JP2576467Y2 - Thermal print head - Google Patents
Thermal print headInfo
- Publication number
- JP2576467Y2 JP2576467Y2 JP1993039761U JP3976193U JP2576467Y2 JP 2576467 Y2 JP2576467 Y2 JP 2576467Y2 JP 1993039761 U JP1993039761 U JP 1993039761U JP 3976193 U JP3976193 U JP 3976193U JP 2576467 Y2 JP2576467 Y2 JP 2576467Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- hard resin
- head substrate
- thermal print
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electronic Switches (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本考案は、サーマルプリントヘッ
ドに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal print head.
【０００２】[0002]
【従来の技術】従来のサーマルプリントヘッドは、図３
に示すように支持板１上にアルミナセラミック等の絶縁
基板からなるヘッド基板２と、ガラス布基材エポキシ樹
脂積層板等からなるプリント配線板３とを当接６して固
定し、前記ヘッド基板２上又は前記プリント配線板３上
にドライバＩＣ５を実装してワイヤボンディングした
後、ドライバＩＣ５を保護するためにエポキシを主材と
する硬質レジン４によりドライバＩＣ５を封止してい
る。2. Description of the Related Art A conventional thermal print head is shown in FIG.
As shown in FIG. 1, a head substrate 2 made of an insulating substrate such as alumina ceramic and a printed wiring board 3 made of a glass cloth base epoxy resin laminate or the like are fixed on the support plate 1 by abutting 6 on the head substrate. After mounting the driver IC 5 on the printed wiring board 3 or on the printed wiring board 3 and performing wire bonding, the driver IC 5 is sealed with a hard resin 4 mainly composed of epoxy to protect the driver IC 5.
【０００３】前記従来構造のサーマルプリントヘッド
は、前記ヘッド基板２と前記プリント配線板３は異なる
素材から作られているため、加熱及び冷却時に熱膨張係
数の違いから長手方向の寸法の変化量に差が生じる。こ
の寸法変化の繰り返しにより、ヘッド基板２とプリント
配線板３の当接部６を跨ぐ前記硬質レジン４は剪断方向
に力を受けることになる。特に当接部６の両端は寸法変
化量が最も大きくなり、剪断力が大きく硬質レジン４に
亀裂が生じやすい。前記硬質レジン４に亀裂が生じる
と、亀裂部分から水分の侵入等によるドライバＩＣ５表
面の腐食や当接部６を跨ぐワイヤの断線を招き、故障の
要因となっていた。In the thermal print head having the conventional structure, the head substrate 2 and the printed wiring board 3 are made of different materials. There is a difference. By repeating this dimensional change, the hard resin 4 straddling the contact portion 6 between the head substrate 2 and the printed wiring board 3 receives a force in the shearing direction. In particular, both ends of the abutting portion 6 have the largest dimensional change, and the shearing force is large, so that the hard resin 4 is easily cracked. When the hard resin 4 is cracked, corrosion of the surface of the driver IC 5 due to the invasion of moisture from the cracked portion or disconnection of the wire straddling the contact portion 6 is caused, thereby causing a failure.
【０００４】[0004]
【考案が解決しようとする課題】本考案は、前記問題点
に鑑み、構成部材の熱変形で前記硬質レジンの剪断力に
よる亀裂の発生を抑制し、故障率の低いサーマルプリン
トヘッドを提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a thermal print head which suppresses the occurrence of cracks due to the shearing force of the hard resin due to thermal deformation of constituent members and has a low failure rate. It is in.
【０００５】[0005]
【課題を解決するための手段】本考案サーマルプリント
ヘッドは、支持板上に、絶縁基板上に列状に複数の発熱
抵抗体を備えたヘッド基板とプリント配線板とを固定
し、該ヘッド基板、又はプリント配線板上に搭載された
ドライバＩＣを硬質レジンで前記ヘッド基板とプリント
配線板に跨がるように塗布したサーマルプリントヘッド
において、前記ヘッド基板とプリント配線板の当接部の
側面部分を覆うように硬質レジンを塗布したことを特徴
とする。According to the present invention, a thermal print head is provided in which a head substrate provided with a plurality of heating resistors in a row on an insulating substrate and a printed wiring board are fixed on a support plate. Or, in a thermal print head in which a driver IC mounted on a printed wiring board is applied with a hard resin so as to straddle the head substrate and the printed wiring board, a side portion of a contact portion between the head substrate and the printed wiring board. A hard resin is applied so as to cover the surface.
