JP2002347087A - Resin mold apparatus and method for manufacturing resin-sealed semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin mold apparatus capable of releasing a molding and an unnecessary resin from a mold only by operations of upper and lower mold structure and a molding machine without providing a special purpose unit out of the machine. SOLUTION: The resin mold apparatus comprises a lower chase 7 having a pot 15 and formed with a resin channel 19, an intermediate mold 9 detachably mounted in the chase 7 and having a gate 23 formed with a cavity 20 and a gate 23 for filling a molten resin in the cavity, ejector pins 14a, 14b for releasing the molding and the unnecessary resin of the channel from the mold, lifting pins 13a, 13b for lifting the ejector pins, an upper chase 8 lowering on the intermediate mold 9 to clamp the mold, a push pin 11 installed in the chase 8 to press the intermediate mold to the lower mold, and a lifting pin 12 for lifting the mold 9. When an ejector pin plate 10 is raised after the resin is sealed, the pin 14a is first raised to release the molding from the cavity 20. Thereafter, the pins 12, 14b are raised to lift the mold 9 and to release a runner resin from the mold.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding apparatus used for resin sealing of semiconductor elements and the like and a method of manufacturing a resin-sealed semiconductor device using the same, and more particularly to a single-sided mold for exposing a substrate or a heat sink. A resin mold for mounting an intermediate mold having a resin-sealed molded product molding cavity and a resin path for filling the cavity with a molten resin, which is suitable for manufacturing a molded product, between a lower mold and an upper mold. The present invention relates to a device and a method for manufacturing a resin-encapsulated semiconductor device using the device.

[0002]

2. Description of the Related Art BGA (ball grid arra)
In the semiconductor device such as y), the single-sided molding of the element mounting surface of the substrate or the like is performed, and the resin flow path cannot be formed on the surface opposite to the element mounting surface of the substrate during resin molding. Sealing is performed using a resin mold device having an upper mold and a lower mold that can be separated and an intermediate mold that can be attached to and detached from the lower mold. A resin molding apparatus equipped with this type of intermediate mold is disclosed in, for example, Japanese Patent Application Laid-Open No. 8-25424. In the resin molding apparatus disclosed in the publication, a substrate set in an intermediate mold is sandwiched between upper molds and clamped, and a resin flow path formed in a lower mold or an intermediate mold and a resin formed perpendicular to the intermediate mold are formed. The molten resin is filled into the cavity for sealing the semiconductor element with the resin through the flow path. As the mold release device in the above resin molding device, after opening the upper mold and the intermediate mold, remove the intermediate mold from the lower mold, and use the ejector pins installed in the intermediate mold to move the molded product upward and the unnecessary resin downward. By extruding the molded product and the unnecessary resin molded in the resin flow path, the molded product and the unnecessary resin are released from the intermediate mold. Then, the molded product and the intermediate mold from which the unnecessary resin has been removed are mounted on the lower mold again and used.

[0003]

However, the above-mentioned conventional resin molding apparatus has the following problems.
In other words, after filling the resin into the molded product molding cavity, the intermediate mold is taken out from the lower mold, and then the molded product and the unnecessary resin part are released from the intermediate mold. Therefore, a dedicated release device is required. Then, the mold release requires pushing in different directions between the molded product and the unnecessary resin portion. In addition, mold release from the molded product and release of the unnecessary resin portion need to be performed at a low speed and precise control because there is a risk of causing a crack in the molded product and clogging of the resin filling port due to breakage of the unnecessary resin portion. For these reasons, providing the mold release mechanism for the molded product and the unnecessary resin portion outside the molding machine complicates the apparatus and increases its size. An object of the present invention is to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a resin mold capable of releasing a molded product and an unnecessary resin portion without increasing the size and complexity of the apparatus. It is to provide a device.

[0004]

According to the present invention, there is provided, according to the present invention, a first mold for accommodating a pot in which a plunger is slidable, and a first mold for detachably attaching to the first mold. An intermediate mold in which a cavity for forming a molded article to be sealed with resin and a gate resin flow path for allowing molten resin to pass through the cavity are formed, and the intermediate mold during resin sealing. Pressing means for pressing the intermediate mold toward the first mold in a state where the second mold is separated from the intermediate mold; A resin-molding apparatus, further comprising: a molded-product releasing means for removing a molded resin-sealed product from the cavity in a state where the intermediate mold is mounted on the first mold. Is provided.

