JP2624322B2 - Method for detecting the position of a feature of an object - Google Patents

Method for detecting the position of a feature of an object

Info

Publication number
JP2624322B2
JP2624322B2 JP1055463A JP5546389A JP2624322B2 JP 2624322 B2 JP2624322 B2 JP 2624322B2 JP 1055463 A JP1055463 A JP 1055463A JP 5546389 A JP5546389 A JP 5546389A JP 2624322 B2 JP2624322 B2 JP 2624322B2
Authority
JP
Japan
Prior art keywords
area
electronic component
detecting
characteristic
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1055463A
Other languages
Japanese (ja)
Other versions
JPH02234005A (en
Inventor
俊明 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1055463A priority Critical patent/JP2624322B2/en
Publication of JPH02234005A publication Critical patent/JPH02234005A/en
Application granted granted Critical
Publication of JP2624322B2 publication Critical patent/JP2624322B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Analysis (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は対象物の特徴部の位置の検出方法に関し、カ
メラの視野内に、対象物の特徴部の検出用エリアを設定
し、このエリアと対象物の重畳面積若しくは非重畳面積
の変化の極値を算出することにより、対象物の特徴部の
位置を検出するようにしたものである。
Description: TECHNICAL FIELD The present invention relates to a method for detecting the position of a characteristic portion of an object, and sets an area for detecting the characteristic portion of the object within the field of view of a camera, and this area By calculating the extreme value of the change of the superimposed area or the non-overlapping area of the object, the position of the characteristic portion of the object is detected.

(従来の技術) 例えばICチップ,LSIチップ,抵抗チップ,コンデンサ
チップなどの電子部品が、基板上の正しい位置に搭載さ
れたかどうかを検査する方法として、パターンマッチン
グ法が知られている。
(Prior Art) For example, a pattern matching method is known as a method for inspecting whether electronic components such as an IC chip, an LSI chip, a resistor chip, and a capacitor chip are mounted at correct positions on a substrate.

第8図及び第9図は、従来のパターンマッチング法を
示すものであって、まず第8図に示すように、検査基準
となる基準画像100の特徴部である角部をカメラの視野
内に設定されたチェックエリアA1〜A4内に入れてこれを
観察し、基準画像100の角部と各エリアA1〜A4が重なり
合った重畳部a〜dの角ka〜kdの座標を検出する。
FIGS. 8 and 9 show a conventional pattern matching method. First, as shown in FIG. 8, a corner, which is a characteristic part of a reference image 100 serving as an inspection reference, is placed in a field of view of a camera. The operator enters the set check areas A1 to A4 and observes them, and detects the coordinates of the corners ka to kd of the superimposed portions a to d where the corners of the reference image 100 and the areas A1 to A4 overlap each other.

次に第9図に示すように、検査対象となる電子部品の
画像101に対して、各エリアA1〜A4を相対的にXY方向に
移動させて、各重畳部a〜dが画像101の角部と最も重
なり合うマッチング位置を求め、その位置での上記角Ka
〜Kdの座標を、画像101の角Ka′〜Kd′の座標と見な
し、各角Ka〜KdのXY座標値から、電子部品のXY方向及び
回転方向の位置ずれ△x,△y,θを算出していた。
Next, as shown in FIG. 9, the areas A1 to A4 are relatively moved in the X and Y directions with respect to the image 101 of the electronic component to be inspected, and the superimposed portions ad are corners of the image 101. Find the matching position that most overlaps the part, and calculate the angle Ka at that position.
KKd are regarded as the coordinates of the corners Ka′〜Kd ′ of the image 101, and from the XY coordinate values of the respective corners Ka〜Kd, the positional deviations △ x, △ y, θ in the XY direction and the rotation direction of the electronic component are calculated. Was calculated.

(発明が解決しようとする課題) しかしながら上記従来方法にあっては、基準画像100
の角部と検査対象の画像101の角部は十分に重なり合い
にくく、それだけ検査精度があがらない問題があった。
(Problems to be Solved by the Invention) However, in the above conventional method, the reference image 100
And the corner of the image 101 to be inspected are difficult to sufficiently overlap with each other, and there is a problem that the inspection accuracy is not improved accordingly.

