JP2565625Y2 - Substrate processing equipment - Google Patents
Substrate processing equipmentInfo
- Publication number
- JP2565625Y2 JP2565625Y2 JP1992069078U JP6907892U JP2565625Y2 JP 2565625 Y2 JP2565625 Y2 JP 2565625Y2 JP 1992069078 U JP1992069078 U JP 1992069078U JP 6907892 U JP6907892 U JP 6907892U JP 2565625 Y2 JP2565625 Y2 JP 2565625Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cover member
- processing apparatus
- horizontal direction
- transport direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Liquid Crystal (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Coating Apparatus (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【0001】[0001]
【産業上の利用分野】本考案は、例えば、液晶表示装置
用のガラス基板や半導体ウエハなどの基板に対し、洗浄
やエッチングなどの処理を施すために、処理室内に、基
板を水平方向に搬送する基板搬送装置を設けるととも
に、基板搬送装置で搬送される基板に処理流体を供給す
るノズルを設けた基板処理装置に関する。The present invention relates to a method of carrying a substrate such as a glass substrate for a liquid crystal display device or a semiconductor wafer in a processing chamber in order to perform a process such as cleaning or etching. The present invention relates to a substrate processing apparatus provided with a substrate transfer device that performs processing and a nozzle that supplies a processing fluid to a substrate transferred by the substrate transfer device.
【0002】[0002]
【従来の技術】上述のような基板処理装置では、洗浄液
やエッチング液や蒸気などの処理流体を基板に供給する
に伴い、蒸気そのものや処理流体が揮発した蒸気成分が
処理室の天井面とか、基板搬送装置の上方を蓋体で覆っ
たものでは、その蓋体の下向き内周面といったように、
基板搬送装置の上方を覆うカバー部材の下向き面に蒸気
や蒸気成分が付着するとともに凝結して水滴になり、そ
の水滴が被処理中の基板上に落下し、基板や処理流体を
汚染して品質が低下する問題があった。2. Description of the Related Art In a substrate processing apparatus as described above, when a processing fluid such as a cleaning liquid, an etching liquid, or a vapor is supplied to a substrate, the vapor itself or a vapor component obtained by volatilizing the processing fluid is removed from a ceiling surface of a processing chamber or the like. When the upper part of the substrate transfer device is covered with a lid, such as the downward facing inner peripheral surface of the lid,
The vapor or vapor component adheres to the downward surface of the cover member that covers the upper part of the substrate transfer device and condenses to form water droplets, which drop onto the substrate being processed, contaminating the substrate and the processing fluid, resulting in quality deterioration. There was a problem of the decrease.
【0003】そのため、従来では、上述のような問題発
生を防止するものとして次のようなものがあった。Therefore, conventionally, there have been the following methods for preventing the above-mentioned problem from occurring.
【0004】 A.第1従来例(特開平3−284386号公報) 図3の断面図に示すように、処理槽01内に、基板Wを
水平方向に搬送する基板搬送装置02と、基板Wに処理
液を噴出供給するシャワーノズル03…が設けられてい
る。処理槽01の上面が開口されるとともに、その開口
縁部の一側部が低くなるように傾斜され、更に、開口縁
に沿い、全周にわたって凹溝01aが形成されるととも
に、この凹溝01aに、蓋体04の外周縁に折り曲げ形
成されたフランジ04aが嵌合されるようになってい
る。蓋体04は平板で形成されていて、フランジ04a
を凹溝01a内に嵌合した状態で、その下向き面が基板
Wの表面に対して傾斜され、蓋体04の下向き面に付着
した水滴が傾斜に沿って下方側へ流下し、蓋体04の最
下部側に設けられた液切板04bにより基板搬送装置0
2の外側方に落下され、基板W上に水滴が落下するのを
防止するように構成されている。A. First Conventional Example (Japanese Unexamined Patent Publication No. 3-284386) As shown in a cross-sectional view of FIG. 3, a substrate transfer device 02 for transferring a substrate W in a horizontal direction into a processing tank 01, and a processing liquid is ejected to the substrate W. The shower nozzles 03 to supply are provided. The upper surface of the processing tank 01 is opened, and one side of the opening edge is inclined so as to be lower. Further, along the opening edge, a groove 01a is formed over the entire circumference, and the groove 01a is formed. In addition, a flange 04a bent and formed on the outer peripheral edge of the lid body 04 is fitted. The lid body 04 is formed of a flat plate and has a flange 04a.
