JPS58225642A - Resin molding method of semiconductor device - Google Patents
Resin molding method of semiconductor deviceInfo
- Publication number
- JPS58225642A JPS58225642A JP10905382A JP10905382A JPS58225642A JP S58225642 A JPS58225642 A JP S58225642A JP 10905382 A JP10905382 A JP 10905382A JP 10905382 A JP10905382 A JP 10905382A JP S58225642 A JPS58225642 A JP S58225642A
- Authority
- JP
- Japan
- Prior art keywords
- molding
- mold
- forces
- thin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/32—Moulds having several axially spaced mould cavities, i.e. for making several separated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】 本発明は半導体装置の樹脂モールド方法に関する。[Detailed description of the invention] The present invention relates to a resin molding method for semiconductor devices.
従来の樹脂モールド方法は、第１図のモールド成形機の
正面図、第２図の下金型の平面図、第３図の上下金型の
正面図に示すように上下モールド金型４．５をモールド
成形機ｌに取付固定し、型締シリンダ２にて型締めを行
ない、射出シリンダー３にてプランジャー６を介１７て
モールド金型に樹脂を注入【７てモールド成形を行ない
、モールド成形後型締シリンダ２を緩めて型を開き、樹
脂モールドさｒｌだ半導体装置を取り出していた。第２
図、第３図において、７はランナー、８は注入樹脂によ
って半導体装置を形成するキャビティー、９は加熱用の
ヒーターである。この従来方法では、モールド成形数を
増やそうとしても、モールド金型の大きさをある程度以
上大きくすることは困難であシ、従って１回のモールド
成形数にも限度があって作業能率の向上は望めなかった
。The conventional resin molding method uses upper and lower molds 4.5 as shown in the front view of the molding machine in Figure 1, the plan view of the lower mold in Figure 2, and the front view of the upper and lower molds in Figure 3. is attached and fixed to the molding machine L, the mold is clamped with the mold clamping cylinder 2, and the resin is injected into the mold die with the injection cylinder 3 through the plunger 6 17. The rear mold clamping cylinder 2 was loosened, the mold was opened, and the semiconductor device from the resin mold was taken out. Second
3, 7 is a runner, 8 is a cavity in which a semiconductor device is formed by injection resin, and 9 is a heater for heating. In this conventional method, even if you try to increase the number of molds to be formed, it is difficult to increase the size of the mold beyond a certain level, and therefore there is a limit to the number of molds to be formed at one time, making it difficult to improve work efficiency. I couldn't hope for it.
本発明はかかる欠点を解決するためになされたものであ
る。The present invention has been made to solve these drawbacks.
次に本発明の冥施例を第４図〜第７図を用いて説明する
。第４図は本発明に用いるモールド成形機の正面図、第
５図はその薄形モールド金型の下型の平面図、第６図は
その薄形モールド金型の正面図、第７図はその最下段の
下型の正面図である。Next, embodiments of the present invention will be explained using FIGS. 4 to 7. Fig. 4 is a front view of the mold forming machine used in the present invention, Fig. 5 is a plan view of the lower mold of the thin mold, Fig. 6 is a front view of the thin mold, and Fig. 7 is a front view of the mold forming machine used in the present invention. It is a front view of the lower mold of the lowest stage.
本発明に用いる多段モールド金型１３は薄形モールド金
型が複数段に積層さ１、この薄形モールド金型はｆＡ６
図に示すように１４が上型で１５が下型全示す。又第５
図、第６図に示すように、７′はランナーで、８′はキ
ャビティーである。又第７図に示す１６は複数段に積層
した多段モールド金型１３の最下段の下型を示す。The multistage molding die 13 used in the present invention has thin molding die stacked in multiple stages 1, and this thin molding die has an fA6
As shown in the figure, 14 indicates the upper mold, and 15 indicates the entire lower mold. Also the fifth
As shown in FIG. 6, 7' is a runner, and 8' is a cavity. Further, reference numeral 16 shown in FIG. 7 indicates the lower mold at the lowest stage of the multi-stage molding die 13 stacked in multiple stages.
第６図かられかるように、薄形モールド金型の上型１４
及び下型１５の厚さはキャビティー８′の深さよりやや
厚い程度に形成さｎ１従来の上下モールド金型４．５に
比べて薄くなっており、最下段の下型を除いてボット１
７が貫通している。又第４図の１０．１１はモールド成
形に必要な温度に多段モールド金型を加熱する加熱板で
あり、ヒーター１２が挿入さｎている。この加熱板１ｏ
。As shown in Fig. 6, the upper die 14 of the thin mold die
The thickness of the lower mold 15 is formed to be slightly thicker than the depth of the cavity 8', and is thinner than the conventional upper and lower mold molds 4.5.
7 is passing through. Further, reference numeral 10.11 in FIG. 4 is a heating plate for heating the multi-stage molding die to a temperature required for molding, into which a heater 12 is inserted. This heating plate 1o
.
１１の間に、あらかじめリードフレームをそｎぞｆＬ組
み込んだ薄形モールド金型を複数段重ね合わせてセット
【７、型締シリンダー２にて型締めを行ない、ボット１
７に樹脂を投入し、射出シリンダー３にてプランジャー
６を介して多段モールド金型１３に樹脂を注入し、モー
ルド成形を行なう。Between 11 and 11, thin molds in which lead frames have been assembled in advance are stacked in multiple stages and set.
7, the resin is injected into the multi-stage molding die 13 via the plunger 6 using the injection cylinder 3, and molding is performed.
モールド成形後、多段モールド金型１３をモールド成形
機１外に堆り出し、樹脂モールドさｎた半導体装置を分
離する。After molding, the multi-stage mold 13 is taken out of the molding machine 1, and the resin-molded semiconductor device is separated.
