JP2727740B2 - Board height measurement circuit for mounting board appearance inspection device - Google Patents
Board height measurement circuit for mounting board appearance inspection deviceInfo
- Publication number
- JP2727740B2 JP2727740B2 JP2167399A JP16739990A JP2727740B2 JP 2727740 B2 JP2727740 B2 JP 2727740B2 JP 2167399 A JP2167399 A JP 2167399A JP 16739990 A JP16739990 A JP 16739990A JP 2727740 B2 JP2727740 B2 JP 2727740B2
- Authority
- JP
- Japan
- Prior art keywords
- height
- board
- measurement
- inspected
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Length Measuring Devices By Optical Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、基板の高さを測定するための回路に係り、
特に基板上の実装部品の実装状態や、はんだ付け状態等
を検査する実装基板外観検査装置における画像処理にお
いて必要となる、被検査基板の高さの測定を行うため
の、実装基板外観検査装置の基板高さ測定回路に関する
ものである。The present invention relates to a circuit for measuring the height of a substrate,
In particular, the mounting board appearance inspection device for measuring the height of the board to be inspected, which is necessary for image processing in the mounting board appearance inspection device for inspecting the mounting state of the mounted components on the board, the soldering state, etc. The present invention relates to a substrate height measuring circuit.
実装基板の外観を検査する実装基板外観検査装置にお
いては、高密度実装やＪリード部品実装等の近年におけ
る動向に対応するため、真下を向いた撮像カメラに加え
て、斜めから撮像するカメラの装備が不可欠となってい
る。In order to respond to recent trends such as high-density mounting and J-lead component mounting, mounting board appearance inspection equipment that inspects the appearance of the mounting board is equipped with a camera that shoots diagonally, in addition to a camera that faces directly downward. Has become indispensable.
この斜方カメラによる画像処理においては、撮像点の
高さ方向の変位が撮像画像平面での位置の変位となって
現れるため、被検査面の高さを精密に測定する必要があ
る。In the image processing by the oblique camera, since the displacement in the height direction of the imaging point appears as the displacement of the position on the plane of the captured image, it is necessary to precisely measure the height of the inspection surface.
従来の実装基板外観検査装置では、被検査部品ごとに
１ないし３箇所の高さ測定点を定め、レーザ変位計等に
よって、高さの測定を行っている。In a conventional mounting board appearance inspection apparatus, one to three height measurement points are determined for each component to be inspected, and the height is measured by a laser displacement meter or the like.
これとは別に、レーザ変位計の代わりにレーザビーム
投光器を用い、検査用の真上カメラによる基板上のビー
ム像撮像画像を処理して、高さを測定する方法も用いら
れている。Separately from this, a method of using a laser beam projector instead of a laser displacement meter, processing a beam image captured on a substrate by a camera directly above for inspection, and measuring the height is also used.
上述した従来の高さ測定装置における高さ測定センサ
は、局部的な測定を行うものであるため、基板の表面ま
たは内部に施されている配線パターン，フラックス，表
面処理状態等に基づく測定誤差が大きいという問題があ
る。Since the height measuring sensor in the above-mentioned conventional height measuring device performs a local measurement, a measurement error based on a wiring pattern, a flux, a surface treatment state or the like applied to the surface or inside of the substrate is reduced. There is a problem of being large.
また、被検査部品ごとに測定位置を設定する必要があ
るので、新品種登録における作業量が多くなる。In addition, since it is necessary to set a measurement position for each component to be inspected, the amount of work in registering new varieties increases.
さらに、小型基板では基板のそりが少ないので、基板
全体に関する高さの測定は不必要である場合が多いのに
かかわらず、稀に存在するそりの大きい基板での検査ミ
スを防止するために、そりが少ない多数の基板に対して
も、同様に基板全体に関する高さの測定を行っており、
そのため検査装置の稼働率が低下するという問題があっ
た。Furthermore, since the warpage of the board is small in a small board, the measurement of the height of the entire board is often unnecessary, but in order to prevent an inspection error on a board with a large warp that is rarely present, For many boards with low warpage, the height of the entire board is measured in the same way,
Therefore, there is a problem that the operation rate of the inspection device is reduced.
本発明は、このような従来技術の課題を解決しようと
するものである。The present invention is to solve such a problem of the related art.
