JPH0624780U - Substrate processing equipment - Google Patents

Substrate processing equipment

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Publication number
JPH0624780U
JPH0624780U JP6907892U JP6907892U JPH0624780U JP H0624780 U JPH0624780 U JP H0624780U JP 6907892 U JP6907892 U JP 6907892U JP 6907892 U JP6907892 U JP 6907892U JP H0624780 U JPH0624780 U JP H0624780U
Authority
JP
Japan
Prior art keywords
substrate
cover member
downward
downward surface
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6907892U
Other languages
Japanese (ja)
Other versions
JP2565625Y2 (en
Inventor
次雄 中村
光明 芳谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP1992069078U priority Critical patent/JP2565625Y2/en
Publication of JPH0624780U publication Critical patent/JPH0624780U/en
Application granted granted Critical
Publication of JP2565625Y2 publication Critical patent/JP2565625Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

(57)【要約】 【目的】 装置全体の大型化を回避しながら、搬送基板
上への水滴の落下を良好に防止し、処理品質を向上す
る。 【構成】 処理室1内に、基板Wを水平方向に搬送する
基板搬送装置2を設けるとともに、その基板搬送装置2
で搬送される基板Wに処理流体を供給するノズル3…を
設け、基板搬送装置2の上方を覆うカバー部材6の下向
き面を、基板Wの搬送方向に直交する水平方向での中央
部箇所が最上部になるとともにその最上部から両端側に
向かって下方に傾斜させ、かつ、最上部Wを基板の搬送
方向に傾斜させて構成する。
(57) [Summary] [Purpose] To prevent the size of the entire device from increasing and to prevent water droplets from falling onto the transfer substrate, thereby improving the processing quality. A substrate transfer device 2 for horizontally transferring a substrate W is provided in a processing chamber 1, and the substrate transfer device 2 is provided.
Are provided with nozzles 3 for supplying a processing fluid to the substrate W transported by the above, and the downward surface of the cover member 6 that covers the upper side of the substrate transport apparatus 2 is defined by the central portion in the horizontal direction orthogonal to the transport direction of the substrate W. The uppermost portion W is inclined downward from the uppermost portion toward both ends, and the uppermost portion W is inclined in the substrate transport direction.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、例えば、液晶表示装置用のガラス基板や半導体ウエハなどの基板に 対し、洗浄やエッチングなどの処理を施すために、処理室内に、基板を水平方向 に搬送する基板搬送装置を設けるとともに、基板搬送装置で搬送される基板に処 理流体を供給するノズルを設けた基板処理装置に関する。 The present invention provides, for example, a substrate transfer device for horizontally transferring a substrate in a processing chamber in order to perform processing such as cleaning and etching on a substrate such as a glass substrate for a liquid crystal display device or a semiconductor wafer. The present invention relates to a substrate processing apparatus provided with a nozzle that supplies a processing fluid to a substrate transported by a substrate transport apparatus.

【0002】[0002]

【従来の技術】[Prior art]

上述のような基板処理装置では、洗浄液やエッチング液や蒸気などの処理流体 を基板に供給するに伴い、蒸気そのものや処理流体が揮発した蒸気成分が処理室 の天井面とか、基板搬送装置の上方を蓋体で覆ったものでは、その蓋体の下向き 内周面といったように、基板搬送装置の上方を覆うカバー部材の下向き面に蒸気 や蒸気成分が付着するとともに凝結して水滴になり、その水滴が被処理中の基板 上に落下し、基板や処理流体を汚染して品質が低下する問題があった。 In the substrate processing apparatus as described above, as the processing fluid such as the cleaning solution, the etching solution, or the vapor is supplied to the substrate, the vapor itself or the vapor component in which the processing fluid is volatilized is above the ceiling surface of the processing chamber or above the substrate transfer apparatus. When the cover is covered with a lid, steam or vapor components adhere to the downward surface of the cover member that covers the upper part of the substrate transfer device, such as the downward inner peripheral surface of the lid, and are condensed into water droplets. There has been a problem that water droplets drop onto the substrate being processed, contaminating the substrate and the processing fluid, and degrading the quality.

