JP2906450B2 - Method of detecting feature of object - Google Patents

Method of detecting feature of object

Info

Publication number
JP2906450B2
JP2906450B2 JP1155288A JP15528889A JP2906450B2 JP 2906450 B2 JP2906450 B2 JP 2906450B2 JP 1155288 A JP1155288 A JP 1155288A JP 15528889 A JP15528889 A JP 15528889A JP 2906450 B2 JP2906450 B2 JP 2906450B2
Authority
JP
Japan
Prior art keywords
curvature
electronic component
area
camera
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1155288A
Other languages
Japanese (ja)
Other versions
JPH0320879A (en
Inventor
俊明 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1155288A priority Critical patent/JP2906450B2/en
Publication of JPH0320879A publication Critical patent/JPH0320879A/en
Application granted granted Critical
Publication of JP2906450B2 publication Critical patent/JP2906450B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は対象物の特徴部の検出方法に関し、カメラの
視野内に、対象物の特徴部の検出用エリアを設定し、こ
のエリアと対象物の重畳部又は非重畳の面積の変化の曲
率と、マスターの特徴部の曲率を照合することにより、
対象物の特徴部の位置を検出するようにしたものであ
る。
Description: TECHNICAL FIELD The present invention relates to a method for detecting a characteristic portion of an object, and sets an area for detecting the characteristic portion of the object in a field of view of a camera, and sets the area and the object to be detected. By comparing the curvature of the change of the superimposed part or non-superimposed area of the object with the curvature of the characteristic part of the master,
The position of the characteristic portion of the object is detected.

(従来の技術) 例えばICチップ,LSIチップ,抵抗チップ,コンデンサ
チップなどの電子部品が、基板上の正しい位置に搭載さ
れたかどうかを検査する方法として、パターンマッチン
グ法が知られている。
(Prior Art) For example, a pattern matching method is known as a method for inspecting whether electronic components such as an IC chip, an LSI chip, a resistor chip, and a capacitor chip are mounted at correct positions on a substrate.

第9図及び第10図は、従来のパターンマッチング法を
示すものであって、まず第9図に示すように、検査基準
となる基準画像100の特徴部である角部をカメラの視野
内に設定されたチェックエリアA1〜A4内に入れてこれを
観察し、基準画像100の角部と各エリアA1〜A4が重なり
合った重畳部a〜dの角ka〜kdの座標を検出し、記憶し
ておく。
9 and 10 show a conventional pattern matching method. First, as shown in FIG. 9, a corner which is a characteristic part of a reference image 100 serving as an inspection reference is placed in a field of view of a camera. It is placed in the set check areas A1 to A4 and observed, and the coordinates of the corners ka to kd of the superimposed portions a to d where the corners of the reference image 100 and the areas A1 to A4 overlap each other are detected and stored. Keep it.

次に第10図に示すように、検査対象となる電子部品の
画像101に対して、各エリアA1〜A4を相対的にXY方向に
移動させて、各重畳部a〜dが画像101の角部と最も重
なり合うマッチング位置を求め、その位置での上記角Ka
〜Kdの座標を、画像101の角Ka′〜Kd′の座標と見な
し、各角Ka〜KdのXY座標値から、電子部品のXY方向及び
回転方向の位置ずれ△x,△y,△θを算出していた。
Next, as shown in FIG. 10, the areas A1 to A4 are relatively moved in the X and Y directions with respect to the image 101 of the electronic component to be inspected, and the superimposed portions ad are corners of the image 101. Find the matching position that most overlaps the part, and calculate the angle Ka at that position.
KKd are regarded as the coordinates of the corners Ka′〜Kd ′ of the image 101, and from the XY coordinate values of each of the corners Ka〜Kd, the positional deviation △ x, △ y, △ θ Was calculated.

(発明が解決しようとする課題) しかしながら上記従来方法にあっては、基準画像100
の角部と検査対象の画像101の角部は完全に重なり合い
にくく、それだけ検査精度があがらない問題があった。
(Problems to be Solved by the Invention) However, in the above conventional method, the reference image 100
And the corner of the image 101 to be inspected are difficult to completely overlap with each other, and there is a problem that the inspection accuracy is not improved accordingly.

したがって本発明は、角部のような対象物の特徴部の
位置を的確に検出できる手段を提供することを目的とす
る。
Therefore, an object of the present invention is to provide a means capable of accurately detecting the position of a characteristic portion of an object such as a corner.