Preferably, the pressing means includes a push pin capable of contacting the intermediate mold, and a spring for urging the push pin toward the intermediate mold. Preferably, the molded product releasing means includes a molded product ejector pin capable of contacting the molded product, and a molded product ejector driving pin for contacting and driving the molded product ejector pin.
Preferably, the intermediate mold is pressed in a direction away from the first mold to separate the intermediate mold from the first mold against the elastic force of the pressing means. A possible intermediate mold lift pin is further provided. Also,
Preferably, in the first mold, a main resin flow path serving as a path of a molten resin from the pot to the gate resin flow path is formed, and the intermediate mold is moved from the first mold to the first mold. The apparatus further includes an unnecessary resin releasing means for releasing the unnecessary resin formed in the main resin flow path from the main resin flow path while separating the main resin flow path. More preferably, the unnecessary resin releasing means includes an unnecessary resin ejector pin that contacts the unnecessary resin, and an unnecessary resin ejector driving pin that contacts the unnecessary resin ejector pin and drives the same.

According to the present invention, in order to achieve the above object, according to the present invention, a cavity for forming a semiconductor device, which is removably mounted in a first mold for accommodating a slidable pot, and Using a resin mold device having an intermediate mold in which a gate resin flow path for passing the molten resin to the cavity is formed, and a second mold for pressing the intermediate mold during resin sealing. In the method of manufacturing a resin-sealed semiconductor device, the resin-sealed resin-sealed semiconductor device is released from the intermediate mold while the intermediate mold is mounted on the first mold. A method for manufacturing a resin-encapsulated semiconductor device, comprising the steps of:

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG.
FIG. 1 is a cross-sectional view illustrating an entire configuration of a first example of the present invention. The present embodiment relates to a resin molding device for resin-sealing a BGA type semiconductor device having the same resin-sealing surface and mounting surface as an example. As shown in FIG.
Is fixed on a lower base 3 of a molding machine (transfer molding apparatus), and the upper die 2 is installed on an upper base 4 of the molding machine. The lower mold 1 is constituted by the lower base 5 and the lower chase 7 containing the heating means 18a, and the upper mold 2 is constituted by the upper base 6 and the upper chase 8 incorporating the heating means 18b. . The lower chase 7 includes a column support 7a, a column 7b, and a support member 7c. The upper chase 8 includes a first support member 8a, a second support member 8b,
An intermediate member 8c, a shielding member 8d, and a chase member 8e are included. On the lower chase 7, that is, the support member 7c
A removable intermediate mold 9 is mounted on the upper side. Positioning of the intermediate mold 9 and the support member 7c is performed by a pin or the like.

The intermediate mold 9 is provided with a tablet input port 24 for inputting a resin tablet. On the upper surface thereof, a cavity 20 for performing resin sealing and a substrate or a substrate for mounting a heat radiating plate are provided. A recess 21 is formed. Further, a gate 23 for allowing molten resin to flow into the cavity is opened below the center of the cavity 20. The gate 23 is formed in a conical shape such that the cross-sectional area becomes smaller as it is closer to the cavity 20. The intermediate mold 9 also holds a molded product ejector pin 14a for taking out a molded product sealed with resin so as to be vertically movable. A stopper plate for regulating the movement of the ejector pin 14a is disposed below the molded product ejector pin 14a, but is not shown (see FIG. 2). A pot 15 is provided below the tab insertion port 24 in the support member 7c, and a plunger 16 driven by a plunger driving device 17 is slidably accommodated in the pot 15.
On the upper surface of the support member 7c, a resin flow path 19 for introducing the molten resin in the pot 15 into the cavity 20 through the gate 23 is opened. The support member 7c also holds a runner resin ejector pin 14b for removing unnecessary resin formed in the resin flow path 19 so as to be vertically movable. Below the runner resin ejector pin 14b,
A stopper plate for restricting the movement is provided, but is not shown (see FIG. 2). Further, the support member 7c is provided with an opening through which the intermediate lift pin 12 and the molded product ejector push-up pin 13a can pass.

