JP2705458B2 - Mounting board appearance inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting board appearance inspection apparatus for inspecting a mounting defect such as a bridge between component leads mounted on a printed circuit board and adhesion of foreign matter.

[0002]

2. Description of the Related Art FIG. 8 shows the configuration of a conventional mounting board appearance inspection apparatus. 8, 11 is a printed circuit board, 12 is a component mounted on the printed circuit board 11,
Reference numeral 803 denotes a three-dimensional coordinate measuring unit for measuring the heights of the printed circuit board 11 and the component 12, and includes a distance sensor 804 and a height calculating circuit 805. 806, a reference height data storage memory for storing reference height data of the component 12;
A square error calculation circuit 807 includes a subtraction circuit 808 and a square calculation circuit 809. 810 stores data corresponding to the processing data of the printed circuit board 11 and
A mask data storage memory in which a mask is set for each two,
811 is a cumulative addition circuit, 812 is an average calculation circuit, 813
Is a reference threshold value storage memory for storing a reference threshold value for each mask, and 814 is a comparison / judgment circuit for judging the quality of the component mounting state.

Next, the operation of the conventional configuration will be described. Component 1 mounted on printed circuit board 11
2 and the height of the surface of the printed circuit board 11 are measured by the three-dimensional coordinate measuring unit 803. The three-dimensional coordinate measuring unit 803 includes a distance sensor unit 804 and the distance sensor unit 8.
Height calculation circuit 8 for calculating height using information from 04
The measurement is performed using the principle of a three-dimensional measurement method using a laser and a light receiving element as a principle of measuring three-dimensional coordinates, and is output to a square error calculation circuit 807.

In a square error calculating circuit 807, a value from a reference height data storage memory 806 in which height data of a reference component 12 is stored, and a three-dimensional coordinate measuring unit 803.
Calculate the square error with the height data measured in. That is, the difference between the two data is obtained by the subtraction circuit 808, and the square of the difference is calculated by the square calculation circuit 809. Then, the calculated square error is referred to the mask data stored in the mask data storage memory 810, and the cumulative addition circuit 81
At 1, the cumulative addition is performed for each mask, and the average calculation circuit 812 divides the cumulative addition value using the cumulative addition number to calculate the average value of the square errors in the mask. Finally, the comparison and determination circuit 814 compares the mean square error of each mask, which is the output of the average calculation circuit 812, with the reference threshold for each good / bad determination mask stored in the reference threshold storage memory 813. By determining the mean square error as the reference threshold value and the magnitude thereof, it is possible to determine whether the component mounting is good or bad.

[0005]

However, in the conventional mounting board appearance inspection apparatus described above, the square error calculating circuit 80 is required.
7, the mean square error is calculated by comparing the reference height data stored in the reference height data storage memory 806 with the height data obtained from the three-dimensional coordinate measuring unit 803. When the substrate 11 is warped, there is a problem that the measured height information cannot be corrected and the inspection accuracy does not improve.

In the conventional mounting board appearance inspection apparatus described above, the mask 901 is set only between the leads 603 of the component 12 as shown in FIG. If the mounting position deviates from the normal mounting position within the allowable range, the mask 901 is not correctly aligned, and a non-defective product is determined as a defective product.

An object of the present invention is to solve such a conventional problem, and an object of the present invention is to provide an excellent mounting board appearance inspection apparatus capable of accurately determining the quality of a component mounting state with high inspection accuracy.

[0008]