(課題を解決するための手段) このために本発明は、カメラにより対象物の外周を観
察して、この対象物の輪郭を検出した後、カメラの視野
内に設定された特徴部検出用エリアを上記輪郭に沿って
移動させて、この特徴部検出用エリアと対象物の周縁部
が重なり合う重畳部又は重なり合わない非重畳部の面積
の変化の曲率を求め、次にこの曲率とマスターの特徴部
の曲率とを照合して、極限値があらわれる点の位置を求
めることにより、対象物の特徴部の位置を検出するよう
にしたものである。
(Means for Solving the Problems) For this purpose, according to the present invention, a camera is used to observe the outer periphery of an object, detect an outline of the object, and then set a feature detection area set in the field of view of the camera. Is moved along the contour, and the curvature of the change in the area of the overlapping portion where the feature detecting area and the peripheral portion of the object overlap or the non-overlapping portion where the overlapping portion does not overlap is determined. The position of the characteristic portion of the target object is detected by comparing the curvature of the part with the position of the point where the limit value appears.

(作用) 上記構成によれば、重畳部又は非重畳部の面積の変化
の曲率と、マスターの特徴部の曲率を照合して、極限値
があらわれる点の位置を求めることにより、角部のよう
な対象物の特徴部の位置を検出する。
(Operation) According to the above configuration, the curvature of the change in the area of the superimposed portion or the non-superimposed portion is collated with the curvature of the characteristic portion of the master, and the position of the point where the limit value appears is obtained. The position of the characteristic portion of the target object is detected.

(実施例1) 次に、基板に搭載された電子部品の位置ずれを検出す
る外観検査手段を例にとり、本発明の実施例を説明す
る。
Embodiment 1 Next, an embodiment of the present invention will be described with reference to an example of an appearance inspection unit that detects a displacement of an electronic component mounted on a substrate.

第1図は外観検査装置の斜視図であって、1は基板、
2は基板1上に搭載された電子部品である。基板1はXY
テーブル3,4から成るXY方向移動装置5上に配設されて
おり、この装置5の駆動により、基板1はXY方向に移動
する。基板1の上方には、CCDエリアカメラやリニアイ
メージカメラのような外観検査用カメラ6が設けられて
おり、また基板1の斜上方には、光源7や集光素子8が
設けられいる。10はカメラ6に接続された制御部であっ
て、D/Aコンバータ11,フレームメモリ12,2値化処理部1
3,重畳面積計算部14及びCPU15等から成っている。
FIG. 1 is a perspective view of a visual inspection device, where 1 is a substrate,
Reference numeral 2 denotes an electronic component mounted on the substrate 1. Substrate 1 is XY
The substrate 1 is arranged on an XY direction moving device 5 composed of tables 3 and 4, and the substrate 1 is moved in the XY direction by driving the device 5. A visual inspection camera 6 such as a CCD area camera or a linear image camera is provided above the substrate 1, and a light source 7 and a light collecting element 8 are provided obliquely above the substrate 1. Reference numeral 10 denotes a control unit connected to the camera 6, which includes a D / A converter 11, a frame memory 12, and a binarization processing unit 1.
3. It is composed of a superimposed area calculator 14, a CPU 15, and the like.

第2図は、上記装置により走査を行って、電子部品2
の輪郭追跡を行っている様子を示すものである。図中、
20はカメラ6の視野、2は上記電子部品である。破線矢
印に示すように、XY座標の原点Oを出発点として電子部
品2の外周を観察し、その輪郭のXY座標を検出する。輪
郭は、基板(白)1と電子部品(黒)2の輝度が異るこ
とから、2値化処理手段により簡単に検出することがで
きる。なおこのような輪郭追跡手段は周知手段である。
FIG. 2 shows that the electronic component 2 is scanned by the above-described device.
3 shows a state in which the contour tracking is performed. In the figure,
Reference numeral 20 denotes the field of view of the camera 6, and reference numeral 2 denotes the electronic component. As shown by the broken line arrow, the outer periphery of the electronic component 2 is observed starting from the origin O of the XY coordinates, and the XY coordinates of the outline are detected. Since the brightness of the substrate (white) 1 and the brightness of the electronic component (black) 2 are different, the outline can be easily detected by the binarization processing means. Such a contour tracking means is a well-known means.

