JP2703340B2 - Liquid phase epitaxial growth method - Google Patents
Liquid phase epitaxial growth methodInfo
- Publication number
- JP2703340B2 JP2703340B2 JP1138502A JP13850289A JP2703340B2 JP 2703340 B2 JP2703340 B2 JP 2703340B2 JP 1138502 A JP1138502 A JP 1138502A JP 13850289 A JP13850289 A JP 13850289A JP 2703340 B2 JP2703340 B2 JP 2703340B2
- Authority
- JP
- Japan
- Prior art keywords
- epitaxial growth
- growth
- layer
- epitaxial
- liquid phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、GaP化合物半導体の液相エピタキシャル成
長において、該エピタキシャル成長層表面の異常成長抑
制による溝状凹部の形成を解消する液相エピタキシャル
成長方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a liquid phase epitaxial growth method for eliminating the formation of groove-like concave portions due to the suppression of abnormal growth on the surface of an epitaxial growth layer in liquid phase epitaxial growth of a GaP compound semiconductor.
液相エピタキシャル成長方法は、熱力学的な相平衡に
基づいた溶液からの結晶析出を利用して、結晶基板の主
面上に結晶を成長させるものであって、結晶欠陥の少な
い良質の結晶成長層が得られることから、レーザーダイ
オード、発光ダイオードなど光デバイスを製造する場合
に多用される。The liquid phase epitaxial growth method uses a crystal precipitation from a solution based on thermodynamic phase equilibrium to grow a crystal on a main surface of a crystal substrate. Is often used when manufacturing optical devices such as laser diodes and light emitting diodes.
しかしながら、液相エピタキシャル成長方法において
は、単結晶基板とこれに接触する溶液の温度をそのエピ
タキシャル成長過程で、該基板の全面にわたって均等な
温度に制御するのが困難であり、更に溶液の均一撹拌が
困難なために、該エピタキシャル層の成長厚さの均一性
が損なわれ易い。かかる問題点を解決するために、従来
次のような提案があった。However, in the liquid phase epitaxial growth method, it is difficult to control the temperature of the single crystal substrate and the solution in contact with the single crystal substrate to a uniform temperature over the entire surface of the substrate during the epitaxial growth process, and furthermore, it is difficult to uniformly stir the solution. For this reason, the uniformity of the growth thickness of the epitaxial layer is likely to be impaired. Conventionally, the following proposals have been made to solve such problems.
例えば、特開昭60−20594号公報によれば、基板表面
と結晶学的な主面とのなす角θが、ストライプ状のメサ
の方向と平行な方向における角度を0.5〜2゜、または
これと垂直は方向に10′とした基板を用いることによっ
て、エピタキシャル層厚の面内分布を改善する技術が開
示されている。また、特開昭59−225518号公報によれ
ば、基板の主面周縁部にドーナツ状の結晶基板を接触設
置し、主面の周縁部に端成長による突起を生じさせない
技術が開示されている。For example, according to Japanese Patent Application Laid-Open No. 60-20594, the angle θ between the substrate surface and the crystallographic main surface is 0.5 to 2 ° in the direction parallel to the direction of the stripe-shaped mesas, or A technique for improving the in-plane distribution of the epitaxial layer thickness by using a substrate whose direction is 10 'in the vertical direction is disclosed. Further, JP-A-59-225518 discloses a technique in which a donut-shaped crystal substrate is provided in contact with a peripheral portion of a main surface of a substrate so as to prevent protrusions due to edge growth on the peripheral portion of the main surface. .
しかしながら、主面の結晶学的方位が{111}に近いG
aP化合物半導体単結晶基板を用い、この上にGaPの液相
エピタキシャル成長を行う際、約100μmの成長を行う
と、しばしばその基板の外周部に深さ3〜4μm或いは
時に10〜50μmに及ぶ細溝が形成され、エピタキシャル
成長面に複数のミミズのように複雑に曲がりくねった表
面形成が観察される(以下これをミミズと称する)。か
かるミミズは前述したような細溝であるので、このミミ
ズを含む領域は、前述の光デバイスの製造に用いること
が出来ないので、解消を必要とする。However, the crystallographic orientation of the main surface is close to {111}
Using aP compound semiconductor single crystal substrate, when performing a liquid phase epitaxial growth of GaP on this, if a growth of about 100 μm is performed, a narrow groove extending to a depth of 3 to 4 μm or sometimes 10 to 50 μm is often formed on the outer peripheral portion of the substrate. Is formed, and a complicated and winding surface formation is observed on the epitaxial growth surface like a plurality of earthworms (hereinafter referred to as earthworms). Since such earthworms are the narrow grooves as described above, the area containing the earthworms cannot be used for manufacturing the above-described optical device, and thus needs to be eliminated.
本発明は、主面の結晶学的方位が{111}に近いGaP化
合物半導体基板にGaPの液相エピタキシャル成長を行う
際に、その成長表面にミミズが発生しないか、或いはこ
の発生を著しく低減するエピタキシャル成長方法を提供
することを目的とする。The present invention provides an epitaxial growth method in which no worms are generated on the growth surface when GaP liquid phase epitaxial growth is performed on a GaP compound semiconductor substrate whose main surface has a crystallographic orientation close to {111}, or the generation is significantly reduced. The aim is to provide a method.
上記目的を達成するために、本発明は、GaP化合物半
導体基板上にエピタキシャル層を成長させる液相エピタ
キシャル成長方法において、該基板の主面の結晶学的方
位が{111}面とのなす角において、1′〜8′である
ことを特徴とする。In order to achieve the above object, the present invention provides a liquid phase epitaxial growth method for growing an epitaxial layer on a GaP compound semiconductor substrate, wherein a crystallographic orientation of a main surface of the substrate forms an angle with a {111} plane. 1 'to 8'.
また、前記エピタキシャル成長層上に、ミミズ(異常
成長抑制部分)発生の初期段階で、該エピタキシャル成
長を中断し、そのエピタキシャル層の一部溶解により該
ミミズ(異常成長抑制部分)を溶解除去した後、該エピ
タキシャル成長を再開するように構成するのが好適であ
る。In the initial stage of generation of earthworms (abnormal growth suppressing portions) on the epitaxial growth layer, the epitaxial growth is interrupted, and after dissolving and removing the earthworms (abnormal growth suppressing portions) by partially dissolving the epitaxial layer, It is preferable that the epitaxial growth be restarted.
さらに、前記エピタキシャル成長層が30〜60μm成長
した後に、該エピタキシャル成長を中断し、そのエピタ
キシャル層の一部溶解によりミミズ(異常成長抑制部
分)を溶解除去した後、該エピタキシャル成長を再開す
るように構成することもできる。Furthermore, after the epitaxial growth layer has grown to 30 to 60 μm, the epitaxial growth is interrupted, and after the earthworm (abnormal growth suppression portion) is dissolved and removed by partially dissolving the epitaxial layer, the epitaxial growth is restarted. Can also.
ミミズ領域は、エピタキシャル成長が抑制されてお
り、このため、ミミズを構成する細溝の深さが大きくな
ると、エピタキシャル成長表面層のpn接合に一部欠陥を
生じたり、また該接合近傍の発光が不充分となったり、
更に、発光ダイオード製作時に、エピタキシャル成長表
面層への電極付けに際し、そのオーミック性及びボンダ
ビリティ等に対し悪影響を及ぼす。従って、ミミズが完
全にないことが必要であるが、発光ダイオードの発光面
積は、エピタキシャル成長層の全表面積に対して著しく
小さいので、ミミズが或る程度エピタキシャル成長層上
であっても、主として製造コストの点から許容される。
本願発明者の経験によれば、この許容されるミミズの発
生した面積は全エピタキシャル層表面積の5%程度と見
られる。In the earthworm region, the epitaxial growth is suppressed, and therefore, when the depth of the narrow groove forming the earthworm increases, some defects occur in the pn junction of the epitaxial growth surface layer, and the light emission near the junction is insufficient. Become
Further, when an electrode is attached to an epitaxially grown surface layer during the manufacture of a light emitting diode, the ohmic property and the bondability are adversely affected. Therefore, it is necessary that no earthworms are completely present. However, since the light emitting area of the light emitting diode is extremely small with respect to the total surface area of the epitaxial growth layer, even if the earthworms are present on the epitaxial growth layer to a certain extent, the production cost is mainly reduced. Acceptable from the point.
According to the experience of the inventor of the present invention, it is considered that the allowable area where the earthworm is generated is about 5% of the total epitaxial layer surface area.
(発明の背景) 従来法による主面が結晶学的方位{111}に近いGaP化
合物半導体単結晶基板上のGaP液相エピタキシャル成長
層の表面に発生するミミズの発生状況について添付図面
に基づいて説明しておく。第1図及び第2図はエピタキ
シャル層Lを示したもので、ミミズMは第1図及び第2
図の(I)〜(VI)の各段階を経て成長していくものと
考えられる。(I)は液相エピタキシャル成長の初期の
段階でエピタキシャル成長縞lが生成してくる。(II)
ではエピタキシャル層の成長とともに上記成長縞lも成
長し、そのステップも強くなる。(III)ではエピタキ
シャル層の成長とともに上記成長縞lは二重線mにな
る。(IV)ではエピタキシャル層はさらに成長し、上記
二重線mは白ミミズMと称される状態まで成長する。こ
の白ミミズMはいまだ溝が浅いために底で反射した光は
上部に出てくるので黒くはない。これに対し、(V)及
び(VI)は白ミミズMがさらに成長して黒ミミズMと称
される状態となったことを示すもので、この黒ミミズM
は溝が深いために光が上部に出てくることはなく黒く見
える。第2図(V)は普通の黒ミミズMを平面図で示す
もので、この黒ミミズMはエピタキシャル成長縞に沿っ
て形成されている。第2図(VI)は強い黒ミミズMを平
面図で示すもので、この黒ミミズMは溝がより深くかつ
直線化しており、一方の結晶方位にならって形成されて
いる。(Background of the Invention) The state of occurrence of earthworms generated on the surface of a GaP liquid phase epitaxial growth layer on a GaP compound semiconductor single crystal substrate whose principal surface is close to the crystallographic orientation {111} according to the conventional method will be described with reference to the accompanying drawings. Keep it. FIGS. 1 and 2 show the epitaxial layer L. The earthworm M is shown in FIGS.
It is considered that the growth proceeds through each of the steps (I) to (VI) in the figure. In (I), epitaxial growth stripes 1 are generated at an early stage of liquid phase epitaxial growth. (II)
In this case, the growth stripe 1 grows with the growth of the epitaxial layer, and the step becomes stronger. In (III), the growth stripe 1 becomes a double line m as the epitaxial layer grows. In (IV), the epitaxial layer further grows, and the double line m grows to a state called white earthworm M. This white earthworm M is not black because the light reflected at the bottom comes out to the top because the groove is still shallow. On the other hand, (V) and (VI) show that the white earthworm M further grew and became a state called black earthworm M.
Due to the deep groove, light does not come out at the top and looks black. FIG. 2 (V) shows a plan view of a normal black earthworm M, which is formed along the epitaxial growth stripes. FIG. 2 (VI) shows a plan view of a strong black earthworm M. The black earthworm M has grooves deeper and straightened, and is formed following one crystal orientation.
(実施例) 以下に実施例を挙げて本発明を説明するが、本発明が
これらの実施例に限定されるものでないことは勿論であ
る。(Examples) Hereinafter, the present invention will be described with reference to examples, but it is needless to say that the present invention is not limited to these examples.
以下の実施例において使用した液相エピタキシャル成
長装置を、第3図に概略的に図示した。同図において、
1は基板、2は石英製ホルダーで、基板1を上昇下降す
る。3は成長用溶液、4は石英製の容器本体、5は石英
製密閉蓋、6は雰囲気ガスの入口及び出口、7はヒータ
ーである。The liquid phase epitaxial growth apparatus used in the following examples is schematically illustrated in FIG. In the figure,
1 is a substrate and 2 is a quartz holder, which raises and lowers the substrate 1. Reference numeral 3 denotes a growth solution, 4 denotes a quartz container main body, 5 denotes a quartz hermetic lid, 6 denotes an inlet and an outlet for an atmospheric gas, and 7 denotes a heater.
実施例1〜5及び比較例1及び2 半導体基板の主面の結晶学的方位を{111}面から僅か
に傾けた場合の実験 上記石英ホルダーに、主面の結晶学的方位が{111}
面に対し下記の傾き(オフアングル)をもつGaP化合物
半導体基板(直径約2インチφ、厚さ約300μm)を取
り付け、成長溶液(Ga中にGaPを3.3重量%の割合で溶解
したもの)に浸漬し、雰囲気ガスとしては、アルゴンガ
スを用いた。この基板としては、そのオフアングルが、
1′,3′,4′,5′,7′,10′,13′の7種各3枚を用い
た。第4図のような温度プログラムで、その成長溶液の
加熱冷却を行った。第4図には、縦軸に温度を示し、横
軸には時間と成長層の対応する厚さを示した。同図に示
したごとく、成長溶液温度を1040℃から850℃まで4℃
/分で冷却させ、エピタキシャル成長を行なった。前記
基板の一枚当たりのミミズを含む面積を、拡大投影機ス
クリーン上で計測し、その結果を第5図に示した。この
結果、オフアングルが1′〜8′ではミミズを含む面積
を基板総面積の5%以下(表面積では1cm2以下)にする
ことができた。Examples 1 to 5 and Comparative Examples 1 and 2 Experiments in which the crystallographic orientation of the main surface of the semiconductor substrate was slightly inclined from the {111} plane.
A GaP compound semiconductor substrate (about 2 inches in diameter, about 300 μm in thickness) with the following inclination (off angle) with respect to the surface is attached to a growth solution (GaP dissolved in Ga at a ratio of 3.3% by weight in Ga). It was immersed, and argon gas was used as an atmosphere gas. For this board, its off angle is
Three pieces each of 7 types of 1 ', 3', 4 ', 5', 7 ', 10', 13 'were used. The growth solution was heated and cooled by a temperature program as shown in FIG. In FIG. 4, the vertical axis shows temperature, and the horizontal axis shows time and the corresponding thickness of the grown layer. As shown in the figure, the growth solution temperature was 4 ° C from 1040 ° C to 850 ° C.
/ Min, and epitaxial growth was performed. The area including earthworms per substrate was measured on a magnifying projector screen, and the results are shown in FIG. As a result, when the off angle was 1 'to 8', the area including earthworms could be reduced to 5% or less of the total substrate area (1 cm 2 or less in surface area).
また、本発明方法は、基板の主面の結晶学的方位を
{111}面から僅かに傾ける(1′〜8′)構成に、エ
ピタキシャル成長層上に、ミミズ発生の初期段階で、該
エピタキシャル成長を中断し、そのエピタキシャル層の
一部溶解により該ミミズを溶解除去した後、該エピタキ
シャル成長を再開する方法、又は、エピタキシャル成長
層が30〜60μm成長した後に、該エピタキシャル成長を
中断し、そのエピタキシャル層の一部溶解により該ミミ
ズを溶解除去した後、該エピタキシャルを再開する方法
を相乗させてもよいのである。この場合のエピタキシャ
ル成長層の一部溶解工程としては、第6図又は第7図に
示した温度プログラムを例示することができる。In the method of the present invention, the crystallographic orientation of the main surface of the substrate is slightly inclined (1 ′ to 8 ′) from the {111} plane, and the epitaxial growth is carried out on the epitaxial growth layer at an early stage of earthworm generation. Interrupting, after dissolving and removing the earthworms by partially dissolving the epitaxial layer, a method of resuming the epitaxial growth, or after the epitaxially grown layer has grown 30 to 60 μm, interrupting the epitaxial growth, and partially removing the epitaxial layer. After dissolving and removing the earthworms by dissolution, a method of restarting the epitaxial growth may be synergistic. In this case, as the partial melting step of the epitaxial growth layer, the temperature program shown in FIG. 6 or 7 can be exemplified.
以上のように、本発明によれば、液相エピタキシャル
成長層の表面の溝状の形状、即ちミミズの成長を解消
し、収率の向上及び面取り工数の減少を図ることができ
るものである。As described above, according to the present invention, it is possible to eliminate the groove-like shape on the surface of the liquid phase epitaxial growth layer, that is, the growth of earthworms, thereby improving the yield and reducing the number of chamfering steps.