In order to achieve the above object, a mounting board appearance inspection apparatus according to the present invention comprises a conveying means for moving a printed circuit board on which components are mounted, and a laser light from a laser light source. Laser light scanning means for scanning on a circuit board, scattered light reflection / condensing means for reflecting and collecting scattered light obtained by reflecting from a printed circuit board by scanning of laser light, and scattered light reflection / condensing means Position detecting means provided at the light condensing position and outputting a position signal corresponding to the light condensing position; height and luminance data of the printed circuit board and the components mounted on the printed circuit board based on the position signal from the position detecting means Image processing means for calculating the first mask data, first mask data storage means for storing data of a plurality of first masks of a predetermined arbitrary size at a component mounting position, A first sub-mask data storage means for storing data of a first sub-mask for moving the upper surface of the lead of the component in a direction perpendicular to the longitudinal direction of the lead in the first mask; Read position determining means for determining the read position from the maximum value of the average luminance in the sub-mask, and a second method for setting the read position to the determined read position.
A second mask data storing means for storing the data of the second mask, and a second mask data storing means for moving the upper surface of the lead of the component in the second mask in a direction parallel to the longitudinal direction of the lead. Sub-mask data storage means, read-lead position determining means for obtaining the lead tip from the minimum value of the average brightness in the second sub-mask moving in the second mask, and the first and second sub-masks. Third mask data storage means for setting a position between leads;
Sample data storage means for storing sample data of good parts and defective parts, determination threshold value storage means for storing a preparation threshold value for quality determination, and brightness data and sample data in the third mask. A determination processing unit that calculates a correlation coefficient, compares the calculated correlation coefficient with a determination threshold value, and determines whether the component mounted on the printed circuit board is good or bad.

The laser beam scanning means includes a polygon mirror and an fθ lens, and the scattered light reflecting and condensing means reflects a scattered light obtained by reflecting from the printed circuit board; and a condenser lens for condensing the light reflected by the polygon mirror via the fθ lens on the position detecting means.

[0010] Further, the lead position determining means determines the position of the first sub-mask moving in the first mask, and the first sub-mask determines the position of the first sub-mask. A first cumulative addition circuit that cumulatively adds the obtained luminance data, a first average calculation circuit that divides the cumulative addition value by the cumulative addition number, and a first average calculation circuit that moves within the first mask obtained by the average calculation circuit. The configuration includes a maximum value detection circuit that detects a position where the maximum value is obtained from the average value of the luminance in one sub-mask.

The lead tip position detecting means determines a second sub-mask position for moving in the second mask, and a second sub-mask position determining means for calculating the position of the second sub-mask. A second cumulative addition circuit for cumulatively adding the obtained luminance data, a second average calculation circuit for dividing the cumulative addition value by the cumulative addition number, and a second average movement circuit for moving in the second mask obtained by the average calculation circuit. Is provided with a minimum value detecting circuit for detecting a position where the luminance becomes the minimum value from the average value of the luminance in the sub-mask.

Further, the judgment processing means calculates the average value of the luminance data in the same group, the group average calculation circuit, the luminance data calculated by the image calculation processing means in the third mask, and the sample data storage means. A non-defective / defective sample data, a correlation coefficient calculating circuit for calculating a correlation coefficient with the average value from the group average calculating circuit, and comparing the correlation coefficient with a judgment threshold value, on a printed circuit board. And a judgment circuit for judging whether the mounting state of the component is good or not.

[0013]

With such a configuration, the mounting board appearance inspection apparatus of the present invention measures the luminance data of the printed circuit board and the mounted component, and detects the brightness data in the first mask set on the mounted component.
The lead position is obtained from the maximum value of the average luminance in the first sub-mask for scanning the upper surface of the lead, and the lead position is obtained from the minimum value of the average luminance in the second sub-mask for scanning the upper surface of the lead in the second mask. And the correlation between the luminance data in the third mask set at the inter-lead position, the same group average data, and the non-defective and defective sample data is calculated. This correlation is compared with the determination threshold. As a result, it is possible to inspect a bridge between leads of a mounted component, adhesion of a foreign substance, and the like without being affected by warpage of the printed circuit board, component displacement, lead bending, and the like.

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a mounting board appearance inspection apparatus according to an embodiment of the present invention.