上記のようにして輪郭追跡を終えたならば、次に任意
の点(例えば電子部品2とY軸のプラス側との交点)
を出発点とし、第3図に示す走査を行う。図中、Aは視
野20内に設定された電子部品2の特徴部検出用サークル
エリアであって、このエリアAを上記輪郭追跡手段によ
り検出された輪郭を沿わせて移動させ、エリアAと電子
部品2の周縁部が重なり合う重畳部(影線部)aの面積
の変化の曲率fiを算出する。その計算処理は、上記制御
部10により行われる。
After the contour tracing is completed as described above, an arbitrary point (for example, an intersection between the electronic component 2 and the plus side of the Y axis)
The scanning shown in FIG. In the drawing, A is a circle area for detecting a characteristic portion of the electronic component 2 set in the field of view 20. The area A is moved along the contour detected by the contour tracking means, and the area A and the electronic The curvature fi of the change in the area of the overlapping portion (shaded portion) a where the peripheral portion of the component 2 overlaps is calculated. The calculation process is performed by the control unit 10.

第4図(a),(b),(c)は、輪郭の座標とその
算出結果を示すものであって、同図(a)中、〜は
第3図における各点の位置である。エリアAを輪郭によ
り2等分される線に沿って移動させると、重畳部aの面
積は、電子部品2のまっすぐな直線部に沿う部分ではエ
リアAの面積の1/2であって曲率fiは変化しないが、そ
の角部すなわち特徴部,,,において変化する
(同図(b)参照)。第5図は、マスターの特徴部の曲
率giの波形を示すものである。この曲率giは、理想形状
の電子部品について、上記走査を行った場合に得られる
曲率であり、理論的にも実験的にも求められるものであ
る。
4 (a), (b) and (c) show the coordinates of the contour and the calculation results thereof. In FIG. 4 (a), symbols "-" indicate the positions of the respective points in FIG. When the area A is moved along a line bisected by the contour, the area of the superimposed portion a is A of the area of the area A at a portion along the straight linear portion of the electronic component 2 and the curvature fi Does not change, but changes at the corners, that is, at the characteristic portions,... (See FIG. 3B). FIG. 5 shows a waveform of the curvature gi of the characteristic portion of the master. The curvature gi is a curvature obtained when the above-described scanning is performed on an electronic component having an ideal shape, and is obtained theoretically and experimentally.

第4図(b)に示すように、このマスターの曲率giの
波形を、矢印N方向にスキャニングさせて、上記曲率fi
との差異の自剰Σ(fi−gi)を求める。同図(c)は
その結果を示すものであって、(イ),(ロ),
(ハ),(ニ)の4点において、極限値(最小値)があ
らわれている。したがってこの極限値があらわれる点
(イ)〜(ニ)が、電子部品2の特徴部,,,
の位置となる。
As shown in FIG. 4 (b), the waveform of the curvature gi of the master is scanned in the direction of arrow N to obtain the curvature fi.
自 (fi-gi) 2 of the difference from FIG. 3C shows the result, in which (a), (b),
At four points (c) and (d), an extreme value (minimum value) appears. Therefore, the points (a) to (d) where this limit value appears are the characteristic parts of the electronic component 2,.
Position.

なお曲率fiと曲率giの照合手段は任意であって、例え
ば単純に両者の差Σ(fi−gi)を求めてもよいものであ
り、要は両者を照合して的確に極限値が求められるもの
であればよい。
The means for checking the curvature fi and the curvature gi is arbitrary. For example, the difference Σ (fi-gi) between the two may be simply obtained. In short, the limit value is accurately obtained by comparing the two. Anything should do.

このようにして特徴部,,,の座標を求めた
ならば、これから電子部品2の中心O′の座標を算出し
て、電子部品2のXY方向の位置ずれ△x,△y(第3図参
照)を簡単に知ることができる。また回転方向の誤差△
θも簡単に算出できる。なお上記方法は、重畳部aの面
積の変化の曲率を求めることにより、特徴部〜の座
標を求めたが、エリアA内の非重畳部bの面積の変化の
曲率を求めても同じことである。
Once the coordinates of the characteristic parts are obtained in this manner, the coordinates of the center O 'of the electronic component 2 are calculated from this, and the displacements △ x, △ y of the electronic component 2 in the XY direction (FIG. 3) See). Also, the error in the rotation direction △
θ can be easily calculated. Note that, in the above method, the coordinates of the characteristic portions to are obtained by calculating the curvature of the change in the area of the superimposed portion a. is there.

