JP6891070B2 - Processing equipment, substrate inspection equipment, processing method and substrate inspection method - Google Patents

Description

The present invention is a processing device for specifying a value indicating the direction of the optical axis of the imaging unit, a substrate inspection device provided with the processing mounting, a processing method for specifying a value indicating the direction of the optical axis of the imaging unit, and a processing method thereof. It relates to a substrate inspection method using.

As a substrate inspection apparatus of this type, a circuit board inspection apparatus disclosed by the applicant in Patent Document 1 below is known. In this type of substrate inspection apparatus including this circuit board inspection apparatus, the amount of misalignment when the substrate is mounted on the mounting surface of the mounting portion (hereinafter, also referred to as “the amount of misalignment of the substrate”) is canceled out on the substrate. Prior to inspection, the amount of misalignment of the substrate is specified so that the probe can be accurately probed at the probing point. Specifically, in the state of being mounted on the mounting surface, the image pickup unit is moved above the position deviation detection sign (mark) provided in advance on the substrate to image the sign, and based on the captured image. Identify the amount of misalignment of the substrate.

Further, in order to correctly probe the probe to the probing point on the substrate, it is necessary to accurately specify the amount of movement of the probe from the standby position (initial position) along the mounting surface. For example, it is specified based on the amount of displacement of the substrate specified as described above and the amount of offset between the imaging unit and the probe. In this case, the applicant specifies the offset amount based on the image obtained by capturing the dents formed on the dent sheet attached to the substrate in order to accurately specify the offset amount between the imaging unit and the probe. ..

On the other hand, when the moving direction (direction of contact and separation with respect to the mounting surface) when the probing mechanism probing the probe is different from the direction of the optical axis of the imaging unit, the above offset amount is the plate thickness of the substrate. It becomes difficult to accurately specify the offset amount depending on the type. Therefore, the work of matching the moving direction of the probe with the direction of the optical axis is performed prior to specifying the offset amount. In this case, in the substrate inspection device developed by the applicant, the imaging unit is attached to an angle adjusting mechanism such as a goniometer that can adjust the angle, and by operating this angle adjusting mechanism, the direction of probing can be determined. It matches the direction of the optical axis.

Japanese Unexamined Patent Publication No. 6-331653 (Page 3, Fig. 1-3)

However, the conventional configuration and method in which the moving direction of the probe and the direction of the optical axis are matched in order to accurately specify the offset amount have the following problems to be improved. Specifically, in the conventional configuration and method, the moving direction of the probe and the direction of the optical axis are matched by operating the angle adjusting mechanism. However, in the angle adjustment by operating the angle adjustment mechanism, the high accuracy corresponding to the high accuracy (for example, the total probing accuracy is about 10 μm) due to the miniaturization of the conductor pattern formed on the substrate is achieved. It is difficult to match the moving direction of the probe with the direction of the optical axis. In order to deal with such a situation, instead of the configuration and method of matching the moving direction of the probe and the direction of the optical axis (without performing the matching work), the direction of the optical axis is specified and the direction of the optical axis is specified. A configuration and method for correcting the offset amount based on the direction can be considered. However, since there is no device or method having a function of accurately specifying the direction of the optical axis, it is difficult to adopt a configuration and method for correcting the offset amount based on the direction of the optical axis. Therefore, it is desired to develop a device and a method capable of accurately specifying the direction of the optical axis.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a processing device, a substrate inspection device, a processing method, and a substrate inspection method capable of accurately specifying the direction of the optical axis of an imaging unit. ..

In order to achieve the above object, the processing apparatus according to claim 1 is mounted on the mounting surface by moving the holding portion holding the probe for inspection in the first direction in which the holding portion is brought into contact with and separated from the mounting surface. Indicates the direction of the optical axis of the imaging unit in a substrate inspection device including a probing mechanism that executes a probing process for probing the probe on the substrate and an imaging unit that images the substrate from a position facing the mounting surface. The processing unit includes a processing unit that executes a specific process for specifying a value, and the processing unit produces a dent on the dent sheet by the probing process on the dent sheet arranged parallel to the above-mentioned mounting surface in the specific process. The dent forming step to be formed was executed a plurality of times with different first distances from the above-described surface to the dent sheet, and each dent in each dent forming step was imaged by the imaging unit. Each position of each dent is specified from the captured image, and the first angle formed by the first direction and the optical axis is specified based on the amount of change in each position and the amount of change in the first distance. The first process and the second process parallel to the mounting surface between the holding portion and the vertical plane along the vertical direction perpendicular to the above-described mounting surface while moving the holding portion along the first direction. The amount of change in the second distance along the direction is specified, and the first direction and the vertical direction are formed based on the amount of change in the second distance and the amount of movement of the holding portion along the first direction. The second process for specifying the second angle and the third angle formed by the optical axis and the vertical direction based on the first angle and the second angle are set as values indicating the direction of the optical axis. The third process to be specified is executed.

Further, the processing apparatus according to claim 2 is the processing apparatus according to claim 1, wherein the processing unit uses a contact type displacement meter attached to the holding unit in the second processing to change the amount of change in the second distance. To identify.