Is fitted in the concave groove 01a, the downward surface thereof is inclined with respect to the surface of the substrate W, and the water droplets attached to the downward surface of the lid 04 flow downward along the inclination, and the lid 04 The liquid transport plate 04b provided at the bottom of the
2 to prevent water drops from falling onto the substrate W.
【0005】 B.第2従来例(実公昭57−43892号公報) 図4の断面図に示すように、基板Wを水平方向に搬送す
る基板搬送装置011の上方を覆う窓板012が円弧状
に形成され、その窓板012を閉じた状態で基板搬送装
置011の上方における窓板012の内面が下方に傾斜
する円形になり、窓板012の内面に付着した水滴を傾
斜に沿って下方側へ流下できるようになっている。01
3…は、腐食液を供給するノズルを示している。B. Second Conventional Example (Japanese Utility Model Publication No. Sho 57-43892) As shown in the cross-sectional view of FIG. 4, a window plate 012 that covers the upper part of a substrate transfer device 011 that transfers a substrate W in a horizontal direction is formed in an arc shape. With the window plate 012 closed, the inner surface of the window plate 012 above the substrate transfer device 011 has a circular shape inclined downward, so that water droplets attached to the inner surface of the window plate 012 can flow downward along the inclination. Has become. 01
Reference numeral 3 denotes a nozzle for supplying a corrosive liquid.
【0006】[0006]
【考案が解決しようとする課題】しかしながら、上記従
来例のいずれにおいても、次のような欠点があった。However, any of the above-mentioned prior arts has the following disadvantages.
【0007】a.第1従来例の欠点 蓋体04の下向き面に付着した水滴を傾斜に沿って流下
させるために、水平面に対してある程度の傾斜が必要で
あり、また、流下を良好にしようとするためには大きな
傾斜にすることが望ましいが、基板の搬送方向に直交す
る水平方向の一端側で、処理槽01の一側壁が高くなら
ざるを得ず、処理槽01全体として大型化してしまう欠
点があった。A. Disadvantages of the first conventional example In order to cause water droplets attached to the downward surface of the lid body 04 to flow down along the slope, a certain degree of inclination with respect to the horizontal plane is required. Although it is desirable to make the inclination large, there is a disadvantage that one side wall of the processing tank 01 must be high at one end in the horizontal direction orthogonal to the substrate transport direction, and the processing tank 01 as a whole becomes large. .
【0008】b.第2従来例の欠点 装置を小型化できるものの、基板Wの搬送方向に直交す
る水平方向の中央部の最も高い内面部分では、水平に近
い面になり、その中央部に付着した水滴が基板Wの搬送
方向に直交する水平方向に流れずに落下し、水滴の落下
を十分に防止できない欠点があった。B. Disadvantages of the second conventional example Although the apparatus can be miniaturized, the highest inner surface at the center in the horizontal direction perpendicular to the direction of transport of the substrate W becomes a nearly horizontal surface, and water droplets adhering to the central portion are formed by the substrate W There is a drawback that the water drops do not flow in the horizontal direction perpendicular to the transport direction and do not sufficiently prevent water drops from falling.
【0009】本考案は、このような事情に鑑みてなされ
たものであって、請求項1に係る考案の基板処理装置
は、装置全体の大型化を回避しながら、搬送基板上への
水滴の落下を良好に防止できるようにすることを目的と
し、また、請求項4に係る考案の基板処理装置は、搬送
基板上への水滴の落下をより良好に防止できるようにす
ることを目的とし、また、請求項5に係る考案の基板処
理装置は、カバー部材の下端から落下する水滴が飛散す
ることを防止して基板の汚染をより良好に防止できるよ
うにすることを目的とする。The present invention has been made in view of such circumstances, and the substrate processing apparatus according to the first aspect of the present invention prevents water droplets on the transfer substrate while avoiding the entire apparatus from being enlarged. The object of the present invention is to make it possible to favorably prevent falling, and the substrate processing apparatus of the present invention according to claim 4 aims to prevent water drops from falling onto a transfer substrate more appropriately. Another object of the present invention is to prevent water droplets falling from the lower end of the cover member from scattering and thereby to better prevent contamination of the substrate.
