JPH05532A - Optical printing head - Google Patents
Optical printing headInfo
- Publication number
- JPH05532A JPH05532A JP15196891A JP15196891A JPH05532A JP H05532 A JPH05532 A JP H05532A JP 15196891 A JP15196891 A JP 15196891A JP 15196891 A JP15196891 A JP 15196891A JP H05532 A JPH05532 A JP H05532A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- substrate
- emitting diode
- base
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Devices (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は発光ダイオードアレイを
整列させてなる光プリントヘッドに関する。FIELD OF THE INVENTION The present invention relates to an optical printhead having an array of light emitting diode arrays.
【０００２】[0002]
【従来の技術】従来より発光ダイオードアレイを用いた
光プリントヘッドは、長さが４〜１０ｍｍの発光ダイオ
ードアレイを整列させて用いており、その発光ダイオー
ドアレイを、そのアレイの継ぎ目であっても発光領域が
印字解像度に対応した０．５〜０．０１ｍｍの所定間隔
を保つように、基板上に多数整列させているが、発光ダ
イオードアレイは点灯によって発熱するので、特開昭６
２−２１１９７２号公報のように放熱板を利用してい
る。2. Description of the Related Art Conventionally, an optical print head using a light emitting diode array has used a light emitting diode array having a length of 4 to 10 mm in an aligned manner, and the light emitting diode array is used even if it is a joint of the arrays. A large number of light emitting regions are arranged on the substrate so that the light emitting regions are kept at a predetermined interval of 0.5 to 0.01 mm corresponding to the printing resolution.
A heat radiating plate is used as in Japanese Patent Laid-Open No. 2-211972.
【０００３】一方、発光ダイオードアレイを前述のよう
に印字解像度に対応した精度で発光ダイオードを整列さ
せる方法として、特開昭５９−９０９７５号公報に示さ
れるように、発光ダイオードを予め小さい基板に固定し
てから、大きい基台上にその小さい基板を整列させる方
法があり、この方法は特に光プリントヘッドが長尺にな
ると整列作業性がよい。On the other hand, as a method for aligning the light emitting diodes in the light emitting diode array with accuracy corresponding to the printing resolution as described above, as shown in Japanese Patent Laid-Open No. 59-90975, the light emitting diodes are fixed to a small substrate in advance. Then, there is a method of aligning the small substrate on a large base, and this method has good aligning workability especially when the optical print head becomes long.
【０００４】[0004]
【発明が解決しようとする課題】この様に発熱体の下に
板状体を積層する場合には、特開昭５６−１４２０８１
号公報に示されるように積層体の熱膨張率を順次小さく
するか、又は大きくすることがなされる。When the plate-like body is laminated under the heating element as described above, JP-A-56-142081 is used.
As shown in the publication, the thermal expansion coefficient of the laminated body is gradually decreased or increased.
【０００５】然し乍ら上述の光プリントヘッドにおいて
は、この様に積層板の熱膨張率を順次変化させると、発
光ダイオードアレイの継ぎ目間隔が広がって印字ドット
間に白線が生じて印字品位を低下させたり、逆に継ぎ目
の間隔が狭まり発光ダイオードアレイ自身が互いにぶつ
かりあって損傷したり基板から剥離したりすることがあ
った。そこで、発熱により発光ダイオードアレイの継ぎ
目の間隔が変動することを考慮した所定の間隔としてお
くと、保存中の周囲の温度変化（例えば保存温度範囲＋
７０度〜−２０度）の方が駆動中の温度変化より低温範
囲を含むので保存中に発光ダイオードアレイがぶつかり
合うということになった。However, in the above-mentioned optical print head, when the coefficient of thermal expansion of the laminated plate is sequentially changed in this manner, the seam interval of the light emitting diode array is widened and a white line is generated between the print dots to deteriorate the print quality. On the contrary, the gap between the joints was narrowed, and the light emitting diode arrays themselves collided with each other and were sometimes damaged or separated from the substrate. Therefore, if a predetermined interval is set in consideration of the fact that the space between the joints of the light emitting diode array fluctuates due to heat generation, a change in ambient temperature during storage (for example, storage temperature range +
Since 70 ° C. to −20 ° C.) includes a lower temperature range than the temperature change during driving, the light emitting diode arrays collide with each other during storage.
