JP2583991B2 - Flexible printed wiring board - Google Patents
Flexible printed wiring boardInfo
- Publication number
- JP2583991B2 JP2583991B2 JP63187221A JP18722188A JP2583991B2 JP 2583991 B2 JP2583991 B2 JP 2583991B2 JP 63187221 A JP63187221 A JP 63187221A JP 18722188 A JP18722188 A JP 18722188A JP 2583991 B2 JP2583991 B2 JP 2583991B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- temporary fixing
- fixing portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は各種電子機器等に使われるフレキシブルプリ
ント配線板に関するものである。Description: TECHNICAL FIELD The present invention relates to a flexible printed wiring board used for various electronic devices and the like.
従来の技術 従来、この種のフレキシブルプリント配線板は、第３
図に示すような構成であった。すなわち、第３図におい
て、絶縁基板１と、両面フレキシブルプリント配線板２
が、部分的に熱硬化性接着剤３を介して熱圧着されてい
た。４および４′は導電パターン５の必要な部分に貼り
付けたオーバレイ、６は絶縁基板１と両面フレキシブル
プリント配線板２を、熱硬化性接着剤３を介して接着さ
せるための位置合わせ用仮留め部を示している。この位
置合わせ用仮留め部６は、両面フレキシブルプリント配
線板２のベースフィルム７を露出させた構成としてい
る。これは、第４図に示すようにオーバレイ4,4′を除
去した状態にしておき、仮留め時に例えば、はんだゴテ
８等で、位置合わせ用仮留め部６の下に対応する熱硬化
性接着剤３の局部的な熱硬化を容易に促進する意図で構
成されたものである。2. Description of the Related Art Conventionally, this type of flexible printed wiring board has
The configuration was as shown in the figure. That is, in FIG. 3, the insulating substrate 1 and the double-sided flexible printed wiring board 2
However, thermocompression bonding was partially performed via the thermosetting adhesive 3. Reference numerals 4 and 4 'denote overlays attached to necessary portions of the conductive pattern 5, and 6 denotes a temporary fixing for positioning the insulating substrate 1 and the double-sided flexible printed wiring board 2 through a thermosetting adhesive 3. Part is shown. The positioning temporary fixing portion 6 has a configuration in which the base film 7 of the double-sided flexible printed wiring board 2 is exposed. This is done by removing the overlays 4 and 4 'as shown in FIG. 4 and, at the time of temporary fixing, for example, using a soldering iron 8 or the like, the corresponding thermosetting adhesive under the temporary fixing portion 6 for alignment. The purpose is to facilitate local thermal curing of the agent 3.
その後、上記仮留め状態で、例えば熱成型プレス等を
用いて、完全硬化状態になるまで加熱プレスしていた。Thereafter, in the temporary fixing state, for example, a hot press was used to heat press until a completely cured state was reached.
発明が解決しようとする課題 しかし、このような構成のものでは部品実装後の急激
なはんだ付け条件、例えばリフローはんだ付工程等で、
第５図に示す９の個所のように、オーバレイ４′とベー
スフィルム７や、導電パターン５間での剥離、また、極
端な場合には10の個所のように、ベースフィルム７と、
導電パターン５間での破壊が起こってしまうという問題
があった。Problems to be solved by the invention However, in the case of such a configuration, rapid soldering conditions after component mounting, such as a reflow soldering process,
As shown at 9 in FIG. 5, the overlay 4 'is peeled off from the base film 7 or between the conductive patterns 5, and in an extreme case, at 10 as shown in FIG.
There is a problem that destruction occurs between the conductive patterns 5.
これは下記の理由による。 This is for the following reason.
つまり、第４図において、位置合わせ用仮留め部６
は、オーバレイ4,4′が除去しているため、オーバレイ
４′の厚み分だけ誤差が生じ、ベースフィルム７にたわ
みが生じることになる。この時に、ベースフィルム７と
熱硬化性接着剤層３との間にすきま11,11′が生じる。
その後、熱成型プレス等で、熱硬化性接着剤層３とベー
スフィルム７間を完全に接着硬化させるのであるが、一
般的な接着剤３層の厚みが25μ〜40μｍ、オーバレイ4,
4′の厚みが12.5〜50μｍ等の場合ではすきま11,11′に
熱硬化性接着剤層３を完全には充填させられないことに
なる。つまり、空気等を部分的にまきこんだ状態での接
着になっていると、はんだ付け工程での熱で、ストレス
がすきま部11,11′部に集中したり空気等が熱により膨
張し、一番弱い接着界面での剥離現象を発生させたりし
た。また、例えば絶縁基板１がフェノール基板等のよう
に、ガスを発生させやすい、材料の場合には、この絶縁
基板１から発生するガスにより、すきま部11,11′周辺
が押し上げられることもある。そして、さらに、仮留め
方法として、前述のようにはんだゴテ８のような局部的
な高熱を熱硬化性接着剤３に加えると、構成体の部分的
な劣化もしくは破壊が起こり最終の熱成型プレスでの完
全硬化のための処理を施しても、他の正常な接着剤層に
比べて弱い構成となり、信頼性の面からも非常に不安定
な状態となっていた。In other words, in FIG.