【0010】[0010]
【課題を解決するための手段】請求項1に係る考案は、
上述のような目的を達成するために、処理室内に、基板
を水平方向に搬送する基板搬送装置を設けるとともに、
前記基板搬送装置で搬送される基板に処理流体を供給す
るノズルを設けた基板処理装置において、前記基板搬送
装置の上方を覆うカバー部材の下向き面を、前記基板の
搬送方向に直交する水平方向での中央部箇所が最上部に
なるとともにその最上部から前記基板の搬送方向に直交
する水平方向での両端側に向かって下方に傾斜させ、か
つ、前記最上部を前記基板の搬送方向の少なくともいず
れか一方側に傾斜させて構成する。According to the first aspect of the present invention,
In order to achieve the object as described above, a substrate transfer device that transfers a substrate in a horizontal direction is provided in the processing chamber,
In a substrate processing apparatus provided with a nozzle for supplying a processing fluid to a substrate transported by the substrate transport apparatus, a downward surface of a cover member that covers an upper part of the substrate transport apparatus is disposed in a horizontal direction orthogonal to a transport direction of the substrate. Is located at the top and is perpendicular to the substrate transfer direction from the top.
Inclined downward toward both ends in the horizontal direction , and the uppermost portion is at least one in the transport direction of the substrate.
It is configured to be inclined to one side .
【0011】カバー部材の下向き面の基板の搬送方向に
直交する水平方向での水平面に対する傾斜角としては、
20〜60°に設定される。20°未満では、水滴の落下を防
止する効果が無く、一方、60°を越えると、装置全体が
大型化するからである(請求項2)。The inclination angle of the downward surface of the cover member with respect to the horizontal plane in the horizontal direction orthogonal to the substrate transfer direction is as follows.
Set to 20-60 °. If it is less than 20 °, there is no effect of preventing the drop of water droplets, while if it is more than 60 °, the whole apparatus becomes large (claim 2).
【0012】また、カバー部材の下向き面の最上部の基
板の搬送方向での水平面に対する傾斜角としては、10〜
30°に設定される。10°未満では、水滴の落下を防止す
る効果が無く、一方、30°を越えると、装置全体が大型
化するからである(請求項3)。The inclination angle of the uppermost portion of the downward surface of the cover member with respect to the horizontal plane in the transport direction of the substrate is 10 to
Set to 30 °. If the angle is less than 10 °, there is no effect of preventing the drop of water droplets, while if it exceeds 30 °, the entire apparatus becomes large (claim 3).
【0013】また、請求項4に係る考案の基板処理装置
は、前述のような目的を達成するために、カバー部材の
下向き面を親水性材料で形成する。親水性材料として
は、ポリアミド系、アクリル系などの親水性樹脂や親水
性ガラス、あるいは、基材に貼り付け可能な、アセチル
セルロースなどを材料とする曇止め用フィルムなどが適
用できる。Further, in the substrate processing apparatus according to the present invention, the downward surface of the cover member is formed of a hydrophilic material in order to achieve the above object. As the hydrophilic material, a hydrophilic resin such as a polyamide resin or an acrylic resin or hydrophilic glass, or an antifogging film made of acetyl cellulose or the like, which can be attached to a substrate, can be used.
【0014】また、請求項5に係る考案の基板処理装置
は、前述のような目的を達成するために、カバー部材の
下向き面の基板の搬送方向に直交する水平方向での両端
それぞれの下部に、下向き面をつたって流下する液体を
受け止めるための樋を設けて構成する。According to a fifth aspect of the present invention, there is provided a substrate processing apparatus according to the fifth aspect of the present invention, wherein a lower surface of a cover member is provided at a lower portion of each of both ends in a horizontal direction orthogonal to a substrate transport direction. It is configured by providing the trough of order receiving <br/> the liquid flows down along the downward surface.