第1図は液相エピタキシャル成長層の表面に発生するミ
ミズの発生状況を示す摘示側面説明図、第2図は第1図
の上面説明図、第3図は実施例で使用した成長装置の概
略説明図、第4図は実施例1〜5及び比較例1及び2の
液相エピタキシャル成長工程の温度プログラムを示す図
面、第5図は実施例1〜5と比較例1及び2のオフアン
グルとミミズを含む面積の相関を示す図面、第6図は本
発明方法の実施に用いられる液相エピタキシャル成長工
程の温度プログラムの1例を示す図面、第7図は本発明
方法の実施に用いられる液相エピタキシャル成長工程の
温度プログラムの他の例を示す図面である。 M……ミミズ、1……半導体基板、2……石英製ホルダ
ー。FIG. 1 is an explanatory side view showing a state of generation of earthworms generated on the surface of a liquid phase epitaxial growth layer, FIG. 2 is an explanatory top view of FIG. 1, and FIG. 3 is a schematic illustration of a growth apparatus used in Examples. FIG. 4 is a drawing showing a temperature program of the liquid phase epitaxial growth process of Examples 1 to 5 and Comparative Examples 1 and 2, and FIG. 5 is a graph showing the off angles and earthworms of Examples 1 to 5 and Comparative Examples 1 and 2. FIG. 6 is a drawing showing the correlation of the areas including the data, FIG. 6 is a drawing showing an example of a temperature program of a liquid phase epitaxial growth step used in carrying out the method of the present invention, and FIG. 6 is a drawing showing another example of the temperature program of FIG. M: earthworm, 1 ... semiconductor substrate, 2 ... quartz holder.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 池田 均 群馬県安中市磯部2丁目13番1号 信越 半導体株式会社磯部工場内 (56)参考文献 特開 昭57−103314(JP,A) 特公 昭54−38599(JP,B2) ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Hitoshi Ikeda 2-13-1, Isobe, Annaka-shi, Gunma Shin-Etsu Semiconductor Co., Ltd. Isobe Plant (56) References JP-A-57-103314 (JP, A) JP 54-38599 (JP, B2)
Claims (3)
層を成長させる液相エピタキシャル成長方法において、
該基板の主面の結晶学的方位が{111}面とのなす角に
おいて、1′〜8′であることを特徴とするエピタキシ
ャル成長方法。In a liquid phase epitaxial growth method for growing an epitaxial layer on a GaP compound semiconductor substrate,
An epitaxial growth method, wherein a crystallographic orientation of a main surface of the substrate is 1 'to 8' at an angle formed with a {111} plane.
抑制部分発生の初期段階で、該エピタキシャル成長を中
断し、そのエピタキシャル層の一部溶解により該異常成
長抑制部分を溶解除去した後、該エピタキシャル成長を
再開することを特徴とする請求項1記載のエピタキシャ
ル成長方法。2. The epitaxial growth is interrupted in an initial stage of generation of an abnormal growth suppressing portion on the epitaxial growth layer, and the abnormal growth suppressing portion is dissolved and removed by partially dissolving the epitaxial layer, and then the epitaxial growth is restarted. The epitaxial growth method according to claim 1, wherein
長した後に、該エピタキシャル成長を中断し、そのエピ
タキシャル層の一部溶解により異常成長抑制部分を溶解
除去した後、該エピタキシャル成長を再開することを特
徴とする請求項1記載のエピタキシャル成長方法。3. The method according to claim 3, wherein the epitaxial growth is interrupted after the epitaxial growth layer has grown by 30 to 60 μm, the abnormal growth suppression portion is dissolved and removed by partially dissolving the epitaxial layer, and then the epitaxial growth is restarted. The epitaxial growth method according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1138502A JP2703340B2 (en) | 1989-05-31 | 1989-05-31 | Liquid phase epitaxial growth method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1138502A JP2703340B2 (en) | 1989-05-31 | 1989-05-31 | Liquid phase epitaxial growth method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH033322A JPH033322A (en) | 1991-01-09 |
JP2703340B2 true JP2703340B2 (en) | 1998-01-26 |
Family
ID=15223625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1138502A Expired - Fee Related JP2703340B2 (en) | 1989-05-31 | 1989-05-31 | Liquid phase epitaxial growth method |
Country Status (1)
Country | Link |
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JP (1) | JP2703340B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60254714A (en) * | 1984-05-31 | 1985-12-16 | Fujikura Ltd | Manufacture of insulated winding |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS533063A (en) * | 1976-06-29 | 1978-01-12 | Nippon Telegr & Teleph Corp <Ntt> | Liquid phase epitaxial growth |
JPS5756399A (en) * | 1980-09-18 | 1982-04-03 | Toshiba Corp | Manufacture of single crystal of compound with high decomposition pressure |
JPS57103314A (en) * | 1980-12-18 | 1982-06-26 | New Japan Radio Co Ltd | Method for liquid phase epitaxial growth |
JPS58107628A (en) * | 1981-12-21 | 1983-06-27 | Nec Corp | Loquid phase epitaxial growth method |
-
1989
- 1989-05-31 JP JP1138502A patent/JP2703340B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JPH033322A (en) | 1991-01-09 |
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