Further, the substrate inspection apparatus according to claim 3 is attached to the substrate by the processing apparatus according to claim 1 or 2, the probing mechanism, the imaging unit, the control unit that controls the probing mechanism, and the probing mechanism. The control unit includes an inspection unit that inspects the substrate based on an electric signal input / output via the probed probe, and the control unit uses a value indicating the direction of the optical axis specified by the processing device. The moving amount of the probe when probing the probe is specified.

Further, in the processing method according to claim 4, the holding portion holding the probe for inspection is moved in the first direction in which the probe is brought into contact with and separated from the mounting surface, and the probe is placed on the substrate mounted on the mounting surface. A value indicating the direction of the optical axis of the imaging unit in a substrate inspection device including a probing mechanism that executes a probing process and an imaging unit that images the substrate from a position facing the mounting surface is specified. In the specific process, a dent forming step of forming a dent on the dent sheet by the probing process on the dent sheet arranged parallel to the previously described placing surface is performed from the previously described placing surface to the dent sheet. It is executed a plurality of times at different distances, and each position of each dent is specified from each captured image obtained by imaging each dent in each dent forming step by the imaging unit, and the amount of change in each position is specified. The first process of specifying the first angle formed by the first direction and the optical axis based on the change amount of the first distance and the front while moving the holding portion along the first direction. The amount of change in the second distance along the second direction parallel to the mounting surface between the vertical plane along the vertical direction perpendicular to the mounting surface and the holding portion is specified, and the change in the second distance is specified. A second process for specifying a second angle between the first direction and the vertical direction based on the amount and the amount of movement of the holding portion along the first direction, the first angle, and the first. A third process of specifying a third angle formed by the optical axis and the vertical direction as a value indicating the direction of the optical axis based on the angle 2 is executed.

Further, in the processing method according to claim 5, in the processing apparatus according to claim 4, the amount of change in the second distance is specified by using a contact type displacement meter attached to the holding portion in the second processing.

Further, the substrate inspection method according to claim 6 specifies the amount of movement of the probe when probing the probe by using a value indicating the direction of the optical axis specified by the processing method according to claim 4 or 5. The probe is probed on the substrate, and the substrate is inspected based on the electric signals input and output via the probe.

The processing apparatus according to claim 1, the substrate inspection apparatus according to claim 3, the processing method according to claim 4, and the substrate inspection method according to claim 6 have different first distances from the mounting surface to the dent sheet. Based on the amount of change in the position of each dent specified from the captured image of each dent formed on the dent sheet and the amount of change in the first distance, the first direction of the holding portion and the optical axis of the imaging portion are set. The first process of specifying the first angle to be formed, the amount of change in the second distance between the vertical surface and the holding portion when the holding portion is moved along the first direction, and the holding along the first direction. The second process of specifying the second angle formed by the first direction and the vertical direction based on the amount of movement of the portion, and the optical axis and the vertical direction formed based on the first angle and the second angle. The third process of calculating the third angle is executed. Therefore, according to this configuration and method, the third angle as a value indicating the direction of the optical axis of the imaging unit can be accurately specified, and as a result, the first direction of the probe and the imaging unit during probing can be specified. Accurately correct the offset distance between the tip of the probe and the center of the lens of the imaging unit based on the third angle and the thickness of the substrate without performing the work of matching the direction of the optical axis. Can be done. Therefore, according to this configuration and method, the probing point can accurately prob the probe.

Further, according to the processing apparatus according to claim 2 and the processing method according to claim 5, the amount of change in the second distance is specified by using a contact type displacement meter attached to the holding portion in the second processing. Although it is a simple configuration and method, the second angle formed by the first direction and the vertical direction can be accurately specified. Therefore, the third angle formed by the optical axis and the vertical direction is based on this second angle. The angle of can be accurately specified.

It is a block diagram which shows the structure of the substrate inspection apparatus 1. It is explanatory drawing explaining the moving direction A1 when probing the probe 21 and the direction of the optical axis Ao of a camera 5. It is 1st explanatory drawing explaining the specific process. It is a 2nd explanatory diagram explaining a specific process.

Hereinafter, embodiments of a processing apparatus, a substrate inspection apparatus, a processing method, and a substrate inspection method will be described with reference to the accompanying drawings.

First, the configuration of the substrate inspection device 1 shown in FIG. 1 will be described. The substrate inspection device 1 is an example of a substrate inspection device, and is configured to be capable of inspecting, for example, the substrate 100 shown in the figure according to a substrate inspection method described later. Specifically, the substrate inspection device 1 includes a mounting table 2, a moving mechanism 3, a probing mechanism 4, a camera 5, a laser displacement meter 6, a storage unit 7, a display unit 8, and a processing unit 9. The processing device is composed of the storage unit 7 and the processing unit 9. In addition, this processing device executes a specific process (a process according to the process method in the present invention) described later.

