JP2697098B2 - Component mounting method - Google Patents
Component mounting methodInfo
- Publication number
- JP2697098B2 JP2697098B2 JP6681489A JP6681489A JP2697098B2 JP 2697098 B2 JP2697098 B2 JP 2697098B2 JP 6681489 A JP6681489 A JP 6681489A JP 6681489 A JP6681489 A JP 6681489A JP 2697098 B2 JP2697098 B2 JP 2697098B2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- metal member
- contact
- metal
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Description
【発明の詳細な説明】 〔概要〕 電子部品の第１のパッドが回路基板の第２のパッドに
液体合金によって接続されることで実装が行われるよう
に形成された部品の実装方法に関し、 電子部品を回路基板に実装する作業を容易し、作業の
能率化を図ることを目的とし、 第１のパッドには室温で固体状の金属部材を固着さ
せ、第２のパッドには該金属部材に対して合金化可能な
金属より成る金属層を積層させ、該金属部材と該金属層
とを介在させることで該第１のパッドを該第２のパッド
に当接させ、該金属部材溶融させることにより該第１の
パッドと該第２のパッドとの間に該金属部材と該金属層
とによって合金化、生成された室温で液体状となる液体
合金による接点が形成されるようにする。DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to a component mounting method in which mounting is performed by connecting a first pad of an electronic component to a second pad of a circuit board by a liquid alloy. For the purpose of facilitating the work of mounting components on a circuit board and improving the efficiency of the work, a solid metal member is fixed to the first pad at room temperature, and the second pad is bonded to the metal member. A metal layer made of a metal that can be alloyed with the first pad is brought into contact with the second pad by interposing the metal member and the metal layer, thereby melting the metal member. Thereby, a contact is formed between the first pad and the second pad by a liquid alloy which is alloyed and generated at room temperature by the metal member and the metal layer.
本発明は電子部品の第１のパッドが回路基板の第２の
パッドに液体合金によって接続されることで実装が行れ
るように形成された部品の実装方法に関する。The present invention relates to a method for mounting a component formed so that mounting is performed by connecting a first pad of an electronic component to a second pad of a circuit board by a liquid alloy.
近年、コンピュータシステムの高速化，高密度実装化
に伴い、半導体素子などの電子部品ではLCC（Leadless
Chip Carrier）などを用いたSMT（Surface Mount Techn
olog）等が使用されるようになった。In recent years, as computer systems have become faster and denser, electronic components such as semiconductor devices have become
SMT (Surface Mount Techn) using Chip Carrier
olog) etc. are used.
しかし、このような電子部品が実装される回路基板
は、一般的に、セラミック材などによって形成されてい
るため、例えば、LCCを回路基板に実装した場合は、両
者間には熱膨張係数に大きな違いがあり、パワーオンま
たはオフ時および運搬または保管時の温度変化によっ
て、接合部にはその温度変化による機械的なストレスが
生じることになる。However, since a circuit board on which such electronic components are mounted is generally formed of a ceramic material or the like, for example, when an LCC is mounted on the circuit board, a large thermal expansion coefficient exists between the two. There is a difference: a temperature change during power-on or power-off and during transport or storage will cause a mechanical stress at the joint due to the temperature change.
したがって、このような電子部品と回路基板との接合
部は、温度変化による機械的なストレスを生じることの
ないように形成されることが望まれている。Therefore, it is desired that such a joint between the electronic component and the circuit board is formed so as not to generate mechanical stress due to a temperature change.
従来は第３図の従来の説明図に示すように構成されて
いた。第３図の（ａ）（ｂ）は側面図，（ｃ）は接点部
の要部側面図である。Conventionally, it was configured as shown in the conventional explanatory diagram of FIG. 3 (a) and 3 (b) are side views, and FIG. 3 (c) is a side view of a main part of a contact portion.