【0003】 そのため、従来では、上述のような問題発生を防止するものとして次のような ものがあった。Therefore, conventionally, there have been the following as means for preventing the occurrence of the above problems.

【0004】 A.第1従来例(特開平3−284386号公報) 図3の断面図に示すように、処理槽01内に、基板Wを水平方向に搬送する基 板搬送装置02と、基板Wに処理液を噴出供給するシャワーノズル03…が設け られている。処理槽01の上面が開口されるとともに、その開口縁部の一側部が 低くなるように傾斜され、更に、開口縁に沿い、全周にわたって凹溝01aが形 成されるとともに、この凹溝01aに、蓋体04の外周縁に折り曲げ形成された フランジ04aが嵌合されるようになっている。蓋体04は平板で形成されてい て、フランジ04aを凹溝01a内に嵌合した状態で、その下向き面が基板Wの 表面に対して傾斜され、蓋体04の下向き面に付着した水滴が傾斜に沿って下方 側へ流下し、蓋体04の最下部側に設けられた液切板04bにより基板搬送装置 02の外側方に落下され、基板W上に水滴が落下するのを防止するように構成さ れている。A. First Conventional Example (Japanese Patent Application Laid-Open No. 3-284386) As shown in the cross-sectional view of FIG. 3, a substrate transfer device 02 for horizontally transferring a substrate W into a processing tank 01, and a processing liquid to the substrate W. Shower nozzles 03 for jetting and supplying are provided. The upper surface of the processing bath 01 is opened, and one side of the opening edge is inclined so as to be lowered, and further, along with the opening edge, a groove 01a is formed over the entire circumference, and the groove 01a is formed. A flange 04a formed by bending the outer peripheral edge of the lid body 04 is fitted to 01a. The lid body 04 is formed of a flat plate, and in a state where the flange 04a is fitted in the groove 01a, the downward surface thereof is inclined with respect to the surface of the substrate W, so that water droplets attached to the downward surface of the lid body 04 can be prevented. To prevent water droplets from flowing down along the slope and falling to the outside of the substrate transfer device 02 by the liquid draining plate 04b provided on the lowermost side of the lid body 04, to drop onto the substrate W. It is composed of

【0005】 B.第2従来例(実公昭57−43892号公報) 図4の断面図に示すように、基板Wを水平方向に搬送する基板搬送装置011 の上方を覆う窓板012が円弧状に形成され、その窓板012を閉じた状態で基 板搬送装置011の上方における窓板012の内面が下方に傾斜する円形になり 、窓板012の内面に付着した水滴を傾斜に沿って下方側へ流下できるようにな っている。013…は、腐食液を供給するノズルを示している。B. Second conventional example (Japanese Utility Model Publication No. 57-43892) As shown in the cross-sectional view of FIG. 4, a window plate 012 covering the upper part of a substrate transfer device 011 for horizontally transferring a substrate W is formed in an arc shape. With the window plate 012 closed, the inner surface of the window plate 012 above the substrate transporting device 011 becomes a circular shape that inclines downward so that water droplets adhering to the inner surface of the window plate 012 can flow down along the inclination. It has become. Reference numerals 013 ... Show nozzles for supplying the corrosive liquid.

【0006】[0006]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら、上記従来例のいずれにおいても、次のような欠点があった。 However, each of the above conventional examples has the following drawbacks.

