JP2603643Y2 - Solid-state imaging device - Google Patents

Description

[Detailed description of the invention]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device for picking up an image formed by an imaging lens with a solid-state imaging device.

2. Description of the Related Art Heretofore, a solid-state imaging device that converts a captured image formed by an imaging lens into an electric signal by a solid-state imaging device and captures an image is used. The imaging lens constituting this solid-state imaging device includes a lens barrel, a plurality of lenses supported in the lens barrel, an aperture mechanism, and the like. The shooting lens is
The solid-state imaging device is disposed on the front side of a front panel constituting a housing of a solid-state imaging device integrally formed of metal or the like, and the solid-state imaging device is mounted on the front panel such that a light receiving surface is located on a focal plane of an imaging lens. Supported. A side plate constituting a housing of the solid-state imaging device is attached to the front panel. An electronic circuit for driving a solid-state imaging device and performing predetermined signal processing on a video signal imaged and output by the solid-state imaging device and outputting the same in a housing constituted by a front panel and a side plate. Part is provided.

By the way, electronic parts such as power transistors that generate heat are provided in an electronic circuit portion provided in the housing. When heat is generated from such a heat-generating component, the temperature inside the housing rises, and the stable operation of the solid-state imaging device and the electronic circuit unit is hindered, so that a good video signal cannot be obtained. In order to dissipate the heat generated in the housing, it has been proposed to provide a fan device for heat dissipation. The provision of the fan device increases the size of the device and further complicates the configuration. In order to dissipate the heat in the housing, it is conceivable that an electronic component such as a power transistor having a large amount of heat is brought into contact with the housing and the heat is radiated through the housing. In such a case, an excessive force may be applied to the soldering portion connecting the printed circuit board and the electronic component constituting the electronic circuit unit, and the electronic circuit unit may be damaged. Therefore, the present invention is proposed in view of the above-described situation, and provides a solid-state imaging device capable of efficiently dissipating heat inside a housing without increasing the size of the device itself and complicating the configuration. The purpose is to provide.

SUMMARY OF THE INVENTION In order to solve the above problems and achieve the above object, the present invention provides a front panel on which a photographic lens and a solid-state imaging device are supported, and a front panel provided at a position facing the front panel. In a solid-state imaging device including a rear panel, and a side plate connecting the front panel and the rear panel, a power transistor fixed in contact with an inner surface of the rear panel facing the front panel, and a power transistor fixed to an inner surface of the rear panel. A positioning pin provided protruding, and a printed circuit board attached to the rear panel in a state substantially parallel to the rear panel at a fixed distance between the positioning pin and an inner surface of the rear panel, The connection terminal of the power transistor is connected to the printed circuit board.