第３図の（ａ）に示すように、先づ、電子部品１の所
定面に配列され、信号の入出力が行われる第１のパッド
３にはボール半田10を固着させることで、それぞれの第
１のパッド３にバンプの形成を行う。As shown in FIG. 3A, first, ball solder 10 is fixed to the first pad 3 which is arranged on a predetermined surface of the electronic component 1 and receives / inputs a signal. A bump is formed on the first pad 3.
次に、バンプの形成が行われた電子部品１は（ａ）に
示すように、セラミック材などによって形成され、所定
のパターン配線を備えた回路基板２に積載する。Next, as shown in (a), the electronic component 1 on which the bumps have been formed is formed of a ceramic material or the like, and is mounted on a circuit board 2 provided with a predetermined pattern wiring.
この場合の積載は、所定の第１のパッド３が回路基板
２の実装面2Aに形成され、所定のパターン配線に接続さ
れた第２のパッド４に当接されるよう位置決めされ、加
熱によってボール半田10を溶融させるボンデイグ処理で
行われる。In this case, the stacking is performed such that a predetermined first pad 3 is formed on the mounting surface 2A of the circuit board 2 and is positioned so as to be in contact with a second pad 4 connected to a predetermined pattern wiring. This is performed by a bonding process for melting the solder 10.
したがって、それぞれの第１のパッド３はボール半田
10を介在することで第２のパッド４に接続され、第１の
パッド３と第２のパッド４とが電気導通を有するように
接続されることが行われていた。Therefore, each first pad 3 is a ball solder.
The connection between the first pad 3 and the second pad 4 has been performed by connecting the first pad 3 and the second pad 4 to each other with the interposition of 10.
しかし、このようなボール半田10によって接続を行う
構成では、電子部品１と回路基板２との熱膨張係数、お
よび、熱容量の違いによって、例えば、パワーオンまた
はオフによる温度変化によって、ボール半田10に機械的
なストレスが発生することになり、第３図の（ｂ）に示
すＣ部の如く亀裂が生じる。However, in such a configuration in which the connection is made by the ball solder 10, the ball solder 10 is connected to the electronic component 1 and the circuit board 2 by a difference in thermal expansion coefficient and heat capacity, for example, by a temperature change due to power on or off. A mechanical stress is generated, and a crack is generated as shown in part C of FIG. 3 (b).
したがって、第１のパッド３と第２のパッド４とにお
ける電気導通が切断されたり、または、電気抵抗が増加
することにる。Therefore, the electrical continuity between the first pad 3 and the second pad 4 is cut off, or the electrical resistance increases.
そこで、（ｃ）に示すように、第１のパッド３と第２
のパッド４と間に液体金属、または、液体合金による接
点11を形成することが特開昭58−130540号で提案されて
いる。Therefore, as shown in FIG.
It has been proposed in Japanese Patent Application Laid-Open No. 58-130540 to form a contact 11 made of a liquid metal or a liquid alloy between the pad 4 of FIG.
したがって、このような接点11は、通常、室温で液体
状の液体金属、または、液体合金によって形成が行われ
るよう、先づ、液体状のボール12を形成し、ボール12を
第１のパッド３に付着させ、次に、第２のパッド４にボ
ール12を当接させように形成される。Therefore, such a contact 11 is usually formed by first forming a liquid ball 12 so that it is formed by a liquid metal or a liquid alloy which is liquid at room temperature, and the ball 12 is connected to the first pad 3. Then, the ball 12 is formed to contact the second pad 4 with the ball 12.
しかし、このような液体状のボール12を多数形成する
こと、更に、それ等のボール12を第１のパッド３に付着
させることは、取り扱いが困難となる。However, it is difficult to form a large number of such liquid balls 12 and to attach such balls 12 to the first pad 3.
したがって、電子部品を回路基板に実装する場合、作
業性が悪くなり、作業能率が低く、工数を要する問題を
有している。。Therefore, when electronic components are mounted on a circuit board, workability is degraded, work efficiency is low, and there are problems that require man-hours. .