以上述べたように、本発明の方法によれば、薄形モール
ド金型を複数段セットすることにより、１回の成形数を
増やすことができる。又、リードフレームの組み込み、
半導体装置の堆シ出し介モールド成形機外で行なえる為
、モールド成形時間中に組み込み、取り外し７が行なえ
るのみでなく、自動化等の手段が幅広く選べる等非常に
利点が多く、高能率な樹脂モールド方法を提供すること
ができる。
、ＩAs described above, according to the method of the present invention, by setting multiple stages of thin molds, it is possible to increase the number of moldings performed at one time. Also, incorporating lead frame,
Since the deposition of semiconductor devices can be carried out outside the molding machine, it not only allows installation and removal during the molding time, but also has many advantages such as a wide range of automation methods. A molding method can be provided.
, I
第１図は従来のモールド方法に使用した成型機の正面図
、第２図は従来のモールド方法に使用したモールド金型
の下型を示す平面図、第３図は従来のモールド方法に使
用した上下モールド金型の正面図、第４図Ｐｉ本発明の
モールド方法に使用する成型機の正面図、第５図は本発
明のモールド方法に使用する薄形モールド金型の一実施
例の下型を示す平面図、第６図は本発明のモールド方法
に使用する上下薄形モールド金型の一実施例の正面図、
第７図は本発明のモールド方法に使用する多段モールド
金型の一実施例の最下段の下型を示す正面図である。
１・・・・・・モールド成形様、２・・・・・・型締シ
リンダ、３・・・・・・射出シリンダ、４・・・・・・
上金型、５・・・・・・下金型、６・・・・・・プラン
ジャー、７．７’・・・・・・ランナー、８．８′・・
・・・・キャビティ、９・・・・・・ヒーター、１０゜
１１・・・・・・加熱板、１２・・・・・・ヒーター、
１３・・・・・・多段モールド金型、１４・・・・・・
薄形モールド金型の上型、１５・・・・・・薄形モール
ド金型の下型ζ １６・・・・・・多段モールド金型の
最下段の下型、１７・・・・・・ホット。
代理人 弁理士 内 原 音
靜１図Figure 1 is a front view of the molding machine used in the conventional molding method, Figure 2 is a plan view showing the lower mold of the mold used in the conventional molding method, and Figure 3 is a front view of the molding machine used in the conventional molding method. FIG. 4 is a front view of the upper and lower molding molds; FIG. 4 is a front view of the molding machine used in the molding method of the present invention; FIG. 5 is a lower mold of an embodiment of the thin molding die used in the molding method of the present invention. 6 is a front view of an embodiment of the upper and lower thin mold molds used in the molding method of the present invention,
FIG. 7 is a front view showing the lower mold of the lowest stage of an embodiment of the multi-stage mold used in the molding method of the present invention. 1... Mold forming, 2... Mold clamping cylinder, 3... Injection cylinder, 4...
Upper mold, 5...Lower mold, 6...Plunger, 7.7'...Runner, 8.8'...
...Cavity, 9...Heater, 10°11...Heating plate, 12...Heater,
13...Multi-stage mold, 14...
Upper die of thin mold die, 15... Lower die of thin mold die ζ 16... Lower die of the lowest stage of multistage mold die, 17... hot. Agent Patent Attorney Uchihara Otosei 1
Claims (1)
する方法において、モールド金型を薄形構造とし、モー
ルド成形機の金型取付部の上下にそｎぞｎ加熱板を取り
付け、前記薄形モールド金型を該加熱板の間へ複数組重
ね合わせて型締めし、この多段モールド金型の最上段か
ら最下段の上型捷で貫通して設けらｎたボットに樹脂を
投入してトランスファモールド成形を行ない、成形後前
記多段モールド金型をモールド成形機外に取り出し、そ
ｎぞｊの薄形モールド金型から樹脂モールド半導体装置
を分離せしめることを特徴とする半導体装置の樹脂モー
ルド方法、In a method of resin molding a semiconductor device using a transfer molding method, the molding die is made into a thin structure, heating plates are attached above and below the mold attachment part of the molding machine, and the thin molding die is A plurality of sets are superimposed between the heating plates and the molds are clamped, and resin is poured into a bot provided by penetrating the mold from the top to the bottom of the multi-stage mold, and transfer molding is performed. A method for resin molding a semiconductor device, characterized in that the multistage mold is then taken out of the molding machine and the resin molded semiconductor device is separated from the thin mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10905382A JPS58225642A (en) | 1982-06-24 | 1982-06-24 | Resin molding method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10905382A JPS58225642A (en) | 1982-06-24 | 1982-06-24 | Resin molding method of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58225642A true JPS58225642A (en) | 1983-12-27 |
Family
ID=14500407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10905382A Pending JPS58225642A (en) | 1982-06-24 | 1982-06-24 | Resin molding method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58225642A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015214125A (en) * | 2014-05-13 | 2015-12-03 | キヤノン株式会社 | Transfer molding method, transfer molding device, and molded article |
| US9878475B2 (en) | 2013-12-18 | 2018-01-30 | Canon Kabushiki Kaisha | Transfer molding method, mold, and molded article |
-
1982
- 1982-06-24 JP JP10905382A patent/JPS58225642A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9878475B2 (en) | 2013-12-18 | 2018-01-30 | Canon Kabushiki Kaisha | Transfer molding method, mold, and molded article |
| JP2015214125A (en) * | 2014-05-13 | 2015-12-03 | キヤノン株式会社 | Transfer molding method, transfer molding device, and molded article |
| US10076859B2 (en) | 2014-05-13 | 2018-09-18 | Canon Kabushiki Kaisha | Transfer molding method, transfer molding device, and molded article |
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