したがって本発明は、角部のような対象物の特徴部の
位置を的確に検出できる手段を提供することを目的とす
る。
Therefore, an object of the present invention is to provide a means capable of accurately detecting the position of a characteristic portion of an object such as a corner.

(課題を解決するための手段) このために本発明は、カメラにより対象物の外周を観
察して、この対象物の輪郭を検出した後、カメラの視野
内に設定された特徴部検出用エリアを上記輪郭に沿って
移動させて、この特徴部検出用エリアと対象物の周縁部
が重なり合う重畳部の面積又は重なり合わない非重畳部
の面積を算出し、この重畳部又は非重畳部の面積の変化
の極値があらわれる点の位置を検出することにより、対
象物の特徴部の位置を検出するようにしたものである。
(Means for Solving the Problems) For this purpose, according to the present invention, a camera is used to observe the outer periphery of an object, detect an outline of the object, and then set a feature detection area set in the field of view of the camera. Is moved along the contour to calculate the area of the overlapping portion where the feature detection area and the peripheral portion of the object overlap or the area of the non-overlapping portion which does not overlap, and the area of the overlapping portion or the non-overlapping portion. By detecting the position of the point where the extreme value of the change of the characteristic appears, the position of the characteristic portion of the object is detected.

(作用) 上記構成によれば、重畳部又は非重畳部の面積の変化
の極値があらわれる点の位置を算出することにより、角
部のような対象物の特徴部の位置を検出する。
(Operation) According to the above configuration, the position of the characteristic portion of the target object such as a corner is detected by calculating the position of the point where the extreme value of the change in the area of the superimposed portion or the non-superimposed portion appears.

(実施例1) 次に、基板に搭載された電子部品の位置ずれを検出す
る外観検査手段を例にとり、本発明の実施例を説明す
る。
Embodiment 1 Next, an embodiment of the present invention will be described with reference to an example of an appearance inspection unit that detects a displacement of an electronic component mounted on a substrate.

第1図は外観検査装置の斜視図であって、1は基板、
2は基板1上に搭載された電子部品である。基板1はXY
テーブル3,4から成るXY方向移動装置5上に配設されて
おり、この装置5の駆動により、基板1はXY方向に移動
する。基板1の上方には、CCDエリアカメラやリニアイ
メージカメラのような外観検査用カメラ6が設けられて
おり、また基板1の斜上方には、光源7や集光素子8が
設けられている。10はカメラ6に接続された制御部であ
って、D/Aコンバータ11,フレームメモリ12,2値化処理部
13,重畳面積計算部14及びCPU15等から成っている。
FIG. 1 is a perspective view of a visual inspection device, where 1 is a substrate,
Reference numeral 2 denotes an electronic component mounted on the substrate 1. Substrate 1 is XY
The substrate 1 is arranged on an XY direction moving device 5 composed of tables 3 and 4, and the substrate 1 is moved in the XY direction by driving the device 5. A visual inspection camera 6 such as a CCD area camera or a linear image camera is provided above the substrate 1, and a light source 7 and a light condensing element 8 are provided obliquely above the substrate 1. Reference numeral 10 denotes a control unit connected to the camera 6, which includes a D / A converter 11, a frame memory 12, and a binarization processing unit.
13, a superimposed area calculator 14, a CPU 15, and the like.

第2図は、上記装置により走査を行って、電子部品2
の輪郭追跡を行っている様子を示すものである。図中、
20はカメラ6の視野、2は上記電子部品である。波線矢
印に示すように、XY座標の原点Oを出発点として電子部
品2の外周を観察し、その輪郭のXY座標を検出する。輪
郭は、基板(白)1と電子部品(黒)2の輝度が異るこ
とから、2値化処理手段により簡単に検出することがで
きる。なおこのような輪郭追跡手段は周知手段である。
FIG. 2 shows that the electronic component 2 is scanned by the above-described device.
3 shows a state in which the contour tracking is performed. In the figure,
Reference numeral 20 denotes the field of view of the camera 6, and reference numeral 2 denotes the electronic component. As shown by the wavy arrow, the outer periphery of the electronic component 2 is observed starting from the origin O of the XY coordinates, and the XY coordinates of the outline are detected. Since the brightness of the substrate (white) 1 and the brightness of the electronic component (black) 2 are different, the outline can be easily detected by the binarization processing means. Such a contour tracking means is a well-known means.

