JPH11312710A - Method for connecting electronic component and connecting structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for connecting a first electronic component such as IC chip with a second electronic component such as a wiring board by a connecting part in a bump electrode configuration, and to provide a method for connecting the electronic components in which the aspect ratio of the connecting part can be increased, and a fine connecting part can be obtained. SOLUTION: A laminated structure 18, constituted of an electrically insulating layer 16 and a layer 17 to be removed, is formed on an IC wafer 13, and the laminated structure 18 is provided with a through-hole 19, through which an electrode 25 for connection can be exposed. The through-hole 19 is filled with a conductive adhesive 20, and then the layer 17 to be removed is removed. Then, each IC chip 11 is cut from the IC wafer 13, and the IC chip 11 is placed on a wiring board 12. Afterwards, the conductive adhesive 20 is made to harden, and when the electrically insulating layer 16 is made of thermosetting resin, this is also simultaneously hardened.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a structure for connecting electronic components, and more particularly, to a method for connecting electronic components which is advantageously applied, for example, for mounting chip-shaped electronic components on a wiring board. It relates to a connection structure.

[0002]

2. Description of the Related Art FIG. 4 shows a conventional method of connecting electronic components which is of interest to the present invention. FIG. 4 shows a method for obtaining a state in which an IC chip 1 as a first electronic component is mounted on a wiring board 2 as a second electronic component, as shown in FIG. ing.

[0003] As shown in FIG.
Are scheduled to be cut later, and are prepared in the state of the IC wafer 3 as a mother part from which a plurality of cuts can be taken out by cutting. On one main surface 4 of such an IC wafer 3, bump electrodes 5 serving as connection electrodes are formed at predetermined plural locations.
These bump electrodes 5 are formed by applying a conductive resin paste by a printing method using, for example, a metal mask.

Then, after the conductive resin paste for forming the bump electrodes 5 is hardened, the IC wafer 3 is cut by, for example, a dicer, and a plurality of IC chips 1 as shown in FIG. It is. On the other hand, as shown in FIG. 4C, a wiring board 2 is prepared. On one main surface 6 of the wiring board 2, a connection electrode 7 is formed corresponding to the bump electrode 5 described above. The conductive adhesive 8 is applied on the connection electrode 7 by, for example, a printing method.

[0005] Next, the IC chip 1 is turned so that the main surface 4 thereof faces the main surface 6 of the wiring board 2, and the IC chip 1 is moved to the wiring board 2 as shown in FIG. Pressed. At this time, the conductive adhesive 8 is in an uncured stage, so that the bump electrode 5 is pressed into the conductive adhesive 8. In this state, the conductive adhesive 8 is cured.

Next, as shown in FIG. 4 (5), an electrically insulating underfill material 9 is provided between the IC chip 1 and the wiring board 2, and the underfill material 9 is cured. In this manner, the bump electrode 5 is connected to the conductive adhesive 8.
While being electrically connected to the connection electrode 7 through
The C chip 1 is mounted on the wiring board 2.

[0007]

However, the connection method shown in FIG. 4 has the following problems to be solved. First, the bump electrode 5 as a connection electrode formed on the IC chip 1 has a fine planar shape (diameter of 10).
0 μm or less) and a certain height is required. However, in order to stably form the bump electrode 5 satisfying such requirements by a printing method, an advanced printing technique is required, and the difficulty is high.

After the IC chip 1 and the wiring board 2 are connected via the bump electrodes 5, the above-described connection portions are reinforced for the purpose of reducing the thermal stress, improving the moisture resistance of the IC chip 1, and the like. As described above, the underfill material 9 needs to be provided between the IC chip 1 and the wiring board 2. However, when the underfill material 9 is applied later as described above, the underfill material 9 is filled between the IC chip 1 and the wiring board 2 in an uncured stage, and then is cured. And it is relatively difficult to properly fill the underfill material 9 between the IC chip 1 and the wiring board 2.

An object of the present invention is to provide a connection method and a connection structure for electronic components that can solve the above-described problems.

