JPH06305193A - Optical printing head - Google Patents
Optical printing headInfo
- Publication number
- JPH06305193A JPH06305193A JP10104793A JP10104793A JPH06305193A JP H06305193 A JPH06305193 A JP H06305193A JP 10104793 A JP10104793 A JP 10104793A JP 10104793 A JP10104793 A JP 10104793A JP H06305193 A JPH06305193 A JP H06305193A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- lens array
- light emitting
- light emission
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Facsimile Heads (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は光像の輪郭が明瞭な光プ
リントヘッドを提供する。FIELD OF THE INVENTION The present invention provides an optical printhead having a well defined optical image.
【０００２】[0002]
【従来の技術】従来より数多くの光プリントヘッドが開
発されているが、その中で例えば特開昭６２−２８２９
５７号公報による光プリントヘッドを図５の断面図に従
い説明する。この図に於て、表面に整列して露出した発
光領域を有する発光ダイオード４１と集積回路４２が基
板４３上に載置され、各々配線されている。レンズアレ
イ４４が発光ダイオード４１の上方に位置する様に、支
持具４５、４６に固定され、支持具４５、４６が放熱体
４７に固定されている。2. Description of the Related Art Many optical print heads have been developed in the past, and among them, for example, Japanese Patent Laid-Open No. 62-2829.
An optical print head according to Japanese Patent No. 57 will be described with reference to the sectional view of FIG. In this figure, a light emitting diode 41 having a light emitting region aligned and exposed on the surface and an integrated circuit 42 are placed on a substrate 43 and are respectively wired. The lens array 44 is fixed to the supports 45 and 46 so that the lens array 44 is located above the light emitting diode 41, and the supports 45 and 46 are fixed to the heat radiator 47.
【０００３】[0003]
【発明が解決しようとする課題】しかして上述の光プリ
ントヘッド４８では、略クランク状の支持具４５、４６
によりレンズアレイ４４が固定されているが、この支持
具４５、４６はクランク状のため傾き易い。従って発光
ダイオード４１の発光領域の中心とレンズアレイ４４の
中心がずれ、かつ両者間の距離が所定の長さに維持しに
くいので、感光ドラム４９上の光像の輪郭が不明瞭にな
る第１の欠点がある。更に基板４３上に発光ダイオード
４１と集積回路４２が並列して載置されるため、光プリ
ントヘッド４８の幅Ｇは約５０mmと幅広になる。それ故
に、この光プリントヘッド４８を用いた光プリンタ等に
於て、感光ドラム４９の周辺に配置されるクリーニング
装置と帯電器等（図示せず）が配置されるスペースが狭
くなる第２の欠点がある。故に本発明はかかる欠点を鑑
みて、光像の輪郭が明瞭なかつ幅が小さい光プリントヘ
ッドを提供するものである。However, in the above-described optical print head 48, the substantially crank-shaped supporting members 45, 46 are provided.
Although the lens array 44 is fixed by, the supporting members 45 and 46 are easily cranked because they are crank-shaped. Therefore, the center of the light emitting area of the light emitting diode 41 and the center of the lens array 44 are deviated, and it is difficult to maintain the distance between them at a predetermined length, so that the contour of the optical image on the photosensitive drum 49 becomes unclear. There is a drawback of. Further, since the light emitting diode 41 and the integrated circuit 42 are mounted in parallel on the substrate 43, the width G of the optical print head 48 becomes as wide as about 50 mm. Therefore, in an optical printer or the like using the optical print head 48, the second drawback is that the space for arranging the cleaning device and the charger (not shown) arranged around the photosensitive drum 49 is narrowed. There is. Therefore, in view of such drawbacks, the present invention provides an optical print head having a clear outline of an optical image and a small width.