【0007】 a.第1従来例の欠点 蓋体04の下向き面に付着した水滴を傾斜に沿って流下させるために、水平面 に対してある程度の傾斜が必要であり、また、流下を良好にしようとするために は大きな傾斜にすることが望ましいが、基板の搬送方向に直交する水平方向の一 端側で、処理槽01の一側壁が高くならざるを得ず、処理槽01全体として大型 化してしまう欠点があった。A. Disadvantages of First Conventional Example In order to allow water droplets adhering to the downward surface of the lid body 04 to flow down along the slope, it is necessary to incline to some degree with respect to the horizontal plane, and in order to improve the flow down, Although it is desirable to make a large inclination, one side wall of the processing bath 01 is inevitably high at one end side in the horizontal direction orthogonal to the substrate transport direction, and there is a disadvantage that the processing bath 01 becomes large as a whole. It was

【0008】 b.第2従来例の欠点 装置を小型化できるものの、基板Wの搬送方向に直交する水平方向の中央部の 最も高い内面部分では、水平に近い面になり、その中央部に付着した水滴が基板 Wの搬送方向に直交する水平方向に流れずに落下し、水滴の落下を十分に防止で きない欠点があった。B. Disadvantages of Second Conventional Example Although the apparatus can be downsized, the innermost part of the horizontal center of the substrate W, which is the highest in the horizontal direction, is almost horizontal, and water droplets attached to the center part of the substrate W However, there was a drawback that it did not flow in the horizontal direction orthogonal to the transport direction of the and dropped, and it was not possible to sufficiently prevent the drop of water drops.

【0009】 本考案は、このような事情に鑑みてなされたものであって、請求項1に係る考 案の基板処理装置は、装置全体の大型化を回避しながら、搬送基板上への水滴の 落下を良好に防止できるようにすることを目的とし、また、請求項4に係る考案 の基板処理装置は、搬送基板上への水滴の落下をより良好に防止できるようにす ることを目的とし、また、請求項5に係る考案の基板処理装置は、カバー部材の 下端から落下する水滴が飛散することを防止して基板の汚染をより良好に防止で きるようにすることを目的とする。The present invention has been made in view of the above circumstances, and the substrate processing apparatus according to the first aspect of the present invention prevents water droplets on the transfer substrate while avoiding an increase in the size of the entire apparatus. It is an object of the present invention to satisfactorily prevent falling of water drops, and the substrate processing apparatus of the invention according to claim 4 is to further prevent water drops from falling onto a transfer substrate. It is another object of the substrate processing apparatus of the invention according to claim 5 to prevent water droplets falling from the lower end of the cover member from scattering and to prevent contamination of the substrate better. .

【0010】[0010]

【課題を解決するための手段】[Means for Solving the Problems]

請求項1に係る考案は、上述のような目的を達成するために、処理室内に、基 板を水平方向に搬送する基板搬送装置を設けるとともに、その基板搬送装置で搬 送される基板に処理流体を供給するノズルを設けた基板処理装置において、基板 搬送装置の上方を覆うカバー部材の下向き面を、基板の搬送方向に直交する水平 方向での中央部箇所が最上部になるとともにその最上部から両端側に向かって下 方に傾斜させ、かつ、最上部を基板の搬送方向に傾斜させて構成する。 In order to achieve the above-mentioned object, the invention according to claim 1 provides a substrate transfer device for horizontally transferring a substrate in a processing chamber and processes a substrate transferred by the substrate transfer device. In a substrate processing apparatus provided with a nozzle for supplying a fluid, a downward facing surface of a cover member that covers the upper side of the substrate transfer apparatus has a central portion in a horizontal direction orthogonal to the substrate transfer direction as the uppermost portion and its uppermost portion. Is inclined downward from both sides toward the both ends, and the uppermost portion is inclined in the substrate transport direction.

【0011】 カバー部材の下向き面の基板の搬送方向に直交する水平方向での水平面に対す る傾斜角としては、20〜60°に設定される。20°未満では、水滴の落下を防止す る効果が無く、一方、60°を越えると、装置全体が大型化するからである(請求 項2)。The inclination angle of the downward surface of the cover member with respect to the horizontal plane in the horizontal direction orthogonal to the substrate transport direction is set to 20 to 60 °. This is because if it is less than 20 °, there is no effect of preventing water droplets from falling, while if it exceeds 60 °, the size of the entire device becomes large (claim 2).