As shown in FIGS. 1 and 2, the mounting table 2 is configured so that the substrate 100 mounted on the mounting surface 2a can be fixed and held by a clamp or the like (not shown).

Under the control of the processing unit 9, the moving mechanism 3 is above the mounting surface 2a on the mounting table 2 and is orthogonal to each other in the plane parallel to the mounting surface 2a in the X and Y directions (corresponding to the second direction). : Refer to FIG. 2) to move the probing mechanism 4, the camera 5, and the laser displacement meter 6.

As shown in FIG. 1, the probing mechanism 4 is moved by the moving mechanism 3 to a position facing the mounting surface 2a of the mounting table 2, and holds the probe 21 for inspection under the control of the processing unit 9. The holding portion 4a is moved in the moving direction A1 (corresponding to the first direction: see FIG. 2) in which the holding portion 4a is brought into contact with and separated from the mounting surface 2a of the mounting table 2, and the substrate 100 mounted on the mounting surface 2a. The probing process of probing the probe 21 to the probing point Pp (see the figure) provided on the surface 101 is executed.

The camera 5 corresponds to an imaging unit, and as shown in FIG. 1, is moved to a position facing the mounting surface 2a of the mounting table 2 by the moving mechanism 3, and is moved from the facing position under the control of the processing unit 9. The surface 101 of the substrate 100 is imaged.

As shown in FIG. 1, the laser displacement meter 6 is moved to a position facing the mounting surface 2a of the mounting table 2 by the moving mechanism 3, and is controlled by the processing unit 9 from the facing position to the surface of the substrate 100. The distance to 101 is detected.

The storage unit 7 is provided on the substrate 100 used for specifying data indicating the position (coordinates) of the probing point Pp on the substrate 100 and the amount of misalignment of the substrate 100 mounted on the mounting surface 2a of the mounting table 2. The substrate data Db including the data indicating the position (coordinates) of the marker M is stored. Further, the storage unit 7 stores various data such as dent position data Ds, distance data Dd, and angle data Da1 to Da3 generated in the specific processing executed by the processing unit 9. Further, the storage unit 7 has a specified value (design offset) of an offset distance Lo (offset amount) between the tip of the probe 21 held by the holding unit 4a of the probing mechanism 4 and the center of the lens of the camera 5. Memorize the distance Lo).

The display unit 8 displays various images under the control of the processing unit 9.

The processing unit 9 executes various processes and functions as a control unit to control each unit constituting the substrate inspection device 1. Specifically, the processing unit 9 controls the moving mechanism 3 to move the probing mechanism 4, the camera 5, and the laser displacement meter 6 in the X and Y directions above the mounting surface 2a on the mounting table 2. Further, the processing unit 9 controls the probing mechanism 4 to execute a probing process for probing the probe 21 at the probing point Pp of the surface 101 of the substrate 100 mounted on the mounting surface 2a. Further, the processing unit 9 controls the camera 5 to image the surface 101 of the substrate 100 mounted on the mounting surface 2a from a position facing the mounting surface 2a. Further, the processing unit 9 controls the laser displacement meter 6 to detect the distance from the facing position facing the mounting surface 2a to the surface 101 of the substrate 100. Further, the processing unit 9 executes the specifying process to specify the direction of the optical axis Ao of the camera 5 (the angle θ3 formed by the optical axis Ao shown in FIG. 2 and the vertical direction Av). Further, the processing unit 9 functions as an inspection unit and inspects the substrate 100 based on the electric signals input / output via the probe 21.

Next, a substrate inspection method for inspecting the substrate 100 using the substrate inspection apparatus 1 and operations of each part at that time (processing contents of the processing unit 9) will be described with reference to the drawings.

Here, the amount of movement in the X and Y directions when the probe 21 is probed to the probing point Pp is the camera 5 when the optical axis Ao of the camera 5 is located at the center of the probing point Pp, as shown in FIG. It is specified based on the offset distance Lo (distance between the X and Y directions) between the center of the lens and the tip of the probe 21 held by the holding portion 4a of the probing mechanism 4. In this case, as shown in the figure, when the optical axis Ao of the camera 5 is inclined with respect to the vertical direction Av perpendicular to the mounting surface 2a of the mounting table 2, the offset distance Lo depends on the plate thickness of the substrate 100. It will be different. Specifically, for example, the offset distance Lo (offset distance Lo shown by the solid line in the figure) in the substrate 100 having a thin plate thickness (the substrate 100 shown by the solid line in the figure) is the substrate 100 having a thick plate thickness (in the figure). It is longer than the offset distance Lo (offset distance Lo shown by the broken line in the figure) in the substrate 100) shown by the broken line. Therefore, for example, the offset distance Lo for the thin substrate 100 is specified by the method described later, and the amount of movement in the X and Y directions when the probe 21 is probed to the probing point Pp of the thick substrate 100 is determined. When specified based on the offset distance Lo (offset distance Lo for the thin substrate 100), the amount of movement becomes inaccurate, and it is difficult to probe the probe 21 to the probing point Pp of the thick substrate 100. May become. Therefore, prior to the inspection, the angle θ3 (value indicating the direction of the optical axis Ao) formed by the optical axis Ao and the vertical direction Av is specified, and the offset distance is based on the angle θ3 and the plate thickness of the substrate 100 to be inspected. Lo needs to be corrected.