【０００４】[0004]
【課題を解決するための手段】本発明は上述の課題を解
決するために、同一平面に位置し又は高さが平行かつ段
違いに位置する様に第１及び第２載置面が形成された放
熱体と、その放熱体の第１載置面に配置された長尺な基
板と、その基板の長尺方向に沿って基板上に載置されか
つ基板の長尺な端面に平行に位置する様に側面に於て整
列して露出した複数の発光領域が形成された発光ダイオ
ードと、底面が前記放熱体の第２載置面上に配置されか
つ側面が前記発光領域の延長上に位置する前記基板の端
面に当接されたレンズアレイを設けるものである。According to the present invention, in order to solve the above-mentioned problems, the first and second mounting surfaces are formed so as to be located on the same plane or in parallel and stepwise. A heat radiator, a long substrate arranged on the first mounting surface of the heat radiator, and a heat sink placed on the substrate along the long direction of the substrate and positioned parallel to the long end surface of the substrate. A light emitting diode in which a plurality of light emitting regions aligned and exposed on the side surface are formed, a bottom surface is disposed on the second mounting surface of the heat radiator, and a side surface is located on an extension of the light emitting area. A lens array is provided in contact with the end surface of the substrate.
【０００５】[0005]
【作用】本発明は上述の様に、発光領域を有する発光ダ
イオードが基板を介して放熱体の第１載置面上に配置さ
れ、第１載置面と同一平面に位置し又はそれと高さが平
行かつ段違いに位置する第２載置面上に、レンズアレイ
が配置されている。故に発光領域の中心の高さ位置とレ
ンズアレイの中心の高さ位置を正確に一致させることが
できる。また発光領域が基板の端面と平行に位置し、か
つレンズアレイの側面が基板の端面に当接しているの
で、発光領域とレンズアレイの側面との距離は所定の長
さに正確に一致させることができる。According to the present invention, as described above, the light emitting diode having the light emitting region is arranged on the first mounting surface of the heat radiator through the substrate, and is located on the same plane as the first mounting surface or at a height higher than that. The lens array is arranged on the second mounting surface which is parallel to and located at different levels. Therefore, the height position of the center of the light emitting region and the height position of the center of the lens array can be accurately matched. Further, since the light emitting region is located parallel to the end face of the substrate and the side surface of the lens array is in contact with the end face of the substrate, the distance between the light emitting region and the side face of the lens array must be exactly equal to the predetermined length. You can
【０００６】[0006]
【実施例】以下に本発明の実施例を図１と図２と図３に
従い説明する。図１は本実施例に係る光プリントヘッド
の断面図、図２はその光プリントヘッドに用いられる発
光ダイオードの平面図、図３は図２のＣＣ断面図であ
る。これらの図に於て、放熱体１は例えば、厚さ５〜１
０mmのアルミニウム板からなり長尺のものである。放熱
体１の表面上に同一平面に位置する第１及び第２載置面
２、３が形成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS. 1 is a sectional view of an optical print head according to the present embodiment, FIG. 2 is a plan view of a light emitting diode used in the optical print head, and FIG. 3 is a sectional view taken along CC of FIG. In these figures, the radiator 1 has, for example, a thickness of 5 to 1
It is made of 0 mm aluminum plate and is long. First and second mounting surfaces 2 and 3 located on the same plane are formed on the surface of the radiator 1.
【０００７】基板４は例えばセラミック混合樹脂又はセ
ラミック又はガラスエポキシ樹脂等からなり、厚さ０、
８〜２mm、幅１０〜２０mm、長さ２３０〜２５０mmの長
尺のものであり、その表面に導電パターン５、６、７、
８、９が形成されている。基板４は放熱体１の第１載置
面２上にビス等により又は接着剤により固定されてい
る。The substrate 4 is made of, for example, ceramic mixed resin or ceramic or glass epoxy resin, and has a thickness of 0,
The length is 8 to 2 mm, the width is 10 to 20 mm, and the length is 230 to 250 mm, and conductive patterns 5, 6, 7 are formed on the surface thereof.
8 and 9 are formed. The substrate 4 is fixed to the first mounting surface 2 of the radiator 1 with screws or the like or an adhesive.
