JP2738361B2 - Resin molding device and resin molding method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin molding apparatus and a resin molding method, and more particularly to a resin molding apparatus and a resin molding method for a semiconductor package having a small floor area and a high production capacity.

[0002]

2. Description of the Related Art FIG. 3 is a sectional view showing an example of a conventional resin molding apparatus. The resin molding device 21 shown in FIG.
Is a set of a mold upper mold 22 and a lower mold 23, a mold clamping cylinder 24 for clamping the upper and lower molds 22, 23, an injection cylinder 25 for injecting resin, and a plunger 26.
have. The upper mold 22 has a plunger 26.
The pot 27 in which is operated is formed. A heater 28 is installed in each of the mold upper and lower molds 22 and 23, and is heated to about 180 ° C.
Is heating up. In the molding of the resin in such an apparatus, the lead frame 19 is set in the lower mold 23, the resin tablet 20 is supplied to the pot 27, and the upper and lower dies 2 are
After closing the resin tablets 2 and 23, the resin tablet 20 is pressed by the plunger 26 and injected into the cavity by the mold upper and lower dies 22 and 23 to perform resin molding.

Further, as disclosed in Japanese Patent Application Laid-Open No. 58-225642, a multi-stage mold is provided between upper and lower mold plates having heaters for resin molding in order to increase the number of productions in one resin molding. Devices have also been proposed. FIG. 4 is a sectional view showing such a conventional resin molding apparatus. FIG. 5 is a front view of the multi-stage type shown in FIG. In these drawings, the same components as those shown in FIG. 3 are denoted by the same reference numerals.

In FIGS. 4 and 5, a multi-stage mold 29 is formed by stacking a plurality of thin mold upper and lower molds 22 and 23 in a plurality of stages. Except for the lowermost thin mold lower mold 34, a pot 27 is formed so as to penetrate the center. The pot 27 is connected to a runner 35 and a cavity 36 of a mold in each step. At the time of resin molding, a lead frame is installed on each step of the mold, and the upper and lower plates 30 and 31 are mounted.
Is closed by the mold clamping cylinder 24, the resin tablet 20 is supplied to the pot 27 of the multi-stage mold 29, extruded by the plunger 26, and the resin is injected into the runner 35 and the cavity 36 in the mold of each stage to mold. I do. After the resin molding, the multi-stage mold 29 is taken out of the resin molding device 21, and the multi-stage mold 29 is separated from each stage to take out the resin-molded lead frame.

[0005]

Among the above-described conventional resin molding apparatuses, an apparatus having one set of molds does not increase the size of the apparatus even if the number of resin molds (the number of products) is increased. Since it is difficult to increase the size of the mold more than a certain level, it is necessary to increase the size of the apparatus in order to improve productivity, and there is a problem that the floor area is increased.

On the other hand, in the apparatus disclosed in Japanese Patent Application Laid-Open No. 58-225642, thin molds are stacked in a plurality of stages.
In order to take out the lead frame set and resin-molded lead frame, the multi-stage mold must be taken out of the device and the thin mold must be separated.
There is a problem that workability is extremely poor and productivity is not improved.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a resin molding apparatus and a resin molding method for a semiconductor package capable of improving the production capacity and improving the workability without increasing the size of the apparatus. Aim.

[0008]

According to a first aspect of the present invention, there is provided an image forming apparatus, comprising: a lower die or an upper die between a lower die and an upper die which are vertically opposed and one of which is vertically moved with respect to the other. An intermediate mold that is arranged to be vertically movable independently of each other and forms a cavity when the mold is closed with each of the lower mold and the upper mold, and is installed in each of the lower mold and the upper mold; And a resin introduction device for introducing a resin material into a cavity formed by each of the lower mold and the upper mold when the mold is closed, and a central part of the lower mold and the upper mold respectively.
And a pot for supplying the resin tablet is provided.
The resin introduction device moves a plunger in the pot.
Resin mold characterized by being an injection cylinder
Device.

