JP3169671B2 - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JP3169671B2 JP3169671B2 JP4810792A JP4810792A JP3169671B2 JP 3169671 B2 JP3169671 B2 JP 3169671B2 JP 4810792 A JP4810792 A JP 4810792A JP 4810792 A JP4810792 A JP 4810792A JP 3169671 B2 JP3169671 B2 JP 3169671B2
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- thermal head
- substrate
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Electronic Switches (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、感熱記録あるいは熱転
写記録に使用されるサーマルヘッドに係り、とくに、発
熱体駆動用ＩＣの配置構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal head used for thermal recording or thermal transfer recording, and more particularly to an arrangement structure of a heating element driving IC.
【０００２】[0002]
【従来の技術および発明が解決しようとする課題】図３
（Ａ）は従来の感熱記録あるいは熱転写記録に使用され
る複合基板式のサーマルヘッドの一例を示す平面図、同
（Ｂ）は側面図である。図３（Ａ）、（Ｂ）に示すよう
に、該サ−マルヘッドは、発熱体列１を表面に設けたア
ルミナ等からなる発熱体列形成基板３と、発熱体駆動用
横型ＩＣ２（入力ライン６および出力ライン７の向き
が、おおよそ、ほぼ長方形をなすＩＣの短辺方向の向き
となるように配置されるもの）を表面に設けた印刷配線
基板４とをアルミニウム板等でなるヒートシンク５の上
に固着し、該発熱体列形成基板３と該印刷配線基板４の
上に設けた前記発熱体駆動用ＩＣ２とをボンディングワ
イヤで接続する構造を有している。該発熱体列１は複数
の発熱体１ａ（図２参照）が被印刷物走行方向（矢印Ｘ
方向）に対して直角に、列状に集合しているものであ
り、各発熱体はＩＣ２からの駆動信号で発熱し、感熱型
の被印刷物に印字または印画を行うものである。2. Description of the Related Art FIG.
(A) is a plan view showing an example of a conventional thermal head of the composite substrate type used for thermal recording or thermal transfer recording, and (B) is a side view. As shown in FIGS. 3A and 3B, the thermal head comprises a heating element row forming substrate 3 made of alumina or the like having a heating element row 1 provided on the surface thereof, and a heating element driving horizontal IC 2 (input line). 6 and the output line 7 are arranged so that the direction of the short side of the IC having a substantially rectangular shape) is provided on the surface of the heat sink 5 made of an aluminum plate or the like. The heating element array forming substrate 3 is fixed on the printed wiring board 4 and the heating element driving IC 2 provided on the printed wiring board 4 is connected by a bonding wire. The heating element row 1 includes a plurality of heating elements 1a (see FIG. 2) in a printing material traveling direction (arrow X).
The heating elements generate heat in response to a drive signal from the IC 2 and perform printing or printing on a heat-sensitive type printing material.
【０００３】このような複合基板式のサーマルヘッドに
おいて、印字および印画の線密度は基板に設ける発熱体
駆動用ＩＣ２の数量が多いほど高密度になり、解像度を
良くすることができる。しかし上述のように印刷配線基
板４に発熱体駆動用ＩＣ２として横型のものを用いた場
合、線密度は１２ドット／ｍｍが限界であった。In such a composite substrate type thermal head, the linear density of printing and printing increases as the number of heating element driving ICs 2 provided on the substrate increases, and the resolution can be improved. However, when a horizontal type is used as the heating element driving IC 2 for the printed wiring board 4 as described above, the linear density is limited to 12 dots / mm.
【０００４】本発明は上記の問題点に鑑み、線密度が高
く、かつ小型で安価な複合基板式のサーマルヘッドを提
供することを目的とする。SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide a small and inexpensive composite substrate type thermal head having a high linear density.
【０００５】[0005]
【課題を解決するための手段】本発明は上記目的を達成
するため、ヒ−トシンク上に、発熱体列を形成した基板
と外部接続用の印刷配線基板とを取り付けたサーマルヘ
ッドにおいて、複数個の発熱体駆動用ＩＣを、その一部
が前記発熱体列を形成した基板上にあり、残部が前記外
部接続用の印刷配線基板にあるように、両基板間にまた
がり千鳥状に配置したことを特徴とする。In order to achieve the above object, the present invention provides a thermal head having a heat sink on which a substrate on which a heating element array is formed and a printed wiring board for external connection are mounted. of the heating element driving IC, a portion thereof
Is on the substrate on which the heating element row is formed, and the rest is outside the substrate.