すなわち、本発明は、高さデータを、近傍のデータと
の外挿によって補正して用いるので、配線パターン等に
よって生じる誤差を除去して、測定精度を高めることが
でき、また、基板ごとに測定位置を設定する必要がな
く、品種登録作業を簡素化することができ、さらに、そ
りの小さい基板では、数本の測定ラインのみ高さ測定を
行い、その後は高さ測定を省略することができるととも
に、高さ測定を各測定ラインごとに連続移動測定によっ
て行うので、総合した測定時間を大幅に短縮することが
できる実装基板外観検査装置の基板高さ測定回路、を提
供することを目的としている。That is, since the present invention uses the height data corrected by extrapolation with the neighboring data, it can eliminate errors caused by wiring patterns and the like, improve the measurement accuracy, and measure each substrate. There is no need to set the position, and the type registration work can be simplified. Further, on a board with a small warp, the height measurement is performed only on a few measurement lines, and the height measurement can be omitted thereafter. In addition, since the height measurement is performed by continuous movement measurement for each measurement line, it is an object of the present invention to provide a board height measurement circuit of a mounting board appearance inspection device that can greatly reduce the total measurement time. .
本発明においては、XYテーブル（13）上に被検査基板
（10）を保持して移動および位置決めを行うとともに、
高さ測定器（15）を備えて被検査基板（10）面の高さ測
定を行い、被検査基板（10）の部品実装面を撮像して得
られた出力画像をこの測定された高さを用いて処理して
実装検査を行う実装基板外観検査装置において、 動作制御回路（４）によって、高さ測定器（15）によ
って被検査基板（10）の面を規定ピッチの格子状に高さ
測定を行うようにXYテーブル（13）の移動と高さ測定器
（15）の測定タイミングを制御し、高さ演算回路（３）
によって高さ測定器（15）の出力信号に対してその高次
成分を除去する信号処理を行って高さデータ曲線を算出
すると共にこの高さデータ曲線から個別の検査箇所にお
ける高さを求め、この算出された高さを用いて上述の実
装検査を行うという構成をとっている。これによって前
述した目的を達成しようとするものである。In the present invention, while moving and positioning the substrate to be inspected (10) on the XY table (13),
Equipped with a height measuring device (15) to measure the height of the substrate (10) to be inspected, and output an image obtained by imaging the component mounting surface of the substrate to be inspected (10) to the measured height. In a mounting board appearance inspection apparatus that performs mounting inspection by processing using a board, the operation control circuit (4) uses a height measuring device (15) to heighten the surface of the board to be inspected (10) in a grid pattern with a specified pitch. The movement of the XY table (13) and the measurement timing of the height measuring device (15) are controlled to perform the measurement, and the height calculation circuit (3)
The output signal of the height measuring device (15) is subjected to signal processing for removing its higher-order component to calculate a height data curve, and from this height data curve, the height at an individual inspection point is obtained, The above-described mounting inspection is performed using the calculated height. This aims to achieve the above-mentioned object.
XYテーブル上に被検査基板を保持して移動および位置
決めを行うとともに、高さ測定器によって被検査基板面
の高さ測定を行い、被検査基板の部品実装面を撮像して
得られた出力画像をこの測定された高さを用いて処理し
て実装検査を行う際に、高さ測定器によって被検査基板
の面を規定ピッチの格子状に高さ測定を行うようにXYテ
ーブルの移動と高さ測定器の測定タイミングを制御し、
高さ測定器の出力信号に対してその高次成分を除去する
信号処理を行って高さデータ曲線を算出して、この算出
された高さデータ曲線を解析して得られた個別の測定箇
所の高さを用いて上述の実装検査を行うようにしたの
で、配線パターン等によって生じる誤差を除去して、測
定精度を高めることができるとともに、基板ごとに測定
位置を設定する必要がなく、品種登録作業が簡素化さ
れ、さらにそりの小さい基板では、数本の測定ラインの
み高さ測定を行い、その後は高さ測定を行わないように
することができる。An output image obtained by holding and moving and positioning the board to be inspected on the XY table, measuring the height of the board to be inspected by a height measuring instrument, and imaging the component mounting surface of the board to be inspected When the mounting inspection is performed using this measured height, the movement of the XY table and the height of the XY table are performed so that the height of the surface of the substrate to be inspected is measured in a grid pattern with a specified pitch using a height measuring device. Control the measurement timing of the
A signal processing for removing the higher-order component from the output signal of the height measuring instrument is performed to calculate a height data curve, and the individual measurement points obtained by analyzing the calculated height data curve The above-described mounting inspection is performed using the height of the wiring board, so that an error caused by a wiring pattern or the like can be removed, measurement accuracy can be improved, and it is not necessary to set a measurement position for each board. The registration operation is simplified, and on a board with a small warp, the height measurement can be performed only on a few measurement lines, and thereafter the height measurement is not performed.
