JPS60175432A - Resin sealing device - Google Patents
Resin sealing deviceInfo
- Publication number
- JPS60175432A JPS60175432A JP3084184A JP3084184A JPS60175432A JP S60175432 A JPS60175432 A JP S60175432A JP 3084184 A JP3084184 A JP 3084184A JP 3084184 A JP3084184 A JP 3084184A JP S60175432 A JPS60175432 A JP S60175432A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- die
- resin
- punch
- reinforcing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 24
- 229920005989 resin Polymers 0.000 title claims abstract description 24
- 238000007789 sealing Methods 0.000 title claims description 13
- 238000004080 punching Methods 0.000 claims abstract description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 4
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 210000001520 comb Anatomy 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は半導体、電子部品の樹脂封止装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a resin sealing device for semiconductors and electronic components.
従来例の構成とその問題点
従来の熱硬化性樹脂封止機においては、第１図に示す様
にリードフレーム１に補強用のブリッジ２を残したまま
封止を行なっている。しかしリードフレームと樹脂は熱
収縮率が異なるため、封止後のコムは補強用ブリッジ２
に応力が集中し、第２図に示す８４にすき？歪む−従っ
て虚嵌瑞小ＩＩ−ドフレーム（以下コムと呼ぶ）を自動
的に金型内よシ取シ出したシ、あるいは運搬用のマガジ
ン等に整列収納を行なうことが困難であり、次工程での
作業者による再整列が必要であったり、制止機そのもの
の自動化が困難である、という問題があった。これらの
問題を解決するものとして、コムを多連ではなく１素子
１コム対応の方式のものがある（図示せず）が、この方
式では生産量増大への対応が困難であるという問題が残
る。Conventional Structure and Problems In the conventional thermosetting resin sealing machine, as shown in FIG. 1, the lead frame 1 is sealed with the reinforcing bridge 2 left in place. However, since the lead frame and the resin have different heat shrinkage rates, the comb after sealing has a reinforcing bridge 2.
Stress is concentrated at 84 shown in Figure 2, causing a gap. Therefore, it is difficult to automatically remove the blank-fitted frame (hereinafter referred to as com) from the mold or to align and store it in a magazine for transportation, etc. There have been problems in that it requires workers to re-align during the process, and that it is difficult to automate the stopper itself. To solve these problems, there is a system that supports one element and one comb instead of multiple combs (not shown), but this system still has the problem that it is difficult to cope with increased production volume. .
発明の目的
本発明はこれらの問題を解決するもので、成形後もコム
の熱変形を生じさせない封止機を提供するものである。OBJECTS OF THE INVENTION The present invention solves these problems and provides a sealing machine that does not cause thermal deformation of the comb even after molding.
発明の構成
本発明の樹脂封止装置は、成形用金型と金型に配置され
た打抜き用のパンチおよびダイと、パンチおよびダイに
よって打ち抜かれた破片を吸引する吸引装置とから構成
されておシ、成形と同時にコムの補強ブリッジを打ち抜
き成形後も熱変形撃力の集中を生じさせず、リードフレ
ームの変形を防ぐという・特有の効果を有する。Structure of the Invention The resin sealing device of the present invention is comprised of a mold for molding, a punch and die for punching disposed in the mold, and a suction device for sucking the pieces punched out by the punch and die. It also has the unique effect of preventing the concentration of thermal deformation impact force and preventing deformation of the lead frame even after the reinforcing bridge of the comb is punched and formed at the same time as the molding.
