JP2746250B2 - Crimping device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure bonding apparatus for bonding a plate-like electronic component or the like to a liquid crystal substrate.

[0002]

2. Description of the Related Art FIG. 3 is a perspective view of a crimping device showing an example of the prior art. Conventionally, as shown in FIG. 3, this type of crimping apparatus includes a receiving table 2a on which a PWB 16 on which a plurality of TABs 15 extending in advance from an end of an LCD panel 17 on a holding table 12 are mounted, and a heater. And a driving cylinder 11 that lowers and raises the pressure bonding head 10. In addition, cradle 2
a and the crimping head 10 are attached to a portal frame including a base.

In order to bond the TAB 15 and the PWB 16, the pressure bonding head 10 is lowered and the TAB 15 and the PW
B16 was pressurized and heated and pressed. However, in this crimping apparatus, distortion occurs due to a change in temperature of the crimping head 10, and the pressing surface of the crimping head 10 is
There is a problem in that it is no longer parallel to the mounting surface of a, causing poor bonding and displacement. Therefore, in order to repair this, parallel adjustment of the pressure bonding head 10 and the pedestal 2a has been performed again. However, there is a disadvantage that a great deal of man-hour is wasted for this adjustment.

A first example of a crimping apparatus that solves such a problem that the degree of parallelism between the crimping head and the pedestal due to a temperature change occurs is disclosed in Japanese Patent Application Laid-Open No. Hei 5-242934. This apparatus is provided with a movable plate fixed to the crimping head between a crimping head and a guide rail on which the crimping head moves up and down, and a rail on which the movable plate can move in a lateral direction. Is absorbed by the movement of the movable plate in the lateral direction.

As a second example, Japanese Patent Application Laid-Open No.
No. 97 is disclosed. This crimping device is a device in which a plurality of narrow crimping devices for crimping the individual members to be bonded are provided, and the pressing area is reduced to facilitate the parallelism.

A third other example is disclosed in Japanese Patent Application Laid-Open No. H6-175199. This crimping device divides the pressing surface into short pressing surfaces so that it can be applied to the production of a liquid crystal panel with a large area. It is.

[0007]

A first example of the conventional crimping apparatus described above is that, although it is possible to absorb the distortion in the horizontal direction, there is no mechanism for absorbing the distortion in the vertical direction, and it is difficult to maintain the parallelism in the vertical direction. It cannot be applied to the bonding of wide members to be bonded.

Further, in the apparatuses of the second and third examples, since the pressure bonding head is divided into a plurality of pressure bonding heads, when the size of the object to be bonded is changed, the number, arrangement and spacing of the pressure bonding heads must be changed. Must. A lot of man-hours and time are wasted on the setup accompanying this change. Furthermore, although the mechanical parallelism of the clamping surface between the pressure bonding head and the receiving table can be obtained, the surface of the member to be bonded supplied and placed on the receiving table is not flat, and always has warpage or dent, and changes. A dent or the like occurs due to partial wear of the pressure bonding head. For this reason, even if the parallelism adjustment between the individual pressure bonding heads and the mounting surface of the receiving table is performed, a gap is partially generated on the pressing surface at the time of pressing, which causes a positional deviation due to poor bonding or unbalanced pressing force. There is.

More seriously, as in the third example, in the latter crimping device in which the pressing surface is divided into a plurality of pressing blocks, the interval between the pressing blocks cannot be changed. If the interval is changed, there is a drawback that it cannot be handled.

[0010] Accordingly, an object of the present invention is to provide a bonding method without the need for adjusting the parallelism even when the surface of the member to be bonded has a warp or a dent or a tilting pressure bonding head, and to cope with a change in the member to be bonded. An object of the present invention is to provide a versatile crimping device that can be used.

[0011]

A feature of the present invention is that a pressure bonding head having a heated flat surface and a long plate on which a plurality of plate-like adhered parts are arranged and mounted in advance. A plurality of pedestals on which the substrate is placed and corresponding to each of the adhered components, and which are arranged to face the flat surface of the pressure bonding head, and each of these cradles is provided with the flat surface of the pressure bonding head. By pressing against the surface, it follows the flat surface
And a plurality of pressing mechanisms for inclining the surfaces of the receiving tables in all directions.

[0012] In addition, before Symbol cradle of the long said the Chakumoto
It is desirable to provide at least two sets of the pressing mechanism as well as a single elongated plate member having the same length as the plate in both ends of the plate member. Further, it is preferable that the pressing mechanism includes a pivot bearing fitted to a shaft end of the pedestal, and an air cylinder for applying a pressing force to the pedestal via the pivot bearing.

[0013]

Next, the present invention will be described with reference to the drawings.

FIGS. 1A and 1B are a perspective view of a crimping apparatus and a cross-sectional view of a pressing mechanism for explaining an embodiment of the present invention. As shown in FIG. 1 (a), this crimping device is firmly fixed to a guide rail 13 on a portal frame erected on a base.
The pressure bonding head 10 with a built-in heater, which is guided by the driving cylinder 11 and moves up and down, and the PWB protruding from one side of the LCD panel 17 placed on the holding table 12
The press table 1 includes a receiving table 2 corresponding to a plurality of TABs 15 loaded on the mounting table 16 and a pressing mechanism 1 for pressing the receiving table 2 against a flat surface 10a of the pressure bonding head 10 to apply an adhesive pressing force.