【0012】 また、カバー部材の下向き面の基板の搬送方向での水平面に対する傾斜角とし ては、10〜30°に設定される。10°未満では、水滴の落下を防止する効果が無く 、一方、30°を越えると、装置全体が大型化するからである(請求項3)。Further, the inclination angle of the downward surface of the cover member with respect to the horizontal plane in the substrate transport direction is set to 10 to 30 °. This is because if it is less than 10 °, there is no effect of preventing water droplets from falling, while if it exceeds 30 °, the size of the entire apparatus becomes large (claim 3).

【0013】 また、請求項4に係る考案の基板処理装置は、前述のような目的を達成するた めに、カバー部材の下向き面を親水性材料で形成する。 親水性材料としては、ポリアミド系、アクリル系などの親水性樹脂や親水性ガ ラス、あるいは、基材に貼り付け可能な、アセチルセルロースなどを材料とする 曇止め用フィルムなどが適用できる。Further, in the substrate processing apparatus according to the fourth aspect of the present invention, the lower surface of the cover member is made of a hydrophilic material in order to achieve the above-mentioned object. As the hydrophilic material, a polyamide-based or acrylic-based hydrophilic resin or hydrophilic glass, or an anti-fog film made of acetyl cellulose or the like that can be attached to a base material can be applied.

【0014】 また、請求項5に係る考案の基板処理装置は、前述のような目的を達成するた めに、カバー部材の下向き面の基板の搬送方向に直交する水平方向での両端それ ぞれの下部に、下向き面をつたって流下する液体を受け止めて流下する樋を設け て構成する。Further, in order to achieve the above-mentioned object, the substrate processing apparatus of the invention according to claim 5 has both ends of the downward surface of the cover member in the horizontal direction orthogonal to the substrate transport direction. A gutter is provided at the lower part of the gutter to catch the liquid flowing down through the downward surface and to flow down.

【0015】[0015]

【作用】[Action]

請求項1に係る考案の基板処理装置の構成によれば、カバー部材の下向き面に 蒸気や蒸気成分が付着し、それらが凝結して水滴になっても、最上部から基板搬 送方向に直交する水平方向の両端側に向かって下方に傾斜した面に沿って流下し 、また、最上部の水滴は、基板搬送方向に向かって傾斜した面に沿って傾斜方向 下方側へ流下させながら、その流下途中において、基板搬送方向に直交する水平 方向の両端側に向かって下方に傾斜した面に沿って流下させ、基板の上方から外 れた位置に水滴を流下させることができる。 According to the structure of the substrate processing apparatus of the first aspect of the invention, even if vapor or vapor components adhere to the downward surface of the cover member and condense into water droplets, they are orthogonal to the substrate transport direction from the top. The water droplets on the uppermost part flow down along the surfaces inclined downward toward both end sides in the horizontal direction, while the uppermost water drops flow downward along the surfaces inclined toward the substrate transfer direction. During the flow-down, it is possible to make the water drop flow down to a position deviated from the upper side of the substrate by making it flow down along the surfaces inclined downward toward both end sides in the horizontal direction orthogonal to the substrate transport direction.

【0016】 また、請求項4に係る考案の基板処理装置の構成によれば、カバー部材の下向 き面に蒸気や蒸気成分が付着するに伴い、その面方向に拡散させて水滴になりに くくすることができる。Further, according to the structure of the substrate processing apparatus of the invention as claimed in claim 4, as the vapor or the vapor component adheres to the downward surface of the cover member, it is diffused in the surface direction to form water droplets. Can be combed.

【0017】 また、請求項5に係る考案の基板処理装置の構成によれば、カバー部材の下向 き面の基板の搬送方向に直交する水平方向での両端それぞれに向かって流下した 水滴を樋で回収し、基板の両側に落下させて跳ね返った水滴が基板の下面などに 飛散して付着することを回避できる。Further, according to the structure of the substrate processing apparatus of the fifth aspect of the present invention, the water droplets flowing down toward both ends of the lower surface of the cover member in the horizontal direction orthogonal to the substrate transport direction are guttered. It is possible to avoid water droplets that have been collected by, dropped on both sides of the substrate and bounced back and scattered and attached to the lower surface of the substrate.