FIG. 1 shows the configuration of the embodiment. FIG.
In the detection section, 11 is a printed circuit board, 12 is a component such as an IC mounted on the printed circuit board 11, 1
3 is a transport mechanism for moving the printed circuit board 11 in the direction of arrow 14, 15 is a laser light source, 16 is a laser beam emitted from the laser light source 15, 17 is a polygon mirror, 18
Reference numerals a, 18b, and 18c denote reflecting mirrors for guiding the laser light 16 to the polygon mirror 17, respectively. Reference numeral 19 denotes an fθ lens, and the laser light 16 reflected by the polygon mirror 17.
To the printed circuit board 11 on which the components 12 are mounted. A reflection mirror 20 guides scattered light reflected from the printed circuit board 11 on which the component 12 is mounted to the fθ lens 19. Reference numeral 21 denotes a condenser lens, and an fθ lens 19
, And the light reflected by the polygon mirror 17 is collected. Reference numeral 22 denotes a position detecting element, which is provided at a light condensing position of the light condensing lens 21 and outputs a position signal S23 corresponding to the light condensing position. In the signal processing unit, reference numeral 24 denotes a position signal S23.
An image calculation processing unit 25 for calculating the height and luminance data of the component 12 from a first mask 601 (refer to FIG. 6A) which stores data of a predetermined first mask 601 at the mounting position of the component 12 The first sub-mask 60 moves on the upper surface of the lead 603 (see FIG. 6A) of the component 12 in the first mask 601.
2 (see FIG. 6A), a first sub-mask data storage unit 27 for storing data, and a read position determination unit 27, which stores the first sub-mask 603 from the first sub-mask data storage unit 26 as a component. The point at which the average value of the data in the first sub-mask 603 when the upper surface of the twelve leads 603 is moved is determined as the lead position. Reference numeral 28 denotes a second mask data storage unit for storing data of a second mask 701 (see FIG. 7A) set at the read position determined by the lead position determination unit 27, and 29 denotes a second mask data in the second mask 701. A second sub-mask data storage unit that stores data of a second sub-mask 702 (see FIG. 7A) that moves on the upper surface of the lead 603 of the component 12, and 30 is a lead tip position determination unit, The point at which the average value of the data in the second sub-mask 702 when the second sub-mask 702 from the sub-mask data storage unit 29 is moved over the upper surface of the lead 603 of the component 12 is determined as the lead end position. Reference numeral 31 denotes a third mask 7 to be set at the inter-lead position determined by the lead position determination unit 27 and the lead tip position determination unit 30.
A third mask data storage unit for storing data 03 (see FIG. 7A), a sample data storage unit 33 for storing non-defective and defective sample data in the third mask 703, and a printed circuit board 32 A judgment threshold value storage unit 34 for storing a reference threshold value for judging the quality of the mounted state of the component 12 on the reference numeral 11, a judgment processing unit 34, and third mask data, non-defective and defective sample data, judgment The mounting state of the component 12 on the printed circuit board 11 is determined using a threshold value for use.

Next, the operation of the configuration of this embodiment will be described. FIG. 6A is a two-dimensional layout explanatory view showing a specific setting example of the first mask when the component 12 is viewed from above, and FIG. 6B is a first sub-mask showing the inside of the first mask. 6 is a graph showing a change in average of luminance data in a first sub-mask when scanning is performed in the first sub-mask. FIG. 7A is a two-dimensional layout explanatory view showing a specific setting example of the second mask when the component 12 is viewed from above, and FIG. Second when scanning with sub-mask
7 is a graph showing a change in average of luminance data in the sub-mask of FIG.

Printed circuit board 1 on which components 12 are mounted
1 is held in a fixed state by the transport mechanism 13 and moved in the arrow 14 direction. During this time, the laser light 16 from the laser light source 15 is reflected by three reflecting mirrors 18a, 18b and 18c,
The laser light 16 is guided to the rotating polygon mirror 17, and the laser light 16 is applied to the component 1 by the polygon mirror 17 and the fθ lens 19.
2 is irradiated vertically on the printed circuit board 11 on which the circuit board 2 is mounted. Thus, the entire surface of the printed circuit board 11 on which the components 12 are mounted is two-dimensionally scanned by the laser light 16 in the up-down direction.