実施例の説明
以下本発明の一実施例について第３図〜第８図を参照し
ながら説明する。第３図は本実施例における熱硬化性樹
脂を用いた封止用金型の一部断面斜視図である。３は下
型で、成形すべき形状の下半分（以下下キャビティと称
する）４が成形されている。５は成形材料である円柱型
に圧縮成形された熱硬化性樹脂（以下タブレ・、）と称
す）を溶融させる部分（以下カル部と称す）である。６
は溶融した樹脂を下キャビティ内に導入する部分（以下
ゲート部と称す）で、ここを通って溶融した樹脂は下キ
ャビティ４内に流れ込む・７は補強ブリ・ソジ２の打抜
用ダイで、打抜かれた補強ブリ・ソジ２は、ダイアの下
方に設けられた吸引穴８を通って型外へ排出される。下
型３は、ヒーター（図示せず）によって定温に加熱され
ている。９は上型で成形すべき形状の上半分（以下キャ
ビティと称す）１ｏが成形されている。１１は下型３の
カル部６にタブレツトを供給するためのボ、フトで、円
筒状である。上型９には、補強用ブリッジ２を打ち抜く
だめのパンチ１２が設けられている。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 3 to 8. FIG. 3 is a partially sectional perspective view of a sealing mold using a thermosetting resin in this example. 3 is a lower mold, in which the lower half (hereinafter referred to as lower cavity) 4 of the shape to be molded is molded. Reference numeral 5 denotes a part (hereinafter referred to as a cull part) for melting a thermosetting resin (hereinafter referred to as Tabulet) which is compression molded into a cylindrical shape, which is a molding material. 6
is a part (hereinafter referred to as the gate part) for introducing the molten resin into the lower cavity, through which the molten resin flows into the lower cavity 4. 7 is a die for punching the reinforcing plate 2. The punched reinforcing material 2 is discharged out of the mold through a suction hole 8 provided below the diamond. The lower mold 3 is heated to a constant temperature by a heater (not shown). 9, an upper half (hereinafter referred to as cavity) 1o of the shape to be molded is molded with an upper mold. Reference numeral 11 denotes a cylindrical hole for supplying the tablet to the cull portion 6 of the lower mold 3. The upper die 9 is provided with a punch 12 for punching out the reinforcing bridge 2.
１３はシランジャで、カル部６で溶融した樹脂を下キャ
ビティ４および上キャビティ１ｏ内に流し込むだめのも
のである。上型９もヒータ（図示せず）によって定温に
加熱されている。１４は真空ポンプで、パンチ１２およ
びダイアによって打抜かれた補強ブリッジ２を下型３の
外へ排除する。Reference numeral 13 denotes a sylanger for pouring the resin melted in the cull portion 6 into the lower cavity 4 and the upper cavity 1o. The upper mold 9 is also heated to a constant temperature by a heater (not shown). A vacuum pump 14 removes the reinforcing bridge 2 punched by the punch 12 and the die from the lower mold 3.
以上のように構成された熱変形のない樹脂封止装置につ
いて以下にその動作を説明する。The operation of the resin sealing device without thermal deformation configured as above will be explained below.
まず手作業もしくは、自動的にコム１が下型３の所定の
位置にセットされる。次に下型３が、押し上げられるか
または、上型９が下降する。この時上型９に形成された
パンチ１２、と、下型３に形成されたダイアによってコ
ム１の補強用ブリ・ソジ２が切断され、同時にコム１は
上型９と下型３によってクランプされる。この時打抜か
れたコム１の補強ブリフジ２は、ダイアの下方に設けら
れた排除穴８より、真空ポンプ１４によって型外へ排除
される。その後ボ、、、 ） １１の上方よシ円柱形の
タプレウトが供給され、上型および下型によって加熱さ
れ溶融状態となってプランジャ１３が下降して、樹脂′
は下キャビティ４および上キャビティ１０内に射出され
る。一定時間型締め状態を保持した後、下型３を下降さ
せるか、上型９を上昇させることで成形は終り、コム１
上の素子は樹脂によ、り封止される。このとき、コム１
の補強用ブリッジ２がすでに切断されているため、樹脂
の収縮率と、コムの収縮率の違いによって発生するべき
応力は分散され、第８図に示すようにコムの歪は発生し
ない。なお本発明において、補強用プＩルンジ２を上型
９のパンチ１１と下型３のダイアによる打抜きとしたが
、カッターによる単なる切断としても良いことは言うま
でもない。First, the comb 1 is manually or automatically set at a predetermined position on the lower mold 3. Next, the lower mold 3 is pushed up or the upper mold 9 is lowered. At this time, the reinforcing bolt 2 of the comb 1 is cut by the punch 12 formed on the upper mold 9 and the diamond formed on the lower mold 3, and at the same time, the comb 1 is clamped by the upper mold 9 and the lower mold 3. be done. The reinforcing baffle 2 of the comb 1 punched out at this time is expelled from the mold by a vacuum pump 14 through an expulsion hole 8 provided below the diamond. Thereafter, a cylindrical tapleout is supplied upward from the bottom mold 11, heated by the upper mold and lower mold to become molten, and the plunger 13 descends to release the resin.