In the resin molding method using the resin molding apparatus according to the first aspect of the present invention , the above-described method is performed while the mold is opened.
Supply the lead frame to the top of the mold and
Supply the resin tablet to the pot and place it on the top of the intermediate mold.
Supplies the lead frame, then the intermediate mold and the
At the same time as closing the lower mold and the upper mold,
A resin tablet is supplied to the lower mold and the upper mold.
The plunger in the pot by each injection cylinder
The resin material is introduced by operating the intermediate mold and the lower mold and the cavity each of said upper die is formed, after the resin introduced, after the elapse of a certain time, the lower mold and the intermediate mold and the upper mold And removing the resin-sealed lead frame from the mold.

According to a second invention, in the resin molding apparatus according to the first invention, the upper mold is provided on an upper surface of the intermediate mold.
The plunger is operated through the pot when the mold is closed.
, And further provided .

In the resin molding method using the resin molding apparatus according to the second invention, a lead frame is supplied to an upper surface of the lower die and a resin tablet is supplied to a pot of the lower die in a state where the die is opened. And on the upper surface of the intermediate mold
Supplies the lead frame and the intermediate pot
After supplying the resin tablet to the intermediate mold and the lower mold
And closing the upper mold, operating the plungers in the pots of the lower mold and the upper mold by respective injection cylinders, and forming a resin in a cavity formed by each of the intermediate mold, the lower mold and the upper mold. After a certain period of time has elapsed after the introduction of the resin and the introduction of the resin, the intermediate mold, the lower mold and the upper mold are opened, and the resin-sealed lead frame is removed from the mold.

[0012]

[0013]

In the resin molding apparatus and the resin molding method according to the first and second aspects of the present invention, the lower mold is provided between the lower mold and the upper mold which are vertically opposed and one of which moves up and down with respect to the other. and by arranging vertically movably independently of the intermediate type the lower mold or upper mold forming a cavity <br/> tee in the mold closed between each of the upper mold, molding ability of the product, Compared to the case of a resin molding apparatus having one set of mold dies, the same floor area is doubled. In addition, since the supply of the material and the removal of the product before and after the resin molding can be performed without removing the mold to the outside of the apparatus, workability is improved and automation is facilitated.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 is a front view showing a first embodiment of the resin molding apparatus of the present invention.

As shown in FIG. 1, the resin molding apparatus of this embodiment includes a top plate 4 and an intermediate base 10 which are installed in parallel with a predetermined space therebetween. An upper mold setting plate 3 is guided by a shaft 6 between the top plate 4 and the intermediate base 10, and can be moved vertically by four upper mold clamping cylinders 5a to 5d on the top plate 4. .
An upper die 2 as a movable die is fixed to the upper die installation plate 3 with the cavity 1 for molding the upper package of the semiconductor package facing downward.

An upper mold pot 7 is formed at the center of the upper mold 2, and an upper mold plunger 9 movable by an upper mold injection cylinder 8 on the top plate 4 is installed in the upper mold pot 7. .

On the intermediate base 10, a lower mold 12 as a fixed mold is installed with the cavity 1 for molding the lower package of the semiconductor package facing upward. A lower mold pot 13 is formed at the center of the lower mold 12, and a lower mold plunger 15 movable by a lower mold injection cylinder 14 below the intermediate base 10 is installed in the lower mold pot 13. In addition, the upper mold injection cylinder 8 and the lower mold injection cylinder 14 correspond to a resin introduction device referred to in the claims.

Between the upper mold 2 and the lower mold 12, a cavity 11 for forming a lower package of the semiconductor package on the upper surface.
An intermediate mold 16 having a cavity 1 forming an upper package of a semiconductor package on a lower surface is installed while being supported by an intermediate mold operating cylinder 17 below the intermediate base 10 so as to be movable in a vertical direction.