A reflection mirror 20 is provided between the printed circuit board 11 and the fθ lens 19 to provide scattered light reflected from the printed circuit board 11 on which the component 12 is mounted by two-dimensional vertical scanning of the laser light 16. And f
The light is condensed on the position detecting element 22 through the condensing lens 21 via the θ lens 19 and the polygon mirror 17. The position signal S23 output from the position detection element 22 is input to the image calculation processing unit 24. In the image calculation processing unit 24,
The position signal S23 input at the timing of the motivation signal is converted into height and luminance data of the printed circuit board 11 and the components 12 mounted on the printed circuit board 11, and the measured luminance data is converted into the lead position determining unit 27. Output to

In the lead position determining section 27, a component (IC)
The first sub-mask data storage unit 26 that moves within the first mask 601 from the first mask data storage unit 25 set so as to cover all 12 leads 603 in the same direction.
From the first sub-mask 602, and the position of the lead is determined.

The lead tip position determining unit 30 sets the second mask 701 from the second mask data storage unit 28 at the lead position determined by the lead position determining unit 27, and moves within the second mask 701. Then, a position where the average value of the luminance in the second sub-mask 702 from the second sub-mask data storage unit 29 is minimized is found and determined as the lead end position.

In the determination processing section 34, the lead position determination section 2
7 and the third mask 703 from the third mask data storage unit 31 are set at the inter-lead position determined by the lead tip position determination unit 30, and the luminance data in the third mask 703 and the luminance data in the same group are set. By calculating a correlation coefficient between the average value of the luminance data and the sample and non-defective sample data from the sample data storage unit 33 and comparing with the judgment threshold value from the judgment threshold value storage unit 32, the lead 60 is calculated.
A bridge or the like between the three can be determined.

Next, the image calculation processing section 24, the lead position determination section 27, the lead tip position determination section 30, and the determination processing section 34
Will be described in detail.

FIG. 2 shows a detailed configuration of the image calculation processing section 24, and FIG. 3 shows a detailed configuration of the lead position determination section 27. FIG. 4 shows a detailed configuration of the lead tip position determination unit 30, and FIG. 5 shows a detailed configuration of the determination processing unit 34.

First, the image operation processing section 24 will be described. As shown in FIG. 2, the position signal S23 from the position detecting element 22 is converted into a digital signal by the A / D converter 201 and input to the height calculation circuit 202 and the luminance calculation circuit 203. In the present embodiment, PSD (P
osilion-Sensitive Detecto
rs (semiconductor position detecting element), and the incident position of the reflected light incident on the PSD is such that the current flowing through the electrodes at both ends of the element is inversely proportional to the distance between the electrodes.
The height calculation circuit 202 obtains height data, and the brightness calculation circuit 203 obtains brightness data, and calculates the currents I1 and I2 from both electrodes converted into digital signals.

[0025]

(Equation 1)

[0026]

(Equation 2)

The height calculation circuit 20
Step 2 obtains height data. According to (Equation 2), the luminance data is calculated by the luminance calculation circuit 203, and the currents I1 and I2 from both electrodes converted into digital signals are calculated.

The height data obtained by (Equation 1) and (Equation 2) are temporarily stored in the measured height data storage memory 204. The luminance data is stored in the measured luminance data storage memory 20.
5 and output to the lead position determination unit 27.

Next, the lead position determining section 27 will be described. In the present embodiment, the XY coordinates of the upper left and right sides of the rectangular parallelepiped indicating the area are stored as the data of the first mask 601, and the size (X direction, Y direction) of the first sub mask 602 is stored. Direction), the second mask 70
1 data (X direction, Y direction), and data of the second submask 702 have the size (X
(Direction, Y direction) and the size (X direction, Y direction) of the third mask 703 are stored. Then, as shown in FIG. 3 and FIG. 6A, the inside of the first mask 601 from the first mask data storage unit 25 set so as to cover all leads 603 of the component 12 in the same direction, that is, In the portion corresponding to all leads 603 in the same direction, the first sub-mask 602 from the first sub-mask data storage unit 26 is replaced with the first sub-mask position determination unit 3
01, the component 12 is scanned in the direction of the arrow perpendicular to the longitudinal direction of the lead 603, and the first sub-mask 602 is scanned.
The first cumulative addition circuit 302 obtains the sum of the measured luminance data from the measured luminance data storage memory 205 corresponding to, and the first average calculation circuit 303 divides the cumulative addition value by the cumulative addition number. Submask of 1 6
An average value in 02 is obtained. In the maximum value detection circuit 304, a portion having the maximum value of the average value obtained by the first average calculation circuit 303 is obtained.