An ejector pin plate 10 that is moved up and down by an ejector pin plate driving device 25 is disposed in a space between the column support 7a and the support member 7c. 9, an intermediate lift pin 12, which pushes up the molded product ejector pin 14a and the runner resin ejector pin 14b upward, a molded product ejector push-up pin 13a, and a runner resin ejector push-up pin 13b, are fixed. Between the intermediate mold 9 and the intermediate lift pin 12, and
A slight gap is provided between the runner resin ejector pin 14b and the runner resin ejector push-up pin 13b. However, it is not necessary to provide a gap between the molded article ejector pin 14a and the molded article ejector push-up pin 13a.

The projecting portion of the shielding member 8d closes the tablet insertion port 24 at the time of mold clamping so that the resin does not leak. A push pin 11 is slidably held by the shielding member 8d. The head of the push pin 11 is urged downward by a spring 27c housed in the intermediate member 8c. When the upper mold 2 is opened with a slight gap, the push pin 11 is
The intermediate mold 9 is pressed against the support member 7c by the elastic force of c. Further, a chase member 8e to which an elastic force acts downward is fitted into the shielding member 8d. When the mold is clamped, the chase member 8e is provided with the substrate recess 21.
It has the function of holding down the board mounted inside and absorbing the uneven thickness of the board.

FIGS. 2A and 2B show a molded product ejector pin 14a and a runner resin ejector pin 14b, respectively.
FIG. 4 is a cross-sectional view showing a state in the vicinity of. As shown in FIG. 2A, the downward movement of the molded product ejector pin 14a urged downward by the spring 27a is restricted by the stopper plate 28a. Stopper plate 28a
Is mounted on the intermediate mold 9 with a bolt 29a via a spacer 30.
It is stuck to. The top surface of the molded product ejector pin 14 a is made to coincide with the bottom surface of the cavity 20. The support member 7c is formed with a concave portion 22 for escaping the stopper plate 28a. As shown in FIG. 2B, the runner resin ejector pin 14b urged downward by the spring 27b is connected to the stopper plate 28b.
The downward movement is regulated by. Stopper plate 2
8b is fixed to the support member 7c by a bolt 29b. The top surface of the runner resin ejector pin 14 b is made to coincide with the bottom surface of the resin flow path 19. However, the runner resin ejector pins 14b are partially
9 may be protruded. As described above, a slight gap is provided between the bottom surface of the runner resin ejector pin 14b and the top surface of the push-up pin 13b for the runner resin ejector, and this gap is formed between the bottom surface of the intermediate mold 9 and the intermediate lift pin. 12 is set to be somewhat larger than the gap between the top surface and the top surface.

FIG. 3A is a plan view of the supporting member 7c as viewed from above, and FIG. 3B is a plan view of the shielding member 8d as viewed from below. As shown in FIG.
c, five pots 15 are provided.
5, resin flow paths 19 are respectively derived. Plungers are installed in each pot, but they can be operated simultaneously. Each resin flow path 19 is provided with two runner resin ejector pins 14b. Also, four molded article ejector push-up pins 13 a are provided so as to surround the distal end of each resin flow path 19. That is, four molded article ejector pins are provided for each cavity. The support member 7c has six openings through which the intermediate lift pins 12 pass. As shown in FIG. 3B, five chase members 8e are fitted in the shielding member 8d. Further, six push pins 11 are provided on the shielding member 8 d, and the installation positions thereof correspond to the installation positions of the intermediate lift pins 12.

FIG. 4 is a partial plan view of the intermediate mold 9 as viewed from above. Substrate recess 21 in a strip shape from top to bottom in the figure
Are formed. 5 on the center line of the substrate recess 21
One cavity 20 is formed (only two are shown in the figure). Then, for each cavity 20, the resin flow path 19 formed in the gate 23 and the support member 7c is formed.
, Two stopper plates 28a are attached. Two molded article ejector pins 14a are provided for each stopper plate 28a, and four ejector pins 14a are provided for each cavity 20.
Ejector pins 14a are provided for each molded product.