When the angle θ3 is specified, as shown in FIG. 3, the substrate 100 on which the dent sheet (pressure sensitive sheet) 200 is attached to the surface 101 is placed on the mounting surface 2a of the mounting table 2. The substrate 100 is fixed with an outer clamp. Further, the probe 21 is held by the holding portion 4a of the probing mechanism 4. Next, the operation unit (not shown) is operated to instruct the substrate inspection device 1 to start the specific process. Subsequently, the processing unit 9 executes the specific processing according to the instruction.

In this specific process, the processing unit 9 first executes the first process. In this first process, the processing unit 9 executes the dent forming step a predetermined number of times (for example, three times). Specifically, in the first dent forming step on the substrate 100 having the thinnest plate thickness (the substrate 100 shown by the solid line in FIG. 3), the processing unit 9 first reads the substrate data Db from the storage unit 7, and then reads the substrate data Db. , One of the probing points Pp provided on the surface 101 of the substrate 100 is selected, and the position of the probing point Pp is specified based on the substrate data Db. Subsequently, the processing unit 9 reads a specified value (design offset distance Lo) of the offset distance Lo stored in advance in the storage unit 7 from the storage unit 7, and reads the position of the selected probing point Pp and the offset distance Lo. The amount of movement of the holding portion 4a in the X direction and the Y direction when the probe 21 is probed to the probing point Pp is specified based on the specified value of. Subsequently, the processing unit 9 controls the moving mechanism 3 to move the holding unit 4a (probing mechanism 4) in the X and Y directions by a specified amount of movement (at this time, the camera 5 also moves together with the holding unit 4a). The holding portion 4a is positioned at a position facing the selected probing point Pp. Next, the processing unit 9 controls the probing mechanism 4 to move the holding unit 4a downward along the moving direction A1 (direction toward the mounting surface 2a), and probing the probe 21 onto the dent sheet 200. At this time, the dent S is formed on the dent sheet 200.

Subsequently, the processing unit 9 controls the probing mechanism 4 to move the holding unit 4a upward (opposite position of the probing point Pp before moving it downward). Next, the processing unit 9 controls the moving mechanism 3 to move the camera 5 in the X direction and the Y direction by a specified value of the offset distance Lo, and then controls the camera 5 to start imaging. In this case, the actual offset distance Lo on the substrate 100 is due to the thickness of the substrate 100, the positional deviation when the camera 5 is attached to the moving mechanism 3, the positional deviation when the probe 21 is held by the holding portion 4a, and the like. When the offset distance Lo is different from the specified value, the center of the imaging range of the camera 5 and the center of the dent S are displaced from each other. At this time, as shown by the solid line in FIG. 3, the processing unit 9 controls the moving mechanism 3 so that the center of the dent S is located at the center of the imaging range of the camera 5 (that is, the optical axis Ao). Move the camera 5 in the X and Y directions (so that is located in the center of the dent S). Subsequently, the processing unit 9 specifies the movement amount of the camera 5 until the center of the dent S is located at the center of the imaging range of the camera 5 (hereinafter, this movement amount is also referred to as “correction movement amount”). To do. Next, the processing unit 9 strikes based on the movement amount of the holding unit 4a moved in the X and Y directions during probing and the movement amount for correction (that is, from the captured image captured by the camera 5). The position of the mark S is specified, and the movement amount for correction and the dent position data Ds indicating the position of the dent S are stored in the storage unit 7.

Further, the processing unit 9 corrects the specified value of the offset distance Lo (design offset distance Lo) stored in advance in the storage unit 7 based on the above-mentioned correction movement amount (corrected to the specified value of the offset distance Lo). The amount of movement for use is added (or subtracted) to correct it, and the storage unit 7 stores (overwrites) it. Next, as shown in FIG. 3, the processing unit 9 controls the moving mechanism 3 to move the laser displacement meter 6 in the X direction and the Y direction, and positions the laser displacement meter 6 at a position facing the dent sheet 200. Position it. Subsequently, the processing unit 9 controls the laser displacement meter 6 to detect the distance Ld from the facing position to the dent sheet 200. Next, the processing unit 9 stores the distance data Dd indicating the detected distance Ld in the storage unit 7. As a result, the first dent forming step is completed.

Subsequently, the processing unit 9 requests the display unit 8 to replace the substrate 100 and displays an image (character information) requesting an instruction to execute the second dent forming step after the replacement. Correspondingly, the substrate 100 used in the first dent forming step is removed from the mounting table 2, and then the plate thickness is different from the removed substrate 100 (from the substrate 100 used in the first dent forming step). The dent sheet 200 is attached to the surface 101 of the substrate 100 (the substrate 100 shown by the broken line in FIG. 3), and the substrate 100 is placed and fixed on the mounting surface 2a of the mounting table 2. Subsequently, an operation unit (not shown) is operated to instruct the execution of the second dent forming step. Next, the processing unit 9 executes the second dent forming step in the same manner as the first dent forming step according to the instruction.