Based on the mask data as described above, the first sub-mask 6 set to cover the lead 603
FIG. 6B shows the calculated and plotted average value in the first submask 602 when 02 is scanned. That is, when the first sub-mask 602 is scanned in the positive direction of X, the luminance increases when the first sub-mask 602 is applied to the upper surface of the lead and has a maximum value. Can be.

Next, the lead tip position determining unit 30 will be described. As shown in FIGS. 4 and 7A, in the second mask 701 from the second mask data storage unit 28 set at the read position from the read position determination unit 27, the second sub-mask data The second sub-mask 702 from the storage unit 29 is scanned by the second sub-mask position determining unit 401 in the direction of the arrow parallel to the longitudinal direction of the lead 603 of the component 12, and the measured luminance data corresponding to the second sub-mask 702 is stored. The sum of the measured luminance data from the memory 205 is obtained by the second cumulative addition circuit 402, and the second average calculation circuit 403 divides the cumulative addition value by the cumulative addition number, thereby obtaining the average in the second sub-mask 702. Find the value. In the minimum value detection circuit 404,
A portion having a minimum value of the average value obtained by the second average calculation circuit 403 is obtained.

The second sub-mask 702 when the second sub-mask 702 set so as to cover the lead 603 is scanned based on the above mask data.
FIG. 7 (b) is a graph when the average value is calculated and plotted. That is, when the second sub-mask 702 is scanned in the negative direction of Y, when the second sub-mask 702 is applied to the leading end of the lead, the luminance becomes low and has a minimum value. be able to.

Next, the judgment processing section 34 will be described.
As shown in FIGS. 5, 6A, and 7A, the third lead position is determined from the lead position from the lead position determination unit 27 and the lead position determined from the lead position from the lead position determination unit 30. Of the third mask 70 from the mask data storage unit 31
Set 3. An average value of the measured luminance data from the measured luminance data storage memory 205 corresponding to the third mask 703 in the same group is obtained by the group average calculation circuit 501. In the correlation coefficient calculation circuit 502, the measured brightness data from the measured brightness storage memory 205 corresponding to the third mask 703, the average value within the group from the group average calculation circuit 501, and the non-defective and non-defective data from the sample data storage unit 33. The correlation coefficient with good sample data is

[0034]

(Equation 3)

[0035] The determination circuit 503 compares the correlation coefficient from the correlation coefficient calculation circuit 502 with the threshold stored in the threshold storage unit 32 for determination. The mounting state of the component 12 is determined based on whether the correlation coefficient is within a threshold range. That is, if the correlation coefficient with the non-defective sample data, the correlation coefficient with the defective sample data, and the correlation coefficient with the group average data calculated from (Equation 3) are within the range of the determination threshold, the component 12 is Properly implemented, lead 6
It is determined that there is no bridge, foreign matter, etc. at the position between 03, and the correlation coefficient with the non-defective sample data, the correlation coefficient with the defective sample data, and the correlation coefficient with the group average data calculated from (Equation 3) Lead 6 if outside the threshold range
It is determined that there is a bridge, foreign matter, etc. at the position between 03.