【０００６】[0006]
【実施例】図１は、本考案サーマルプリントヘッドの１
実施例を示しており、図１の（Ａ）はその側面図、図１
の（Ｂ）はその平面図である。なお、従来例と同じ構成
部分には同じ符号を付して説明する。支持板１上にヘッ
ド基板２及びプリント配線板３を接着剤８により固定す
る。そして、前記ヘッド基板２の一側辺に形成される発
熱抵抗体２ａを駆動制御するドライバＩＣ５をヘッド基
板２のもう一方の側辺側に実装する。前記実装されたド
ライバＩＣ５は、前記ヘッド基板２上の形成された電極
パターン（図示せず）にワイヤボンディングにより電気
的に接続される。FIG. 1 shows a thermal print head 1 according to the present invention.
FIG. 1A shows an embodiment of the present invention, and FIG.
(B) is a plan view thereof. The same components as those in the conventional example will be described with the same reference numerals. The head substrate 2 and the printed wiring board 3 are fixed on the support plate 1 with an adhesive 8. Then, a driver IC 5 for driving and controlling the heating resistor 2a formed on one side of the head substrate 2 is mounted on the other side of the head substrate 2. The mounted driver IC 5 is electrically connected to an electrode pattern (not shown) formed on the head substrate 2 by wire bonding.
【０００７】そして、前記ドライバＩＣ５及びその周囲
の接続パターンを硬質レジン４で覆うとともに、４ａ、
４ｂのように支持板１にも及ぶように封止する。この
時、前記支持板１上に及んで硬質レジン４を塗布するこ
とになるので、前記支持板１を長辺方向に延設する必要
がある。Then, the driver IC 5 and the connection pattern around the driver IC 5 are covered with a hard resin 4 and 4a,
4b, sealing is performed so as to reach the support plate 1. At this time, the hard resin 4 is applied over the support plate 1, so that the support plate 1 needs to be extended in the long side direction.
【０００８】図２は、本考案の第２の実施例を示してお
り、図２の（Ａ）はその側面図、図２の（Ｂ）はその平
面図である。この実施例は、前記第１実施例における支
持板１の延設を伴わずにヘッド基板２とプリント配線板
３の当接部の全体を塗布する構造である。FIG. 2 shows a second embodiment of the present invention. FIG. 2 (A) is a side view and FIG. 2 (B) is a plan view. This embodiment has a structure in which the entire contact portion between the head substrate 2 and the printed wiring board 3 is applied without extending the support plate 1 in the first embodiment.
【０００９】この実施例の場合は、プリント配線板３の
当接部両端に硬質レジン４が塗布可能なスペースを切除
した切除部３ａ及び３ｂに硬質レジン４ｃを充填するこ
とにより当接部側面を含む全体を覆うように硬質レジン
４を塗布できるので、前記支持板１の延設を必要としな
い。In the case of this embodiment, hard resin 4c is filled in cutouts 3a and 3b in which spaces for applying the hard resin 4 are cut off at both ends of the contact portion of the printed wiring board 3, so that the side surface of the contact portion is formed. Since the hard resin 4 can be applied so as to cover the entire structure including the support resin 1, the support plate 1 does not need to be extended.