The intermediate mold 16, the upper mold 2 and the lower mold 12 are provided with the cavity 1 of the upper mold 2 and the cavity 1 on the upper surface of the intermediate mold 16.
1 and the cavity 1 on the lower surface of the intermediate mold 16 and the lower mold 12
The cavities 11 are in a positional relationship in which a semiconductor package can be formed. A lead frame 19 can be placed on the upper surface of each of the intermediate mold 16 and the lower mold 12. Further, in order to ensure the positioning between the opposing dies, the positioning pins 18 are provided with the intermediate dies 16.
And the lower mold 12.

Each of the upper mold 2, the intermediate mold 16 and the lower mold 12 is provided with a heater (not shown), and heats the upper mold, the intermediate mold and the lower mold to a predetermined temperature.

Next, the molding by the above resin molding apparatus will be described.

In the resin molding method according to the present embodiment, first, the lead frame 19 and the resin tablet 20 are supplied to the upper surface of the lower mold 12 and the lower mold pot 13, respectively. Or supplied manually. After such supply, the intermediate mold 16
Is lowered by the intermediate operation mold clamping cylinder 17 and is combined with the lower mold 12. At the same time, the upper mold equipment plate 3 is also lowered by the upper mold clamping cylinders 5a to 5d, and is combined with the intermediate mold 16. At this time, the resin tablet 20 is supplied to the upper mold pot 7 (the supply mechanism is not shown).

In this way, the upper mold 2, the intermediate mold 16 and the lower mold 12 are integrated, and after the mold is clamped at a predetermined pressure, the upper mold plunger 9 and the lower mold plunger 9, The lower plunger 15 moves and pushes each resin tablet 20. Thereby, the cavities 1 and 1 of the intermediate mold 16 and the upper mold 2 and the lower mold 12
1 and the resin molding is completed.

After a lapse of a predetermined time from the end of the resin molding, the upper mold setting plate 3 is raised by the upper mold clamping cylinders 5a to 5d, and at the same time, the intermediate mold 16 is also raised by the intermediate mold clamping cylinder 17, and The mold opens,
The resin-molded lead frame 19 is automatically (not shown) or manually taken out of the mold.

The supply and removal of the lead frame, the resin-molded lead frame 19, and the resin tablet 20 can be realized by, for example, a handling device provided with a suction pad, a gripping mechanism, and the like at the distal end.

(Second Embodiment) FIG. 2 is a front view showing a second embodiment of the resin molding apparatus of the present invention. In this figure, the same components as those of the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 2, in the resin molding apparatus of this embodiment, an intermediate mold pot 37 is provided at the center of the upper surface of the intermediate mold 16 so that the upper mold pot 7 communicates with the upper mold plunger 9 when the mold is closed. It is formed. According to this embodiment, since the supply of the resin tablet 20 can be performed simultaneously with the lead frame 19 on the upper surface of the intermediate mold 16, the molding process on the upper mold 2 side and the lower mold 12 side becomes the same. As a result, in automating the supply of the lead frame and the resin tablet before and after the resin molding, it is not necessary to use separate supply devices and control mechanisms for the upper mold 2 and the lower mold 12. Moreover, since the molding process on the upper mold 2 side and the lower mold 12 side becomes the same, the cycle time required from the installation of the lead frame to the removal of the product can be shortened as compared with the first embodiment, and the productivity is higher. Equipment.

In the first and second embodiments described above, the upper die 2 is movable in the vertical direction and the lower die 12 is fixed. However, the present invention is not limited to this. May be fixed, and the lower mold 12 may be movable in the vertical direction.

Furthermore, cavities are formed on the upper and lower surfaces between the upper mold 2 and the lower mold 12, and an intermediate mold 16 which can be moved up and down independently by a dedicated mold clamping cylinder is installed, so that the production capacity can be reduced in a small space. The device of the present invention to improve is not only suitable for the transfer molding method,
For example, both the injection device and the mold clamping device can be appropriately applied to a vertical injection molding machine in which the center lines are in the vertical direction and these are arranged in a straight line.