【0018】[0018]

【実施例】【Example】

次に、本考案の実施例を図面に基づいて詳細に説明する。 Next, an embodiment of the present invention will be described in detail with reference to the drawings.

【0019】 図1は、本考案に係る基板処理装置の実施例を示す全体横断面図、図2はその 全体縦断面図であり、処理室1内に、基板Wを水平方向に搬送する基板搬送装置 2が設けられるとともに、基板搬送装置2の上下それぞれに、処理流体としての 洗浄液を供給するノズル3…が設けられ、基板搬送装置2で搬送される基板Wの 上下両面を洗浄するように構成されている。FIG. 1 is an overall horizontal sectional view showing an embodiment of a substrate processing apparatus according to the present invention, and FIG. 2 is an overall vertical sectional view thereof, showing a substrate for horizontally transferring a substrate W into a processing chamber 1. The transfer device 2 is provided, and nozzles 3 for supplying a cleaning liquid as a processing fluid are provided on the upper and lower sides of the substrate transfer device 2 so that the upper and lower surfaces of the substrate W transferred by the substrate transfer device 2 are cleaned. It is configured.

【0020】 前記基板搬送装置2は、長手方向の両端側それぞれに基板Wの幅方向両端を載 置支持する鍔体4を備えたローラ5を、所定間隔を隔てて駆動回転可能に並設し て構成され、そして、下側のノズル3…は、隣合うローラ5,5間のほぼ中央に 位置するように設けられている。In the substrate transfer device 2, rollers 5 each having a collar body 4 for mounting and supporting both ends in the width direction of the substrate W on both ends in the longitudinal direction are arranged side by side at predetermined intervals so as to be driven and rotatable. The lower nozzles 3 ... Are provided so as to be located substantially in the center between the adjacent rollers 5 and 5.

【0021】 基板搬送装置2の上方を覆って山形のカバー部材6が、その上側部分が基板W の搬送方向上手側程低くなるように設けられ、カバー部材6の下向き面が、基板 Wの搬送方向に直交する水平方向での中央部箇所が最上部になるとともにその最 上部から両端側に向かって下方に傾斜され、かつ、最上部が基板Wの搬送方向の 一方側、本実施例では図2における左側程低くなるように傾斜されている。A chevron-shaped cover member 6 that covers the substrate transfer device 2 is provided so that its upper portion is lower toward the upper side in the transfer direction of the substrate W, and the lower surface of the cover member 6 transfers the substrate W. The central portion in the horizontal direction orthogonal to the direction is the uppermost portion and is inclined downward from the uppermost portion toward both end sides, and the uppermost portion is one side in the transport direction of the substrate W. 2 is inclined so that it becomes lower toward the left side.

【0022】 カバー部材6は、基材の下向き面に親水性材料としての曇止め用フィルムを貼 り付けて構成され、下向き面に付着した水分が面方向に拡散し、水滴が生じにく いようになっている。この下向き面に親水性を付与する構成としては、カバー部 材6自体を、親水性樹脂や親水性のガラスで構成するものでも良い。The cover member 6 is formed by sticking an anti-fog film as a hydrophilic material on the downward surface of the base material, and moisture adhering to the downward surface is diffused in the surface direction, and water drops are less likely to occur. It is like this. As a structure for imparting hydrophilicity to the downward surface, the cover member 6 itself may be made of hydrophilic resin or hydrophilic glass.

【0023】 カバー部材6の下向き面の基板Wの搬送方向に直交する水平方向での両端それ ぞれの下部に樋7が傾斜状態で設けられ、下向き面をつたって流下する水分を受 け止め、基板Wに影響を及ぼさない所定箇所に流下できるように構成されている 。A gutter 7 is provided in an inclined state at the lower portion of each end of the lower surface of the cover member 6 in the horizontal direction orthogonal to the transport direction of the substrate W, and catches the water flowing down along the lower surface. , So that it can flow down to a predetermined location that does not affect the substrate W.