そこで、電子部品を回路基板に実装する作業を容易
し、作業の能率化を図ることを目的とする。Therefore, an object of the present invention is to facilitate the work of mounting electronic components on a circuit board and to improve the work efficiency.
第１図の（ａ）（ｂ）は本発明の原理説明図である。 FIGS. 1 (a) and 1 (b) are explanatory diagrams of the principle of the present invention.
第１図の（ａ）（ｂ）に示すように、第１のパッド３
には室温で固体状の金属部材５を固着させ、第２のパッ
ド４には該金属部材５に対して合金化可能な金属より成
る金属層６を積層させ、該金属部材５と該金属層６とを
介在させることで該第１のパッド３を該第２のパッド４
に当接させ、該金属部材５を溶融することにより該第１
のパッド３と該第２のパッド４との間に該液体金属５と
該金属層６とによって合金化、生成された室温で液体状
の液体合金による接点７が形成されるように構成する。As shown in FIGS. 1A and 1B, the first pad 3
A metal member 5 in a solid state at room temperature is fixed on the second pad 4, a metal layer 6 made of a metal alloyable with the metal member 5 is laminated on the second pad 4, and the metal member 5 and the metal layer 6, the first pad 3 is connected to the second pad 4
To the first member by melting the metal member 5.
The liquid metal 5 and the metal layer 6 are alloyed by the liquid metal 5 and the metal layer 6 to form a contact 7 made of a liquid liquid alloy at room temperature between the pad 3 and the second pad 4.
このように構成することによって前述の課題は解決さ
れる。With this configuration, the above-described problem is solved.
即ち、電子部品１の第１のパッド３に室温で固体状の
金属部材５を固着させ、一方、回路基板２の第２のパッ
ド４に金属層６を積層することで、第１のパッド３が第
２のパッド４に重ね合わせることで、金属部材５を溶融
させ、金属層６が金属部材５に溶け込み、合金化、生成
されることで室温で液体状の液体合金が形成され、液体
合金による接点７によって第１と第２のパッド3,4との
間が電気的に接続されるようにしたものである。That is, the solid metal member 5 is fixed to the first pad 3 of the electronic component 1 at room temperature, and the metal layer 6 is laminated on the second pad 4 of the circuit board 2, thereby forming the first pad 3. Is superimposed on the second pad 4 to melt the metal member 5, and the metal layer 6 melts into the metal member 5 and is alloyed and formed to form a liquid liquid alloy at room temperature. Is electrically connected between the first and second pads 3 and 4 by the contact 7.
したがって、従来のような液体化したボール12による
接続と異なり、電子部品１を回路基板２に実装する際、
液体状の扱い難いボール12を台のパッド３に付着させる
必要がなく、第１のパッド３には固体状の金属部材５
を、第２のパッド４には金属層６を形成することで第１
と第２のパッド3,4間には液体合金によるの接点７が容
易に形成することができ、作業能率の向上を図ることが
できる。Therefore, unlike the conventional connection using the liquefied ball 12, when the electronic component 1 is mounted on the circuit board 2,
There is no need to attach a liquid, unwieldy ball 12 to the pad 3 of the table.
The first pad is formed by forming a metal layer 6 on the second pad 4.
A contact 7 made of a liquid alloy can be easily formed between the second pad 3 and the second pad 3, and the working efficiency can be improved.
以下本発明を第２図を参考に詳細に説明する。第２図
は本発明による一実施例の説明図で、（ａ）は側面図，
（b1）（b2）（c1）（c2）および（ｄ）は実装工程図で
ある。Hereinafter, the present invention will be described in detail with reference to FIG. FIG. 2 is an explanatory view of an embodiment according to the present invention, wherein (a) is a side view,
(B1), (b2), (c1), (c2) and (d) are mounting process diagrams.