【0015】[0015]
【作用】請求項1に係る考案の基板処理装置の構成によ
れば、カバー部材の下向き面に蒸気や蒸気成分が付着
し、それらが凝結して水滴になっても、最上部から基板
搬送方向に直交する水平方向の両端側に向かって下方に
傾斜した面に沿って流下し、また、最上部の水滴は、基
板搬送方向に向かって傾斜した面に沿って傾斜方向下方
側へ流下させながら、その流下途中において、基板搬送
方向に直交する水平方向の両端側に向かって下方に傾斜
した面に沿って流下させ、基板の上方から外れた位置に
水滴を流下させることができる。According to the structure of the substrate processing apparatus of the present invention, even if vapor or vapor components adhere to the downward surface of the cover member and condense into water droplets, the substrate is transported from the top in the substrate transport direction. While flowing down along a surface inclined downward toward both ends in the horizontal direction perpendicular to the horizontal direction, and the uppermost water droplet flowing downward along the surface inclined toward the substrate transfer direction in the inclination direction downward. In the middle of the flow, the water can flow down along a surface inclined downward toward both ends in the horizontal direction orthogonal to the substrate transport direction, and the water droplet can flow down to a position deviated from above the substrate.
【0016】また、請求項4に係る考案の基板処理装置
の構成によれば、カバー部材の下向き面に蒸気や蒸気成
分が付着するに伴い、その面方向に拡散させて水滴にな
りにくくすることができる。Further, according to the structure of the substrate processing apparatus of the present invention, as the vapor or the vapor component adheres to the downward surface of the cover member, the vapor is diffused in the direction of the surface to make it difficult to become water droplets. Can be.
【0017】また、請求項5に係る考案の基板処理装置
の構成によれば、カバー部材の下向き面の基板の搬送方
向に直交する水平方向での両端それぞれに向かって流下
した水滴を樋で回収し、基板の両側に落下させて跳ね返
った水滴が基板の下面などに飛散して付着することを回
避できる。Further, according to the configuration of the substrate processing apparatus of the present invention, water drops flowing toward both ends in the horizontal direction orthogonal to the substrate transport direction on the downward surface of the cover member are collected by the gutter. However, it is possible to avoid that water droplets dropped on both sides of the substrate and rebounded are scattered and attached to the lower surface of the substrate or the like.
【0018】[0018]
【実施例】次に、本考案の実施例を図面に基づいて詳細
に説明する。Next, an embodiment of the present invention will be described in detail with reference to the drawings.
【0019】図1は、本考案に係る基板処理装置の実施
例を示す全体横断面図、図2はその全体縦断面図であ
り、処理室1内に、基板Wを水平方向に搬送する基板搬
送装置2が設けられるとともに、基板搬送装置2の上下
それぞれに、処理流体としての洗浄液を供給するノズル
3…が設けられ、基板搬送装置2で搬送される基板Wの
上下両面を洗浄するように構成されている。FIG. 1 is an overall cross-sectional view showing an embodiment of a substrate processing apparatus according to the present invention, and FIG. 2 is an overall vertical cross-sectional view thereof. The substrate for horizontally transferring a substrate W into a processing chamber 1 is shown. A transfer device 2 is provided, and nozzles 3 for supplying a cleaning liquid as a processing fluid are provided above and below the substrate transfer device 2, respectively, so that both upper and lower surfaces of a substrate W transferred by the substrate transfer device 2 are cleaned. It is configured.
【0020】前記基板搬送装置2は、長手方向の両端側
それぞれに基板Wの幅方向両端を載置支持する鍔体4を
備えたローラ5を、所定間隔を隔てて駆動回転可能に並
設して構成され、そして、下側のノズル3…は、隣合う
ローラ5,5間のほぼ中央に位置するように設けられて
いる。The substrate transfer apparatus 2 has rollers 5 provided with flanges 4 for placing and supporting both ends in the width direction of the substrate W at both ends in the longitudinal direction so as to be driven and rotatable at predetermined intervals. The lower nozzles 3 are provided so as to be located substantially at the center between the adjacent rollers 5.