[0010]

According to the present invention, there is provided the above-mentioned I
The present invention is directed to a method for electrically connecting a first electronic component such as a C chip and a second electronic component such as a wiring board to each other. In order to solve the above-described technical problem, the method for connecting an electronic component according to the present invention exposes the first connection electrode on a surface of the first electronic component on which the first connection electrode is formed. Forming a laminated structure comprising at least two layers of an electric insulating layer and a layer to be removed which is formed on the electric insulating layer and which can be easily removed from the electric insulating layer, each forming a through hole to be obtained; Filling the through-holes with a conductive adhesive, removing the layer to be removed from the laminated structure at a stage where the conductive adhesive is not cured, and a stage where the conductive adhesive is not cured. In such a manner that the conductive adhesive is brought into contact with the second connection electrode of the second electronic component,
The method is characterized by including a step of aligning the first electronic component and the second electronic component, and a step of subsequently curing the conductive adhesive.

In the method of connecting an electronic component according to the present invention, in the step of aligning the first electronic component and the second electronic component, not only the conductive adhesive but also the electric insulating layer is not cured. Preferably, it is in the state. In the method for connecting electronic components according to the present invention, the through-hole formed in the multilayer structure as described above may be formed in advance before forming the multilayer structure on the first electronic component. Preferably, but preferably, after forming the laminated structure on the first electronic component, it is formed.

In the method of connecting an electronic component according to the present invention, when forming the laminated structure, first, an electrical insulating layer is formed on the first electronic component, and then a layer to be removed is formed on the electrical insulating layer. , And in a state where the electrical insulating layer and the layer to be removed are integrated,
There may be a case where a procedure such as forming a laminated structure on the first electronic component is taken.

In the method for connecting an electronic component according to the present invention, preferably, the electrical insulating layer is made of a thermosetting resin, and the layer to be removed is made of a film which can be easily peeled off from the thermosetting resin. The step of removing the layer includes a step of peeling the film, and the thermosetting resin is cured in a step of curing the conductive adhesive. On the other hand, in the electronic component connection method according to the present invention, the electric insulating layer may be made of an adhesive, and in this case, the layer to be removed is made of a film that can be easily peeled off from the adhesive, and the layer to be removed is The film is peeled off in order to remove the film.

In the method for connecting electronic components according to the present invention, the first electronic component is scheduled to be cut later, and the mother can be taken out by cutting the first electronic component. It may be prepared in the state of parts. In this case, it is preferable that the step of forming the laminated structure, the step of filling with the conductive adhesive, and the step of removing the layer to be removed are performed in the state of the mother component. The mother part cuts this,
A plurality of first electronic components are taken out therefrom, and after such a cutting process, a step of aligning the first electronic component and the second electronic component as described above, and A step of curing the adhesive is performed.

The present invention also provides a first electronic component and a second electronic component.
For electrically connecting the electronic components to each other. In the electronic component connection structure according to the present invention, the first connection electrode of the first electronic component and the second connection electrode of the second electronic component are opposed to each other at a predetermined interval. Disposed, the first connection electrode and the second connection electrode are electrically connected by a conductive adhesive,
Between the surface of the first electronic component on which the first connection electrode is formed and the surface of the second electronic component on which the second connection electrode is formed so as to surround the conductive adhesive. An electrical insulation layer is formed.

In the connection structure for an electronic component according to the present invention, the above-mentioned electric insulating layer is made of a thermosetting resin or an adhesive. Further, the connection structure for electronic components according to the present invention is advantageously applied, for example, when the first electronic component is a chip-shaped electronic component such as an IC chip and the second electronic component is a wiring board. .

[0017]

FIG. 1 shows a method for connecting electronic components according to an embodiment of the present invention. The connection method of the electronic component shown here is for obtaining a state in which the IC chip 11 as the first electronic component is mounted on the wiring board 12 as the second electronic component as shown in FIG. Applied to

First, as shown in FIG. 1A, the IC chip 11 is scheduled to be cut later, and as a mother part from which a plurality of chips can be taken out by cutting. It is prepared in the state of the IC wafer 13. On one main surface 14 of the IC wafer 13, connection electrodes 15 for the IC chip 11 are distributed at a plurality of predetermined locations in each region to be the IC chip 11 when cut later. It is formed.