第２図の（ａ）に示すように電子部品１の第１のパッ
ド３に固着された金属部材５と、回路基板２の第２のパ
ッド４に積層された金属層６とによって合金化されるこ
とで生成された液体合金による接点７が第１と第２のパ
ッド3,4に形成されるようにしたものである。As shown in FIG. 2A, the metal member 5 fixed to the first pad 3 of the electronic component 1 and the metal layer 6 laminated on the second pad 4 of the circuit board 2 are alloyed. In this way, the contact 7 made of the liquid alloy generated by this is formed on the first and second pads 3 and 4.
また、電子部品１の所定個所にはスペーサ８が、回路
基板２には接続パッド９がそれぞれ設けられ、互いが半
田11によって固着され、第１のパッド３と第２のパッド
４とが位置決めされている。A spacer 8 is provided at a predetermined position of the electronic component 1, and a connection pad 9 is provided on the circuit board 2. The first and second pads 3 and 4 are fixed to each other by soldering 11 and positioned. ing.
そこで、このように生成された液体合金による接点７
を介在させることで第１のパッド３を第２のパッド４に
電気的に接続することは以下の実装工程によって行うこ
とができる。Therefore, the contact 7 made of the liquid alloy thus generated is used.
The electrical connection of the first pad 3 to the second pad 4 with the interposition of can be performed by the following mounting process.
先づ、実装すべき電子部品１には（b1）に示すよう
に、第１のパッド３に隣接してスペーサ８を設け、（b
2）に示すように、第１のパッド３には所定量の金属部
材５を固着させ、また、スペーサ８には予備半田付けに
より半田11を固着する。First, as shown in (b1), the electronic component 1 to be mounted is provided with a spacer 8 adjacent to the first pad 3, and (b1)
As shown in 2), a predetermined amount of the metal member 5 is fixed to the first pad 3, and the solder 11 is fixed to the spacer 8 by preliminary soldering.
この場合の金属部材５としては、例えば、ガリュウム
（Ga）を用いると、室温（25℃）では固体化されている
ので取り扱いが容易で、また、第１のパッド３に固着さ
せることは、室温（25℃）の状態で若干の加熱を加える
行える。In this case, for example, if gallium (Ga) is used as the metal member 5, it is solidified at room temperature (25 ° C.), so that it is easy to handle. (25 ° C) and a little heating can be applied.
一方、回路基板２は（c1）に示すように、第２のパッ
ド４が配列された実装面2Aには電子部品１のスペーサ８
に合致される接続パッド９を設け、（c2）に示すよう
に、第２のパッド４には前述の金属部材５に溶融される
金属層６を積層する。On the other hand, as shown in (c1), the circuit board 2 has a spacer 8 of the electronic component 1 on the mounting surface 2A on which the second pads 4 are arranged.
Is provided, and a metal layer 6 that is melted in the metal member 5 is laminated on the second pad 4 as shown in (c2).
この場合の金属層としは、例えば、錫（Sn）またはイ
ンジュウム（In）が適している。In this case, for example, tin (Sn) or indium (In) is suitable as the metal layer.
次に、（ｄ）に示すように、電子部品１を回路基板２
の実装面2Aに積層し、スペーサ８を接続パッド９に合致
させることで位置決めを行い、所定の圧力Ｐによって電
子部品１を押圧して、加熱を行う。Next, as shown in (d), the electronic component 1 is attached to the circuit board 2.
The electronic component 1 is positioned by aligning the spacers 8 with the connection pads 9, and the electronic component 1 is pressed by a predetermined pressure P to perform heating.
そこで、金属部材５に金属層６が溶け込み、合金化さ
れ、金属部材５より融点の低い、室温（25℃）で液体状
となる液体合金が生成される。Then, the metal layer 6 melts into the metal member 5 and is alloyed, and a liquid alloy having a lower melting point than the metal member 5 and being liquid at room temperature (25 ° C.) is generated.