上記のようにして輪郭追跡を終えたならば、次に任意
の点(例えば電子部品2とY軸のプラス側との交点)を
出発点とし、第3図に示す走査を行う。図中、Aは視野
20内に設定された電子部品2の特徴部検出用サークルエ
リアであって、このエリアAを上記輪郭追跡手段により
検出された輪郭に沿わせて移動させ、エリアAと電子部
品2の周縁部が重なり合う重畳部(影線部)aの面積S
を算出する。
After the contour tracing is completed as described above, the scanning shown in FIG. 3 is performed with an arbitrary point (for example, the intersection of the electronic component 2 and the plus side of the Y axis) as a starting point. In the figure, A is the field of view
The area A is a circle area for detecting a characteristic portion of the electronic component 2 set in 20. The area A is moved along the contour detected by the contour tracking means so that the area A and the peripheral edge of the electronic component 2 are moved. Area S of overlapping overlapping portion (shaded line portion) a
Is calculated.

第4図はその算出結果を示すものであって、重畳部a
の面積の変化を示しており、図中、SOはエリアAの面
積、〜は第3図における各点の位置である。エリア
Aを輪郭により2等分される線に沿って移動させると、
重畳部aの面積は、電子部品2のまっすぐな直線部に沿
う部分ではS0/2であるが、その角部すなわち特徴部,
,,において、極値(最小値)S0/4となる。した
がってこれらの点,,,のXY座標を求めること
により、特徴部(角部)の位置を検出することができ
る。
FIG. 4 shows the result of the calculation.
In the figure, SO is the area of area A, and 〜 is the position of each point in FIG. When area A is moved along a line bisected by the contour,
The area of the superimposed portion a is S0 / 2 at a portion along the straight linear portion of the electronic component 2, but its corner, that is, the characteristic portion,
,, Becomes an extreme value (minimum value) S0 / 4. Therefore, the position of the characteristic portion (corner) can be detected by obtaining the XY coordinates of these points.

このようにして特徴部〜の座標を求めたならば、
これから電子部品2の中心O′の座標を算出して、電子
部品2のXY方向の位置ずれ△x,△y(第3図参照)を簡
単に知ることができる。また回転方向の誤差θも簡単に
算出できる。なお上記方法は、重畳部aの面積Sの極値
(最小値)を求めることにより、特徴部〜の座標を
求めたが、エリアA内の非重畳部bの面積(SO−S)を
求めても同じことであり、この場合、非重畳部bの面積
が極大値(最大値)となる点が特徴部〜の位置とな
る。
Once the coordinates of the feature part have been obtained in this way,
From this, the coordinates of the center O 'of the electronic component 2 can be calculated, and the displacements △ x, △ y (see FIG. 3) of the electronic component 2 in the XY direction can be easily known. Further, the error θ in the rotation direction can be easily calculated. Note that, in the above method, the coordinates of the characteristic part to are obtained by obtaining the extreme value (minimum value) of the area S of the superimposed portion a. In this case, the point at which the area of the non-overlapping portion b has a local maximum value (maximum value) is the position of the characteristic portion.