As in a printed wiring board for connection of parts , it is characterized in that it is arranged in a staggered manner over both boards.
【０００６】[0006]
【作用】本発明は上記構造を有するので、基板上に配置
するＩＣの数を増やすことができ、線密度が高くなる。Since the present invention has the above-mentioned structure, the number of ICs arranged on the substrate can be increased, and the line density can be increased.
【０００７】[0007]
【実施例】図１は本発明によるサーマルヘッドの一実施
例を示す平面図、図２は図１のＩＣ部拡大図である。図
１において、前記のように５はアルミニウム板等でなる
ヒートシンクであり、３は発熱体の集合で形成される発
熱体列１を表面に形成した基板であり、アルミナ等のセ
ラミック板あるいは金属板に絶縁膜を施したものでな
る。４は外部接続用印刷配線基板であり、例えばガラス
エポキシ樹脂等でなる絶縁板に銅箔等の導体を固着した
ものでなる。これらの基板３、４はそれぞれ該ヒートシ
ンク５上に接着により、あるいはビスもしくはリベット
等の適宜の固定具を用いて取り付けられている。FIG. 1 is a plan view showing an embodiment of a thermal head according to the present invention, and FIG. 2 is an enlarged view of an IC portion of FIG. In FIG. 1, 5 is a heat sink made of an aluminum plate or the like as described above, and 3 is a substrate on the surface of which a heating element array 1 formed of a group of heating elements is formed. With an insulating film. Reference numeral 4 denotes a printed wiring board for external connection, which is formed by fixing a conductor such as a copper foil to an insulating plate made of, for example, glass epoxy resin. These substrates 3 and 4 are mounted on the heat sink 5 by bonding or using appropriate fixing tools such as screws or rivets.
【０００８】２は発熱体駆動用の横型ＩＣであり、該横
型ＩＣ２は、その一部が発熱体列形成基板３上にあり、
残部が印刷配線基板４上にあるように千鳥状に配置す
る。本実施例においては、発熱体形成基板３上のＩＣ２
と印刷配線基板４上のＩＣ２とが、オ−バ−ラップ代Ｚ
を有するように配置している。Reference numeral 2 denotes a horizontal IC for driving a heating element, and a part of the horizontal IC 2 is on a heating element row forming substrate 3;
The remaining portions are arranged in a staggered manner so as to be on the printed wiring board 4 . In the present embodiment, the IC 2 on the heating element forming substrate 3
And the IC 2 on the printed wiring board 4 are overlapped with each other.
It is arranged so that it may have.
【０００９】図２はＩＣ２に接続される導体パターンを
示す図であり、発熱体列１を構成する各発熱体１ａと各
ＩＣ２の出力端子とは、ＩＣ２の１個に対して複数個の
発熱体１ａに対応させて、該基板３上に形成された導体
７およびボンディングワイヤ１２で接続している。また
基板３上のＩＣ２の入力端子は基板３上の導体６にボン
ディングワイヤ１１で接続し、該導体６を印刷配線基板
４上の導体９とボンディングワイヤ１０で接続してい
る。印刷配線基板４上のＩＣ２の入力端子は印刷配線基
板４上の導体６とボンディングワイヤ１３で接続し、印
刷配線基板４上のＩＣ２の出力端子は発熱体列形成基板
３上の導体７とボンディングワイヤ１４で接続してい
る。FIG. 2 is a view showing a conductor pattern connected to the IC 2. Each heating element 1 a constituting the heating element array 1 and the output terminal of each IC 2 are provided with a plurality of heating elements for one IC 2. The conductors 7 formed on the substrate 3 and the bonding wires 12 are connected so as to correspond to the body 1a. The input terminal of the IC 2 on the board 3 is connected to the conductor 6 on the board 3 by a bonding wire 11, and the conductor 6 is connected to the conductor 9 on the printed wiring board 4 by a bonding wire 10. The input terminal of the IC 2 on the printed wiring board 4 is connected to the conductor 6 on the printed wiring board 4 by a bonding wire 13, and the output terminal of the IC 2 on the printed wiring board 4 is bonded to the conductor 7 on the heating element row forming board 3. They are connected by wires 14.