【0021】基板搬送装置2の上方を覆って山形のカバ
ー部材6が基板Wの搬送方向上手側(図2における左
側)程低くなるように設けられ、カバー部材6の下向き
面が、基板Wの搬送方向に直交する水平方向での中央部
箇所が最上部になるとともにその最上部から基板Wの搬
送方向に直交する水平方向での両端側に向かって下方に
傾斜され、かつ、最上部が基板Wの搬送方向の一方側、
本実施例では図2における左側程低くなるように傾斜さ
れている。The substrate transfer apparatus cover member 6 Yamagata covering over the 2 transport direction upstream side of the board W (left in FIG. 2
Side), the lower surface of the cover member 6 is located at the center in the horizontal direction perpendicular to the direction of transport of the substrate W, and the substrate W is transported from the uppermost portion.
It is inclined downward toward both ends in the horizontal direction perpendicular to the transport direction , and the top is one side in the transport direction of the substrate W,
In the present embodiment, it is inclined so that it becomes lower toward the left side in FIG.
【0022】カバー部材6は、基材の下向き面に親水性
材料としての曇止め用フィルムを貼り付けて構成され、
下向き面に付着した水分が面方向に拡散し、水滴が生じ
にくいようになっている。この下向き面に親水性を付与
する構成としては、カバー部材6自体を、親水性樹脂や
親水性のガラスで構成するものでも良い。The cover member 6 is formed by attaching an anti-fog film as a hydrophilic material to a downward surface of the substrate.
Water attached to the downward surface is diffused in the surface direction, so that water droplets are hardly generated. As a configuration for imparting hydrophilicity to the downward surface, the cover member 6 itself may be made of a hydrophilic resin or hydrophilic glass.
【0023】カバー部材6の下向き面の基板Wの搬送方
向に直交する水平方向での両端それぞれの下部に樋7が
傾斜状態で設けられ、下向き面をつたって流下する水分
を受け止め、基板Wに影響を及ぼさない所定箇所に流下
できるように構成されている。Gutters 7 are provided at the lower portions of both ends of the lower surface of the cover member 6 in the horizontal direction orthogonal to the direction of transport of the substrate W in an inclined state, and receive water flowing down the lower surface to receive the water flowing down. It is configured to be able to flow down to a predetermined location that has no influence.
【0024】上記実施例では、専用のカバー部材6を設
けて、その下向き面を傾斜させているが、例えば、カバ
ー部材6を設けずに処理室1の天井面を傾斜させてもよ
く、専用のカバー部材6および処理室の天井形成部材な
どをしてカバー部材と総称する。[0024] In the above embodiment, a special cover member 6 is provided, but is inclined to its lower surface, for example, it may be inclined to the ceiling surface of the processing chamber 1 without a cover member 6, The exclusive cover member 6 and the ceiling forming member of the processing chamber are collectively referred to as a cover member.
【0025】本考案としては、上述実施例のような洗浄
処理を行う基板処理装置に限らず、エッチング処理する
基板処理装置にも適用でき、洗浄液やエッチング液、更
にはフッ酸蒸気などをして処理流体と総称する。The present invention can be applied not only to the substrate processing apparatus for performing the cleaning processing as in the above-described embodiment but also to the substrate processing apparatus for performing the etching processing. Collectively referred to as processing fluid.
【0026】[0026]
【考案の効果】以上説明したように、請求項1に係る考
案の基板処理装置によれば、カバー部材の下向き面に付
着し、凝結により発生した水滴を、カバー部材の下向き
面に沿い、基板の搬送方向に直交する水平方向の中央部
から基板の搬送方向に直交する水平方向での両端側に向
かって下方に流下させるのみならず、最上部の水滴は基
板搬送方向側にも流下させ、基板の上方から外れた位置
に水滴を流下させるから、基板の搬送方向に直交する水
平方向の一方側にのみ傾斜させた従来例のように装置全
体を大型化することなく、搬送基板上への水滴の落下を
良好に防止でき、水滴による基板や処理全体の汚染を回
避して処理品質を向上できるようになった。As described above, according to the substrate processing apparatus of the first aspect of the present invention, water droplets adhered to the lower surface of the cover member and generated by the condensation are transferred along the lower surface of the cover member to the substrate. Not only does it flow downward from the central portion in the horizontal direction perpendicular to the transport direction to both ends in the horizontal direction perpendicular to the transport direction of the substrate, but the top water droplet also flows down to the substrate transport direction side, Since the water droplets flow down to a position deviated from above the substrate, the water droplets flow onto the transfer substrate without enlarging the entire apparatus as in the conventional example in which only one side in the horizontal direction perpendicular to the substrate transfer direction is inclined. The drop of water droplets can be prevented well, and contamination of the substrate and the whole process by water droplets can be avoided to improve the processing quality.