【０００６】[0006]
【課題を解決するための手段】本発明はこの様な点を考
慮して温度による継ぎ目の間隔の変動量を少なくするも
ので、放熱板と、放熱板に載置された長尺な基台と、基
台の上に配置された基台より小さい基板と、基板の上に
整列して設けられた発光ダイオードアレイからなり、基
板の熱膨張係数は発光ダイオードアレイの熱膨張係数及
び基台の熱膨張係数のいずれよりも小さくしたもので、
また各々の基板の上に発光ダイオードアレイを複数個設
けたものである。SUMMARY OF THE INVENTION The present invention is intended to reduce the amount of variation in the gap between seams due to temperature in consideration of such a point. The heat dissipation plate and a long base mounted on the heat dissipation plate. And a substrate smaller than the base placed on the base and a light emitting diode array aligned on the substrate. The thermal expansion coefficient of the substrate is equal to that of the light emitting diode array and the base. It is smaller than any of the thermal expansion coefficients,
Also, a plurality of light emitting diode arrays are provided on each substrate.
【０００７】[0007]
【作用】発光ダイオードアレイから発生した熱は、熱膨
張係数の小さい基板を伝搬する間に温度が低下し、熱膨
張の大きい基台に基板より低い熱を伝搬させる。これに
より基台の伸びを基板の伸びと発光ダイオードの伸びが
補償しその相乗効果で継ぎ目部分の間隙の変化量は少な
くなるものと考えられる。The heat generated from the light emitting diode array lowers in temperature while propagating through the substrate having a small coefficient of thermal expansion, and causes the heat lower than that of the substrate to propagate to the base having a large thermal expansion. As a result, it is considered that the elongation of the base is compensated by the elongation of the substrate and the elongation of the light emitting diode, and the synergistic effect reduces the amount of change in the gap at the joint.
【０００８】また基板上に複数の発光ダイオードを固着
した場合、基板の上では基板の熱膨張と発光ダイオード
の熱膨張との差に相当する量しか継ぎ目の間隔が変動せ
ず、基板がある程度長い方が長さの予測が正確であり、
また発光ダイオードアレイの固着作業も容易となる。Further, when a plurality of light emitting diodes are fixed on the substrate, the distance between the joints varies on the substrate by an amount corresponding to the difference between the thermal expansion of the substrate and the thermal expansion of the light emitting diode, and the substrate is long to some extent. The more accurate the length estimate,
Further, the work of fixing the light emitting diode array becomes easy.
【０００９】[0009]
【実施例】図１は本発明実施例の光プリントヘッドの平
面図で、図２、図３はその長手方向要部、短手方向の側
面図である。なお図１、図２においては説明のためワイ
ヤボンド等の配線手段は省略してある。これらの図にお
いて、１はアルミニウム等からなる放熱板で、プリンタ
ーの主走査長さよりも長く、必要に応じてプリンターへ
の固定手段を設けてある。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view of an optical print head according to an embodiment of the present invention, and FIGS. 2 and 3 are side views in the longitudinal direction and in the lateral direction thereof. 1 and 2, wiring means such as wire bonds are omitted for the sake of explanation. In these figures, 1 is a heat dissipation plate made of aluminum or the like, which is longer than the main scanning length of the printer, and is provided with fixing means to the printer if necessary.
【００１０】２は放熱板に載置された基台で、ニッケル
鉄合金（４２Ｎｉ−Ｆｅ）等からなり、幅は１０〜５０
ｍｍであるが長さは少なくともプリンターの主走査長さ
（２１０〜１０００ｍｍ）を持つ長尺な基台である。３
は基台２の上に配置された基台２より小さい基板で、セ
ラミック混合樹脂基板からなり、表面にはプリントパタ
ーン（図示せず）を有している。４は基板３の上に１列
に整列して固着された発光ダイオードアレイで、その表
面には１列又は千鳥配置の２〜３列に整列された発光領
域４１と個別電極（図示せず）が設けられ、裏面には共
通電極（図示せず）が設けてある。発光領域４１は光プ
リンタの印字解像度に対応して０．５〜０．０１ｍｍピ
ッチで配列されており、複数の基板３を通じて光プリン
タの主走査長さの全長を網羅するように一列（千鳥配置
のときはその列数）に整列されている。Reference numeral 2 denotes a base mounted on a heat dissipation plate, which is made of nickel iron alloy (42Ni-Fe) or the like and has a width of 10 to 50.