以下、本発明の一実施例を第１図ないし第４図に基づ
いて説明する。An embodiment of the present invention will be described below with reference to FIGS. 1 to 4.
この第１図ないし第４図に示す実施例は、XYテーブル
13上に被検査基板10を保持して移動および位置決めを行
うとともに、高さ測定器15を備えて被検査基板10の面の
高さ測定を行い、被検査基板10の部品実装面を撮像して
得られた出力画像をこの測定された高さを用いて処理し
て実装検査を行う実装基板外観検査装置において、動作
制御回路４を設けて高さ測定器15によって被検査基板10
の面を規定ピッチの格子状に高さ測定を行うようにXYテ
ーブル13の移動と高さ測定器15の測定タイミングを制御
し、高さ測定器15の出力信号に対してその高次成分を除
去する信号処理を行って高さデータ曲線を算出すると共
にこの高さデータ曲線から個別の検査箇所における高さ
を求め、この算出された高さを用いて実装検査を行うよ
うにしたものである。The embodiment shown in FIGS. 1 to 4 uses an XY table.
While holding and moving and positioning the substrate 10 to be inspected on the surface 13, the height measuring device 15 is used to measure the height of the surface of the substrate 10 to be inspected and to image the component mounting surface of the substrate 10 to be inspected. An operation control circuit 4 is provided in a mounting board appearance inspection apparatus for processing a mounting image by processing an output image obtained by using the measured height.
The movement of the XY table 13 and the measurement timing of the height measuring device 15 are controlled so that the surface of the A height data curve is calculated by performing signal processing for elimination, a height at an individual inspection point is obtained from the height data curve, and a mounting inspection is performed using the calculated height. .
第１図において、画像処理部１は、撮像カメラからの
映像信号を画像処理して、実装部品の有無，はんだ付け
の良否等の検査結果を出力する。システム制御部２は、
基板搬送部やXYテーブル等機構系の動作制御と、画像処
理部１および高さ演算回路３との信号の授受に基づく画
像データ処理の制御を行う。In FIG. 1, an image processing unit 1 performs image processing on a video signal from an imaging camera, and outputs an inspection result such as the presence or absence of a mounted component and the quality of soldering. The system control unit 2
The operation control of a mechanical system such as a substrate transport unit and an XY table, and the control of image data processing based on the exchange of signals with the image processing unit 1 and the height calculation circuit 3 are performed.
高さ演算回路３は、システム制御部２からの動作制御
データと、動作制御回路４からの高さ測定データ等によ
って、高さの演算を行う。動作制御回路４は、高さ測定
器とXYテーブルに関するタイミング制御を行うととも
に、高さデータを収集して高さ演算回路３に出力する。The height calculation circuit 3 calculates a height based on operation control data from the system control unit 2 and height measurement data from the operation control circuit 4. The operation control circuit 4 performs timing control on the height measuring device and the XY table, collects height data, and outputs the data to the height calculation circuit 3.
第２図は、本発明の一実施例の機構系の側面図であ
る。FIG. 2 is a side view of a mechanical system according to one embodiment of the present invention.
この第２図において、撮像カメラ11および12は、被検
査基板10をそれぞれ真上と斜めから撮像する。XYテーブ
ル13は、検査時および高さ測定時に被検査基板10を保持
して、位置決めする。基板搬送部14は、XYテーブル13へ
の被検査基板10の供給および収納を行う。高さ測定器15
は、基板の高さ測定を行うセンサ、例えばレーザ変位計
から構成されている。In FIG. 2, imaging cameras 11 and 12 image the substrate 10 to be inspected from directly above and obliquely, respectively. The XY table 13 holds and positions the substrate to be inspected 10 at the time of inspection and height measurement. The substrate transport unit 14 supplies and stores the substrate to be inspected 10 to the XY table 13. Height measuring device 15
Comprises a sensor for measuring the height of the substrate, for example, a laser displacement meter.