【０００８】発光ダイオード１０は例えば、Ｎ型ＧａＡ
ｓからなる基台１１上に気相エピタキシャル成長にて不
純物のテルルが添加されたＮ型ＧａＡｓ0、6Ｐ0、4からな
る成長層１２が形成された厚さ４００μm程度のもので
あり、長さは８mm程度である。発光領域１３は成長層１
２に選択拡散法で形成されたものであり、成長層１２の
側面に整列して露出して複数個が形成されている。表面
電極１４の１端は発光領域１３とオーミック接触がとら
れ、他端は成長層１２の表面に絶縁層１５を介して形成
され、アルミニウム蒸着膜等からなる。裏面電極１６は
例えば金等からなり、基台１１の裏面全体に形成されて
いる。The light emitting diode 10 is, for example, N-type GaA.
A growth layer 12 made of N-type GaAs 0, 6 P 0, 4 to which an impurity tellurium is added is formed on a base 11 made of s by vapor phase epitaxial growth, and has a thickness of about 400 μm. Is about 8 mm. The light emitting region 13 is the growth layer 1
2 is formed by the selective diffusion method, and a plurality of them are formed in alignment with the side surface of the growth layer 12 and exposed. One end of the surface electrode 14 is in ohmic contact with the light emitting region 13, and the other end is formed on the surface of the growth layer 12 via the insulating layer 15 and is made of an aluminum vapor deposition film or the like. The back surface electrode 16 is made of, for example, gold and is formed on the entire back surface of the base 11.
【０００９】複数の発光ダイオード１０は互いに約０、
１mm離れて基板１の導電パターン５上に導電性接着剤を
介して直線状に載置されている。すなわち発光領域１３
の側面が直線状にかつ基板４の端部１７に平行になる様
に、発光ダイオード１０は基板１の長尺方向に沿って基
板１上に載置されている。基板４の導電パターン５の長
尺方向の２箇所に所定の位置決め用マーク（図示せず）
が形成され、このマークを結ぶ線が正確に基板４の端部
１７に平行になる様に設けられている。そして自動チッ
プマウンタがこれらのマークの位置を認識しながら複数
の発光ダイオード１０を載置するので、発光領域１３の
側面は基板４の端部１７と正確に平行な位置を維持され
ている。The plurality of light emitting diodes 10 are about 0 to each other,
It is linearly placed on the conductive pattern 5 of the substrate 1 at a distance of 1 mm via a conductive adhesive. That is, the light emitting region 13
The light emitting diode 10 is mounted on the substrate 1 along the longitudinal direction of the substrate 1 so that the side surface of the substrate 1 is linear and parallel to the end portion 17 of the substrate 4. Predetermined positioning marks (not shown) at two locations in the lengthwise direction of the conductive pattern 5 on the substrate 4.
Are formed so that the line connecting the marks is exactly parallel to the end portion 17 of the substrate 4. Since the automatic chip mounter mounts the plurality of light emitting diodes 10 while recognizing the positions of these marks, the side surface of the light emitting region 13 is maintained in a position accurately parallel to the end 17 of the substrate 4.
【００１０】集積回路１８は例えばシリアル入力６４ビ
ットパラレル出力のシフトレジスタとラッチレジスタと
ドライバーアレー等からなり、導電パターン６上に絶縁
性接着剤を介して固着されている。集積回路１８の入力
端子と基板４上の導電パターン７、８、９が配線され、
集積回路１８の出力端子と発光ダイオード１０の表面電
極１４が配線されている。The integrated circuit 18 comprises, for example, a serial input 64-bit parallel output shift register, a latch register, a driver array, etc., and is fixed on the conductive pattern 6 via an insulating adhesive. The input terminals of the integrated circuit 18 and the conductive patterns 7, 8, 9 on the substrate 4 are wired,
The output terminal of the integrated circuit 18 and the surface electrode 14 of the light emitting diode 10 are wired.
【００１１】レンズアレイ１９は例えばレンズ集合体を
樹脂で固定されたものであり、外形は略直方体であり、
その厚さＡは５〜７mmである。レンズアレイ１９の底面
２０は放熱体１の第２載置面３上に配置され、レンズア
レイ１９の側面２１は基板４の端面１７に当接して配置
されている。本実施例では例えば基板４は厚さ２mmのも
のが、そしてレンズアレイ１９は厚さ５mmのものが選択
されている。The lens array 19 is, for example, a lens assembly fixed with resin, and the outer shape is a substantially rectangular parallelepiped.