【0024】 上記実施例ては、専用のカバー部材6を設けて、その下向き面を傾斜させてい るが、例えば、カバー部材6を設けずに処理室1の天井面を傾斜させても良く、 専用のカバー部材6および処理室の天井形成部材などをしてカバー部材と総称す る。In the above embodiment, the dedicated cover member 6 is provided and the downward surface thereof is inclined. However, for example, the ceiling surface of the processing chamber 1 may be inclined without providing the cover member 6, The dedicated cover member 6 and the ceiling forming member of the processing chamber are collectively referred to as a cover member.

【0025】 本考案としては、上述実施例のような洗浄処理を行う基板処理装置に限らず、 エッチング処理する基板処理装置にも適用でき、洗浄液やエッチング液、更には フッ酸蒸気などをして処理流体と総称する。The present invention is not limited to the substrate processing apparatus that performs the cleaning process as in the above-described embodiment, but can be applied to the substrate processing apparatus that performs the etching process, and the cleaning liquid, the etching liquid, and the hydrofluoric acid vapor are used. Collectively referred to as processing fluid.

【0026】[0026]

【考案の効果】[Effect of device]

以上説明したように、請求項1に係る考案の基板処理装置によれば、カバー部 材の下向き面に付着し、凝結により発生した水滴を、カバー部材の下向き面に沿 い、基板の搬送方向に直交する水平方向の中央部から両端側に向かって下方に流 下させるのみならず、最上部の水滴は基板搬送方向側にも流下させ、基板の上方 から外れた位置に水滴を流下させるから、基板の搬送方向に直交する水平方向の 一方側にのみ傾斜させた従来例のように装置全体を大型化することなく、搬送基 板上への水滴の落下を良好に防止でき、水滴による基板や処理流体の汚染を回避 して処理品質を向上できるようになった。 As described above, according to the substrate processing apparatus of the first aspect of the invention, the water droplets adhering to the downward surface of the cover member and generated by condensation are moved along the downward surface of the cover member in the substrate transfer direction. Not only is it made to flow downward from the central part in the horizontal direction perpendicular to the direction toward both ends, but the topmost water droplet is also made to flow down to the substrate transport direction side, and the water droplet is made to flow to a position deviated from above the substrate. , It is possible to satisfactorily prevent water drops from falling onto the transfer substrate without increasing the size of the entire device as in the conventional example in which only one side of the horizontal direction orthogonal to the transfer direction of the substrate is inclined, and It has become possible to improve processing quality by avoiding contamination of the processing fluid and processing fluid.

【0027】 また、請求項4に係る考案の基板処理装置によれば、カバー部材の下向き面に 発生する水滴の量そのものを少なくするから、搬送基板上への水滴の落下をより 良好に防止し、処理品質を一層向上できるようになった。Further, according to the substrate processing apparatus of the present invention, the amount of water droplets generated on the downward surface of the cover member is reduced, so that the water droplets can be more effectively prevented from falling on the transfer substrate. , The processing quality can be further improved.

【0028】 また、請求項5に係る考案の基板処理装置によれば、カバー部材の下向き面に 沿って流下した水滴を樋で回収するから、落下水滴の跳ね返りに起因する基板の 汚染をも回避でき、処理品質を一層向上できるようになった。According to the substrate processing apparatus of the fifth aspect of the present invention, since the water droplets flowing down along the downward surface of the cover member are collected by the gutter, the contamination of the substrate due to the rebound of the falling water droplets can be avoided. The processing quality can be further improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案に係る基板処理装置の実施例を示す全体
横断面図である。
FIG. 1 is an overall cross-sectional view showing an embodiment of a substrate processing apparatus according to the present invention.

【図2】全体縦断面図である。FIG. 2 is an overall vertical sectional view.

【図3】第1従来例を示す断面図である。FIG. 3 is a cross-sectional view showing a first conventional example.

【図4】第2従来例を示す断面図である。FIG. 4 is a sectional view showing a second conventional example.