Although the length is mm, the length is a long base which has at least the main scanning length (210 to 1000 mm) of the printer. Three
Is a substrate smaller than the base 2 arranged on the base 2, and is made of a ceramic mixed resin substrate and has a print pattern (not shown) on its surface. Reference numeral 4 denotes a light emitting diode array fixedly arranged in a row on the substrate 3, and on the surface thereof, light emitting regions 41 and individual electrodes (not shown) arranged in a row or in a staggered arrangement of 2-3 rows. And a common electrode (not shown) is provided on the back surface. The light emitting regions 41 are arranged at a pitch of 0.5 to 0.01 mm corresponding to the printing resolution of the optical printer, and are arranged in a line (staggered arrangement) so as to cover the entire main scanning length of the optical printer through the plurality of substrates 3. When the number of columns) is aligned.
【００１１】そしてこれらの構成において、発光ダイオ
ードアレイ４は基板３の上に複数個が各々導電性接着剤
などで固着されワイヤボンド等で駆動用の集積回路５に
配線が施されており、基板３は接着剤またはビスなどで
基台２に固定され、基台２はクランパー６で放熱板に圧
接されている。そして基板３に接続された端子（可撓性
基板）はクランパー６に挟まれて導出されている。In these structures, a plurality of light emitting diode arrays 4 are fixed on the substrate 3 by a conductive adhesive or the like, and wiring is provided to the driving integrated circuit 5 by wire bonding or the like. Reference numeral 3 is fixed to the base 2 with an adhesive or screws, and the base 2 is pressed against the heat sink by a clamper 6. The terminal (flexible substrate) connected to the substrate 3 is sandwiched by the clamper 6 and led out.
【００１２】この様な構成において、各々の熱膨張係数
と熱伝導率は以下の如くである。 発光ダイオード：熱膨張率６．４×１０-6／熱伝導率５
４．０ｗ／ｍ・ｋ 導電性接着剤：熱膨張率４０〜８０×１０-6／熱伝導率
２．１ｗ／ｍ・ｋ 基板：熱膨張率３．８×１０-6／熱伝導率０．９ｗ／ｍ
・ｋ 基台：熱膨張率４．６×１０-6／熱伝導率１４．６ｗ／
ｍ・ｋ 放熱板：熱膨張率２３．０×１０-6／熱伝導率２３６．
０ｗ／ｍ・ｋ なお、基板や基台として従来から良く用いられているセ
ラミックプレートは、熱膨張率７．０×１０-6／熱伝導
率２０．０ｗ／ｍ・ｋである。このように基板３の熱膨
張係数は発光ダイオードアレイ４の熱膨張係数及び基台
２の熱膨張係数のいずれよりも小さくなっている。In such a structure, the thermal expansion coefficient and the thermal conductivity of each are as follows. Light-emitting diode: coefficient of thermal expansion 6.4 × 10 −6 / heat conductivity 5
4.0 w / m · k Conductive adhesive: thermal expansion coefficient 40 to 80 × 10 −6 / thermal conductivity 2.1 w / m · k Substrate: thermal expansion coefficient 3.8 × 10 −6 / thermal conductivity 0 .9 w / m
・ K base: thermal expansion coefficient 4.6 × 10 -6 / thermal conductivity 14.6w /
m · k radiator plate: thermal expansion coefficient 23.0 × 10 −6 / thermal conductivity 236.
0 w / m · k A ceramic plate that has been conventionally often used as a substrate or a base has a thermal expansion coefficient of 7.0 × 10 −6 / thermal conductivity of 20.0 w / m · k. Thus, the thermal expansion coefficient of the substrate 3 is smaller than both the thermal expansion coefficient of the light emitting diode array 4 and the thermal expansion coefficient of the base 2.