Next, as shown in FIG.
A laminated structure 18 comprising at least two layers of an electric insulating layer 16 and a layer 17 to be removed formed on the electric insulating layer 16 and easily removable from the electric insulating layer 16 on the main surface 14 of the IC wafer 13. Is formed. More specifically, in order to form the above-mentioned laminated structure 18, first, an electric insulating layer 16 is formed on the main surface 14 of the IC wafer 13, and then, a layer 17 to be removed is formed on the electric insulating layer 16. It is formed. In order to form the electric insulating layer 16, for example, an epoxy-based thermosetting resin is used, and a film made of a thermosetting resin having a thickness of several tens of μm is formed by a spin coater. Since the IC wafer 13 has a disk shape with a diameter of, for example, 6 inches, the spin coater can be advantageously applied as described above when forming the electric insulating layer 16.

On the other hand, as the layer 17 to be removed, for example, a film which can be easily peeled off from the above-mentioned thermosetting resin is used. The film to be the layer 17 to be removed is preferably stuck on the electric insulating layer 16 in the B-stage state of the thermosetting resin to be the electric insulating layer 16.
Next, as shown in FIG. 1 (2), a through hole 19 through which the connection electrode 15 can be exposed is formed in the laminated structure 18 so as to penetrate both the electrical insulating layer 16 and the layer 17 to be removed. You. In order to form these through holes 19, for example, a laser such as an excimer laser is used. Alternatively, the through hole 19 may be formed by applying a photolithography technique using a photo-curable resin.

Next, as shown in FIG. 1 (3), the through holes 19 are filled with a conductive adhesive 20. At this time, the laminated structure 18 functions as a mask for selectively forming the conductive adhesive 20 only on the connection electrode 15. Next, as shown in FIG. 1D, the layer 17 to be removed is removed from the laminated structure 18. Layer 1 to be removed
Since film 7 is made of a film, the film may be peeled off for the removal. When the layer 17 to be removed is removed in this manner, the conductive adhesive 20
Is exposed from the electrical insulating layer 16 at a height corresponding to the thickness of the layer 17 to be removed. This FIG. 1 (4)
In the process shown in (1), the conductive adhesive 20 is in an uncured stage, and the thermosetting resin forming the electrical insulating layer 16 is also in the B-stage state, that is, in an uncured state.

Next, as shown in FIG. 1 (5), the IC wafer 13 is cut by, for example, a dicer, whereby a plurality of IC chips 11 are taken out. On the other hand, as shown in FIG. 1 (6), a wiring board 12 for mounting the IC chip 11 is prepared. This wiring board 12
On one main surface 21, a connection electrode 22 is formed at a predetermined location corresponding to the connection electrode 15 of the IC chip 11.

As shown in FIG. 1 (6),
The main surface 14 of the C chip 11 is the main surface 2 of the wiring board 12.
1 and is pressed against the wiring board 12. Thereby, the IC chip 11 and the wiring board 12 are aligned so that the conductive adhesive 20 contacts the connection electrodes 22 on the wiring board 12. Also in this step, the conductive adhesive 20 is in an uncured state, and the electric insulating layer 16 is also in an uncured state. for that reason,
The conductive adhesive 20 and the electrical insulating layer 16 are partially deformed so as to conform to the shape of the main surface 21 of the wiring board 12 on which the connecting electrodes 22 are formed, while the connecting electrodes 22 on the wiring board 12 are formed. And a state in which it is in close contact with main surface 21.

Next, while maintaining the state shown in FIG. 1 (6), the conductive adhesive 20 is cured, and at the same time, the electric insulating layer 16 is cured. In this manner, the connection electrode 15 and the connection electrode 22 are arranged so as to face each other at a predetermined interval, and the connection electrode 15 and the connection electrode 22 are electrically connected by the conductive adhesive 20. Connected
The IC chip 1 surrounds the conductive adhesive 20.
IC chip 11 and wiring board 12 in which an electrical insulating layer 16 is formed between main surface 14 of substrate 1 and main surface 21 of wiring board 12.
Is obtained.