Its thickness A is 5 to 7 mm. The bottom surface 20 of the lens array 19 is arranged on the second mounting surface 3 of the radiator 1, and the side surface 21 of the lens array 19 is arranged in contact with the end surface 17 of the substrate 4. In this embodiment, for example, the substrate 4 having a thickness of 2 mm and the lens array 19 having a thickness of 5 mm are selected.
【００１２】基板４の表面から発光ダイオード１０の発
光領域１３の中心までの距離は０、５mmだから、放熱体
１の第１載置面２から発光領域１３の中心までの距離は
２、５mmである。第２載置面３からレンズアレイ１９の
中心までの距離は２、５mmであり、第１及び第２載置面
２、３は同一平面だから、発光領域１３の中心の高さ位
置とレンズアレイ１９の中心の高さ位置は完全に一致す
る。また第１及び第２載置面２、３は同一平面だから、
段差を設けることによる高さのばらつきの恐れがない。
この様に、発光領域１３の中心の高さとレンズアレイ１
９の中心の高さを一致させるために基板４の厚さとレン
ズアレイ１９の厚さが選択されている。Since the distance from the surface of the substrate 4 to the center of the light emitting region 13 of the light emitting diode 10 is 0, 5 mm, the distance from the first mounting surface 2 of the heat radiator 1 to the center of the light emitting region 13 is 2, 5 mm. is there. The distance from the second mounting surface 3 to the center of the lens array 19 is 2.5 mm, and since the first and second mounting surfaces 2 and 3 are on the same plane, the height position of the center of the light emitting region 13 and the lens array The height positions of the centers of 19 are exactly the same. Further, since the first and second mounting surfaces 2 and 3 are on the same plane,
There is no fear of height variations due to the provision of the steps.
Thus, the height of the center of the light emitting region 13 and the lens array 1
The thickness of the substrate 4 and the thickness of the lens array 19 are selected to match the heights of the centers of the lenses 9.
【００１３】上述の自動チップマウンタにより、基板４
の端部１７を基準として、発光ダイオード１０の位置決
めを正確を行うことができるので、発光ダイオード１０
の発光領域１３とレンズアレイ１９の側面２１までの距
離を所定の長さ±０、２mm以内に抑えることができる。
故にレンズアレイ１９の光学中心が発光領域１３の列に
焦点が合う。By the automatic chip mounter described above, the substrate 4
Since the light emitting diode 10 can be accurately positioned with reference to the end portion 17 of the light emitting diode 10,
The distance between the light emitting region 13 and the side surface 21 of the lens array 19 can be suppressed within a predetermined length ± 0, 2 mm.
Therefore, the optical center of the lens array 19 is focused on the row of the light emitting regions 13.
【００１４】回路基板２２が基板４の導電パターン（図
示せず）に接続され、その上にカバー２３が設けられて
いる。ラバー２４が回路基板２２を圧接する様に、カバ
ー２３の凹部に配置されている。カバー２３の先端はレ
ンズアレイ１９を覆う様に又は当接する様に形成されて
いる。接着剤２５はシリコン等からなり、放熱体１とレ
ンズアレイ１９の境目及びカバー２３とレンズアレイ１
９の境目に塗布されてゴミとかトナー等が発光ダイオー
ド１０等の周辺に入らない様にされている。これらの部
品により本実施例の光プリントヘッド２６が構成されて
いる。The circuit board 22 is connected to a conductive pattern (not shown) of the board 4, and a cover 23 is provided thereon. The rubber 24 is arranged in the recess of the cover 23 so that the rubber 24 presses the circuit board 22. The tip of the cover 23 is formed so as to cover or contact the lens array 19. The adhesive 25 is made of silicon or the like, and is located at the boundary between the radiator 1 and the lens array 19 and the cover 23 and the lens array 1.