Next, the operation from the actual resin sealing to the mold release will be described with reference to FIGS. The intermediate mold 9 in which the substrate on which the semiconductor element is mounted is mounted on the substrate recess 21 is set on the support member 7c, and the tablet is put into the pot 15 from the tablet insertion port 24 of the intermediate mold 9. After clamping the upper and lower chase 8 and 7, the plunger 16 is raised by the plunger driving device 17, and the resin melted in the pot is supplied to the resin flow path 19,
The cavity 20 is filled through the gate 23 provided in the intermediate mold 9. After filling the cavity 20 with the resin, the filled resin is thermally cured while maintaining the mold clamping state for a predetermined time. FIG. 5 shows a state where the molded product 26 is released from the cavity 20 of the intermediate mold 9. After the thermosetting of the resin is completed, the upper and lower chase 8, 7 are opened at a predetermined interval and stopped. At this time, the intermediate mold 9 is pressed against the lower chase 7 by the push pin 11 pressed by the spring 27. In this state, the ejector pin plate 10 is raised by the ejector pin plate driving device 25, the molded product ejector pin 14a is raised by the molded product ejector push-up pin 13a, and the molded product 26 is released from the cavity 20. Since the gate 23 has a conical shape as described above, the resin (gate resin) in the gate 23 is separated from the molded product at the same time as the mold 26 is released. At this time, the intermediate mold lift pin 12 and the runner ejector push-up pin 13b are set so as to have a gap with the intermediate mold 9 and the runner ejector pin 14b, respectively.
When the molded product 26 is released, the molding machine may be opened from the stopped state to the initial state.

FIGS. 6 and 7 illustrate a process of removing a runner resin which is unnecessary resin generated in the resin flow path 19 formed in the lower chase. As shown in FIG. 6, the ejector pin plate 10 is further raised by the ejector pin plate driving device 25, and the intermediate mold lift pins 12 lift the intermediate mold 9 by a predetermined amount. At this time, the push pin 11 is pushed up against the elastic force of the spring 27c. At this time, the runner ejector push-up pin 13b and the runner ejector pin 14b are set so that there is still a gap. As shown in FIG. 7, when the ejector pin plate 10 is further raised by the ejector pin plate driving device 25, the push-up pins 13b for the runner ejector become the runner ejector pins 14b.
To release the runner resin formed in the resin flow path 19 from the support member 7c together with the gate resin (in the figure, the runner resin and the gate resin are collectively shown as unnecessary resin 31). By the above operation, the mold release of the runner resin molded in the molded product 26 and the resin flow path 19 and the separation of the molded product 26 and the gate resin are completed.

FIG. 8 is a sectional view showing the entire structure of the second embodiment of the present invention. In FIG. 8, the same reference numerals are given to the same portions as those of the first embodiment shown in FIG. 1, and the duplicate description will be omitted. In the present embodiment, the resin flow path 19 formed in the support member 7c in the first embodiment is moved to the intermediate mold 9 side. Then, the runner resin ejector pin 14b provided on the support member 7c is deleted, and the push-up pin 13b for the runner resin ejector on the ejector pin plate 10 is deleted. Instead, in the present embodiment, the runner resin ejector pins 14 c
Is installed. This runner resin ejector pin 14
c is urged upward by a spring. The upper end of the runner resin ejector pin 14c protrudes from the surface of the intermediate mold 9, and by pressing this upper end, the runner resin can be released. The lower end surface of the runner resin ejector pin 14 c is made to coincide with the ceiling surface of the resin flow path 19. Alternatively, a part thereof may protrude into the resin flow path 19.

The mold and the runner resin are released from the mold using this molding machine as follows. Resin sealing is performed in the same manner as in the first embodiment, and after the sealing resin is cured by heat, the upper and lower chase 8 and 7 are opened at regular intervals and stopped. Then, in a state where the intermediate mold 9 is pressed against the support member 7c by the push pin 11, the ejector pin plate 10 is raised, and the ejector push-up pin 13a for the molded product is moved.
As a result, the molded product ejector pin 14a is lifted to release the molded product 26 from the cavity 20. Thereby, the gate resin filled in the gate 23 is separated from the molded product 26. Next, the ejector pin plate 10 is further raised to lift the intermediate mold 9 from the support member 7c, and the gap between the upper and lower chase 8, 7 is widened to completely open the mold. Then, the intermediate mold 9 filled with the runner resin and the gate resin is taken out of the molding machine. Then, the runner resin ejector pins 14c are pushed down to release the unnecessary resin (runner resin + gate resin). In this embodiment, since a part of the resin is released outside the molding machine, the apparatus is more complicated than in the first embodiment. Since this is achieved only by pressing in one direction, the device can be simplified as compared with the conventional example.