Further, as shown in FIG. 1 (b), the pressing mechanism 1 has a spherical member at the lower end of the shaft 3 of the receiving base 2 and precisely fits the spherical member to change the inclination of the receiving base 2 in various ways. , A pneumatic cylinder 5 connected with the other end of the pivot bearing 4 and the piston rod 6 to apply a pressing force to the receiving base 2, and a shaft slightly larger than the shaft 3 of the receiving base 2. A housing 8 having a hole and a guide hole through which the pivot bearing 4 slides.

Next, a description will be given of the bonding operation by this pressure bonding apparatus. First, as shown in FIG.
7 is put on the holding table 12 and the PWB 16 is
On top of which TAB1 is placed via an adhesive sheet.
5 is placed on each cradle 2.

Next, the pressure bonding head 10 is lowered and the flat surface 1
0a is stopped at a position where it contacts TAB15.
Next, the pneumatic cylinder 5 of the pressing mechanism 1 shown in FIG.
Compressed air is sent to the air port 7 of FIG.

As a result, the PWB 16 and the TAB 15 placed on the pedestal 2 by the swinging action of the pivot bearing 4
The laminated plate member is pressed with a constant pressing force along the flat surface 10a of the pressure bonding head 10, heated and bonded.

As described above, since the pivot bearing 4 swings due to the slant of the flat surface 10a which is the crimping surface of the crimping head 10, even if the pedestal 2 and the flat surface 10a are not parallel, they follow the flat crepe. As a result, the TAB 15 and the PWB 16 are pressed uniformly, so that even if the degree of parallelism is deviated due to a change in temperature, poor adhesion or misalignment does not occur. The hemispherical member of the shaft 3 is made of a retainer and metal for preventing backlash so that a bearing metal is inserted and precisely fitted into the recess of the pivot bearing 4 so as not to give an impact to the member to be bonded at the time of bonding and pressing. Is held.

FIG. 2 is a perspective view of a crimping device for explaining another embodiment of the present invention. The crimping device according to the above-described embodiment can be applied to a case where the size of the member to be bonded is large and small in width and length, and is versatile, but the cost of the device increases accordingly. Many of the members to be bonded in this liquid crystal panel are relatively long and thin, and FIG. 2 shows a device which is devised as an inexpensive crimping device suitable for these objects.

This crimping apparatus includes a long plate-shaped receiving base 9 on which a long PWB 16 is placed, and a crimping head 1 which is provided at both ends of the receiving base 9 and is loaded with TAB 15 and PWB 16.
That is, a pressing mechanism 1 for pressing to zero is provided. Otherwise, it is the same as the crimping device in the above-described embodiment.

The pedestal 9 is made of a steel material having a certain thickness and reinforced so as not to be distorted by the pressing of the pressing mechanism 1, and it is necessary to have a rigidity so that a bending of at most about 0.05 mm occurs when pressed. . By pressing through such a long base 9 having high rigidity, it is possible to perform pressure bonding from a long one to a short one, and even if the pressure bonding head 10 is inclined in the horizontal or vertical direction, a pressing mechanism is provided. 1 pivot bearing 4
Can be absorbed by the swinging action of.

[0023]

As described above, the present invention provides a pressing member which can be tilted in any direction so as to follow the flat surface of a heated pressure bonding head and has a pressing mechanism for pressing a member to be bonded. Even if the degree of parallelism of the pressure bonding head with the table is deviated or the flatness of the member to be bonded is poor, there is an effect that a uniform pressing force is applied to the entire surface to obtain good bonding. In addition, it is possible to reduce the number of steps for repairing the parallelism and waste time. As a result, the operation rate could be improved by 10%.

On the other hand, instead of dividing the pressure bonding head as in the conventional example, a plurality of pressing mechanisms are provided for the integrated pressure bonding head having a wide pressing surface, and the pressing mechanism is provided at an arbitrary position of the member to be bonded via the receiving table. By pressing, a wide range of workpieces, from wide or long to short, can be bonded without replacing the tool, eliminating the man-hours required for replacement and the time spent on it. Thus, there is an effect that the bonding cost can be reduced and the operation rate of the apparatus can be greatly increased.

[Brief description of the drawings]

FIG. 1 is a perspective view of a crimping device and a cross-sectional view of a pressing mechanism for explaining an embodiment of the present invention.

FIG. 2 is a perspective view of a crimping device for explaining another embodiment of the present invention.

FIG. 3 is a perspective view of a crimping device showing an example of the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Pressing mechanism 2, 2a, 9 Cradle 3 Shaft 4 Pivot bearing 5 Pneumatic cylinder 6 Piston rod 7 Airport 8 Housing 10 Crimping head 10a Flat surface 11 Driving cylinder 12 Holder 13 Guide rail 14 Guide 15 TAB 16 PWB 17 LCD panel

Claims (3)

(57) [Claims] 1. A crimping head having a heated flat surface and a plurality of plate-like parts to be mounted are arranged side by side on top of each other.
Each elongated deposition substrate which is of the loading and the adherend component
A plurality of cradle which is the flat surface disposed opposite of the bonding head with corresponding, each of these cradle
The by that pressed on the flat surface of the bonding head
And a plurality of pressing mechanisms for inclining the surfaces of the receiving tables in all directions following the flat surface . 2. The receiving base is in contact with the elongated substrate.
A single long plate member of the same length,
2. The crimping device according to claim 1 , wherein at least two pressing mechanisms are provided at both ends of the pressing device. 3. The pressing mechanism is fitted with a shaft end of the pedestal.
And a pivot bearing that
And an air cylinder for applying a pressing force to the cradle.
The crimping device according to claim 1 or 2, wherein