【0027】また、請求項4に係る考案の基板処理装置
によれば、カバー部材の下向き面に発生する水滴の量そ
のものを少なくするから、搬送基板上への水滴の落下を
より良好に防止し、処理品質を一層向上できるようにな
った。According to the substrate processing apparatus of the present invention, since the amount of water droplets generated on the downward surface of the cover member is reduced, it is possible to prevent the water droplets from dropping onto the transfer substrate. Thus, the processing quality can be further improved.
【0028】また、請求項5に係る考案の基板処理装置
によれば、カバー部材の下向き面に沿って流下した水滴
を樋で回収するから、落下水滴の跳ね返りに起因する基
板の汚染をも回避でき、処理品質を一層向上できるよう
になった。According to the substrate processing apparatus of the present invention, since the water droplets flowing down the downward surface of the cover member are collected by the gutter, contamination of the substrate due to the rebound of the falling water droplets is also avoided. The processing quality can be further improved.
【図1】本考案に係る基板処理装置の実施例を示す全体
横断面図である。FIG. 1 is an overall cross-sectional view showing an embodiment of a substrate processing apparatus according to the present invention.
【図2】全体縦断面図である。FIG. 2 is an overall vertical sectional view.
【図3】第1従来例を示す断面図である。FIG. 3 is a sectional view showing a first conventional example.
【図4】第2従来例を示す断面図である。FIG. 4 is a sectional view showing a second conventional example.
1…処理室 2…基板搬送装置 3…ノズル 6…カバー部材 7…樋 W…基板 DESCRIPTION OF SYMBOLS 1 ... Processing chamber 2 ... Substrate transfer apparatus 3 ... Nozzle 6 ... Cover member 7 ... Gutter W ... Substrate
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H05K 3/26 7511−4E H05K 3/26 (56)参考文献 特開 昭55−139260(JP,A) 特開 平3−284386(JP,A) 特開 平2−241582(JP,A) 特開 平1−292892(JP,A) 実開 平2−45180(JP,U) 実開 平2−133485(JP,U) 実開 平1−76758(JP,U) 実開 昭63−107656(JP,U) 実開 昭62−199945(JP,U) 実開 昭57−43892(JP,U) 実開 平1−79457(JP,U) 実開 昭60−80761(JP,U) 特公 昭56−27597(JP,B2) 実公 平1−12004(JP,Y2)────────────────────────────────────────────────── (5) Continuation of the front page (51) Int.Cl. 6 Identification number Agency reference number FI Technical indication location H05K 3/26 7511-4E H05K 3/26 (56) References JP-A-55-139260 (JP, A) JP-A-3-284386 (JP, A) JP-A-2-241582 (JP, A) JP-A-1-292892 (JP, A) JP-A-2-45180 (JP, U) JP-A-2,180 -133485 (JP, U) Actually open 1-76758 (JP, U) Actually open 63-107656 (JP, U) Actually open 62-199945 (JP, U) Actually open 57-43892 (JP, U Japanese Utility Model Application Hei 1-79457 (JP, U) Japanese Utility Model Application Sho 60-80761 (JP, U) Japanese Patent Publication No. 56-27597 (JP, B2) Japanese Utility Model Application Hei 1-12004 (JP, Y2)
Claims (5)
基板搬送装置を設けるとともに、前記基板搬送装置で搬
送される基板に処理流体を供給するノズルを設けた基板
処理装置において、 前記基板搬送装置の上方を覆うカバー部材の下向き面
を、前記基板の搬送方向に直交する水平方向での中央部
箇所が最上部になるとともにその最上部から前記基板の
搬送方向に直交する水平方向での両端側に向かって下方
に傾斜させ、かつ、前記最上部を前記基板の搬送方向の
少なくともいずれか一方側に傾斜させてあることを特徴
とする基板処理装置。1. A substrate processing apparatus, comprising: a substrate transfer device that transfers a substrate in a horizontal direction in a processing chamber; and a nozzle that supplies a processing fluid to the substrate transferred by the substrate transfer device. The downward surface of the cover member that covers the upper part of the apparatus is arranged such that the central portion in the horizontal direction perpendicular to the transport direction of the substrate becomes the uppermost portion and the substrate is
Inclined downward toward both ends in the horizontal direction orthogonal to the transport direction , and the uppermost portion in the transport direction of the substrate .