In connection with the embodiment shown in FIG.
As shown in FIG. 1A, when forming the laminated structure 18 on the IC wafer 13, instead of forming the electrical insulating layer 16 and the layer 17 to be removed sequentially on the IC wafer 13, A laminated structure 18 in which the layer 16 and the layer 17 to be removed are integrated in advance may be formed in another place, and may be stacked on the IC wafer 13.

In the embodiment shown in FIG. 1, after the laminated structure 18 is formed on the IC wafer 13, the structure shown in FIG.
As shown in (2), the through holes 19 are formed. However, a laminated structure 18 in which the through holes 19 are formed may be prepared in advance, and may be stacked on the IC wafer 13. . Further, the electric insulating layer 16 in which the through-hole 19 is formed in advance may be stacked on the IC wafer 13, and then the layer 17 to be removed in which the through-hole 19 is formed in advance may be stacked.

FIG. 2 illustrates a method for connecting electronic components according to another embodiment of the present invention. In this embodiment, as shown in FIG. 2 (5), an attempt is made to obtain a state in which an IC chip 32 as a second electronic component is mounted on a wiring board 31 as a first electronic component. First, as shown in FIG. 2A, a wiring board 31 is prepared. On one main surface 33 of the wiring board 31, connection electrodes 34 are formed to be distributed at a plurality of predetermined locations.

Next, as shown in FIG.
On the main surface 33 of the wiring board 31, a laminated structure 37 including at least two layers of an electric insulating layer 35 and a layer 36 to be removed is formed. More specifically, the electrical insulating layer 35 is made of an adhesive, and the layer 36 to be removed is made of a film that can be easily peeled from the adhesive. The laminated structure 37 having such a structure is in the same state as the state after peeling off one separator of a commercially available double-sided pressure-sensitive adhesive tape.
Can be used advantageously. When a commercially available double-sided adhesive tape is used, one of the remaining separators functions as the layer 36 to be removed.

Next, as shown in FIG. 2 (2), the laminated structure 37 has through holes 3 through which the connection electrodes 34 can be exposed.
8 are formed. The formation of the through hole 38 is performed, for example, by
The method can be performed by a method using a laser such as an excimer laser, a method using a photolithography technique using a photocurable resin, or the like. Then, FIG.
As shown in (3), the through holes 38 are filled with the conductive adhesive 39.

Next, as shown in FIG. 2D, the layer 36 to be removed made of a film is removed by peeling. The conductive adhesive 39 maintains an uncured state even after completing this step. Conductive adhesive 39
Project from the electrical insulating layer 35 with a height corresponding to the thickness of the layer 36 to be removed. Further, the electric insulating layer 35 made of an adhesive still maintains the adhesiveness.

On the other hand, as shown in FIG. 2 (5), an IC chip 32 is prepared. One main surface 40 of the IC chip 32
A connection electrode 41 corresponding to the connection electrode 34 on the wiring board 31 is formed thereon. Next, as shown in FIG. 2 (5), the IC chip 32 is then brought into a state where its main surface 40 faces the main surface 33 of the wiring board 31,
It is pressed toward the wiring board 31. Thereby, the uncured conductive adhesive 39 adheres to the connection electrode 41 of the IC chip 32, and the electric insulating layer 35, which still maintains the adhesiveness, adheres to the IC chip 32.

Next, while maintaining the state shown in FIG. 2 (5), the conductive adhesive 39 is cured. In this manner, the connection electrode 34 and the connection electrode 41 are arranged so as to face each other at a predetermined interval, and the connection electrode 34
And the connection electrode 41 are electrically connected by the conductive adhesive 39 so as to surround the conductive adhesive 39.
The wiring board 31 and the IC board 32 each having an electrical insulating layer 35 formed between the main surface 33 of the wiring board 31 and the main surface 40 of the IC chip 32
A connection structure with the C chip 32 is obtained.