[0032]

As described above, according to the present invention, the mold is closed between the lower mold and the upper mold between the lower mold and the upper mold, which are vertically opposed to each other and move up and down with respect to the other. Even when the intermediate mold that forms the cavity is arranged independently of the lower mold or the upper mold so as to be vertically movable and a resin molding method using the same, the productivity is one set of the conventional one. It is twice as large as a resin molding device with a mold, and the supply and removal of the lead frame before and after the resin molding can be automated without taking out the mold. Therefore, the production capacity is higher without increasing the floor area. It becomes possible to be equipment.

In addition, by providing a pot on the upper surface of the intermediate mold where the plunger is operated by communicating with the pot of the upper mold, the supply of the resin tablet to the upper surface of the intermediate mold can be performed similarly to the lower mold side. Since the molding can be performed simultaneously with the supply of the lead frame, the molding conditions on the upper mold side and the lower mold side can be the same.
The cycle time required from the installation of the lead frame to the removal of the product can be shortened to a minimum, and the equipment has higher productivity.

[Brief description of the drawings]

FIG. 1 is a front view showing a first embodiment of a resin molding apparatus according to the present invention.

FIG. 2 is a front view showing a second embodiment of the resin molding device of the present invention.

FIG. 3 is a sectional view showing an example of a conventional resin molding apparatus.

FIG. 4 is a cross-sectional view showing an example of a conventional resin molding apparatus capable of increasing the number of productions in one resin molding.

FIG. 5 is a front view of the multistage type shown in FIG. 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Upper package side cavity 2 Upper die 3 Upper die installation plate 4 Top plate 5a-5d Upper die clamping cylinder 6 Shaft 7 Upper die 8 Upper die injection cylinder 9 Upper die plunger 10 Intermediate base 11 Lower package side cavity 12 Lower Mold 13 Lower mold pot 14 Lower mold injection cylinder 15 Lower mold plunger 16 Intermediate mold 17 Intermediate mold operation mold clamping cylinder 18 Positioning pin 19 Lead frame 20 Resin tablet 37 Intermediate mold pot

Claims (4)

(57) [Claims] 1. A lower mold and an upper mold which are vertically opposed to each other and which are vertically movable with respect to the other. An intermediate mold that forms a cavity with each of the upper molds when the mold is closed; and a cavity that is installed in each of the lower mold and the upper mold, and that the intermediate mold, the lower mold, and the upper mold each form when the mold is closed. A resin introduction device for introducing a resin material into the lower mold and a central portion of the upper mold, each of which is provided with a pot to which a resin tablet is supplied, wherein the resin introduction device is A resin molding device comprising an injection cylinder for operating a plunger in the pot. 2. The resin molding apparatus according to claim 1, further comprising a pot on the upper surface of the intermediate mold, the pot being connected to the upper mold pot when the mold is closed and operated by a plunger. Resin molding equipment. 3. A resin mold device according to claim 1, wherein a lead frame is supplied to an upper surface of the lower die and a resin tablet is supplied to a pot of the lower die while the die is opened, and A lead frame is supplied to the upper surface of the mold, and thereafter, the intermediate mold and the lower mold and the upper mold are closed, and at the same time, a resin tablet is supplied to the upper mold pot, and the lower mold and the upper mold are supplied. The plunger in the pot is operated by each injection cylinder to introduce a resin material into the cavity formed by each of the intermediate mold, the lower mold and the upper mold, and after a certain time has elapsed after the introduction of the resin, A resin molding method, wherein the intermediate mold, the lower mold, and the upper mold are opened, and a resin-sealed lead frame is removed from the mold. 4. A resin mold device according to claim 2, wherein a lead frame is supplied to an upper surface of the lower die and a resin tablet is supplied to a pot of the lower die in a state where the die is opened. After supplying the lead frame to the upper surface of the mold and supplying the resin tablet to the intermediate mold pot, the intermediate mold, the lower mold and the upper mold are closed, and the lower mold and the upper mold are closed. The plunger is operated by each injection cylinder, a resin material is put into the cavity formed by each of the intermediate mold, the lower mold and the upper mold, and after a certain time has elapsed after the resin was introduced,
A resin molding method, wherein the intermediate mold, the lower mold, and the upper mold are opened, and a resin-sealed lead frame is removed from the mold.