A substrate processing apparatus, wherein the substrate processing apparatus is inclined to at least one side .
の基板の搬送方向に直交する水平方向での水平面に対す
る傾斜角が20〜60°である基板処理装置。2. A substrate processing apparatus according to claim 1, wherein the inclination angle of the downward surface of the cover member with respect to a horizontal plane in a horizontal direction orthogonal to the substrate transport direction is 20 to 60 °.
下向き面の前記最上部の基板の搬送方向での水平面に対
する傾斜角が10〜30°である基板処理装置。3. The substrate processing apparatus according to claim 1 , wherein an inclination angle of a downward surface of the cover member with respect to a horizontal plane in a transport direction of the uppermost substrate is 10 to 30 °.
バー部材の下向き面が親水性材料で形成されたものであ
る基板処理装置。4. A substrate processing apparatus according to claim 1, wherein the downward surface of the cover member according to claim 1 is formed of a hydrophilic material.
バー部材の下向き面の基板の搬送方向に直交する水平方
向での両端それぞれの下部に、前記下向き面をつたって
流下する液体を受け止めるための樋を設けてある基板処
理装置。5. A liquid flowing down the lower surface of the cover member according to any one of claims 1 to 4 through the lower surface at a lower portion of each of both ends in a horizontal direction orthogonal to the substrate transport direction. the substrate processing apparatus is provided with a trough for.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1992069078U JP2565625Y2 (en) | 1992-09-07 | 1992-09-07 | Substrate processing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1992069078U JP2565625Y2 (en) | 1992-09-07 | 1992-09-07 | Substrate processing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0624780U JPH0624780U (en) | 1994-04-05 |
JP2565625Y2 true JP2565625Y2 (en) | 1998-03-18 |
Family
ID=13392195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1992069078U Expired - Lifetime JP2565625Y2 (en) | 1992-09-07 | 1992-09-07 | Substrate processing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2565625Y2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006247541A (en) * | 2005-03-11 | 2006-09-21 | Toray Ind Inc | Liquid removing device |
JP4637705B2 (en) * | 2005-09-29 | 2011-02-23 | 荒川化学工業株式会社 | Thin substrate cleaning method and apparatus |
JP6962683B2 (en) * | 2016-01-22 | 2021-11-05 | 芝浦メカトロニクス株式会社 | Board processing equipment |
CN107024790B (en) * | 2016-01-29 | 2021-04-09 | 芝浦机械电子株式会社 | Substrate processing apparatus |
JP6904694B2 (en) * | 2016-01-29 | 2021-07-21 | 芝浦メカトロニクス株式会社 | Board processing equipment |
JP7152187B2 (en) * | 2018-05-24 | 2022-10-12 | ホシザキ株式会社 | Conveyor washing machine |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5947990B2 (en) * | 1979-04-17 | 1984-11-22 | 松下電器産業株式会社 | wall |
JPS6412004U (en) * | 1987-07-14 | 1989-01-23 | ||
JPH0176758U (en) * | 1987-11-06 | 1989-05-24 | ||
JPH0429898Y2 (en) * | 1988-07-22 | 1992-07-20 | ||
JPH0245180U (en) * | 1988-09-21 | 1990-03-28 | ||
JPH03284386A (en) * | 1990-03-30 | 1991-12-16 | Shibaura Eng Works Co Ltd | Cleaning tank |
-
1992
- 1992-09-07 JP JP1992069078U patent/JP2565625Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0624780U (en) | 1994-04-05 |
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