FIG. 9 is a sectional view showing the entire structure of the third embodiment of the present invention. In FIG. 9, the same reference numerals are given to the same parts as those of the second embodiment shown in FIG. 8, and thus the duplicated description will be omitted. In this embodiment, the intermediate member 8c of the upper chase 8, the shielding member 8
d, a push block 32 is fixed to the side surface, and a drawer rail 33 that can be moved in the left-right direction
And an unnecessary resin discharge chute 34 are provided. Release of the molded product and the runner resin using this molding machine is performed as follows. The steps from resin sealing to release and removal of the molded product are performed in the same manner as in the second embodiment. After opening the mold and taking out the molded product, the ejector pin plate 10
Is further raised, and the intermediate mold 9 is pushed up by the intermediate mold lift pin 12. In this state, the drawer rail 33 is moved to the left in the figure and inserted between the support member 7c and the intermediate mold 9. Next, the ejector pin plate 10 is lowered to place the intermediate mold 9 on the pull-out rail 33. Thereafter, the upper mold 2 is lowered, and the runner ejector pins 14 c are pressed by the push block 32 to release the unnecessary resin from the intermediate mold 9. The unnecessary resin that has been released falls into the unnecessary resin discharge chute 34 between the drawer rails 33. Thereafter, the intermediate mold 9 is set on the support member 7c through a process reverse to the above description.

Although the preferred embodiments have been described above, the present invention is not limited to these embodiments.
Appropriate changes can be made without departing from the scope of the present invention. For example, in the embodiment, the cavity is provided only on one side of the pot, but the resin flow path (runner) may be drawn out of the pot in two directions, and the resin may be supplied from each pot to the two cavities. In the embodiment, the gate is disposed at the center of the cavity, but the gate may be provided at a corner of the cavity. Further, in the embodiment, an example in which the substrate is common to a plurality of semiconductor devices has been described, but a separate substrate may be provided for each semiconductor device. In the second embodiment, the unnecessary resin is released from the molding machine. However, the unnecessary resin is released from the molding machine, and the molded product is released from the molding machine. Is also good. In order to achieve this, the push-up pin 13a for the molded article ejector may be omitted from the embodiment of FIG. 1, and the molded article ejector pin may be pushed up outside the molding machine.

[0020]

As described above, the resin molding apparatus according to the present invention performs the release of a molded article and / or the release of unnecessary resin by using the operation of the molding machine in the molding machine. Therefore, simplification of the device can be realized. In addition, since it is not necessary to provide a large-scale release device outside the molding machine, the entire device can be reduced in size.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing the overall configuration of a first embodiment of the present invention.

FIG. 2 is a partial sectional view of the first embodiment of the present invention.

FIG. 3 is a plan view of a lower chase and an upper chase according to the first embodiment of the present invention.

FIG. 4 is a plan view of an intermediate mold according to the first embodiment of the present invention.

FIG. 5 is a sectional view (part 1) for explaining the operation of the first embodiment of the present invention;

FIG. 6 is a sectional view (part 2) for explaining the operation of the first embodiment of the present invention;

FIG. 7 is a sectional view (part 3) for explaining the operation of the first embodiment of the present invention;

FIG. 8 is a sectional view showing the overall configuration of a second embodiment of the present invention.

