JP2751235B2 - Photoresist coating equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a photoresist coating apparatus, and more particularly to a photoresist coating apparatus for coating a photoresist on a semiconductor substrate.

[Conventional technology]

Conventionally, a photoresist coating apparatus of this type, as shown in FIG. 4, rotates and chucks a semiconductor substrate 4 to be processed on an upper surface and rotates the same, and drops a photoresist from above the semiconductor substrate 4. It had a dripping nozzle 2 and a cup 3 provided around the outer periphery of the rotary chuck 1.

Also, the semiconductor device manufacturing apparatus using the photoresist coating apparatus of FIG. 4 was composed of a substrate pretreatment apparatus, a photoresist coating apparatus, and a drying apparatus (for example, Semiconductor Manufacturing Equipment Handbook, p. 236, Science Forum, 1984).

[Problems to be solved by the invention]

The conventional photoresist coating apparatus described above is provided with a heating mechanism using a hot plate or a dehydration processing mechanism using hexamethyldisilazane for the purpose of dehydrating an oxide film or a silicon surface layer on the surface of the semiconductor substrate before applying the photoresist. Is generally used to improve the adhesion.

In particular, when a positive photoresist having poor adhesion to the underlying substrate is applied, the vapor treatment of hexamethyldisilazane is generally performed. In this case, the amount of hexamethyldisilazane adhering to the surface of the semiconductor substrate is reduced. It is difficult to control, and if the amount of adhesion is too large, there is a drawback that the adhesion between the photoresist and the substrate is hindered or a foaming phenomenon occurs during exposure.

[Means for solving the problem]

The photoresist coating apparatus of the present invention is a photoresist coating apparatus comprising: a rotating chuck that fixes and rotates a semiconductor substrate on an upper surface; and a drip nozzle that drops a photoresist on the semiconductor substrate. And an ultraviolet light irradiator for directly irradiating the semiconductor substrate with ultraviolet light.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

 FIG. 1 is a sectional view showing a first embodiment of the present invention.

As shown in FIG. 1, the first embodiment is obtained by adding an ultraviolet light irradiation unit 5 to the above-described photoresist coating apparatus of FIG. 4, and the other configuration is the same as that of the photoresist coating apparatus of FIG. It is.

The semiconductor substrate 4 which has been subjected to the hexamethyldisilazane vapor treatment in a pretreatment section (not shown) is sent onto the rotary chuck 1 by a transport mechanism (not shown), and is vacuum-sucked to the rotary chuck 1. Conventionally, a required amount of photoresist was dropped from the dropping nozzle 2 at this stage. However, in the first embodiment, ultraviolet light having a wavelength of 180 to 300 nm is irradiated from the ultraviolet light irradiation unit 5 to the semiconductor substrate 4.
Irradiate upward to modify the surface of the substrate.

FIG. 2 is a characteristic diagram showing a correlation between a method of treating a semiconductor substrate surface and a contact angle of a water droplet on the semiconductor substrate.

In FIG. 2, the vertical axis shows the result of measuring the contact angle generated by the surface tension of a water drop dropped on the semiconductor substrate, and the horizontal axis shows various processing methods for the semiconductor substrate. As shown in FIG. 2, it can be seen that the modification on the semiconductor substrate is advanced by the irradiation of ultraviolet light, and the surface tension is extremely reduced.

That is, the ozonation reaction of oxygen molecules is accelerated by the irradiation of ultraviolet light, and this ozone is further decomposed into excited oxygen atoms to decompose organic substances, particularly carbon, hooker carbon and hydrocarbons, on the surface of the semiconductor substrate.

FIG. 3 is a perspective view of an apparatus for manufacturing a semiconductor device using the second embodiment of the present invention.

As shown in FIG. 3, a semiconductor device manufacturing apparatus is a photoresist coating apparatus including a hexamethyldisilazane processing section 11 as a preprocessing section, a hot plate type oven 12, an ultraviolet light processing section 13, and a photoresist dropping section 14. 15 and is included.

A low-pressure mercury lamp 16 is provided in the ultraviolet light processing unit 13 and is sealed so that ultraviolet light does not leak to the outside. A semiconductor substrate (not shown) is placed on a substrate transport path 17, sequentially sent from a hexamethyldisilazane processing unit 11 to a photoresist dropping unit 14, and subjected to steam processing in the hexamethyldisilazane processing unit 11, It is heated in a plate type oven 12, further irradiated with ultraviolet light having a wavelength of 185 nm in an ultraviolet light processing section 13, and coated with a photoresist in a photoresist dropping section 14.

In the second embodiment, since the ultraviolet light processing section 13 and the photoresist dropping section 14 are independent, there is an advantage that the mechanism is simplified.

〔The invention's effect〕

As described above, the present invention provides an ultraviolet light irradiating unit for irradiating ultraviolet light having a wavelength of 180 to 300 nm immediately before spin-coating of a photoresist, so that the organic residue remaining on the surface immediately before coating the photoresist on the semiconductor substrate is provided. It has the effect of improving the coating characteristics of the photoresist by dissolving the components and modifying the surface of the semiconductor substrate, as well as improving the fine workability during exposure.

[Brief description of the drawings]

FIG. 1 is a sectional view of a first embodiment of the present invention, FIG. 2 is a characteristic diagram showing a correlation between a method of treating a semiconductor substrate surface and a contact angle of a water droplet on the semiconductor substrate, and FIG. FIG. 4 is a perspective view of a semiconductor device manufacturing apparatus using the second embodiment, and FIG. 4 is a sectional view of an example of a conventional photoresist coating apparatus. DESCRIPTION OF SYMBOLS 1 ... Rotating chuck, 2 ... Drip nozzle, 3 ... Cup, 4 ... Semiconductor substrate, 5 ... Ultraviolet light irradiation section, 11 ... Hexamethyldisilazane processing section, 12 ... Hot plate type oven, 13 … UV light processing unit, 14… photoresist dropping unit, 15… photoresist coating device, 16… low pressure mercury lamp, 17… substrate transport path.

Claims (1)

(57) [Claims] 1. A photoresist coating apparatus, comprising: a rotary chuck that fixes and rotates a semiconductor substrate on an upper surface; and a drip nozzle that drip a photoresist onto the semiconductor substrate. A photoresist coating apparatus comprising an ultraviolet light irradiating section for directly irradiating ultraviolet light thereon.