is injected into the lower cavity 4 and upper cavity 10. After keeping the mold clamped for a certain period of time, molding is finished by lowering the lower mold 3 or raising the upper mold 9, and the com 1
The upper element is sealed with resin. At this time, com 1
Since the reinforcing bridge 2 has already been cut, the stress that should be generated due to the difference between the shrinkage rate of the resin and the shrinkage rate of the comb is dispersed, and no distortion of the comb occurs as shown in FIG. In the present invention, the reinforcing pull-I lunge 2 is punched using the punch 11 of the upper die 9 and the diamond of the lower die 3, but it goes without saying that it may be simply cut using a cutter.
発明の効果
以上のように本発明によれば、熱硬化性の樹脂を用いた
多連フレームの半導体、電子部品の樹脂封止機において
、多連フレーム補強用のブリッジを打ち抜くパンチとダ
イを、樹脂成形用金型内に設けるととで、成形」の多連
フレームが、樹脂の材質と、フレームの材質の違いによ
って生じるコムの変形を防止することが可能となる。Effects of the Invention As described above, according to the present invention, in a resin sealing machine for multi-frame semiconductors and electronic components using a thermosetting resin, a punch and a die for punching bridges for reinforcing the multi-frames are provided. By providing the multiple frame in the mold for resin molding, it becomes possible to prevent deformation of the comb caused by the difference in the material of the resin and the material of the frame.
第１図は多連リードフレームの上面図、第２図は従来の
封止機による封止後のリードフレーム断面図、第３図は
本発明の実施例における金型の斜視図、第４図は同断面
図、第６図は同型締め状態の斜視図、第６図は同断面図
、第７図は本発明の実施例による封止後の多連リードフ
レーム上面図、第８図は同側断面図である。
３・・・・・下型、７・・・・・・ダイ、９・・・・・
・上型、１１・・・・・・パンチ。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第３図FIG. 1 is a top view of the multiple lead frame, FIG. 2 is a sectional view of the lead frame after being sealed by a conventional sealing machine, FIG. 3 is a perspective view of the mold in the embodiment of the present invention, and FIG. 4 is a sectional view of the same, FIG. 6 is a perspective view of the same mold clamped state, FIG. 6 is a sectional view of the same, FIG. 7 is a top view of the multiple lead frame after sealing according to an embodiment of the present invention, and FIG. FIG. 3...Lower mold, 7...Die, 9...
・Upper die, 11... Punch. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 3
Claims (1)
封止用金型と、この金型内に配置された打抜き用パンチ
、およびダイと、このパンチ、ダイによって打ち抜かれ
た製品の破片を吸引する吸引装置とを有する樹脂封止装
置。A mold for resin sealing that is heated by a heater to melt and harden the thermosetting resin, a punch for punching placed in this mold, a die, and the pieces of the product punched by the punch and die are sucked. A resin sealing device having a suction device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3084184A JPS60175432A (en) | 1984-02-21 | 1984-02-21 | Resin sealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3084184A JPS60175432A (en) | 1984-02-21 | 1984-02-21 | Resin sealing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60175432A true JPS60175432A (en) | 1985-09-09 |
Family
ID=12314918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3084184A Pending JPS60175432A (en) | 1984-02-21 | 1984-02-21 | Resin sealing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60175432A (en) |
-
1984
- 1984-02-21 JP JP3084184A patent/JPS60175432A/en active Pending
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