FIG. 9 is a sectional view showing the entire configuration of a third embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Lower mold, 2 ... Upper mold, 3 ... Lower base of molding machine, 4 ... Upper base of molding machine, 5 ...
Lower base, 6 Upper base, 7 Lower chase, 7a Post support, 7b Post, 7c Support member, 8 Upper chase, 8a First Support member, 8b ... second
Support member, 8c: intermediate member, 8d: shielding member, 8e: chase member, 9: intermediate type, 10: ejector pin plate, 11
... Push pin, 12 ... Intermediate lift pin, 13a ... Push-up pin for molded product ejector,
13b ... push-up pin for runner ejector, 14
a: molded product ejector pin, 14b, 14c
..Runner ejector pins, 15 pots,
16 plunger 17 plunger drive 18a 18b heating means
19: resin flow path, 20: cavity,
21: recess for substrate, 22: recess, 23
... Gate, 24 ... Tablet slot,
25: ejector pin plate drive device, 26
... molded products, 27a, 27b, 27c ... springs, 28a, 28b ... stopper plates, 2
9a, 29b ... bolt, 30 ... spacer,
31 ... unnecessary resin, 32 ... push block, 33 ... draw-out rail, 34 ... unnecessary resin discharge chute

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F202 AD18 AH34 CA12 CB01 CB12 CB17 CK42 CK53 CK75 CM02 CM07 4F206 AD18 AH37 JA02 JB12 JB17 JN41 JQ81 5F061 AA01 BA03 CA21 DA01 DA06 DA15

Claims (27)

