit occurrence rate and the delamination occurrence rate are greatly improved compared to the conventional method. When the causes of short circuits in the present invention were investigated, it was found that most of them were caused by pinholes in the raw ceramic sheet. At the same time, in the present invention, since the mold is flatly embedded in the raw ceramic sheet, the difference in thickness between the center and the periphery of the multilayer ceramic capacitor is greatly reduced, and this makes it possible to It is assumed that this method reduces not only the incidence of delamination but also the incidence of delamination.

The raw ceramic sheet portion of the ceramic raw sheet embedded with electricity and blood used in the present invention has thermal transferability due to the property of polyvinyl butyral resin contained therein. In addition, the less polyvinyl butyral sealant (hereinafter referred to as PVB resin) contained in the raw ceramic sheet, the warmer the transferability due to heat; The more flexible the fingers are, the better the transferability will be. The ceramic raw sheet used here contained about 20 grams of PVB fingers per 100 grams of ceramic powder, and the transferability was good. However, the amount of PVBJ fat required for transfer here depends on the particle size of the ceramic powder used as the raw material for weight rally.
The amount of resin required for transfer is thought to vary depending on the degree of polymerization and type of fat, or the attitude during transfer. When the sealant is insufficient, it is necessary to raise the transfer temperature.

Next, Table 2 below shows the results of actual tests on the resin acid contained in the green ceramic sheet and the transferability of the green ceramic sheet for the barium titanate powder having the particle size used in the experiment. Here, as mentioned above, the ceramic raw sheet is made of barium titanate powder, diptyl heptatalate as a plasticizer, and PVBI resin, and the transfer when the weight percentage of the PVB resin contained therein is changed. I looked into gender. Here, the amount of phthalate dibutyl added to the green ceramic sheet was fixed at 10% by weight of the PVB resin d''.In addition, regarding the transferability of the green ceramic sheet, electrodes were placed on the surface as shown in Figure 1. The actual test was carried out by transferring a ceramic raw sheet with an embedded electric image onto the ceramic raw laminate on which the image was formed.The transfer was performed from the base film side with a transfer pressure of 16 kg 15"f' x 1,000 meters. This was done by pressing a hot film heated to 180°C. Further, the PVBI index was expressed as the amount of balls in the ceramic raw sheet π.

(The following is a blank space.) Next, using the raw ceramic sheets shown in Table 2 above, a multilayer ceramic capacitor was manufactured in the same manner as in the example shown in Table 1 above. Table 3 below shows the relationship between the amount of PVB resin contained in the raw ceramic sheet and the rate of occurrence of delamination at this time.

Table 3 From Table 3, it can be seen that delamination is less likely to occur when the amount of PVBI fat is about 40% by weight.

That's all, PVB resin dragon is ceramic raw sheet 10~
It can be seen that 40% by weight, especially around 16% by weight, has good transferability and less occurrence of delamination.

Here, as resins having transferability like PVB resins, there are other thermoplastic resins such as acrylic resins, vinyl resins, and cellulose derivative resins.

In addition to thermoplastic resins, curable resins and polymeric resins can also be transferred by adjusting the curing and polymerization conditions appropriately, for example, by making them rubber-like and giving them adhesiveness on the surface. , it can be used as D lj 4M for ceramic raw sheets.

Furthermore, in the cases shown in FIGS. 3 and 4, a non-transferable ceramic green sheet containing only about 6 parts by weight of resin per 100 parts by weight of barium titanate is added to the ceramic green sheet 241L. Even if used, lamination can be achieved by using the wire-embedding sheet of the present invention, which has poor transferability, for hybridization.

Next, FIG. 9 is a diagram for explaining a method of transferring an electrode-embedded ceramic raw sheet using a heat roller in a second embodiment of the present invention. In FIG. 9, 26b
33 is a stand, and 33 is a heat roller, which is set at a constant temperature by a heater 291L. And the embedded electrode 2
51L and the green ceramic sheet 31 pass between the green ceramic laminate 28 and the heat roller 33, they are transferred to the surface of the green ceramic laminate 28, becoming the transferred electrodes 32 and the transferred green ceramic sheet 31. According to this method, the electrode-embedded ceramic green sheet can be transferred continuously.