Subsequently, when the second dent forming step is completed, the processing unit 9 causes the display unit 8 to display an image requesting instructions for replacing the substrate 100 and executing the third dent forming step. Correspondingly, the plate thickness is different from that of the substrate 100 used in the first and second dent forming steps (the plate thickness is thicker than that of the substrate 100 used in the second dent forming step, that is, the plate thickness is higher. The dent sheet 200 is attached to the surface 101 of the (thickest) substrate 100 (the substrate 100 shown by the alternate long and short dash line in FIG. 3), and the substrate 100 is placed and fixed on the mounting surface 2a of the mounting table 2, and then 3 Instructs the execution of the second dent formation step. Subsequently, the processing unit 9 executes the third dent forming step according to the instruction.

Next, the processing unit 9 has an X-direction component (hereinafter, also referred to as “angle θ1x”) of an angle θ1 (corresponding to the first angle) formed by the moving direction A1 and the optical axis Ao shown in FIG. 3, and an angle θ1. (Hereinafter, also referred to as “angle θ1y”) is specified.

Specifically, the processing unit 9 reads out each dent position data Ds stored in the storage unit 7 in each of the three dent forming steps, and specifies the position of each dent S. Subsequently, the processing unit 9 specifies the X-direction component and the Y-direction component of the amount of change (deviation amount) in the position of each dent S. Further, the processing unit 9 specifies the X-direction component and the Y-direction component of the moving amount for correction of the camera 5 based on each dent position data Ds. Further, the processing unit 9 reads out the distance data Dd stored in the storage unit 7 in each of the three dent forming steps to specify the distance Ld. Next, the processing unit 9 sets the difference value between the predetermined distance and the distance Ld from the opposite position where the laser displacement meter 6 is positioned when the distance Ld is detected to the mounting surface 2a of the mounting table 2 on the mounting surface. It is specified as the distance L1 (corresponding to the first distance) from 2a to the dent sheet 200. Subsequently, the processing unit 9 specifies the amount of change in the distance L1.

Next, the processing unit 9 moves the tip portion of the probe 21 in the X direction during the formation of the dent S by the X-direction component ΔSx of the amount of change in the position of each dent S in the first and second dent formation steps. Based on the amount), the X-direction component ΔAx of the movement amount for correction of the camera 5, and the change amount ΔL1 of the distance L1, the angle θx (first and second dent forming steps) is obtained from the following equation (1). Calculate the based angle θ1x).
θx = arctan (ΔL1 / ΔSx) -arctan (ΔL1 / ΔAx) ... Equation (1)
Subsequently, the processing unit 9 sets the angle θx (second and third dent forming steps) from the above equation (1) based on ΔSx, ΔAx and the amount of change ΔL1 in the second and third dent forming steps. The angle θ1x) based on the result is calculated. Next, the processing unit 9 calculates the average value of the calculated two angles θx as the angle θ1x.

Subsequently, the processing unit 9 determines the Y-direction component ΔSy of the amount of change in the position of each dent S in the first and second dent forming steps (in the Y direction of the tip of the probe 21 when the dent S is formed). Based on the movement amount), the Y-direction component ΔAy of the movement amount for correction of the camera 5, and the change amount ΔL1 of the distance L1, the angle θy (results of the first and second dent forming steps) from the following equation (2). The angle θ1y) based on is calculated.
θy = arctan (ΔL1 / ΔSy) -arctan (ΔL1 / ΔAy) ... Equation (2)
Next, the processing unit 9 is based on ΔSy, ΔAy and the amount of change ΔL1 in the second and third dent forming steps, and the angle θy (results of the second and third dent forming steps) from the above equation (2). The angle θ1y) based on is calculated. Subsequently, the processing unit 9 calculates the average value of the calculated two angles θy as the angle θ1y. Next, the processing unit 9 stores the angle data Da1 indicating the angles θ1x and θ1y in the storage unit 7. This completes the first process.

Subsequently, the processing unit 9 causes the display unit 8 to display an image (character information) notifying that the first processing has been completed. In response to this, preparation for the second process is performed. Specifically, as shown in FIG. 4, the plate 31 is attached to the mounting table 2. In this case, the plate body 31 is arranged so that the plate surface 31a of the plate body 31 is along the vertical direction Av perpendicular to the mounting surface 2a of the mounting table 2 and also along the Y direction. Further, the displacement meter 41 is attached to the holding portion 4a of the probing mechanism 4. In this case, the displacement meter 41 is a lever-type dial gauge type displacement meter as an example of a contact type displacement meter, and detects the amount of movement of the stylus and outputs a detection signal. Next, the moving mechanism 3 and the probing mechanism 4 are operated using an operation unit (not shown), and as shown in the figure, the tip of the stylus of the displacement meter 41 is on the plate surface 31a of the plate body 31 (in the vertical direction Av). The holding portion 4a is moved so as to come into contact with the upper part (corresponding to the vertical plane along the line). Subsequently, the operation unit is operated to instruct the execution of the first second process. Next, the processing unit 9 executes the first second processing according to the instruction.