【００１３】この構成において、基板４として２１５．
５ｍｍの長さのものを４枚用い、Ａ０版用の光プリント
ヘッドを構成したとき、基板４の相互間隔を０．０１ｍ
ｍ、長さ８ｍｍの発光ダイオードアレイ４の相互間隔を
１０μｍとし、黒率９０％で駆動したとき、発光ダイオ
ードアレイ４の温度７５度、放熱板１の温度４５度で基
板間隔は−２．９μｍ、基板３の継ぎ目での発光ダイオ
ードアレイ４の間隔は−４．２μｍ、基板３上の発光ダ
イオードアレイ４の間隔は−１．３μｍとなった。これ
は基板として従来から良く用いているセラミックを利用
したとき、同じ条件で基板間隔は−１０．５μｍ、基板
３の継ぎ目での発光ダイオードアレイ４の間隔は−１
１．５μｍ、基板３上の発光ダイオードアレイ４の間隔
は−０．５μｍに比較し、著しく小さい。そして実際に
光プリンターで利用されるのはもっと低い黒率であっ
て、標準原稿を百枚連続印写したときの継ぎ目のドット
間隔は平均−０．７８μｍの変動であった。また保存温
度範囲である７０〜−２０度において、継ぎ目の変動は
＋８μｍ〜−７μｍであった。In this structure, as the substrate 4, 215.
When an optical print head for A0 plate is constructed by using four sheets having a length of 5 mm, the mutual distance between the substrates 4 is 0.01 m.
When the mutual spacing between the light emitting diode arrays 4 having a length of m and a length of 8 mm is set to 10 μm and the black ratio is 90%, the temperature of the light emitting diode array 4 is 75 °, the temperature of the heat sink 1 is 45 °, and the substrate spacing is −2.9 μm. The distance between the light emitting diode arrays 4 at the joint of the substrate 3 was -4.2 μm, and the distance between the light emitting diode arrays 4 on the substrate 3 was -1.3 μm. This is because when ceramics which have been conventionally used as a substrate are used, the substrate spacing is -10.5 μm under the same conditions, and the spacing of the light emitting diode array 4 at the joint of the substrates 3 is -1.
The distance between the light emitting diode arrays 4 on the substrate 3 is 1.5 μm, which is significantly smaller than that of −0.5 μm. The lower black ratio is actually used in the optical printer, and the dot interval of the joint at the time of printing 100 standard originals continuously has an average variation of −0.78 μm. In addition, in the storage temperature range of 70 to -20 degrees, the seam variation was +8 μm to −7 μm.
【００１４】この様に発光ダイオードの継ぎ目のドット
間隔の変動が少ない理由は、以下のように考えられる。
即ち、発光ダイオードから発生した熱は、基板を伝搬
し、基台を伝搬し、放熱板において外部に放出される
が、各々の板状体を伝搬する間に温度が低下する。従っ
て高温となる基板の熱膨張率が小さいと、基台の熱膨張
をむしろ補償するように働き、さらに発光ダイオードア
レイは最も高温で伸び量も大きいので、これらの相乗効
果で継ぎ目部分の間隙の変化量は極めて少なくなるもの
と考えられる。また基板上に複数の発光ダイオードを固
着した場合、基板の上では基板の熱膨張と発光ダイオー
ドの熱膨張との差に相当する量しか継ぎ目の間隔が変動
しない。The reason why the variation in the dot spacing at the joint of the light emitting diode is small is considered as follows.
That is, the heat generated from the light emitting diode propagates through the substrate, propagates through the base, and is radiated to the outside at the heat radiating plate, but the temperature lowers while propagating through each plate. Therefore, when the coefficient of thermal expansion of the substrate, which becomes high temperature, is small, it works rather to compensate for the thermal expansion of the base. Further, since the light emitting diode array has the highest elongation at the highest temperature, the synergistic effect of these causes a gap in the joint portion The amount of change is considered to be extremely small. Further, when a plurality of light emitting diodes are fixed on the substrate, the space between the seams varies on the substrate by an amount corresponding to the difference between the thermal expansion of the substrate and the thermal expansion of the light emitting diode.