(実施例2) 第6図において、3は3個の端子部3a,3b,3cを有する
ミニトランジスタである。このものも、上記第1実施例
の場合と同様に、その外周に沿って輪郭追跡を行ってそ
の輪郭の座標を求めた後、特徴部検出エリアAをこの輪
郭に沿って移動させて、重畳部aの面積の変化の曲率fi
を求める。第7図(a),(b)はその結果を示すもの
であって、図中、〜は、第6図における各点の位置
である。このものも、上記第1実施例の場合と同様に、
マスターの曲率giの波形を矢印N方向にスキャニングさ
せて、曲率fiと曲率giの差異の自剰Σ(fi−gi)を求
め(同図(b)参照)、これから極限値があらわれる点
(イ),(ロ),(ハ)を求めることにより、電子部品
3の特徴部であるリード3a〜3cの位置を求める。
Embodiment 2 In FIG. 6, reference numeral 3 denotes a minitransistor having three terminal portions 3a, 3b, 3c. In this case, similarly to the case of the first embodiment, after the contour is traced along the outer periphery to obtain the coordinates of the contour, the characteristic portion detection area A is moved along the contour to be superimposed. Curvature fi of the change in area of part a
Ask for. FIGS. 7 (a) and 7 (b) show the results. In FIG. 7, 〜 indicates the position of each point in FIG. This is also similar to the case of the first embodiment.
The waveform of the curvature gi of the master is scanned in the direction of the arrow N, and the self-retention Σ (fi-gi) 2 of the difference between the curvature fi and the curvature gi is obtained (see FIG. 13B). By determining (a), (b), and (c), the positions of the leads 3a to 3c, which are characteristic parts of the electronic component 3, are determined.

(実施例3) 第8図は、本発明をロータリーヘッド式電子部品実装
装置に適用した場合を示すものである。31はロータリー
ヘッド、32はヘッド31の外周に沿って多数垂設された移
送ヘッド、33はそのノズル、34はxy方向移動装置35に位
置決めされた基板、36は支持台、6はこの支持台36に設
けられた上記カメラ、Pは電子部品である。
Embodiment 3 FIG. 8 shows a case where the present invention is applied to a rotary head type electronic component mounting apparatus. 31 is a rotary head, 32 is a number of transfer heads vertically suspended along the outer periphery of the head 31, 33 is its nozzle, 34 is a substrate positioned on the xy-direction moving device 35, 36 is a support, and 6 is this support. The camera P provided in 36 is an electronic component.

このものは、ロータリーヘッド31をその軸心を中心に
ピッチ回転させながら、チップ供給部(図示せず)にお
いてノズル33の下端部に電子部品Pを吸着してテイクア
ップし、ロータリーヘッド31の回転にともなって、この
電子部品Pを基板34上に搭載するものである。
In this apparatus, while rotating the rotary head 31 at a pitch around its axis, a chip supply unit (not shown) sucks up the electronic component P at the lower end of the nozzle 33 and takes up the same. At the same time, the electronic component P is mounted on the substrate 34.

カメラ6をチップ供給部と基板34の間に設け、ノズル
33に吸着された電子部品Pを下方から観察することによ
り、上記第1実施例で述べたように電子部品Pの位置ず
れ△x,△y,△θを検出する。そしてxy方向移動装置35を
駆動して基板34をXY方向に同量移動させることにより、
XY方向の位置ずれ△x,△yを補正するとともに、ノズル
33をモータ(図外)によりその軸心を中心にθ方向に回
転させることにより、回転方向の誤差△θを補正し、そ
のうえで電子部品Pを基板34に搭載すれば、上記誤差△
x,△y,△θを補正して基板34上に搭載することができ
る。
The camera 6 is provided between the chip supply unit and the substrate 34, and the nozzle
By observing the electronic component P attracted to the device 33 from below, the positional deviations Δx, Δy, Δθ of the electronic component P are detected as described in the first embodiment. Then, by driving the xy direction moving device 35 to move the substrate 34 by the same amount in the XY direction,
In addition to correcting the 位置 x and △ y displacements in the XY direction,
By rotating the motor 33 (not shown) in the θ direction about its axis, the error Δθ in the rotation direction is corrected, and then the electronic component P is mounted on the board 34.
x, △ y, △ θ can be corrected and mounted on the substrate 34.