In the solid-state imaging device according to the present invention, heat generated by driving the power transistor is radiated through the rear panel to which the power transistor is fixed.
At this time, since the printed circuit board to which the power transistor is connected via the connection terminal is in contact with the positioning pins at a constant distance from the rear panel, the amount of heat transmitted to the printed circuit board is suppressed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A specific embodiment of the present invention will be described below with reference to the drawings. The solid-state imaging device according to the present invention is shown in FIG.
As shown in FIG. 1, an imaging lens 2 and a solid-state imaging device (CCD) that converts an image formed by the imaging lens 2 into an electric signal are provided. The imaging lens 2 constituting the solid-state imaging device includes a lens barrel, a plurality of lenses supported in the lens barrel, an aperture mechanism, and the like. The taking lens is disposed on the front side of a front panel 1 that forms a casing of a solid-state imaging device integrally formed of metal or the like into a rectangular shape, and the solid-state imaging device has a light-receiving surface on a focal plane of the imaging lens. It is supported by the front panel 1 so as to be positioned. On the front panel 1, upper and lower side plates 3 and 4 constituting a housing of the solid-state imaging device are attached. These side plates 3 and 4 are formed so as to have a U-shaped cross section, and are butt-joined to each other to form a cylindrical housing having a front side and a back side open. The front panel 1 is mounted on the front side of the upper side plate 3 via a set screw 6. That is, the front panel 1 closes the front side of the housing composed of the side plates 3 and 4,
It is attached to the front side of each side plate 3,4. On the back side of each side plate 3, 4, a rear panel 5 formed in the shape of a rectangular plate having substantially the same shape as the front panel 1 closes the rear side of the housing formed of each side plate 3, 4. Thus, it is attached so as to face the front panel 1. The rear panel 5 is fixed to the rear side of the upper side plate 3 via a set screw 7. That is, the side plates 3 and 4, the front panel 1 and the rear panel 5 are integrated to form a housing. An electronic circuit constituting the solid-state imaging device is housed in a housing constituted by the side plates 3 and 4, the front panel 1 and the rear panel 5. The electronic circuit unit is a circuit for driving the solid-state imaging device, performing predetermined signal processing on the video signal converted by the solid-state imaging device into an electric signal, and outputting the processed signal to the outside. In the solid-state imaging device, an image captured by an imaging lens is converted into an electric signal by a solid-state imaging device, and a video signal converted into the electric signal is subjected to predetermined signal processing such as amplification and output to the outside. As shown in FIG. 2, on the rear side facing the outside of the rear panel 5 constituting the housing,
A plurality of connectors 8, 9 for connecting the solid-state imaging device to external devices are provided. These connectors 8, 9
Are used for outputting a video signal, supplying power to the solid-state imaging device, and the like, and each has a plurality of connection pins. As shown in FIG. 3, these connectors 8 and 9 are soldered at their base ends 19 and 20 to the printed circuit board 13 disposed in the housing through openings provided in the rear panel 5 respectively. You are connected by: The printed board 13 has a copper foil pattern forming a predetermined circuit pattern formed on a base material made of an insulating material, and an electronic component forming an electronic circuit portion mounted thereon. The printed circuit board 13 is fixedly attached to the inner surface of the rear panel 5 facing the inside of the housing by a set screw 18. The set screw 18 is inserted into a through hole provided in the printed circuit board 13 and screwed into a screw hole formed in the rear panel 5. The screw hole into which the set screw 18 is screwed is formed in the bulging portion 10 bulging to the rear side of the rear panel 5. On the inner surface of the rear panel 5, first and second positioning pins 21 and 22 that come into contact with the printed circuit board 13 are integrally provided to protrude. The printed circuit board 13 includes first and second positioning pins 21 and 22.
Are supported by the rear panel 5 at a predetermined interval from the rear panel 5. A power transistor 14 constituting an electronic circuit unit is connected to the printed circuit board 13. Power transistor 14
As shown in FIG. 3 and FIG. 4, a part of an electronic circuit portion is configured by connecting a connection terminal 15 protruding from a transistor body to a copper foil pattern on a printed circuit board 13 by soldering. I have. By the way, the power transistor 14 is attached to the inner surface of the rear panel 5 by fixing the transistor body to a transistor mounting portion 23 provided on the inner surface of the rear panel 5 and fixing the power transistor 14 by a fixing screw 16. The stop screw 16 is a power transistor 14
The power transistor 14 is brought into close contact with a transistor mounting portion 23 provided on the inner surface of the rear panel 5 by being inserted into a screw insertion hole 14a provided in the transistor main body and screwed into a screw hole 17 provided in the rear panel 5. So that it is fixed. Note that the transistor mounting portion 23 is
In order to easily and accurately determine the position at which the power transistor 14 is mounted on the rear panel 5, the power transistor 14 is formed as a concave portion large enough to fit the transistor body. In the solid-state imaging device according to the present invention, when imaging is performed by the solid-state imaging device and signal processing is performed by the electronic circuit unit, a large amount of heat is generated from the power transistor 14 included in the electronic circuit unit. This heat is generated by the rear panel 5 with which the power transistor 14 is in contact.
And is radiated to the outside through the rear panel 5. In order to further improve the thermal conductivity between the power transistor 14 and the rear panel 5, a material such as a so-called thermal compound that improves the thermal conductivity may be applied to the transistor mounting portion 23. Also,
In the solid-state imaging device according to the present invention, the printed circuit board 13 is supported by the positioning pins 21 and 22 so as to be spaced apart from the rear panel 5 by a predetermined distance. No large force is applied between the copper foil pattern of the substrate 13 and the connection terminal 15 of the power transistor 14 that is fixed in contact with the rear panel 5, and the heat generated by the power transistor 14 is directly applied to the printed circuit board 13. Transmission can also be prevented. In the solid-state imaging device according to the present invention, the connection between the power transistor 14 and the printed board 13
The power transistor 14 is preferably mounted on the rear panel 5 and the printed circuit board 13 is mounted on the rear panel 5.

As described above, in the solid-state imaging device according to the present invention, the power transistor that generates heat is mounted in contact with the rear panel located on the outermost side of the device, and the printed circuit board to which the power transistor is connected is mounted on the rear panel. On the other hand, because it is supported at a certain interval,
The heat generated by the driving of the power transistor can be efficiently radiated to the outside via the rear panel, and the amount of heat transmitted to the printed circuit board can be suppressed. And the connection between the power transistor and the printed circuit board can be protected.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a solid-state imaging device according to the present invention.

FIG. 2 is an enlarged perspective view of a main part showing the vicinity of a rear panel of the solid-state imaging device.

FIG. 3 is an enlarged longitudinal sectional view of a main part showing the vicinity of a rear panel of the solid-state imaging device.

FIG. 4 is an enlarged exploded perspective view of a main part showing a power transistor mounting portion provided on the rear panel.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Front panel 2 ... Imaging lens 3 ... Upper side plate 4 ... Lower side plate 5 ... Rear panel 13 ... Printed circuit board 14 ... Power transistor 15 ... Connection terminal 16 Stop screw 21 First positioning pin 22 Second positioning pin

Claims (1)

(57) [Scope of request for utility model registration] An imaging lens and a solid-state imaging device are supported.
Front panel and a position facing the front panel
Rear panel, and the front panel
Solid-state imaging device having a side plate connecting to the rear panel
In location, the inner surface facing the front panel of the rear panel
A power transistor that is fixed by contact, a positioning pin projecting from an inner surface of the rear panel, and an inner surface of the rear panel that abuts on the positioning pin.
Is approximately parallel to the rear panel with a certain distance between
With the printed circuit board attached to the rear panel
A connection terminal of the power transistor the printed circuit board
A solid-state imaging device, which is connected to a device.