【００１０】この実施例は、比較的容易に局部的に切除
可能なプリント配線板３側に前記切除部３ａを設けてい
るが、ヘッド基板２側又は双方に切除部を設けても良
い。前記各実施例では、ヘッド基板２上にドライバＩＣ
５を搭載した例としているが、プリント配線板３上にド
ライバＩＣを搭載しても同様の効果は得られる。In this embodiment, the cutout portion 3a is provided on the printed wiring board 3 side which can be locally cut off relatively easily. However, the cutout portion may be provided on the head substrate 2 side or both sides. In each of the above embodiments, the driver IC is provided on the head substrate 2.
5, the same effect can be obtained even if a driver IC is mounted on the printed wiring board 3.
【００１１】[0011]
【考案の効果】本考案は、ヘッド基板とプリント配線板
の当設部両端の側面に至るまで硬質レジンを塗布するこ
とにより構成部材の熱変形による前記硬質レジンの剪断
力による亀裂の発生を抑制することができる。これによ
り故障率の低いサーマルプリントヘッドを提供すること
ができる。The present invention suppresses the occurrence of cracks due to the shearing force of the hard resin due to the thermal deformation of the constituent members by applying the hard resin to the side surfaces of both ends of the head substrate and the printed wiring board at both ends of the contact portion. can do. Thus, a thermal print head having a low failure rate can be provided.
【図１】本考案サーマルプリントヘッドの第１実施例の
側面図及び平面図である。FIG. 1 is a side view and a plan view of a first embodiment of the thermal print head of the present invention.
【図２】本考案サーマルプリントヘッドの第２実施例の
側面図及び平面図である。FIG. 2 is a side view and a plan view of a second embodiment of the thermal printhead of the present invention.
【図３】従来のサーマルプリントヘッドの側面図及び平
面図である。FIG. 3 is a side view and a plan view of a conventional thermal print head.
１ 支持板 ２ ヘッド基板 ２ａ 発熱抵抗体 ３ プリント配線板 ４、４ａ、４ｂ、４ｃ 硬質レジン ５ 駆動ＩＣ ６ 当接部 DESCRIPTION OF SYMBOLS 1 Support plate 2 Head board 2a Heating resistor 3 Printed wiring board 4, 4a, 4b, 4c Hard resin 5 Drive IC 6 Contact part
Claims (2)
発熱抵抗体を備えたヘッド基板とプリント配線板とを固
定し、該ヘッド基板、又はプリント配線板上に搭載され
たドライバＩＣを硬質レジンで前記ヘッド基板とプリン
ト配線板に跨がるように塗布したサーマルプリントヘッ
ドにおいて、前記ヘッド基板とプリント配線板の当接部
の側面部分を覆うように硬質レジンを塗布したことを特
徴とするサーマルプリントヘッド。1. A head substrate provided with a plurality of heating resistors in a row on an insulating substrate and a printed wiring board fixed on a support plate, and a driver mounted on the head substrate or the printed wiring board. In a thermal print head in which an IC is applied with a hard resin so as to straddle the head substrate and the printed wiring board, the hard resin is applied so as to cover a side portion of a contact portion between the head substrate and the printed wiring board. Characteristic thermal print head.
接部両端に前記硬質レジン充填用切欠部を形成したこと
を特徴とする請求項１記載のサーマルプリントヘッド。2. The thermal printhead according to claim 1, wherein the hard resin filling notches are formed at both ends of the contact portion of the head substrate or the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1993039761U JP2576467Y2 (en) | 1993-06-24 | 1993-06-24 | Thermal print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1993039761U JP2576467Y2 (en) | 1993-06-24 | 1993-06-24 | Thermal print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0728650U JPH0728650U (en) | 1995-05-30 |
| JP2576467Y2 true JP2576467Y2 (en) | 1998-07-09 |
Family
ID=12561935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1993039761U Expired - Fee Related JP2576467Y2 (en) | 1993-06-24 | 1993-06-24 | Thermal print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2576467Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6525822B2 (en) * | 2015-08-29 | 2019-06-05 | 京セラ株式会社 | Thermal head and thermal printer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH047142U (en) * | 1990-05-07 | 1992-01-22 |
-
1993
- 1993-06-24 JP JP1993039761U patent/JP2576467Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0728650U (en) | 1995-05-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |