JPS62272107A - Inspecting method for packaging component - Google Patents

Inspecting method for packaging component

Info

Publication number
JPS62272107A
JPS62272107A JP11545786A JP11545786A JPS62272107A JP S62272107 A JPS62272107 A JP S62272107A JP 11545786 A JP11545786 A JP 11545786A JP 11545786 A JP11545786 A JP 11545786A JP S62272107 A JPS62272107 A JP S62272107A
Authority
JP
Japan
Prior art keywords
board
sensor
beams
height
curvature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11545786A
Other languages
Japanese (ja)
Inventor
Giichi Kakigi
Kikuo Mita
Koji Oka
Satoshi Iwata
Moritoshi Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11545786A priority Critical patent/JPS62272107A/en
Publication of JPS62272107A publication Critical patent/JPS62272107A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To accurately detect a component and decide its position even on a curved printed board by measuring the curvature state of the printed board previously and moving a line sensor and light beams.
CONSTITUTION: The heights of both end parts of an area on the printed board P are measured by using displacement (height) sensors 19 and 20 to measure the curvature state of the board P. Then, slit beams l are generated by a beam unit 10 to illuminate the board P. The unit 10 is fixed on a rotary stage 15 and rotated according to the tilt angle of the board P and the beams l are therefore rotated by the same angle. The beams l on the board P, on the other hand, are passed through an image forming lens 16 in the opposite direction from the incidence direction to form an image on a line sensor 17. The sensor 17 detects only the position of specific height on the board P by the principle of a light cutting method. The sensor 17 is fixed on a stage 18 and moved in parallel from a reference position by distance (d) along an image formation surface according to the curvature quantity (height) of the board P. The sensor 17 detects different heights on the board P by said movement.
COPYRIGHT: (C)1987,JPO&Japio
JP11545786A 1986-05-20 1986-05-20 Inspecting method for packaging component Pending JPS62272107A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11545786A JPS62272107A (en) 1986-05-20 1986-05-20 Inspecting method for packaging component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11545786A JPS62272107A (en) 1986-05-20 1986-05-20 Inspecting method for packaging component

Publications (1)

Publication Number Publication Date
JPS62272107A true JPS62272107A (en) 1987-11-26

Family

ID=14663027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11545786A Pending JPS62272107A (en) 1986-05-20 1986-05-20 Inspecting method for packaging component

Country Status (1)

Country Link
JP (1) JPS62272107A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455708A (en) * 1990-06-26 1992-02-24 Nec Corp Substrate-height measuring circuit of visual inspections apparatus for mounting substrate
JPH06176132A (en) * 1992-12-04 1994-06-24 Iwaki Electron Corp Ltd Inspection area correction method
JP2002098513A (en) * 2000-09-22 2002-04-05 Tani Denki Kogyo Kk Lens frame form measuring device
KR20140057155A (en) * 2012-11-02 2014-05-12 쥬키 가부시키가이샤 Electronic part mounting apparatus and mounted part inspection method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455708A (en) * 1990-06-26 1992-02-24 Nec Corp Substrate-height measuring circuit of visual inspections apparatus for mounting substrate
JPH06176132A (en) * 1992-12-04 1994-06-24 Iwaki Electron Corp Ltd Inspection area correction method
JP2002098513A (en) * 2000-09-22 2002-04-05 Tani Denki Kogyo Kk Lens frame form measuring device
KR20140057155A (en) * 2012-11-02 2014-05-12 쥬키 가부시키가이샤 Electronic part mounting apparatus and mounted part inspection method
JP2014093390A (en) * 2012-11-02 2014-05-19 Juki Corp Electronic component mounting device and inspection method for mounted component

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