It is applied at the boundary of 9 to prevent dust, toner, and the like from entering the periphery of the light emitting diode 10 or the like. The optical print head 26 of this embodiment is constituted by these components.
【００１５】上述の様に、レンズアレイの光学中心が発
光領域１３の列に焦点が合うので、感光ドラム２７上に
輪郭の明確な光像を得ることができる。また光プリント
ヘッドの幅Ｂは１３〜１８mmとなり、従来のそれと比べ
て約１／３の厚さとなる。As described above, since the optical center of the lens array is focused on the row of the light emitting regions 13, a light image with a clear contour can be obtained on the photosensitive drum 27. The width B of the optical print head is 13 to 18 mm, which is about 1/3 the thickness of the conventional one.
【００１６】次に本実施例より高輝度の光プリントヘッ
ドが得られる第２実施例を図４の断面図に従い説明す
る。放熱体２８は例えばアルミニウム板からなる長尺の
ものであり、第１載置面２９とそれに連なりかつそれと
高さが平行かつ段違いに形成された第２載置面３０が形
成されている。Next, a second embodiment in which an optical print head having a higher brightness than that of the present embodiment can be obtained will be described with reference to the sectional view of FIG. The radiator 28 is a long one made of, for example, an aluminum plate, and has a first mounting surface 29 and a second mounting surface 30 which is continuous with the first mounting surface 29 and whose height is parallel and stepped.
【００１７】基板４ａはセラミック混合樹脂等からな
り、厚さ０、８〜１、２mmの長尺のものであり、導電パ
ターン５ａ、６ａ、７ａ、８ａ、９ａが形成されてい
る。第１実施例と同じ様に基板４ａの導電パターン５
ａ、６ａ上にそれぞれ、発光ダイオード１０と集積回路
１８が載置され配線されている。The substrate 4a is made of a ceramic mixed resin or the like, has a long thickness of 0, 8 to 1, 2 mm, and has conductive patterns 5a, 6a, 7a, 8a, 9a formed thereon. The conductive pattern 5 on the substrate 4a is the same as in the first embodiment.
The light emitting diode 10 and the integrated circuit 18 are placed and wired on a and 6a, respectively.
【００１８】レンズアレイ３１は比較的厚いものが選択
され、その厚さＤは７mmであり、レンズ集合体が発光領
域１３の延長上に２列に千鳥配列したものである。その
結果光伝達率（レンズアレイを出た光量／レンズアレイ
に入る光量）が高いので、高輝度が得られる。レンズア
レイ３１の底面３２は放熱体２８の第２載置面３０上に
配置され、レンズアレイ３１の側面３３は基板４ａの端
面３４に当接して配置されている。A relatively thick lens array 31 is selected, the thickness D is 7 mm, and the lens assemblies are staggered in two rows on the extension of the light emitting region 13. As a result, the light transmittance (the amount of light leaving the lens array / the amount of light entering the lens array) is high, so that high brightness can be obtained. The bottom surface 32 of the lens array 31 is arranged on the second mounting surface 30 of the radiator 28, and the side surface 33 of the lens array 31 is arranged in contact with the end surface 34 of the substrate 4a.
【００１９】例えば基板４ａの厚さを１mmとして、放熱
体１の第１載置面２９から発光領域の中心までの距離は
１、５mmであり、第２載置面３０からレンズアレイ３１
の中心までの距離は３、５mmだから、第１及び第２載置
面２９、３０の段差Ｅは２mmに設ければ良い。For example, if the thickness of the substrate 4a is 1 mm, the distance from the first mounting surface 29 of the radiator 1 to the center of the light emitting region is 1.5 mm, and the second mounting surface 30 to the lens array 31.
Since the distance to the center of 3 is 5 mm, the step E between the first and second mounting surfaces 29 and 30 may be 2 mm.