[Claims] A first mold for accommodating a pot in which a plunger is slidable; a cavity for forming a resin-sealed molded product removably mounted on the first mold; In a resin molding apparatus having an intermediate mold in which a gate resin flow path for allowing a molten resin to pass through a cavity is formed, and a second mold that presses the intermediate mold during resin sealing, Pressing means for pressing the intermediate mold toward the first mold in a state where the second mold is separated from the intermediate mold; and a resin in a state where the intermediate mold is mounted on the first mold. A molded article releasing means for removing the sealed molded article from the cavity. 2. The resin molding apparatus according to claim 1, wherein said pressing means presses said intermediate mold with an elastic force. 3. The apparatus according to claim 2, wherein said pressing means includes a push pin capable of contacting said intermediate mold, and a spring for urging said push pin toward said intermediate mold. 2. The resin molding device according to 1. 4. A molded product release means comprising: a molded product ejector pin capable of contacting the molded product; and a molded product ejector driving pin for contacting and driving the molded product ejector pin. Claim 1.
4. The resin molding apparatus according to any one of items 1 to 3. 5. The molded product releasing means includes a spring for urging the molded product ejector pin away from the molded product, and prohibiting the molded product ejector pin from being separated from the molded product by a predetermined distance or more. 5. The resin molding apparatus according to claim 4, further comprising: 6. An intermediate mold lift pin, which can press the intermediate mold in a direction away from the first mold to separate the intermediate mold from the first mold. The resin molding apparatus according to any one of claims 1 to 5, wherein 7. The method of pressing the intermediate mold in a direction away from the first mold to separate the intermediate mold from the first mold against the elastic force of the pressing means. 4. The resin molding apparatus according to claim 2, further comprising an intermediate mold lift pin that can be used. 8. A distance between the molded product ejector pin and the molded product ejector drive pin during resin molding is A, and a distance between the intermediate mold and the intermediate mold lift pin during resin molding is B. 8. The resin molding apparatus according to claim 6, wherein a relationship of B> A ≧ 0 is satisfied. 9. The first mold is provided with a main resin flow path serving as a path for molten resin from the pot to the gate resin flow path, and the intermediate mold is provided with the first mold. The unnecessary resin releasing means for releasing the unnecessary resin formed in the main resin flow path from the main resin flow path while separating from the mold is further provided. Resin molding equipment. 10. The first mold is provided with a main resin flow path serving as a path of a molten resin from the pot to the gate resin flow path, and the intermediate mold is provided with the first mold. The apparatus according to any one of claims 1 to 8, further comprising an unnecessary resin releasing unit configured to release the unnecessary resin formed in the main resin flow path from the main resin flow path while being separated from the mold. The resin molding apparatus as described in the above. 11. When the unnecessary resin formed in the main resin flow path is released from the main resin flow path by the unnecessary resin release means, the intermediate die is disposed to face the first die. The resin molding apparatus according to claim 10, wherein: 12. The unnecessary resin releasing means includes an unnecessary resin ejector pin that contacts the unnecessary resin, and an unnecessary resin ejector drive pin that contacts the unnecessary resin ejector pin and drives the unnecessary resin ejector pin. Claim 9
12. The resin molding apparatus according to any one of items 11 to 11. 13. A spring for urging the unnecessary resin ejector pin in a direction away from the main resin flow path, wherein the unnecessary resin ejector pin is separated from the main resin flow path by a predetermined distance or more. 13. A stopper for prohibiting the operation is provided.
The resin molding apparatus as described in the above. 14. When the distance between the unnecessary resin ejector pins and the unnecessary resin ejector drive pins during resin molding is C, and the distance between the intermediate mold and the intermediate mold lift pins during resin molding is B, 14. The resin molding apparatus according to claim 12, wherein a relationship of C ≧ B> 0 is satisfied. 15. The resin mold according to claim 12, wherein the molded article ejector drive pins, the intermediate mold lift pins, and the unnecessary resin ejector drive pins are mounted on and driven by the same pin plate. apparatus. 16. The intermediate mold is provided with a main resin flow path serving as a path for a molten resin from the pot to the gate resin flow path, and is provided with an unnecessary resin formed in the main resin flow path. The resin molding apparatus according to any one of claims 1 to 5, further comprising an unnecessary resin means for releasing the mold from the main resin flow path. 17. The intermediate mold is provided with a main resin flow path that serves as a path for molten resin from the pot to the gate resin flow path, and removes unnecessary resin formed in the main resin flow path. The resin molding apparatus according to any one of claims 1 to 5, further comprising an unnecessary resin releasing means for releasing the resin from the main resin flow path. 18. A drawer mechanism for pulling out the intermediate mold to the side of the first mold, and the unnecessary resin of the intermediate mold drawn out to the side of the first mold by the drawer mechanism. 17. The resin molding apparatus according to claim 16, further comprising a release mechanism pressing mechanism for pressing the release means. 19. The resin molding apparatus according to claim 17, wherein the release mechanism pressing mechanism is provided on the second mold. 20. A first mold in which a plunger accommodates a slidable pot, and a first mold in which a main resin flow path serving as a path of a molten resin from the pot to the gate resin flow path is formed; An intermediate mold in which a cavity for forming a molded article to be resin-sealed and the gate resin flow path for allowing molten resin to pass through the cavity are detachably attached to the mold; And a second mold that presses the intermediate mold at the time of stopping. In the resin molding apparatus, the unnecessary resin formed in the main resin flow path is separated from the first mold while separating the intermediate mold from the first mold. A mold release means for releasing the resin from the main resin flow path. 21. The drive source for separating the intermediate mold from the first mold and the drive source for the unnecessary resin releasing means are constituted by the same drive source. 20. The resin molding apparatus according to 19. 22. The unnecessary resin releasing means includes an unnecessary resin ejector pin that contacts the unnecessary resin, and an unnecessary resin ejector drive pin that contacts the unnecessary resin ejector pin and drives the same. Claim 1
21. The resin molding apparatus according to 9 or 20. 23. A spring for urging the unnecessary resin ejector pin in a direction away from the main resin flow path, wherein the unnecessary resin ejector pin is separated from the main resin flow path by a predetermined distance or more. 22. A stopper for prohibiting the operation is provided.
The resin molding apparatus as described in the above. 24. A cavity for forming a semiconductor device and a gate resin flow for allowing molten resin to pass through the cavity, the cavity being removably mounted on a first mold accommodating a slidable pot with a plunger. A method for manufacturing a resin-sealed semiconductor device using a resin molding apparatus having an intermediate mold having a path formed therein and a second mold for pressing the intermediate mold during resin sealing; A step of releasing the resin-sealed resin-sealed semiconductor device from the intermediate mold while the mold is mounted on the first mold. Manufacturing method. 25. The step of releasing the resin-sealed semiconductor device from the intermediate mold, wherein the step of pressing the intermediate mold against the first mold is performed. Item 24. The method for manufacturing a resin-encapsulated semiconductor device according to item 23. 26. The method according to claim 23, wherein a step of releasing the unnecessary resin is performed subsequent to the step of releasing the resin-sealed semiconductor device from the intermediate mold.
5. The method for manufacturing a resin-encapsulated semiconductor device according to item 4. 27. The resin-encapsulated semiconductor according to claim 25, wherein the step of releasing the unnecessary resin is performed while the intermediate mold is being separated from the first mold. Device manufacturing method.