(実施例2) 第5図において、3は3個の端子部3a,3b,3cを有する
ミニトランジスタである。このものも、上記第1実施例
の場合と同様に、その外周に沿って輪郭追跡を行ってそ
の輪郭の座標を求めた後、特徴部検出エリアAをこの輪
郭に沿って移動させて、重畳部aの面積Sを求める。第
6図はその結果を示すものであって、極値(最大値及び
最小値)があらわれる点〜の座標を求めることによ
り、特徴部の位置を求めることができる。このように本
方法によれば、対象物の形状の如何にかかわらず、角部
のような特徴部の座標を的確に求めることができる。
Embodiment 2 In FIG. 5, reference numeral 3 denotes a mini-transistor having three terminal portions 3a, 3b, 3c. In this case, similarly to the case of the first embodiment, after the contour is traced along the outer periphery to obtain the coordinates of the contour, the characteristic portion detection area A is moved along the contour to be superimposed. The area S of the part a is obtained. FIG. 6 shows the result. The position of the characteristic portion can be obtained by obtaining the coordinates of the point (1) where the extreme value (maximum value and minimum value) appears. As described above, according to the present method, the coordinates of a characteristic portion such as a corner can be accurately obtained regardless of the shape of the object.

(実施例3) 第7図は、本方法をロータリーヘッド式電子部品実装
装置に適用した場合を示すものである。31はロータリー
ヘッド、32はヘッド31の外周に沿って多数垂設された移
送ヘッド、33はそのノズル、34はXY方向移動装置35に位
置決めされた基板、36は支持台、6はこの支持台36に設
けられた上記カメラ、Pは電子部品である。
Embodiment 3 FIG. 7 shows a case where the present method is applied to a rotary head type electronic component mounting apparatus. 31 is a rotary head, 32 is a number of transfer heads vertically suspended along the outer periphery of the head 31, 33 is its nozzle, 34 is a substrate positioned on the XY direction moving device 35, 36 is a support stand, and 6 is this support stand The camera P provided in 36 is an electronic component.

このものは、ロータリーヘッド31をその軸心を中心に
ピッチ回転させながら、チップ供給部(図示せず)にお
いてノズル33の下端部に電子部品Pを吸着してテイクア
ップし、ロータリーヘッド31の回転にともなって、この
電子部品Pを基板34上に搭載するものである。
In this apparatus, while rotating the rotary head 31 at a pitch around its axis, a chip supply unit (not shown) sucks up the electronic component P at the lower end of the nozzle 33 and takes up the same. At the same time, the electronic component P is mounted on the substrate 34.

カメラ6をチップ供給部と基板34の間に設け、ノズル
33に吸着された電子部品Pを下方から観察することによ
り、上記第1実施例で述べたように電子部品Pの位置ず
れ△x,△y,θを検出する。そしてXY方向移動装置35を駆
動して基板34をXY方向に同量移動させることにより、XY
方向の位置ずれ△x,△yを補正するとともに、ノズル33
をモータ(図外)によりその軸心を中心にθ方向に回転
させることにより、回転方向の誤差θを補正し、そのう
えで電子部品Pを基板34に搭載すれば、上記誤差△x,△
y,θを補正して基板34上に搭載することができる。
The camera 6 is provided between the chip supply unit and the substrate 34, and the nozzle
By observing the electronic component P attracted to the device 33 from below, the positional shifts Δx, Δy, θ of the electronic component P are detected as described in the first embodiment. Then, by driving the XY direction moving device 35 to move the substrate 34 by the same amount in the XY direction,
Direction deviations △ x and △ y,
Is rotated by a motor (not shown) in the θ direction about its axis, thereby correcting the error θ in the rotation direction. Then, when the electronic component P is mounted on the board 34, the errors △ x, △
y and θ can be corrected and mounted on the substrate 34.

本方法は更に種々の分野に利用できるものであって、
例えば基板に印刷された回路パターンの特徴部の検出等
も行うことができるものであり、対象物は電子部品以外
のものでもよいものである。
The method can be further used in various fields,
For example, detection of a characteristic portion of a circuit pattern printed on a substrate can be performed, and the object may be other than electronic components.