【００２０】第１実施例と同じ様に、回路基板２２とカ
バー３５と接着剤２５が設けられ、これらの部品により
本実施例の光プリントヘッドが構成されている。上述の
様に基板４ａの厚さとレンズアレイ３１の厚さの選択に
関係なく、第１及び第２載置面の段差Ｅを所定の大きさ
に設けることにより、発光領域１３の中心の高さ位置と
レンズアレイ３１の中心の高さ位置を完全に一致させる
ことができる。また光プリントヘッドの幅Ｆは１５〜２
０mmとなり、従来のそれと比べて約１／３の厚さとな
る。Similar to the first embodiment, the circuit board 22, the cover 35 and the adhesive 25 are provided, and these components constitute the optical print head of the present embodiment. As described above, regardless of the thickness of the substrate 4a and the thickness of the lens array 31, the height E of the center of the light emitting region 13 is provided by providing the step E of the first and second mounting surfaces with a predetermined size. The position and the height position of the center of the lens array 31 can be perfectly matched. The width F of the optical print head is 15 to 2
The thickness is 0 mm, which is about 1/3 the thickness of the conventional one.
【００２１】[0021]
【発明の効果】本発明は上述の様に、発光領域を有する
発光ダイオードが基板を介して放熱体の第１載置面上に
配置され、第１載置面と同一平面に位置し又はそれと高
さが平行かつ段違いに位置する第２載置面上に、レンズ
アレイが配置されている。故に発光領域の中心の高さ位
置とレンズアレイの中心の高さ位置を正確に一致させる
ことができる。また発光領域が基板の端面と平行に位置
し、レンズアレイの側面が基板の端面に当接しているの
で、発光領域とレンズアレイの側面との距離は所定の長
さに正確に一致させることができる。その結果、レンズ
アレイの光学中心が発光領域の列に焦点が合うので、感
光ドラム上に輪郭の明瞭な光像を得ることができる。As described above, according to the present invention, the light emitting diode having the light emitting region is arranged on the first mounting surface of the heat radiator through the substrate, and is located on the same plane as the first mounting surface or with the first mounting surface. The lens array is arranged on the second mounting surface whose heights are parallel to each other and are arranged at different levels. Therefore, the height position of the center of the light emitting region and the height position of the center of the lens array can be accurately matched. Further, since the light emitting region is located in parallel with the end face of the substrate and the side surface of the lens array is in contact with the end face of the substrate, the distance between the light emitting region and the side face of the lens array can be accurately matched to a predetermined length. it can. As a result, since the optical center of the lens array is focused on the row of the light emitting region, a light image with a clear contour can be obtained on the photosensitive drum.
【００２２】また基板上に載置された発光ダイオードの
側面から発光するので、感光ドラムの接線方向に位置す
る光プリントヘッドの幅は放熱体の厚さと基板の厚さと
発光ダイオードの厚さとカバーの厚さを加えたものだか
ら、従来より細幅となる。Since light is emitted from the side surface of the light emitting diode mounted on the substrate, the width of the optical print head located in the tangential direction of the photosensitive drum is determined by the thickness of the radiator, the thickness of the substrate, the thickness of the light emitting diode, and the cover. Since the thickness is added, the width is narrower than before.
【図１】本発明の第１実施例に係る光プリントヘッドの
断面図である。FIG. 1 is a sectional view of an optical print head according to a first embodiment of the present invention.
【図２】本発明の第１実施例に係る光プリントヘッドに
用いられる発光ダイオードの平面図である。FIG. 2 is a plan view of a light emitting diode used in the optical print head according to the first exemplary embodiment of the present invention.
【図３】図２のＣＣ断面図である。FIG. 3 is a sectional view taken along line CC of FIG.
【図４】本発明の第２実施例に係る光プリントヘッドの
断面図である。FIG. 4 is a sectional view of an optical print head according to a second embodiment of the present invention.
【図５】従来の光プリントヘッドの断面図である。FIG. 5 is a cross-sectional view of a conventional optical printhead.