【００１０】上記のようにＩＣ２を発熱体列形成基板３
と印刷配線基板４上に分割して千鳥状に配置すれば、両
基板の大きさを変えずにＩＣ２の搭載数量を増やすこと
ができ、線密度を１６ドット／ｍｍ程度まで高密度化す
ることができる。As described above, the IC 2 is connected to the heating element row forming substrate 3.
And arranging them in a zigzag pattern on the printed wiring board 4, it is possible to increase the number of mounted ICs 2 without changing the size of both boards, and to increase the line density to about 16 dots / mm. Can be.
【００１１】ここで、発熱体列形成基板３は、成膜チャ
ンバに入れてグレーズ層、電極、発熱抵抗体等を形成す
るが、その成膜を能率良く行えるか否かがサーマルヘッ
ドのコストを大きく左右する。すなわち、成膜チャンバ
内に収容できる基板３の数を多くすることができれば、
生産性が良くなるので、コスト低減が達成できる。仮
に、発熱体列形成基板３上のみにすべてのＩＣ２を千鳥
状に搭載したとすれば、該基板３の幅ａ（図１参照）が
大きくなり、該基板３の成膜チャンバに収容可能数が減
少し、コスト高を招く。一方、本実施例によれば、発熱
体列形成基板３の幅ａを増加させる必要がないため、成
膜チャンバに収容する基板３の数を減少させることがな
く、高密度で廉価な、しかも基板３のサイズの小さなサ
ーマルヘッドが提供できる。また、本実施例のように、
ＩＣ２間にオーバーラップ代Ｚを持たせれば、ＩＣ２の
搭載数量をより増加させることができる。Here, the heating element row forming substrate 3 is placed in a film forming chamber to form glaze layers, electrodes, heat generating resistors, etc. The cost of the thermal head depends on whether the film formation can be performed efficiently. It depends greatly. That is, if the number of substrates 3 that can be accommodated in the film forming chamber can be increased,
Since productivity is improved, cost reduction can be achieved. Assuming that all the ICs 2 are mounted in a zigzag pattern only on the heating element row forming substrate 3, the width a of the substrate 3 (see FIG. 1) becomes large, and the number of substrates 3 that can be accommodated in the film forming chamber is increased. Decrease, resulting in higher costs. On the other hand, according to the present embodiment, it is not necessary to increase the width a of the heating element row forming substrate 3, so that the number of substrates 3 accommodated in the film forming chamber is not reduced, and the density and cost are reduced. A thermal head having a small size of the substrate 3 can be provided. Also, as in this embodiment,
If the overlap margin Z is provided between the ICs 2, the mounting quantity of the ICs 2 can be further increased.
【００１２】本発明は、ＩＣ２が縦型ＩＣ（入力ライン
６および出力ライン７の向きが、おおよそ、ほぼ長方形
をなすＩＣの長辺方向の向きとなるように配置されるも
の）である場合にも適用できる。縦型ＩＣは入出力端子
のレイアウトが特殊であるため、横型ＩＣ２と比べてコ
ストが高くなり、また発熱体列形成基板３の幅ａを大き
くする必要があるものの、横型ＩＣに比較してより線密
度を高めることができ、より高品質の印字、印画質が求
められる場合に採用できる。また、縦型ＩＣを用いるに
しても、発熱体列形成基板３の上に千鳥状にＩＣを配列
する場合に比較し、本発明のように基板３と４でＩＣを
分割配置すれば、該基板３の幅も従来の縦型ＩＣを１列
に配置したものと同じ幅ですむ。The present invention is applicable to the case where the IC 2 is a vertical IC (the input line 6 and the output line 7 are arranged so that the direction of the input line 6 and the output line 7 is substantially in the direction of the long side of the substantially rectangular IC). Can also be applied. Since the vertical IC has a special layout of input / output terminals, the cost is higher than that of the horizontal IC 2 and the width a of the heating element row forming substrate 3 needs to be increased. The linear density can be increased, and can be adopted when higher quality printing and printing quality are required. Even if a vertical IC is used, compared to a case where ICs are arranged in a staggered manner on the heating element row forming substrate 3, if the ICs are divided and arranged on the substrates 3 and 4 as in the present invention, the The width of the substrate 3 is the same as that of the conventional vertical ICs arranged in one row.