したがって、第１と第２のパッド3,4の間には室温（2
5℃）では液体状となる液体合金による接点７が形成さ
れ、接点７によって第１と第２のパッド3,4の間が電気
導通を有するように接続され、スペーサ８は接続パッド
９に半田11によって固着されることになる。Therefore, the room temperature (2
At 5 ° C.), a contact 7 made of a liquid alloy which is in a liquid state is formed. The contact 7 connects the first and second pads 3 and 4 so as to have electrical continuity. 11 will be fixed.
この場合、金属部材５としてガリュウム（Ga）を用
い、金属層６として錫（Sn）を用いると、ガリュウム
（Ga）に錫（Sn）が溶け込み、合金化により、ガリュウ
ム（Ga）より融点の低い約30℃で液化するGa−Snの液体
合金が生成され、Ga−Snの液体合金より成る接点７によ
って第１と第２のパッド3,4間の接続が行われことにな
る。In this case, when gallium (Ga) is used as the metal member 5 and tin (Sn) is used as the metal layer 6, tin (Sn) dissolves into the gallium (Ga) and has a lower melting point than gallium (Ga) due to alloying. A liquid alloy of Ga-Sn which liquefies at about 30 ° C. is produced, and the connection between the first and second pads 3 and 4 is made by the contact 7 made of the liquid alloy of Ga-Sn.
また、この接点７は、温度が上昇することで直ちに液
化されるため、前述のような収縮の差によるストレスの
発生は皆無となり、かつ、部品の実装時は固体状である
ため、取り扱いが容易で作業能率の向上が図れる。Further, since the contact 7 is liquefied immediately when the temperature rises, there is no stress due to the difference in shrinkage as described above, and since the contact 7 is in a solid state at the time of mounting components, it is easy to handle. Thus, work efficiency can be improved.
更に、このような金属層６を金属部材５に溶け込ませ
る合金化により接点７を生成することは、第２のパッド
４に対する金属部材５の濡れ性を良くし、第１と第２の
パッド3,4間の接続をより確実にすることができる。Further, by forming the contact 7 by alloying such that the metal layer 6 is melted into the metal member 5, the wettability of the metal member 5 with respect to the second pad 4 is improved, and the first and second pads 3 are formed. , 4 can be more reliably connected.
以上説明したように、本発明によれば、第１のパッド
に室温で固体状の金属部材を固着させ、第２のパッドに
は金属部材に溶け込む金属層を積層し、金属部材と金属
層とによって室温で液体状となる合金化、生成された液
体合金の接点によって第１と第２のパッド間を接続する
ことが行われるようにしたものである。As described above, according to the present invention, a solid metal member is fixed to a first pad at room temperature, and a metal layer that dissolves in the metal member is laminated on the second pad. The connection between the first and second pads is performed by means of an alloy which becomes liquid at room temperature and a contact of the generated liquid alloy.
したがって、従来のような液体化されたボールによっ
て接続を行う場合に比較して、作業性が良く、電子部品
の実装作業の効率化が図れ、安定した接続が得られ、接
続信頼性の向上が図れ、実用的効果は大である。Therefore, compared to the case where connection is made by using a liquefied ball as in the past, workability is improved, the efficiency of mounting work of electronic components can be improved, stable connection can be obtained, and connection reliability is improved. The practical effect is great.
第１図の（ａ）（ｂ）は本発明の原理説明図， 第２図は本発明による一実施例の説明図で、（ａ）は側
面図，（b1）（b2）（c1）（c2）および（ｄ）は実装工
程図， 第３図は従来の説明図で、（ａ）（ｂ）は側面図，
（ｃ）は接点部の要部側面図を示す。 図において、 １は電子部品,2は回路基板， ３は第１のパッド,4は第２のパッド， ５は金属部材,6は金属層， ７は接点,2Aは実装面を示す。1 (a) and 1 (b) are explanatory diagrams of the principle of the present invention, FIG. 2 is an explanatory diagram of one embodiment according to the present invention, (a) is a side view, (b1) (b2) (c1) ( c2) and (d) are mounting process diagrams, FIG. 3 is a conventional explanatory diagram, (a) and (b) are side views,
(C) shows a side view of a main part of the contact portion. In the figure, 1 is an electronic component, 2 is a circuit board, 3 is a first pad, 4 is a second pad, 5 is a metal member, 6 is a metal layer, 7 is a contact, and 2A is a mounting surface.