１ 放熱体 ２ 第１載置面 ３ 第２載置面 ４ 基板 １０ 発光ダイオード １９ レンズアレイ DESCRIPTION OF SYMBOLS 1 Heat sink 2 1st mounting surface 3 2nd mounting surface 4 Substrate 10 Light emitting diode 19 Lens array
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０４Ｎ 1/036 Ａ 8721−5Ｃ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H04N 1/036 A 8721-5C
Claims (1)
違いに位置する様に第１及び第２載置面が形成された放
熱体と、その放熱体の第１載置面に配置された長尺な基
板と、その基板の長尺方向に沿って基板上に載置されか
つ基板の長尺な端面に平行に位置する様に側面に於て整
列して露出した複数の発光領域が形成された発光ダイオ
ードと、底面が前記放熱体の第２載置面上に配置されか
つ側面が前記発光領域の延長上に位置する前記基板の端
面に当接されたレンズアレイを具備した事を特徴とする
光プリントヘッド。1. A heat radiator having first and second mounting surfaces formed so as to be located on the same plane or to be parallel and stepped in height, and the heat radiator is arranged on the first mounting surface. A long substrate and a plurality of light emitting regions that are placed on the substrate along the long direction of the substrate and are aligned and exposed on the side surface so as to be positioned parallel to the long end face of the substrate. And a lens array having a bottom surface disposed on the second mounting surface of the heat radiator and a side surface abutting on an end surface of the substrate located on an extension of the light emitting region. Characteristic optical print head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10104793A JP3316252B2 (en) | 1993-04-27 | 1993-04-27 | Optical print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10104793A JP3316252B2 (en) | 1993-04-27 | 1993-04-27 | Optical print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06305193A true JPH06305193A (en) | 1994-11-01 |
| JP3316252B2 JP3316252B2 (en) | 2002-08-19 |
Family
ID=14290219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10104793A Expired - Fee Related JP3316252B2 (en) | 1993-04-27 | 1993-04-27 | Optical print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3316252B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0985985A (en) * | 1995-09-25 | 1997-03-31 | Nippon Sheet Glass Co Ltd | Photoprinting head and rod lens unit |
| JP2006035721A (en) * | 2004-07-29 | 2006-02-09 | Kyocera Corp | Optical printer head, its manufacturing method and optical printer |
| JP2008518461A (en) * | 2004-10-25 | 2008-05-29 | クリー インコーポレイテッド | Solid metal block semiconductor light emitting device mounting substrate and package including cavity and heat sink and method for packaging them |
| JP2016091023A (en) * | 2014-11-06 | 2016-05-23 | 新科實業有限公司ＳＡＥ Ｍａｇｎｅｔｉｃｓ（Ｈ．Ｋ．）Ｌｔｄ． | Wafer-level packaged optical sub-assembly and transmission/reception module having the same |
| JP2018016009A (en) * | 2016-07-29 | 2018-02-01 | 株式会社沖データ | Exposure device and light receiving device |
-
1993
- 1993-04-27 JP JP10104793A patent/JP3316252B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0985985A (en) * | 1995-09-25 | 1997-03-31 | Nippon Sheet Glass Co Ltd | Photoprinting head and rod lens unit |
| JP2006035721A (en) * | 2004-07-29 | 2006-02-09 | Kyocera Corp | Optical printer head, its manufacturing method and optical printer |
| JP4511273B2 (en) * | 2004-07-29 | 2010-07-28 | 京セラ株式会社 | Optical printer head, manufacturing method thereof, and optical printer |
| JP2008518461A (en) * | 2004-10-25 | 2008-05-29 | クリー インコーポレイテッド | Solid metal block semiconductor light emitting device mounting substrate and package including cavity and heat sink and method for packaging them |
| JP2012089870A (en) * | 2004-10-25 | 2012-05-10 | Cree Inc | Solid metal block semiconductor light emitting device mounting substrates, package including cavity and heat sink, and method for packaging the same |
| JP2016091023A (en) * | 2014-11-06 | 2016-05-23 | 新科實業有限公司ＳＡＥ Ｍａｇｎｅｔｉｃｓ（Ｈ．Ｋ．）Ｌｔｄ． | Wafer-level packaged optical sub-assembly and transmission/reception module having the same |
| JP2018016009A (en) * | 2016-07-29 | 2018-02-01 | 株式会社沖データ | Exposure device and light receiving device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3316252B2 (en) | 2002-08-19 |
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