In connection with the embodiment shown in FIG.
The formation of the through hole 38 shown in FIG.
7 was formed on the wiring board 31, but the laminated structure 37 in which the through-hole 38 was previously formed was connected to the wiring board 31.
It may be stacked on top. In particular, according to the embodiment shown in FIG. 2, a chip-shaped electronic component such as an IC chip designed for wire bonding without a bump electrode can be applied as it is.

While the present invention has been described with reference to the exemplary embodiments shown in FIGS. 1 and 2, respectively, there is also an embodiment in which the characteristic configurations of these two exemplary embodiments are replaced with each other. It is possible. For example, in the embodiment shown in FIG. 1, the electric insulating layer 16 may be made of an adhesive, and the laminated structure 18 may be a commercially available double-sided adhesive tape, for example. Further, in the embodiment shown in FIG. 2, a thermosetting resin may be used as the electric insulating layer 35.

In each of the above-described embodiments, the case where the IC chip 11 or 32 is mounted on the wiring board 12 or 31 has been described. An electronic component may be mounted with the connection method and connection structure according to the present invention. FIG. 3 shows a state in which IC chips 52 and 53 as chip-shaped electronic components and a chip capacitor 54 are mounted on a wiring board 51, respectively. The connection structure shown in FIG. 3 can be basically obtained by the connection method according to the embodiment shown in FIG.

Referring to FIG. 3, connection electrodes 56, 57 and 58 are formed on one main surface 55 of wiring board 51. On the other hand, a connection electrode 60 corresponding to the connection electrode 56 is formed on one main surface 59 of the IC chip 50, and a connection electrode 57 is formed on one main surface 61 of the IC chip 53. The connection electrode 62 is formed, and on one main surface 63 of the chip capacitor 54, the connection electrode 5 is formed.
A connection electrode 64 corresponding to 8 is formed.

On the main surface 55 of the wiring board 51, the electric insulating layer 6 is formed in the same manner as in the embodiment shown in FIG.
5 is formed over substantially the entire surface of the wiring board 51. Also, the connection electrodes 56, 57 and 58 are connected to the connection electrodes 60, 62 and 64, respectively.
The conductive adhesives 66, 67 and 68 are used to form the electrically insulating layer 65.
Is provided so as to penetrate through.

In each of the illustrated embodiments, one of the first electronic component and the second electronic component to be connected is an IC.
Although a chip-like electronic component such as a chip was used, and the other was a wiring board, the connection method and connection structure of the electronic component according to the present invention can be used for connection between chip-like electronic components and connection between wiring boards. Can also be applied.

[0039]

As described above, according to the method for connecting electronic components according to the present invention, the conductive adhesive is filled in the through holes formed in the laminated structure, and the conductive adhesive is provided with bumps. Since a function as an electrode can be performed, a connection portion in a bump electrode mode having a high aspect ratio can be realized. In addition, the height of the connection portion by the conductive adhesive can be easily controlled by the thickness of the electric insulating layer. Also, by the size of the through hole, it is possible to easily control the cross-sectional dimension of the connection portion by the conductive adhesive,
Therefore, formation of a fine connection portion is also facilitated. Also, since the conductive adhesive is applied in a state defined by the through holes provided in the electric insulating layer, as in the related art,
Problems such as printing bleeding that may occur when the bump electrodes are formed by printing are not encountered.

Further, according to the electronic component connection method and connection structure of the present invention, the first insulating layer used for applying the conductive adhesive is formed so as to surround the conductive adhesive. Since it remains between the electronic component and the second electronic component, the function of the underfill material can be achieved with this electric insulating layer. Therefore, a step for applying the underfill material is not required, and the electric insulating layer is already formed before the first electronic component and the second electronic component are aligned. It is easy to completely fill a predetermined space between the component and the second electronic component with the electric insulating layer, and the function as the underfill material can be favorably exhibited.

Further, according to the method for connecting electronic components according to the present invention, no stress is applied to a specific portion of the electronic component in a process until a target connection structure is obtained. For this reason, it is possible to avoid a situation in which the active area of the electronic component is arranged at a position where such stress can be avoided, so that the electronic component must be enlarged. As a result, the electronic component can be downsized. Can be.