第３図は、本発明の一実施例による基板高さ測定デー
タのグラフを示したものである。また第４図は、被検査
基板の斜視図である。FIG. 3 shows a graph of substrate height measurement data according to one embodiment of the present invention. FIG. 4 is a perspective view of a substrate to be inspected.
以下、これら各図に基づいて本実施例による高さ測定
回路の動作について説明する。Hereinafter, the operation of the height measuring circuit according to the present embodiment will be described with reference to these drawings.
本実施例による高さ測定では、第４図中、a,b,c,dで
示すような基板の基準座標軸ＸおよびＹにほぼ平行な測
定ラインをまず数本設定し、高さ測定器15がこの測定ラ
インをなぞるように、XYテーブル13の位置および速度
を、動作制御回路４が指令して、高さ測定器15から各測
定ラインごとに、第３図に示されたような高さ生データ
ｈを収集する。In the height measurement according to the present embodiment, first, several measurement lines substantially parallel to the reference coordinate axes X and Y of the substrate as shown by a, b, c, and d in FIG. The operation control circuit 4 instructs the position and speed of the XY table 13 so that the XY table 13 traces the measurement line. Collect raw data h.
高さ演算回路３では、第３図に示した信号波形に対し
て、フーリエ変換，高次成分カット，逆フーリエ変換等
を順次施して高さデータ曲線hX（ｘ＝a,b,c,d）を生成
する。次に、高さデータ曲線hXを解析し、高さ変動が検
査のための画像処理の許容値以下であれば、基板そり補
正不要と判定して、直ちに実検査を開始する。The height calculation circuit 3 sequentially performs Fourier transform, high-order component cut, inverse Fourier transform, and the like on the signal waveform shown in FIG. 3 to obtain a height data curve h X (x = a, b, c, Generate d). Next, analyze the height data curve h X, height variations is equal to or less than the allowable value of the image processing for the inspection, it is determined that the substrate warpage correction required, immediately starts the actual inspection.
それ以外の場合には、すでに測定したa,b,c,dの間お
よび外側を一定間隔で等分するように測定ライン群を設
定して、同様に高さ測定と、高さデータ曲線hXの生成を
実行する。In other cases, the measurement line group is set so as to equally divide the already measured a, b, c, and d between and outside at regular intervals. Similarly, the height measurement and the height data curve h Execute X generation.
最後に、上述の処理によって得られた高さデータ曲線
群から被検査基板上の個別の検査箇所における高さを内
挿によって求め、システム制御部２に出力する。Finally, the height at each inspection point on the inspection target board is obtained from the height data curve group obtained by the above processing by interpolation, and output to the system control unit 2.
以上説明したように、本発明によると高さ測定器によ
って得られた高さデータをそのまま用いるのでなく、近
傍の高さデータとの外挿によって補正して高さデータ曲
線を求めるので、配線パターン等によって生じる誤差を
除去して、測定精度を高めることができる。また、上記
のような補正処理によって得られた高さデータ曲線に基
づいて、被検査基板上の個別の検査箇所における高さを
演算によって求めので、被検査基板の全面にわたり高精
度の高さ測定をすることができる、という優れた効果を
生じる。As described above, according to the present invention, instead of using the height data obtained by the height measuring device as it is, the height data curve is obtained by correcting by extrapolation with nearby height data, so that the wiring pattern By removing the error caused by the above, the measurement accuracy can be improved. In addition, since the height at each inspection point on the inspection target board is calculated by calculation based on the height data curve obtained by the correction processing as described above, the height measurement with high accuracy over the entire inspection target board is performed. The effect is excellent.
また、画像処理要求精度に応じた測定ピッチを予め定
めておけば、基板ごとに測定位置を設定する必要がな
く、品種登録作業が簡素化される。Further, if the measurement pitch corresponding to the required accuracy of the image processing is determined in advance, it is not necessary to set the measurement position for each substrate, and the type registration work is simplified.
さらに、そりの小さい基板では、数本の測定ラインの
み高さ測定を行い、その後は高さ測定を行わないように
することができる。また、通常の全品高さ測定方式で
は、各点で一時停止後高さ測定を行うのに対し、本発明
では、各測定ラインごとには連続移動測定を行うので、
総合した測定時間を大幅に短縮することができる効果が
ある。Further, on a substrate having a small warp, it is possible to measure the height of only a few measurement lines and not to measure the height thereafter. In addition, in the normal height measurement method for all products, height measurement is performed after a pause at each point, whereas in the present invention, continuous movement measurement is performed for each measurement line.