【００１３】[0013]
【発明の効果】請求項１によれば、発熱体列形成基板の
大きさは従来のままで搭載するＩＣの数量を増やすこと
ができるので、線密度を高密度化することができる。し
たがって成膜チャンバにおける膜形成の生産性を低下さ
せることなく、すなわち価格を大幅に上げることなく、
線密度の向上を達成できるとともに、小型のサーマルヘ
ッドを提供できる。According to the first aspect, since the number of ICs to be mounted can be increased without changing the size of the heating element row formation substrate, the line density can be increased. Therefore, without lowering the productivity of film formation in the film forming chamber, that is, without significantly increasing the price,
An improvement in linear density can be achieved, and a small thermal head can be provided.
【００１４】請求項２によれば、発熱体駆動用ＩＣとし
て横型ＩＣを使用するので、縦型ＩＣを使用する場合と
比べて、高い線密度を有するものでありながら小型で、
かつ安価なサ−マルヘッドを提供できる。According to the second aspect of the present invention, the horizontal IC is used as the heating element driving IC.
In addition, an inexpensive thermal head can be provided.
【図１】本発明によるサーマルヘッドの一実施例を示す
平面図である。FIG. 1 is a plan view showing an embodiment of a thermal head according to the present invention.
【図２】本実施例のＩＣ部の部分拡大図である。FIG. 2 is a partially enlarged view of an IC unit according to the embodiment.
【図３】（Ａ）は従来のサーマルヘッドを示す平面図、
（Ｂ）はその側面図である。FIG. 3A is a plan view showing a conventional thermal head.
(B) is a side view thereof.
１ 発熱体列 １ａ 発熱体 ２ 横型ＩＣ ３ 発熱体列形成基板 ４ 印刷配線基板 ５ ヒートシンク ６、７、９ 導体 １０〜１４ ボンディングワイヤ DESCRIPTION OF SYMBOLS 1 Heating element row 1a Heating element 2 Horizontal IC 3 Heating element row forming board 4 Printed wiring board 5 Heat sink 6, 7, 9 Conductor 10-14 Bonding wire
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) B41J 2/335 - 2/345 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) B41J 2/335-2/345
Claims (2)
板と外部接続用の印刷配線基板とを取り付けたサーマル
ヘッドにおいて、複数個の発熱体駆動用ＩＣを、その一
部が前記発熱体列を形成した基板上にあり、残部が前記
外部接続用の印刷配線基板にあるように、両基板間にま
たがり千鳥状に配置したことを特徴とするサーマルヘッ
ド。In a thermal head in which a substrate on which a heating element array is formed and a printed wiring board for external connection are mounted on a heat sink, a plurality of heating element driving ICs are provided .
Part is on the substrate on which the heating element row is formed, and the rest is
A thermal head, wherein the thermal head is arranged in a staggered manner between two substrates as in a printed wiring board for external connection .
が横型ＩＣでなることを特徴とするサーマルヘッド。2. The IC for driving a heating element according to claim 1, wherein
Is a horizontal IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4810792A JP3169671B2 (en) | 1992-02-04 | 1992-02-04 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4810792A JP3169671B2 (en) | 1992-02-04 | 1992-02-04 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05212891A JPH05212891A (en) | 1993-08-24 |
| JP3169671B2 true JP3169671B2 (en) | 2001-05-28 |
Family
ID=12794096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4810792A Expired - Lifetime JP3169671B2 (en) | 1992-02-04 | 1992-02-04 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3169671B2 (en) |
-
1992
- 1992-02-04 JP JP4810792A patent/JP3169671B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05212891A (en) | 1993-08-24 |
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