In the step of aligning the first electronic component and the second electronic component, which is included in the electronic component connection method according to the present invention, not only the conductive adhesive but also the uncured electric insulating layer is used. When in the state, the uncured electric insulating layer is deformed to conform to the surface of the second electronic component,
The adhesion between the electric insulating layer and the second electronic component can be enhanced, and the adhesive effect of the electric insulating layer can be expected.

In the method for connecting electronic components according to the present invention, when forming the laminated structure, the laminated structure is formed on the surface of the first electronic component on which the first connection electrode is formed. Later, if a through hole is formed, the laminated structure can be formed without the through hole,
The operation for forming the laminated structure is facilitated. Also,
Inconvenience that the position of the through hole is undesirably shifted at the stage of forming the laminated structure can be avoided.

In the method for connecting electronic components according to the present invention, when forming the laminated structure, the electric insulating layer is first formed on the surface of the first electronic component on which the first connection electrode is formed. Then, if a layer to be removed is formed on the electric insulating layer, as a material for the electric insulating layer,
For example, a liquid thermosetting resin having poor shape retention can be used without any problem.

In the method of connecting an electronic component according to the present invention, when forming the laminated structure, the first connection of the first electronic component is performed in a state where the electrical insulating layer and the layer to be removed are integrated. If the laminated structure is stacked on the surface on which the electrode for forming is formed, the step of forming the laminated structure on the first electronic component can be efficiently performed by preparing the laminated structure in advance. You can proceed.

In the method for connecting an electronic component according to the present invention, the electrical insulating layer is made of a thermosetting resin, the layer to be removed is made of a film which can be easily peeled off from the thermosetting resin, and the layer to be removed is removed. When the thermosetting resin is cured in the step of curing the conductive adhesive, the step of forming the laminated structure and the step of removing the layer to be removed can be performed efficiently. And a special process for curing the thermosetting resin is not required. Not only that, when the first electronic component and the second electronic component are aligned, the electric insulating layer made of a thermosetting resin becomes the second electronic component.
The electronic component is deformed so as to conform to the surface of the electronic component, and the adhesiveness between the electronic component and the second electronic component is enhanced, and the adhesive effect of the thermosetting resin can be expected.

In the method for connecting electronic parts according to the present invention, the electrical insulating layer is made of an adhesive, and the layer to be removed is made of a film which can be easily peeled off from the adhesive. By peeling off, the step of removing the layer to be removed can be efficiently performed, and the adhesiveness and the adhesiveness with the second electronic component by the adhesive forming the electric insulating layer can be improved. You can expect.

In the method for manufacturing an electronic component according to the present invention, the first electronic component is scheduled to be cut later, and the mother can be taken out by cutting the first electronic component. Prepared in the state of parts,
The step of forming the laminated structure, the step of filling with a conductive adhesive, and the step of removing the layer to be removed are performed in the state of the mother component. After the mother component is cut, the first electronic component and the second electronic component are removed. When the step of aligning the electronic component and the step of curing the conductive adhesive are performed, the step of forming a laminated structure, the step of filling with the conductive adhesive, and the step of removing the layer to be removed Has a plurality of first
Are performed at the same time for the electronic components, and the efficiency of these steps can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a connection structure of an electronic component according to an embodiment of the present invention, and schematically illustrating each step included in a method of connecting an electronic component according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a connection structure of an electronic component according to another embodiment of the present invention and schematically illustrating each step included in a method of connecting an electronic component according to another embodiment of the present invention.

FIG. 3 is a cross-sectional view schematically illustrating a connection structure of an electronic component according to still another embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a conventional electronic component connection structure that is of interest to the present invention, and also schematically showing a conventional electronic component connection method.

[Explanation of symbols]

Reference Signs List 11 IC chip (first electronic component) 12 Wiring board (second electronic component) 13 IC wafer (mother component) 14, 21, 33, 40, 55, 59, 61, 63 Main surface 15 Connection electrode (first 1, connection electrode) 16, 35, 65 electrical insulating layer 17, 36 layer to be removed 18, 37 laminated structure 19, 38 through hole 20, 39, 66, 67, 68 conductive adhesive 22 connection electrode (first 2 connection electrode) 31 wiring board (first electronic component) 32 IC chip (second electronic component) 34 connection electrode (first connection electrode) 41 connection electrode (second connection electrode) 51 Wiring board (first electronic component) 52, 53 IC chip (second electronic component) 54 Chip capacitor (second electronic component) 56, 57, 58 Connection electrode (first connection electrode) 60, 62, 64 connection electrode ( 2 connecting electrodes)

Claims (12)

[Claims] 1. A method for electrically connecting a first electronic component and a second electronic component to each other, wherein the first electronic component is on a surface on which a first connection electrode is formed. An electric insulating layer and a layer to be removed which is formed on the electric insulating layer and which can be easily removed from the electric insulating layer, wherein the through hole is formed so as to expose the first connection electrode. A step of forming a laminated structure composed of at least two layers; a step of filling the through-hole with a conductive adhesive; and a step of removing the layer to be removed from the laminated structure at a stage where the conductive adhesive is uncured. Removing the first electronic component and the first electronic component so that the conductive adhesive is brought into contact with a second connection electrode of the second electronic component at a stage where the conductive adhesive is uncured. Aligning the second electronic component; And a step of curing the adhesive, the connection method of the electronic component. 2. In the step of aligning the first electronic component and the second electronic component, not only the conductive adhesive but also the electric insulating layer is in an uncured state.
The method for connecting electronic components according to claim 1. 3. The step of forming the laminated structure includes the steps of: forming the laminated structure on a surface of the first electronic component on which the first connection electrode is formed; The method for connecting electronic components according to claim 1, further comprising: forming a hole. 4. The step of forming the laminated structure includes the steps of: forming the electrical insulating layer on a surface of the first electronic component on which the first connection electrode is formed; Forming the layer to be removed on an insulating layer.
The method for connecting electronic components according to claim 1. 5. The step of forming the laminated structure, wherein the electric insulating layer and the layer to be removed are integrated,
4. The method of connecting an electronic component according to claim 1, further comprising a step of forming the laminated structure on a surface of the first electronic component on which the first connection electrode is formed. 5. 6. The electric insulating layer is made of a thermosetting resin, the layer to be removed is made of a film that can be easily peeled off from the thermosetting resin, and the step of removing the layer to be removed is performed by removing the film. The method for connecting electronic components according to claim 1, further comprising a step of peeling, wherein the thermosetting resin is cured in a step of curing the conductive adhesive. 7. The electric insulating layer is made of an adhesive, the layer to be removed is made of a film that can be easily peeled off from the adhesive, and the step of removing the layer to be removed includes a step of peeling the film. The method of connecting an electronic component according to claim 1, wherein the method includes: 8. The laminated structure according to claim 1, wherein the first electronic component is scheduled to be cut later, and is prepared in a state of a mother component from which a plurality of components can be taken out by cutting. The step of forming an object, the step of filling with the conductive adhesive, and the step of removing the layer to be removed are performed in a state of the mother part, and the mother part is cut to form a plurality of the first parts. The method further includes a step of taking out an electronic component, and after the step of cutting, a step of aligning the first electronic component and the second electronic component, and a step of curing the conductive adhesive are performed. A method for connecting an electronic component according to any one of claims 1 to 7. 9. A structure for electrically connecting a first electronic component and a second electronic component to each other, wherein the first connection electrode of the first electronic component and the second electronic component are connected to each other. A second connection electrode of the component is disposed so as to face a predetermined distance from each other, and the first connection electrode and the second connection electrode are electrically connected by a conductive adhesive. And a surface of the first electronic component on which the first connection electrode is formed and the second connection electrode of the second electronic component are formed so as to surround the conductive adhesive. A connection structure for electronic components, wherein an electrical insulating layer is formed between the surface and the surface. 10. The electronic component connection structure according to claim 9, wherein said electric insulating layer is made of a thermosetting resin. 11. The electronic component connection structure according to claim 9, wherein the electric insulating layer is made of an adhesive. 12. The electronic component connection structure according to claim 9, wherein the first electronic component is a chip-shaped electronic component, and the second electronic component is a wiring board.