As described above, according to the above embodiment, the component 12
The entire surface of the printed circuit board 11 on which is mounted is scanned by the laser light 16, and the scattered light obtained by reflecting from the printed circuit board 11 is passed through the reflection mirror 20, the fθ lens 19, the polygon mirror 17, and the condenser lens 21 to detect the position 22
To detect the condensing position of the scattered light on the position detecting element 22 that changes according to the height irregularity on the printed circuit board 11. From the position signal S23, the printed circuit board 11 and the component 1 mounted thereon are processed by the image arithmetic processing unit 24.
The height and luminance data of 2 are calculated. Then, in the first mask 601 set at the mounting position of the component 12 by the lead position determining unit 27, the position of the lead 603 is obtained from the maximum value of the average luminance in the first sub-mask 602 for scanning the upper surface of the lead. Lead tip position determination unit 30
Thus, in the second mask 701 set on the lead 603 from the lead position determination unit 27, the tip position of the lead 603 is obtained from the minimum value of the average luminance in the second sub-mask 702 that scans the upper surface of the lead. Third mask 70 set at the position between leads by determination processing unit 34
3 and the average luminance data of the same group,
By calculating the correlation coefficient with the sample data of the good and defective products, the bridge between the leads 603 of the component 12 and the foreign matter are not affected by the warpage of the substrate 11, the displacement of the component 12, and the bending of the lead 603. Can be inspected.

[0037]

As is apparent from the above description, the mounting board appearance inspection apparatus of the present invention measures the luminance data of the printed circuit board and the mounted components, and determines the first data set on the mounted components.
In the second mask, the lead position is determined from the maximum value of the average luminance in the first sub-mask that scans the upper surface of the lead, and the minimum value of the average luminance in the second sub-mask that scans the upper surface of the lead in the second mask The leading end position of the lead is obtained from the value, and the correlation between the luminance data in the third mask set at the position between the leads and the average data of the same group and the sample data of the good and defective products is obtained by calculation. Since the threshold value is compared with the threshold value, it is possible to inspect a bridge between leads of a mounted component, adhesion of a foreign substance, and the like without being affected by warpage of the printed circuit board, component displacement, lead bending, and the like.

[Brief description of the drawings]

FIG. 1 is a diagram showing an overall configuration of a detection unit and a signal processing unit in an embodiment of a mounting board appearance inspection apparatus of the present invention.

FIG. 2 is a block diagram illustrating a detailed configuration of an image calculation processing unit according to the embodiment.

FIG. 3 is a block diagram showing a detailed configuration of a lead position determining unit in the embodiment.

FIG. 4 is a block diagram showing a detailed configuration of a lead tip position determining unit in the embodiment.

FIG. 5 is a block diagram illustrating a detailed configuration of a determination processing unit according to the embodiment.

FIG. 6 is an explanatory diagram for describing a first mask and a first sub-mask stored in a first mask data storage unit, a first sub-mask data storage unit according to the embodiment;

FIG. 7 is an explanatory diagram for describing a second mask data storage unit, a second mask stored in a second sub-mask data storage unit, and a second sub-mask in the embodiment.

FIG. 8 is a block diagram showing a configuration of a conventional mounting board appearance inspection apparatus.

FIG. 9 is a view for explaining a mask in a conventional example.

DESCRIPTION OF SYMBOLS 11 Printed circuit board 12 Parts 13 Transport mechanism 15 Laser light source 16 Laser light 17 Polygon mirror 18a, 18b, 18c Reflecting mirror 19 fθ lens 20 Reflecting mirror 21 Condensing lens 22 Position detecting element 24 Image processing unit 25 First mask data storage unit 26 First sub-mask data storage unit 27 Read position determination unit 28 Second mask data storage unit 29 Second sub-mask data storage unit 30 Lead end position determination unit 31 Third mask data Storage unit 32 Determination threshold storage unit 33 Sample data storage unit 34 Judgment processing unit

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Eiichi Hayashi 3-1, Tsunashimahigashi 4-chome, Kohoku-ku, Yokohama-shi, Kanagawa Prefecture Inside Matsushita Communication Industrial Co., Ltd. (72) Kunio Sannomiya 3 Higashi-Mita, Tama-ku, Kawasaki City, Kanagawa Prefecture No. 10-1 Matsushita Giken Co., Ltd. (56) References JP-A-4-86548 (JP, A) JP-A-3-245046 (JP, A) JP-A-3-14851 (JP, A) JP-A-3-148050 (JP, A) JP-A-2-212705 (JP, A) JP-A-2-110306 (JP, A) JP-A-2-203258 (JP, A) JP-A-1-219656 (JP JP-A-3-189772 (JP, A) JP-A-3-229107 (JP, A) JP-A-4-178508 (JP, A) JP-A-4-268445 (JP, A)

Claims (5)

(57) [Claims] 1. A conveying means for moving a printed circuit board on which components are mounted, a laser light scanning means for scanning a laser light from a laser light source on the printed circuit board,
Scattered light condensing means for reflecting and condensing scattered light obtained by being reflected from the printed circuit board by scanning of the laser light, and condensing provided at a condensing position of the scattered light condensing means Position detecting means for outputting a position signal corresponding to a position, and image calculation processing means for calculating height and luminance data of the printed circuit board and components mounted on the printed circuit board based on the position signal from the position detecting means First mask data storage means for storing data of a plurality of first masks of a predetermined size in a mounting position of the component; and, in the first mask, a lead upper surface of the component is connected to a lead upper surface. First sub-mask data storage means for storing data of a first sub-mask moving in a direction perpendicular to the longitudinal direction, and the first sub-mask moving in the first mask; Read position determining means for determining a read position from the maximum value of the average luminance in the mask, second mask data storing means for storing data of a second mask to be set at the determined read position, and the second mask And a second sub-mask data storage means for storing data of a second sub-mask for moving the upper surface of the lead of the component in a direction parallel to the longitudinal direction of the lead, and the second sub-mask for moving in the second mask. Lead tip position determining means for finding the lead tip from the minimum value of the average luminance in the sub-mask 2;
Third mask data storage means for setting the inter-lead position determined from the first and second submasks, sample data storage means for storing sample data of good parts and bad parts, and preparation for good / bad judgment A threshold value storing means for storing a threshold value; a correlation coefficient between the luminance data in the third mask and the sample data is calculated and compared with the threshold value for determination; A mounting board appearance inspection apparatus comprising: a determination processing unit configured to determine whether or not a mounting state of the upper component is good. 2. A laser beam scanning means comprising: a polygon mirror;
a reflecting mirror for reflecting the scattered light obtained by reflecting the scattered light from the printed circuit board on the printed circuit board, and reflected by the reflecting mirror, and reflected by the polygon mirror via the fθ lens. The mounting board appearance inspection device according to claim 1, further comprising: a condensing lens that condenses the emitted light on the position detection unit. 3. A lead position determining means for determining a position of a first sub-mask moving within a first mask, and a first sub-mask position determining means for determining a position of the first sub-mask moving within the first mask; A first cumulative addition circuit for cumulatively adding the calculated luminance data, a first average calculation circuit for dividing the cumulative addition value by the cumulative addition number, and moving within the first mask obtained by the average calculation circuit The mounting board appearance inspection device according to claim 1, further comprising a maximum value detection circuit that detects a position at which a maximum value is obtained from an average value of luminance in the first sub-mask. 4. A lead tip position detecting means for determining a second sub-mask position for moving in a second mask, and a second sub-mask position determining means for calculating the position of the second sub-mask by image processing. A second cumulative addition circuit for cumulatively adding the obtained luminance data, a second average calculation circuit for dividing the cumulative addition value by the cumulative addition number, and moving in the second mask obtained by the average calculation circuit. The second
4. The mounting board appearance inspection apparatus according to claim 3, further comprising a minimum value detection circuit that detects a position where the luminance becomes a minimum value from the average value of the luminance in the sub-mask. 5. A group average calculation circuit for calculating an average value of luminance data in the same group, the determination processing means comprising:
Coefficient calculation for calculating a correlation coefficient between the luminance data calculated by the image calculation processing means within the mask, the non-defective and defective sample data from the sample data storage means, and the average value from the group average calculation circuit Circuit and
5. The mounting board appearance inspection apparatus according to claim 4, further comprising a determination circuit that compares the correlation coefficient with a determination threshold value and determines whether the components on the printed circuit board are mounted properly.