Since the overlays 4 and 4 'are removed, an error occurs by the thickness of the overlay 4', and the base film 7 is bent. At this time, gaps 11, 11 'are generated between the base film 7 and the thermosetting adhesive layer 3.
Thereafter, the thermosetting adhesive layer 3 and the base film 7 are completely adhered and cured by a thermoforming press or the like. The thickness of the general adhesive 3 layer is 25 μm to 40 μm,
When the thickness of 4 ′ is 12.5 to 50 μm or the like, the gaps 11 and 11 ′ cannot be completely filled with the thermosetting adhesive layer 3. In other words, if the bonding is performed in a state where air or the like is partially introduced, the heat in the soldering process causes stress to concentrate on the gaps 11 and 11 'or the air or the like to expand due to the heat. For example, a peeling phenomenon occurred at the weakest adhesive interface. Further, for example, when the insulating substrate 1 is made of a material that easily generates a gas, such as a phenol substrate, the gas generated from the insulating substrate 1 may push up the vicinity of the clearances 11 and 11 ′. Further, as a temporary fixing method, when local high heat such as the soldering iron 8 is applied to the thermosetting adhesive 3 as described above, the component is partially degraded or broken, and the final thermoforming press is performed. Even when the treatment for complete curing was performed, the structure was weaker than other normal adhesive layers, and the state was very unstable also from the viewpoint of reliability.
そこで、本発明はこのような問題点を解決するため
に、位置合わせ用仮留め部に、熱工程でのストレスが、
かからないようにするものである。Therefore, the present invention, in order to solve such problems, the temporary fixing portion for alignment, the stress in the heat process,
It is to prevent it.
課題を解決するための手段 この課題を解決するために本発明は、周辺のレジスト
を除去した位置合わせ用仮留め部のベースフィルムに切
欠きや透孔を設ける構成にしたものである。Means for Solving the Problems In order to solve the problems, the present invention has a configuration in which notches and through holes are provided in a base film of a temporary fixing portion for positioning where peripheral resist is removed.
作 用 この技術的手段による作用は次のようになる。すなわ
ち、フレキシブルプリント配線板と、他の基板を接着さ
せる部分において、位置合わせ用仮留め部のフレキベー
スフィルムに切欠きや透孔があるために、はんだ付け工
程等での熱履歴において、例えば、他の基板からのガス
の発生や、仮留め部に介在していた水分や気泡等をすみ
やかに全て出してしまう効果をもたらす。そして、これ
らの熱膨張によるストレスもとり除いてしまうことがで
きることになるのである。Operation The effect of this technical means is as follows. That is, in the portion where the flexible printed wiring board and the other substrate are to be bonded, because there is a notch or a hole in the flexible base film of the temporary fixing portion for alignment, in a heat history in a soldering process or the like, for example, This has the effect of generating gas from other substrates and immediately releasing all moisture, air bubbles, and the like interposed in the temporary fixing portion. Then, the stress due to these thermal expansions can be removed.
実施例 以下、本発明の一実施例を添付図面にもとづいて説明
する。第１図，第２図は、ポリイミドフィルム25μｍを
ベースとした両面に導電パターンを形成した両面フレキ
シブルプリント配線板と硬質板12として厚さ1.6mmで導
電パターンのないフェノール基板をエポキシ系の熱硬化
型接着剤13を介して接着された構成になっている。ま
た、両面フレキシブルプリント配線板には、導電パター
ンの必要な部分にそれぞれ両面より絶縁層14としてポリ
イミドフィルム25μｍをベースとしたオーバレイを施し
ているが、フェノール基板との位置合わせ用仮留め部15
は、両面ともオーバレイの絶縁層14を円状に除去して、
ポリイミドフィルムのフレキシブル絶縁フィルムベース
16を露出させている。そして、この位置合わせ用仮留め
部15内に、同心円状に比較的小さな透孔17として丸孔を
フレキシブル絶縁フィルムベース16に設けている。これ
は、はんだゴテ等で位置合わせを行った状態で位置合わ
せ用仮留め部15に対応する熱硬化性接着剤13に局部的な
熱を与え、局部的に硬化を促進させ、仮留めしようとす
る目的のためであり、フレキシブル絶縁フィルムベース
16を露出させ熱の伝導を容易にしようとすることを、透
孔17をフレキシブルベース露出部に対して比較的小さな
孔とすることで、仮留め部15の面積を確保し、さらに熱
伝導を妨げない構成にしている。Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. 1 and 2 show a two-sided flexible printed wiring board with a conductive pattern formed on both sides based on a polyimide film 25 µm and a phenol substrate with a thickness of 1.6 mm and no conductive pattern as a hard plate 12 made of epoxy-based thermosetting. It is configured to be bonded via a mold adhesive 13. In addition, the double-sided flexible printed wiring board is provided with an overlay based on a polyimide film 25 μm as an insulating layer 14 on both sides of a necessary portion of the conductive pattern from both sides.
Removes the insulating layer 14 of the overlay on both sides in a circle,
Flexible insulation film base of polyimide film
16 are exposed. A round hole is formed in the flexible insulating film base 16 as a relatively small through hole 17 concentrically in the positioning temporary fixing portion 15. This is to apply local heat to the thermosetting adhesive 13 corresponding to the positioning temporary fixing portion 15 in a state where the positioning has been performed with a soldering iron or the like, to locally accelerate the curing, and to temporarily fix. For flexible insulation film base
To facilitate the heat conduction by exposing 16, the through hole 17 is made a relatively small hole with respect to the exposed portion of the flexible base, so that the area of the temporary fixing portion 15 is secured and the heat conduction is further improved. The configuration does not hinder.
この透孔17の形成は、両面フレキシブルプリント配線
板を作成して、外形プレス打抜きを行う際、同時に打抜
くこともできる。また、フレキシブルプリント配線板の
製造工程のスルホール孔18等の形成時に同時に孔をあけ
ておくこともできる。これは、従来のNCドリルによるド
リル加工やプレス打抜きによる方法等で、いずれも容易
に形成することができる。つまり、どの工程で上記透孔
17を形成するとしても、従来のフレキシブルプリント配
線板の製造工程に新たに工程を追加する必要もなく、容
易にまた安価に提供できるものである。The formation of the through holes 17 can be performed at the same time when a double-sided flexible printed wiring board is formed and the outer shape press punching is performed. Further, holes can be formed at the same time when the through hole 18 and the like are formed in the manufacturing process of the flexible printed wiring board. Any of these can be easily formed by a conventional method such as drilling with an NC drill or press punching. In other words, in any step
Even if 17 is formed, there is no need to add a new process to the conventional manufacturing process of a flexible printed wiring board, and it can be provided easily and at low cost.
なお、上記実施例では、両面フレキシブルプリント配
線板について述べたが、片面フレキシブルプリント配線
板でも同様の効果をもたらす。そして、位置合わせ用仮
留め部15の周辺のレジストが、スクリーン印刷等で形成
されるエポキシ樹脂等でのソルダレジストでも同様であ
る。また、当然フレキシブル配線板と他の基板とを熱圧
着させた後で、位置合わせ用仮留め部15にカッター等の
鋭利な刃で線状の切り込みを設けることでも同様の効果
は得られる。In the above embodiment, a double-sided flexible printed wiring board has been described, but a single-sided flexible printed wiring board has the same effect. The same applies to a case where the resist around the positioning temporary fixing portion 15 is a solder resist made of epoxy resin or the like formed by screen printing or the like. Also, the same effect can be obtained by forming a linear cut in the positioning temporary fixing portion 15 with a sharp blade such as a cutter after thermocompression bonding of the flexible wiring board and another substrate.
発明の効果 以上のように本発明によれば、部品実装後のリフロー
はんだ工程等での急激な熱履歴によっておこる、他の接
着板からの発生ガスおよびフレキシブル配線板本体に吸
湿していた水分や、位置合わせ仮留め部と接着剤層との
間に内在していた気泡等を前記フレキシブルベースフィ
ルムに設けた切欠きや透孔より外部へ放出させることが
できる。また、オーバレイとベースフィルム、導電パタ
ーン間での剥離や、さらには、フレキシブルベースフィ
ルムと導電パターン間での破壊は皆無になる。これによ
り、従来の量産工程に支障をきたすことなく、容易に安
定しな品質のフレキシブルプリント配線板を提供できる
ものである。Effects of the Invention As described above, according to the present invention, a gas generated from another adhesive plate and a moisture absorbed in the flexible wiring board main body caused by a rapid thermal history in a reflow soldering process after component mounting or the like are described. In addition, air bubbles and the like existing between the positioning temporary fixing portion and the adhesive layer can be released to the outside through cutouts or through holes provided in the flexible base film. Also, there is no peeling between the overlay and the base film and the conductive pattern, and no breakage between the flexible base film and the conductive pattern. As a result, a flexible printed wiring board of stable quality can be easily provided without hindering the conventional mass production process.