本方法は更に種々の分野に利用できるものであって、
例えば基板に印刷された回路パターンの特徴部の検出等
も行うことができるものであり、対象物は電子部品以外
のものでもよいものである。
The method can be further used in various fields,
For example, detection of a characteristic portion of a circuit pattern printed on a substrate can be performed, and the object may be other than electronic components.

(発明の効果) 以上説明したように本発明は、カメラにより対象物の
外周を観察して、この対象物の輪郭を検出した後、カメ
ラの視野内に設定された特徴部検出用エリアを上記輪郭
に沿って移動させて、この特徴部検出用エリアと対象物
の周縁部が重なり合う重畳部又は重なり合わない非重畳
部の面積の変化を曲率を求め、次にこの曲率とマスター
の特徴部の曲率とを照合して、極限値があらわれる点の
位置を求めることにより、対象物の特徴部の位置を検出
するようしているので、電子部品の角部やリードのよう
な対象物の特徴部の位置を的確に検出することができ、
殊にノイズの悪影響を排して、正確に特徴部の位置を検
出できる利点を有する。
(Effects of the Invention) As described above, according to the present invention, after observing the outer periphery of an object using a camera and detecting the contour of the object, the feature detection area set in the field of view of the camera is set as described above. By moving along the contour, the change in the area of the overlapping portion where the feature detection area and the peripheral portion of the object overlap or the non-overlapping portion that does not overlap is determined as the curvature, and then this curvature and the master feature The position of the characteristic part of the object is detected by comparing the curvature with the position of the point where the extreme value appears, so the characteristic part of the object such as a corner or a lead of an electronic component is detected. Position can be accurately detected,
In particular, there is an advantage that the position of the characteristic portion can be accurately detected while eliminating the adverse effect of noise.

【図面の簡単な説明】[Brief description of the drawings]

図は本発明の実施例を示すものであって、第1図は外観
検査装置の斜視図、第2図及び第3図は検査中の平面
図、第4図(a),(b),(c)はグラフ図、第5図
はマスターの特徴部の曲率波形図、第6図は他の実施例
の平面図、第7図(a),(b)はグラフ図、第8図は
ロータリーヘッド式電子部品実装装置の部分側面図、第
9図,第10図は従来手段の平面図である。 2,3,P……対象物 6……カメラ 20……カメラの視野 A……特徴部検出エリア a……重畳部 b……非重畳部
1 shows an embodiment of the present invention. FIG. 1 is a perspective view of an appearance inspection apparatus, FIGS. 2 and 3 are plan views during inspection, and FIGS. 4 (a), (b), and FIG. (C) is a graph, FIG. 5 is a curvature waveform diagram of a characteristic portion of the master, FIG. 6 is a plan view of another embodiment, FIGS. 7 (a) and (b) are graph diagrams, and FIG. FIGS. 9 and 10 are plan views of a conventional means of the rotary head type electronic component mounting apparatus. 2,3, P… Object 6… Camera 20… Camera view A… Characteristic part detection area a… Superimposed part b …… Non-superimposed part

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】カメラにより対象物の外周を観察して、こ
の対象物の輪郭を検出した後、カメラの視野内に設定さ
れた特徴部検出用エリアを上記輪郭に沿って移動させ
て、この特徴部検出用エリアと対象物の周縁部が重なり
合う重畳部又は重なり合わない非重畳部の面積の変化の
曲率を求め、次にこの曲率とマスターの特徴部の曲率と
を照合して、極限値があらわれる点の位置を求めること
により、対象物の特徴部の位置を検出することを特徴と
する対象物の特徴部の検出方法。
1. An outer periphery of an object is observed by a camera, an outline of the object is detected, and then a feature detection area set in the field of view of the camera is moved along the outline. Find the curvature of the change in the area of the overlapping portion where the feature detection area and the peripheral portion of the object overlap or the non-overlapping portion where it does not overlap, and then compare this curvature with the curvature of the master feature portion, A method for detecting a characteristic part of an object, wherein a position of a characteristic part of the object is detected by obtaining a position of a point where a symbol appears.
JP1155288A 1989-06-16 1989-06-16 Method of detecting feature of object Expired - Fee Related JP2906450B2 (en)

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