In this first second process, the processing unit 9 controls the probing mechanism 4 to move the holding unit 4a along the moving direction A1 (in this example, downward (in the direction toward the mounting surface 2a)). Let me. At this time, as shown in FIG. 4, when the moving direction A1 is inclined with respect to the vertical direction Av (the plate surface 31a of the plate body 31), the holding portion 4a moves in the X direction as the holding portion 4a moves. Also move to. In this example, as the holding portion 4a moves downward, the holding portion 4a moves in a direction closer to the plate surface 31a of the plate body 31 (to the left in the figure). Further, the contactor of the displacement meter 41 is displaced to the main body side (to the right in the figure) of the displacement meter 41 due to the movement of the holding portion 4a in the X direction, and the displacement meter 41 detects the displacement amount and outputs a detection signal. To do. Further, the processing unit 9 specifies the amount of change in the distance L2 along the X direction between the plate surface 31a and the holding unit 4a based on the detection signal output from the displacement meter 41. Subsequently, the processing unit 9 changes the moving direction A1 and the vertical direction Av based on the amount of change in the distance L2 and the amount of movement of the holding unit 4a along the moving direction A1 by the probing mechanism 4 corresponding to the change amount. The X-direction component (hereinafter, also referred to as “angle θ2x”) of the angle θ2 to be formed (corresponding to the second angle: see the figure) is specified. Next, the processing unit 9 stores the angle data Da2 indicating the angle θ2x in the storage unit 7.

Subsequently, the processing unit 9 requests the display unit 8 to change the arrangement of the plate 31 and displays an image (character information) requesting an instruction to execute the second second processing after the change. Correspondingly, the arrangement of the plate body 31 is changed so that the plate surface 31a of the plate body 31 is along the vertical direction Av perpendicular to the mounting surface 2a of the mounting table 2 and also along the X direction. Next, the moving mechanism 3 and the probing mechanism 4 are operated using an operation unit (not shown), and the holding unit 4a is moved so that the tip end portion of the stylus of the displacement meter 41 comes into contact with the upper portion of the plate surface 31a of the plate body 31. Let me. Subsequently, the execution of the second second process is instructed. Next, the processing unit 9 executes the second second processing in the same manner as the first second processing according to the instruction.

In this case, when the moving direction A1 is inclined with respect to the vertical direction Av, the holding portion 4a also moves in the Y direction as the holding portion 4a moves, and the displacement meter 41 moves due to the movement of the holding portion 4a in the Y direction. The contactor is displaced, and the displacement meter 41 detects the displacement amount and outputs a detection signal. Further, the processing unit 9 specifies the amount of change in the distance L2 along the Y direction between the plate surface 31a and the holding unit 4a based on the detection signal output from the displacement meter 41. Subsequently, the processing unit 9 changes the moving direction A1 and the vertical direction Av based on the amount of change in the distance L2 and the amount of movement of the holding unit 4a along the moving direction A1 by the probing mechanism 4 corresponding to the change amount. The Y-direction component of the angle θ2 to be formed (hereinafter, also referred to as “angle θ2y”) is specified. Next, the processing unit 9 stores the angle data Da2 indicating the angle θ2y in the storage unit 7. This completes the second process.

Subsequently, the processing unit 9 executes the third processing. In this third process, the processing unit 9 reads out the angle data Da1 and Da2 stored in the storage unit 7 in the first process and the second process, respectively, and specifies the angles θ1x, θ1y, θ2x, and θ2y. Next, the processing unit 9 determines the X-direction component (hereinafter, also referred to as “angle θ3x”) of the angle θ3 (third angle) formed by the optical axis Ao and the vertical direction Av based on the angles θ1x, θ1y, θ2x, and θ2y. And the Y-direction component of the angle θ3 (hereinafter, also referred to as “angle θ3y”) is calculated, and the angles θ3x and θ3y are set as values indicating the direction of the optical axis Ao. In this example, as shown in FIG. 2, the processing unit 9 adds the angles θ1x and θ2x to calculate the angle θ3x, and adds the angles θ1y and θ2y to calculate the angle θ3y. Subsequently, the processing unit 9 stores the angle data Da3 indicating the angles θ3x and θ3y in the storage unit 7. As a result, the third process is completed and the specific process is completed.