In addition, in the present invention, at the time of transfer, in addition to heat, light, electron beam, microwave, X-ray, etc. may be used for transfer. Furthermore, by changing the type of PVB resin, the type of plasticizing agent, and the additive thickness, transfer at room temperature is also possible.

Furthermore, the method of the present invention is not only applicable to the multilayer ceramic capacitors described in the above embodiments, but also can be commercially applied to other multilayer ceramic electronic components such as multilayer ceramic substrates and multilayer varistors.

Effects of the Invention As described above, the dried electrode of the present invention is coated on a support with a doctor blade or an applicator having regular irregularities on the coated surface, and after being softened, heat treatment is applied. After applying a ceramic slurry containing 10% by weight or more and 40% by weight or less of sugar beet, drying the ceramic slurry to create a green ceramic sheet with electrodes embedded on the support, and then After thermocompression-bonding the electrode-embedded ceramic raw sheet onto another ceramic raw sheet or other electrostrictive material without peeling or deforming the support, only the support is peeled off, and the tiq
By transferring the embedded ceramic green sheet onto the ceramic green sheet or other electrode, the electrode is dried, which reduces the negative effects of the solvent contained in the electrolyte ink. Since the raw ceramic sheet is handled together with the support, it will not be damaged during handling, and by embedding the electrodes, the occurrence of unevenness due to internal electrodes can be reduced by using a doctor blade or applicator with unevenness, resulting in a high yield. Multilayer ceramic electronic components such as multilayer ceramic capacitors can be manufactured.

[Brief explanation of the drawing]

FIGS. 1 and 2 show ti in the first embodiment of the present invention.
Figures 3 and 4 are diagrams for explaining how the embedded green ceramic sheets are laminated; Figures 3 and 4 are diagrams for explaining modified rows of the first embodiment; Figure 6 is a diagram showing the first embodiment of the present invention. A diagram for explaining the method for manufacturing a raw ceramic sheet with embedded electrodes used in the method for manufacturing a laminated ceramic electronic component in the example, FIG. 6 is a view seen from the direction of C in FIG. 6, and FIG. FIG. 8 is a diagram for explaining how a green ceramic sheet dries after embedding an electrode, and FIG. Figure 9 is a diagram for explaining the method of transferring an electrode-embedded ceramic raw sheet using a heat roller in the second embodiment of the present invention, and Figure 10 is a cross-sectional view of a part of a multilayer ceramic capacitor. Figure 11 shown in
The figure shows how electrode ink is printed on a raw ceramic sheet using the 11J method in a conventional example. Figure 12 is a cross-sectional view of a multilayer ceramic capacitor when multiple layers are formed. Figure 13 is Similarly, Fig. 14 shows the difference in speed between the middle 1U section and the peripheral section with respect to the number of laminated layers.
16 is a side view of the applicator 13 in FIG. 14, and FIG. 16 is a conventional example. Figure 17 is a diagram illustrating how a green ceramic sheet dries after embedding an electrographic image in the same manner as the doctor blade. . 21.211...Base film, 22...
...Uneven applicator, 23...Dielectric main slurry, 24゜241...Ceramic raw sheet, 25
．． 25&・・・Embedded ball, 26, 26a,
2eb...stand, 27--uneven doctor blade, 28...ceramic raw laminate, 29.2
9 &... Heater, 30... Hot melt, 31...
...Transferred ceramic raw sheet, 32...
...Transferred electric phoenix, 33...heat roller. Name of agent: Patent attorney Toshio Nakao and 1 other person2/
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Claims (1)

[Claims] After drying, 10% by weight of the thermoplastic resin is applied onto the support formed with the dried electrode using a doctor blade or an applicator that has regular irregularities on the coating surface.
After applying a ceramic slurry blended to 40% by weight or less, the ceramic slurry is dried to form an electrode-embedded ceramic green sheet on the support, and then the electrode-embedded ceramic green sheet is coated. After thermocompression bonding onto another ceramic raw sheet or other electrode without peeling from the support, only the support is peeled off, and the electrode-embedded ceramic raw sheet is bonded to the other ceramic raw sheet or other electrode. 1. A method for manufacturing a multilayer ceramic electronic component, which comprises transferring the component onto an electrode.