(発明の効果) 以上説明したように本発明は、カメラにより対象物の
外周を観察して、この対象物の輪郭を検出した後、カメ
ラの視野内に設定された特徴部検出用エリアを上記輪郭
に沿って移動させて、この特徴部検出用エリアと対象物
の周縁部が重なり合う重畳部の面積又は重なり合わない
非重畳部の面積を算出し、この重畳部又は非重畳部の面
積の変化の極値があらわれる点の位置を検出することに
より、対象物の特徴部の位置を検出するようにしている
ので、電子部品の角部のような対象物の特徴部の位置を
的確に検出することができる。
(Effects of the Invention) As described above, according to the present invention, after observing the outer periphery of an object using a camera and detecting the contour of the object, the feature detection area set in the field of view of the camera is set as described above. By moving along the contour, calculate the area of the overlapping portion where the feature detection area and the peripheral portion of the object overlap or the area of the non-overlapping portion which does not overlap, and change the area of the overlapping portion or the non-overlapping portion. By detecting the position of the point where the extreme value of the object appears, the position of the characteristic part of the object is detected, so that the position of the characteristic part of the object such as the corner of the electronic component is accurately detected. be able to.

【図面の簡単な説明】[Brief description of the drawings]

図は本発明の実施例を示すものであって、第1図は外観
検査装置の斜視図、第2図及び第3図は検査中の平面
図、第4図は特徴図、第5図は他の実施例の平面図、第
6図は特徴図、第7図はロータリーヘッド式電子部品実
装装置の部分側面図、第8図,第9図は従来手段の平面
図である。 2,3,P……対象物 6……カメラ 20……カメラの視野 A……特徴部検出エリア a……重畳部 b……非重畳部
1 shows an embodiment of the present invention. FIG. 1 is a perspective view of an appearance inspection apparatus, FIGS. 2 and 3 are plan views during inspection, FIG. 4 is a characteristic view, and FIG. FIG. 6 is a plan view of another embodiment, FIG. 6 is a characteristic view, FIG. 7 is a partial side view of a rotary head type electronic component mounting apparatus, and FIGS. 8 and 9 are plan views of conventional means. 2,3, P… Object 6… Camera 20… Camera view A… Characteristic part detection area a… Superimposed part b …… Non-superimposed part

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】カメラにより対象物の外周を観察して、こ
の対象物の輪郭を検出した後、特徴部検出用エリアを上
記輪郭に沿って移動させて、この特徴部検出用エリアと
対象物の周縁部が重なり合う重畳部の面積又は重なり合
わない非重畳部の面積を算出し、この重畳部又は非重畳
部の面積の変化の極値があらわれる点の位置を検出する
ことにより、対象物の特徴部の位置を検出することを特
徴とする対象物の特徴部の位置の検出方法。
An outer periphery of an object is observed by a camera, and a contour of the object is detected. Then, an area for detecting a characteristic portion is moved along the outline, and the area for detecting the characteristic portion and the object are detected. By calculating the area of the overlapping portion where the peripheral portion overlaps or the area of the non-overlapping portion that does not overlap, and detecting the position of the point where the extreme value of the change in the area of the overlapping portion or the non-overlapping portion appears, A method for detecting the position of a feature of an object, comprising detecting the position of the feature.
JP1055463A 1989-03-08 1989-03-08 Method for detecting the position of a feature of an object Expired - Fee Related JP2624322B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1055463A JP2624322B2 (en) 1989-03-08 1989-03-08 Method for detecting the position of a feature of an object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1055463A JP2624322B2 (en) 1989-03-08 1989-03-08 Method for detecting the position of a feature of an object

Publications (2)

Publication Number Publication Date
JPH02234005A JPH02234005A (en) 1990-09-17
JP2624322B2 true JP2624322B2 (en) 1997-06-25

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Country Link
JP (1) JP2624322B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07113531B2 (en) * 1990-11-06 1995-12-06 株式会社ミツトヨ Coordinate conversion method of measuring device
CN102351309B (en) * 2011-06-17 2012-11-07 河南农业大学 Azotification method by use of organic wastewater

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61128107A (en) * 1984-11-28 1986-06-16 Nachi Fujikoshi Corp Detection of welded wire, etc.
JPS61239105A (en) * 1985-04-17 1986-10-24 Fuji Electric Co Ltd Inspecting method of printing pattern

Also Published As

Publication number Publication date
JPH02234005A (en) 1990-09-17

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