Claims (1)
（３）が回路基板（２）に形成された第２のパッド
（４）に電気導通を有するように接続されることで該回
路基板（２）の実装面（2A）に該電子部品（１）の実装
が行われる部品の実装方法であって、 前記第１のパッド（３）には室温で固体状の金属部材
（５）を固着させ、前記第２のパッド（４）には該金属
部材（５）に対して合金化可能な金属より成る金属層
（６）を積層させ、該金属部材（５）と該金属層（６）
とを介在させることで該第１のパッド（３）を該第２の
パッド（４）に当接させ、該金属部材（５）を溶融させ
ることにより該第１のパッド（３）と該第２のパッド
（４）との間に該金属部材（５）と該金属層（６）とに
よって合金化、生成された室温で液体状となる液体合金
による接点（７）が形成されることを特徴とする部品の
実装方法。A first pad (3) formed on an electronic component (1) is electrically connected to a second pad (4) formed on a circuit board (2). A method for mounting a component on which the electronic component (1) is mounted on a mounting surface (2A) of the circuit board (2), wherein the first pad (3) includes a solid metal member ( 5) is fixed, and a metal layer (6) made of a metal alloyable with the metal member (5) is laminated on the second pad (4), and the metal member (5) and the metal Layer (6)
The first pad (3) is brought into contact with the second pad (4) by interposing the first member (3), and the first pad (3) and the second pad (3) are melted by melting the metal member (5). A contact (7) made of a liquid alloy which is alloyed and formed at room temperature by the metal member (5) and the metal layer (6) between the second pad (4) and the second pad (4). How to mount the featured parts.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6681489A JP2697098B2 (en) | 1989-03-17 | 1989-03-17 | Component mounting method |
| EP90102348A EP0385142B1 (en) | 1989-02-28 | 1990-02-07 | Electrical connecting apparatus |
| DE69022605T DE69022605T2 (en) | 1989-02-28 | 1990-02-07 | Electrical connection device. |
| CA002010306A CA2010306C (en) | 1989-02-28 | 1990-02-19 | Connecting apparatus |
| US07/483,170 US5017738A (en) | 1989-02-28 | 1990-02-22 | Connecting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6681489A JP2697098B2 (en) | 1989-03-17 | 1989-03-17 | Component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02246130A JPH02246130A (en) | 1990-10-01 |
| JP2697098B2 true JP2697098B2 (en) | 1998-01-14 |
Family
ID=13326699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6681489A Expired - Fee Related JP2697098B2 (en) | 1989-02-28 | 1989-03-17 | Component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2697098B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5818244A (en) * | 1992-11-13 | 1998-10-06 | Commissariat A L'energie Atomique | Brazed solid material specimen holder for apparatus that measures dielectric and magnetic parameters |
| FR2698168B1 (en) * | 1992-11-13 | 1994-12-16 | Commissariat Energie Atomique | Method for measuring dielectric and magnetic parameters of a solid material, using brazing of this material on a sample holder. |
| TW381411B (en) * | 1997-01-20 | 2000-02-01 | Oki Electric Ind Co Ltd | Assembly unit for optical semiconductor components and the supporting substrate and the method for embedding optical semiconductor components on the supporting substrate |
| JP5520097B2 (en) * | 2010-03-23 | 2014-06-11 | 富士フイルム株式会社 | Manufacturing method of microstructure |
-
1989
- 1989-03-17 JP JP6681489A patent/JP2697098B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02246130A (en) | 1990-10-01 |
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