【００１５】[0015]
【発明の効果】以上の如く複数に分割した基板を用いて
光プリンターを構成する場合であっても、発光ダイオー
ドアレイの間隔は少ない変動であり、分割基板を用いる
ことによる組立て易さ等はそのままを利用できる。As described above, even when an optical printer is constructed using a plurality of divided substrates, the intervals between the light emitting diode arrays vary little, and the ease of assembling by using the divided substrates remains unchanged. Is available.
【図１】本発明実施例の光プリントヘッドの平面図であ
る。FIG. 1 is a plan view of an optical print head according to an embodiment of the present invention.
【図２】図１の長手方向の要部側面図である。FIG. 2 is a side view of a main part in the longitudinal direction of FIG.
【図３】図１の短手方向の側面図である。FIG. 3 is a side view in the lateral direction of FIG.
１ 放熱板 ２ 基台 ３ 基板 ４ 発光ダイオードアレイ 1 Heat sink 2 Base 3 Substrate 4 Light emitting diode array
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 33/00 Ｎ 8934−4Ｍ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H01L 33/00 N 8934-4M
Claims (1)
台と、基台の上に配置された複数の基板と、基板の上に
整列された複数の発光領域を持つ複数の発光ダイオード
アレイからなり、前記発光領域は、複数の基板を通じて
一列に整列されていることを特徴とする光プリントヘッ
ド。 【請求項２】 放熱板と、放熱板に載置された長尺な基
台と、基台の上に配置された基台より小さい基板と、基
板の上に整列して設けられた発光ダイオードアレイから
なり、前記基板の熱膨張係数は発光ダイオードアレイの
熱膨張係数及び基台の熱膨張係数のいずれよりも小さい
ことを特徴とする光プリントヘッド。Claim: What is claimed is: 1. A heat dissipation plate, an elongated base mounted on the heat dissipation plate, a plurality of substrates arranged on the base, and a plurality of substrates arranged on the substrate. And a plurality of light emitting diode arrays each having a plurality of light emitting regions, the light emitting regions being arranged in a line through a plurality of substrates. 2. A heat dissipation plate, an elongated base mounted on the heat dissipation plate, a substrate smaller than the base arranged on the base, and light-emitting diodes arranged on the substrate in alignment. An optical print head comprising an array, wherein a thermal expansion coefficient of the substrate is smaller than both a thermal expansion coefficient of the light emitting diode array and a thermal expansion coefficient of the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15196891A JP2983692B2 (en) | 1991-06-24 | 1991-06-24 | Optical print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15196891A JP2983692B2 (en) | 1991-06-24 | 1991-06-24 | Optical print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05532A true JPH05532A (en) | 1993-01-08 |
| JP2983692B2 JP2983692B2 (en) | 1999-11-29 |
Family
ID=15530157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15196891A Expired - Fee Related JP2983692B2 (en) | 1991-06-24 | 1991-06-24 | Optical print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2983692B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5658024A (en) * | 1995-02-17 | 1997-08-19 | Bachmann Inc. | Expansion joint with a sloped cavity and improved fabric clamping |
| JP2008011230A (en) * | 2006-06-29 | 2008-01-17 | Ricoh Co Ltd | Optical device, image reading device, and image forming device |
| JP2015226249A (en) * | 2014-05-29 | 2015-12-14 | 株式会社沖データ | Semiconductor device, image forming apparatus using semiconductor device, and image reading device |
-
1991
- 1991-06-24 JP JP15196891A patent/JP2983692B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5658024A (en) * | 1995-02-17 | 1997-08-19 | Bachmann Inc. | Expansion joint with a sloped cavity and improved fabric clamping |
| JP2008011230A (en) * | 2006-06-29 | 2008-01-17 | Ricoh Co Ltd | Optical device, image reading device, and image forming device |
| JP2015226249A (en) * | 2014-05-29 | 2015-12-14 | 株式会社沖データ | Semiconductor device, image forming apparatus using semiconductor device, and image reading device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2983692B2 (en) | 1999-11-29 |
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