Next, the substrate 100 is inspected. Specifically, instead of the substrate 100 to which the dent sheet 200 is attached, the substrate 100 to be inspected is placed and fixed on the mounting surface 2a of the mounting table 2, and then the operation unit (not shown) is operated. Then, instruct the execution of the inspection. Next, the processing unit 9 executes the inspection process according to the instruction. In this inspection process, the processing unit 9 controls the moving mechanism 3 to move the laser displacement meter 6 in the X and Y directions, and positions the laser displacement meter 6 at a position facing the surface 101 of the substrate 100. Subsequently, the processing unit 9 controls the laser displacement meter 6 to detect the distance L3 from the facing position to the surface 101 of the substrate 100. Next, the processing unit 9 reads the angle data Da3 from the storage unit 7 to specify the angles θ3x and θ3y, and reads the distance data Dd stored in the storage unit 7 in the first dent forming step from the storage unit 7. The distance Ld (the distance Ld with respect to the substrate 100 having the thinnest plate thickness described above) is specified. Subsequently, the processing unit 9 reads the offset distance Lo (offset distance Lo overwritten in the first dent forming step) stored in the storage unit 7 from the storage unit 7, and sets the offset distance Lo at an angle θ3x, Correction is made based on θ3y, distance L3, and distance Ld. Specifically, for example, when the X-direction component of the distance Ld is the distance Ldx, the processing unit 9 sets the value of tan θ3x × (L3-Ldx) as the X-direction component of the offset distance Lo (hereinafter, “offset distance Lox”). The offset distance Lox is corrected by subtracting from (also referred to as)), and when the Y-direction component of the distance Ld is the distance Ldy, the value of tanθ3y × (L3-Ldy) is the Y-direction component of the offset distance Lo (hereinafter, “ The offset distance Loy is corrected by subtracting it from the offset distance Loy).

Subsequently, the processing unit 9 reads the substrate data Db from the storage unit 7 and specifies the position of the marker M provided on the substrate 100 based on the substrate data Db. Next, the processing unit 9 controls the moving mechanism 3 to move the camera 5 to the position facing the sign M. Subsequently, the processing unit 9 controls the camera 5 to start imaging, and controls the moving mechanism 3 so that the center of the marker M is located at the center of the imaging range of the camera 5 (the optical axis Ao is labeled). Move the camera 5 in the X and Y directions (so that it is located in the center of M). Next, the processing unit 9 specifies the amount of movement of the camera 5 until the center of the marker M is positioned at the center of the imaging range of the camera 5 as the amount of displacement of the substrate 100, and stores it in the storage unit 7.

Subsequently, the processing unit 9 identifies the position of the probing point Pp based on the substrate data Db, and determines the amount of movement of the holding unit 4a required for probing the probe 21 at the position of the probing point Pp. It is specified based on the amount of misalignment and the corrected offset distance Lo (offset distance Lox, Loy). Specifically, the processing unit 9 is required to correct the position of the probing point Pp based on, for example, the amount of misalignment of the substrate 100, and to position the camera 5 at a position opposite to the corrected probing point Pp position. The amount of movement of the camera 5 from the standby position is specified, and the corrected offset distance Lo (offset distance Lox, Loy) is added (or subtracted) to the amount of movement to specify the amount of movement of the holding unit 4a. Next, the processing unit 9 controls the moving mechanism 3 and the probing mechanism 4 to move the holding unit 4a by a specified moving amount to probing the probe 21 at the probing point Pp.

Subsequently, the processing unit 9 executes an inspection on the substrate 100 based on the electric signals input / output via the probe 21. Next, the processing unit 9 causes the display unit 8 to display the inspection result. With the above, the inspection of the substrate 100 is completed.

As described above, in the processing device, the substrate inspection device 1, the processing method, and the substrate inspection method, the dents S formed on the dent sheet 200 with different distances L1 from the mounting surface 2a to the dent sheet 200. The first process of specifying the angle θ1 formed by the moving direction A1 of the holding portion 4a and the optical axis Ao of the camera 5 based on the amount of change in the position of each dent S and the amount of change in the distance L1 identified from the captured image. , The movement is based on the amount of change in the distance L2 between the plate surface 31a and the holding portion 4a when the holding portion 4a is moved along the moving direction A1 and the amount of movement of the holding portion 4a along the moving direction A1. The second process of specifying the angle θ2 formed by the direction A1 and the vertical direction Av and the third process of calculating the angle θ3 formed by the optical axis Ao and the vertical direction Av based on the angle θ1 and the angle θ2 are executed. .. Therefore, according to this configuration and method, the angle θ3 as a value indicating the direction of the optical axis Ao of the camera 5 can be accurately specified. As a result, the moving direction A1 of the probe 21 and the camera 5 during probing can be accurately specified. Accurately correct the offset distance Lo between the tip of the probe 21 and the center of the lens of the camera 5 based on the angle θ3 and the thickness of the substrate 100 without performing the work of matching the direction of the optical axis Ao. can do. Therefore, according to this configuration and method, the probe 21 can be accurately probed at the probing point Pp.

Further, according to the processing device, the substrate inspection device 1, the processing method, and the substrate inspection method, the amount of change in the second distance is specified by using the contact type displacement meter 41 attached to the holding portion 4a in the second processing. Therefore, the angle θ2 formed by the moving direction A1 and the vertical direction Av can be accurately specified with a simple configuration and method. Therefore, the angle formed by the optical axis Ao and the vertical direction Av based on this angle θ2. θ3 can be specified accurately.