There is an effect that the total measurement time can be significantly reduced.
第１図は本発明の一実施例における制御系のブロック
図、第２図は本発明の一実施例の機構系の側面図、第３
図は本発明の一実施例による基板高さ測定データのグラ
フを示す図、第４図は被検査基板の斜視図である。 ３……高さ演算回路,4……動作制御回路,10……被検査
基板,13……XYテーブル,15……高さ測定器。FIG. 1 is a block diagram of a control system according to one embodiment of the present invention, FIG. 2 is a side view of a mechanical system according to one embodiment of the present invention, and FIG.
FIG. 4 is a graph showing substrate height measurement data according to an embodiment of the present invention, and FIG. 4 is a perspective view of a substrate to be inspected. 3 ... height operation circuit, 4 ... operation control circuit, 10 ... board to be inspected, 13 ... XY table, 15 ... height measuring instrument.
Claims (1)
および位置決めを行うとともに、高さ測定器を備えて被
検査基板面の高さ測定を行い、被検査基板の部品実装面
を撮像して得られた出力画像を該測定された高さを用い
て処理して実装検査を行う実装基板外観検査装置におい
て、 前記高さ測定器によって被検査基板の面を規定ピッチの
格子状に高さ測定を行うように前記XYテーブルの移動と
高さ測定器の測定タイミングを制御する動作制御回路
と、前記高さ測定器の出力信号に対してその高次成分を
除去する信号処理を行って高さデータ曲線を算出すると
共にこの高さデータ曲線から個別の検査箇所における高
さを求める高さ演算回路を設け、 該算出された高さを用いて前記実装検査を行うことを特
徴とする実装基板外観検査装置の基板高さ測定回路。1. A board to be inspected is held and moved and positioned on an XY table, and a height measuring device is provided to measure the height of the board to be inspected, and to image the component mounting surface of the board to be inspected. A mounting board appearance inspection apparatus that performs mounting inspection by processing the output image obtained by using the measured height, wherein the height measuring device heightens the surface of the board to be inspected in a grid pattern with a specified pitch. An operation control circuit that controls the movement of the XY table and the measurement timing of the height measuring device so as to perform height measurement, and performs signal processing for removing higher-order components from an output signal of the height measuring device. A height calculating circuit that calculates a height data curve and obtains a height at an individual inspection point from the height data curve, and performs the mounting inspection using the calculated height. Substrate for board inspection equipment Measured circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2167399A JP2727740B2 (en) | 1990-06-26 | 1990-06-26 | Board height measurement circuit for mounting board appearance inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2167399A JP2727740B2 (en) | 1990-06-26 | 1990-06-26 | Board height measurement circuit for mounting board appearance inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0455708A JPH0455708A (en) | 1992-02-24 |
| JP2727740B2 true JP2727740B2 (en) | 1998-03-18 |
Family
ID=15848983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2167399A Expired - Lifetime JP2727740B2 (en) | 1990-06-26 | 1990-06-26 | Board height measurement circuit for mounting board appearance inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2727740B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002098513A (en) * | 2000-09-22 | 2002-04-05 | Tani Denki Kogyo Kk | Lens frame form measuring device |
| JP4660957B2 (en) * | 2001-04-23 | 2011-03-30 | イビデン株式会社 | Inspection equipment for printed wiring boards |
| JP4537223B2 (en) * | 2005-02-15 | 2010-09-01 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting device |
| WO2019021365A1 (en) * | 2017-07-25 | 2019-01-31 | ヤマハ発動機株式会社 | Component-mounting device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62272107A (en) * | 1986-05-20 | 1987-11-26 | Fujitsu Ltd | Inspecting method for packaging component |
| JP2543585B2 (en) * | 1988-12-16 | 1996-10-16 | 富士通株式会社 | Pattern inspection device |
-
1990
- 1990-06-26 JP JP2167399A patent/JP2727740B2/en not_active Expired - Lifetime
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| Publication number | Publication date |
|---|---|
| JPH0455708A (en) | 1992-02-24 |
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