第１図は本発明のフレキシブル配線板の位置合わせ用仮
留め部の一実施例を示す要部断面図、第２図は同要部斜
視図、第３図は従来の位置合わせ用仮留め部を示す斜視
図、第４図は従来の仮留め方法を示す断面図、第５図は
従来法での問題点を示す拡大断面図である。 12……硬質板、13……熱硬化性接着剤、14……絶縁層、
15……仮留め部、16……絶縁フィルムベース、17……透
孔。1 is a sectional view of an essential part showing an embodiment of a temporary fixing part for positioning of a flexible wiring board of the present invention, FIG. 2 is a perspective view of the main part, and FIG. 3 is a conventional temporary fixing part for positioning. FIG. 4 is a sectional view showing a conventional temporary fixing method, and FIG. 5 is an enlarged sectional view showing a problem in the conventional method. 12: Hard plate, 13: Thermosetting adhesive, 14: Insulating layer,
15: Temporary fastening part, 16: Insulating film base, 17: Through-hole.
Claims (1)
成し、導電パターン上の所定の部分を絶縁層で被覆し、
部分的に硬質板を接着させ、硬質板との接着部の絶縁フ
ィルムベースを露出させ、かつ露出した絶縁フィルムベ
ースに切欠きや透孔を設けた硬質板との仮留め部を有す
るフレキシブルプリント配線板。1. A conductive pattern is formed on an insulating film base, and a predetermined portion on the conductive pattern is covered with an insulating layer.
Flexible printed wiring with a hard plate partially adhered, exposing the insulating film base at the bonding portion with the hard plate, and having a temporary fixing portion with the hard plate provided with cutouts or through holes in the exposed insulating film base Board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63187221A JP2583991B2 (en) | 1988-07-27 | 1988-07-27 | Flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63187221A JP2583991B2 (en) | 1988-07-27 | 1988-07-27 | Flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0236586A JPH0236586A (en) | 1990-02-06 |
| JP2583991B2 true JP2583991B2 (en) | 1997-02-19 |
Family
ID=16202192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63187221A Expired - Lifetime JP2583991B2 (en) | 1988-07-27 | 1988-07-27 | Flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2583991B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883540B (en) * | 2012-10-17 | 2014-12-24 | 无锡江南计算技术研究所 | Non-vacuum film pressing bubble removing method of variable-thickness soft-hard combined plate |
-
1988
- 1988-07-27 JP JP63187221A patent/JP2583991B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0236586A (en) | 1990-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2707903B2 (en) | Manufacturing method of multilayer printed wiring board | |
| JP2012039090A (en) | Semiconductor device and method of manufacturing the same | |
| JP5007164B2 (en) | Multilayer wiring board and multilayer wiring board manufacturing method | |
| JP2002076578A (en) | Printed wiring board and manufacturing method therefor | |
| JP2583991B2 (en) | Flexible printed wiring board | |
| JP2019047063A (en) | Printed circuit board and manufacturing method thereof | |
| JPH06204663A (en) | Manufacture of printed wiring board | |
| JPH07193370A (en) | Flex rigid printed board and its manufacturing method | |
| JPH0936499A (en) | Epoxy based flexible printed wiring board | |
| JPH118471A (en) | Manufacture of multilevel interconnection board and mounting method of electronic component by using the multilevel interconnection board | |
| JP4121339B2 (en) | Manufacturing method of multilayer wiring board | |
| JP3246954B2 (en) | Method for manufacturing flexible circuit wiring board for mounting circuit components | |
| JPH05267853A (en) | Manufacture of multilayer printed circuit board | |
| JP2674171B2 (en) | Printed wiring board | |
| JP3261064B2 (en) | Method of manufacturing flexible circuit board for semiconductor device | |
| JPS59217385A (en) | Printed circuit board | |
| JPH02265296A (en) | Manufacture of printed wiring substrate | |
| JP2023074860A (en) | Manufacturing method for printed wiring board | |
| JPS5967687A (en) | Printed circuit board | |
| JPH04291749A (en) | Electronic component mounting board equipped with heat dissipating member | |
| JPH0512876B2 (en) | ||
| JP2004047796A (en) | Method for manufacturing wiring board, and wiring board | |
| JP2005175388A (en) | Substrate for multilayer substrate, multilevel metallization board, and its manufacturing method | |
| JPH11312710A (en) | Method for connecting electronic component and connecting structure | |
| JP2019079869A (en) | Assembly of printed wiring board and support and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071121 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081121 Year of fee payment: 12 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081121 Year of fee payment: 12 |