The processing apparatus, substrate inspection apparatus, processing method, and substrate inspection method are not limited to the above configurations and methods. For example, the example described above in which the processing unit 9 specifies the amount of change in the distance L2 based on the detection signal output from the displacement meter 41, but the operator reads the indicated value of the dial gauge, which is a value indicating the distance L2. It is also possible to adopt a configuration in which the operation unit is operated with the indicated value and the processing unit 9 specifies the amount of change in the distance L2 based on the input indicated value.

Further, in the first process, the example in which the number of dent forming steps executed at different distances L1 (first distance) is defined as 3 times has been described above, but the number of dent forming steps is arbitrarily 2 or more. Can be specified in the number of times.

Further, although the example of using the contact type displacement meter (lever type dial gauge type displacement meter) as the displacement meter 41 is described above, it is also possible to adopt a configuration in which a non-contact type displacement meter such as a laser displacement meter is used as the displacement meter 41. it can.

Further, although the configuration example in which the processing device is incorporated in the substrate inspection device 1 has been described above, it is also possible to configure a single processing device that is not incorporated in the substrate inspection device 1.

1 Board inspection device 2 Mounting table 2a Mounting surface 4 Probing mechanism 4a Holding part 5 Camera 9 Processing part 21 Probe 31 Plate 31a Plate surface 41 Displacement meter 100 Board 200 Scratch sheet A1 Moving direction Aa Optical axis direction Ao Optical axis Av Vertical direction L1 distance L2 distance S dent θ1 to θ3 angle XX direction YY direction

Claims (6)

With a probing mechanism that executes a probing process in which the holding portion holding the probe for inspection is moved in the first direction in which the probe is brought into contact with the mounting surface and the probe is probed on the substrate mounted on the mounting surface. A processing unit that executes a specific process for specifying a value indicating the direction of the optical axis of the imaging unit in a substrate inspection device including an imaging unit that images the substrate from a position facing the mounting surface.
In the specific process, the processing unit performs a dent forming step of forming a dent on the dent sheet by the probing process on the dent sheet arranged parallel to the previously described placing surface from the previously described placing surface. The first distance to the scar sheet was made to be different and executed a plurality of times, and each position of each dent was specified from each captured image obtained by imaging each dent in each dent forming step on the imaging unit. The first process of specifying the first angle formed by the first direction and the optical axis based on the amount of change in each position and the amount of change in the first distance.
While moving the holding portion along the first direction, a second along a second direction parallel to the mounting surface between the vertical plane perpendicular to the above-mentioned mounting surface and the holding portion. The amount of change in the two distances is specified, and the second angle formed by the first direction and the vertical direction is determined based on the amount of change in the second distance and the amount of movement of the holding portion along the first direction. The second process to identify and
A processing device that executes a third process of specifying a third angle formed by the optical axis and the vertical direction as a value indicating the direction of the optical axis based on the first angle and the second angle. The processing apparatus according to claim 1, wherein the processing unit uses a contact type displacement meter attached to the holding unit in the second processing to specify the amount of change in the second distance. Input / output via the processing device according to claim 1 or 2, the probing mechanism, the imaging unit, the control unit that controls the probing mechanism, and the probe probed to the substrate by the probing mechanism. It is equipped with an inspection unit that inspects the board based on electrical signals.
The control unit is a substrate inspection device that specifies the amount of movement of the probe when probing the probe using a value indicating the direction of the optical axis specified by the processing device. With a probing mechanism that executes a probing process in which the holding portion holding the probe for inspection is moved in the first direction in which the probe is brought into contact with the mounting surface and the probe is probed on the substrate mounted on the mounting surface. In a specific process for specifying a value indicating the direction of the optical axis of the imaging unit in a substrate inspection device including an imaging unit that images the substrate from a position facing the mounting surface.
The dent forming step of forming a dent on the dent sheet by the probing treatment on the dent sheet arranged parallel to the previously described placing surface is performed by differentiating the first distance from the previously described placing surface to the dent sheet. This is executed a plurality of times, and each position of each dent is specified from each captured image obtained by imaging each dent in each dent forming step by the imaging unit, and the amount of change in each position and the first The first process of specifying the first angle formed by the first direction and the optical axis based on the amount of change in distance, and
While moving the holding portion along the first direction, a second along a second direction parallel to the mounting surface between the vertical plane perpendicular to the above-mentioned mounting surface and the holding portion. The amount of change in the two distances is specified, and the second angle formed by the first direction and the vertical direction is determined based on the amount of change in the second distance and the amount of movement of the holding portion along the first direction. The second process to identify and
A processing method for executing a third process of specifying a third angle formed by the optical axis and the vertical direction as a value indicating the direction of the optical axis based on the first angle and the second angle. The processing apparatus according to claim 4, wherein in the second processing, a contact type displacement meter attached to the holding portion is used to specify the amount of change in the second distance. Using the value indicating the direction of the optical axis specified by the processing method according to claim 4 or 5, the amount of movement of the probe when the probe is probed is specified, the probe is probed on the substrate, and the probe is probed. A substrate inspection method for inspecting the substrate based on an electric signal input / output via.

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