【符号の説明】[Explanation of symbols]

1…処理室 2…基板搬送装置 3…ノズル 6…カバー部材 7…樋 W…基板 DESCRIPTION OF SYMBOLS 1 ... Processing chamber 2 ... Substrate transfer device 3 ... Nozzle 6 ... Cover member 7 ... Gutter W ... Substrate

フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H05K 3/26 7511−4E Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 3/26 7511-4E

Claims (5)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 処理室内に、基板を水平方向に搬送する
基板搬送装置を設けるとともに、前記基板搬送装置で搬
送される基板に処理流体を供給するノズルを設けた基板
処理装置において、 前記基板搬送装置の上方を覆うカバー部材の下向き面
を、前記基板の搬送方向に直交する水平方向での中央部
箇所が最上部になるとともにその最上部から両端側に向
かって下方に傾斜させ、かつ、前記最上部を前記基板の
搬送方向に傾斜させてあることを特徴とする基板処理装
置。
1. A substrate processing apparatus comprising a substrate transfer device for horizontally transferring a substrate in a processing chamber, and a nozzle for supplying a processing fluid to the substrate transferred by the substrate transfer device. The downward surface of the cover member that covers the upper part of the device is inclined at the central portion in the horizontal direction orthogonal to the transfer direction of the substrate to be the uppermost portion, and is inclined downward from the uppermost portion to both end sides, and A substrate processing apparatus, wherein an uppermost portion is inclined in the substrate transfer direction.
【請求項2】 請求項1に記載のカバー部材の下向き面
の基板の搬送方向に直交する水平方向での水平面に対す
る傾斜角が20〜60°である基板処理装置。
2. The substrate processing apparatus according to claim 1, wherein the downward surface of the cover member has an inclination angle of 20 to 60 ° with respect to a horizontal plane in a horizontal direction orthogonal to the substrate transport direction.
【請求項3】 請求項1または2に記載のカバー部材の
下向き面の基板の搬送方向での水平面に対する傾斜角が
10〜30°である基板処理装置。
3. The inclination angle of the downward surface of the cover member according to claim 1 or 2 with respect to the horizontal plane in the substrate transfer direction.
Substrate processing equipment that is 10-30 °.
【請求項4】 請求項1ないし3のいずれかに記載のカ
バー部材の下向き面が親水性材料で形成されたものであ
る基板処理装置。
4. A substrate processing apparatus in which the downward surface of the cover member according to claim 1 is formed of a hydrophilic material.
【請求項5】 請求項1ないし4のいずれかに記載のカ
バー部材の下向き面の基板の搬送方向に直交する水平方
向での両端それぞれの下部に、前記下向き面をつたって
流下する液体を受け止めて流下する樋を設けてある基板
処理装置。
5. The liquid which flows down through the downward surface is received at the lower portion of each end of the downward surface of the cover member according to claim 1 in the horizontal direction orthogonal to the substrate transport direction. Substrate processing equipment equipped with a gutter that flows down.
JP1992069078U 1992-09-07 1992-09-07 Substrate processing equipment Expired - Lifetime JP2565625Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1992069078U JP2565625Y2 (en) 1992-09-07 1992-09-07 Substrate processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1992069078U JP2565625Y2 (en) 1992-09-07 1992-09-07 Substrate processing equipment

Publications (2)

Publication Number Publication Date
JPH0624780U true JPH0624780U (en) 1994-04-05
JP2565625Y2 JP2565625Y2 (en) 1998-03-18

Family

ID=13392195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1992069078U Expired - Lifetime JP2565625Y2 (en) 1992-09-07 1992-09-07 Substrate processing equipment

Country Status (1)

Country Link
JP (1) JP2565625Y2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006247541A (en) * 2005-03-11 2006-09-21 Toray Ind Inc Liquid removing device
KR100839876B1 (en) * 2005-09-29 2008-06-19 아라까와 가가꾸 고교 가부시끼가이샤 Apparatus and method for cleaning of thin substrate
JP2017134392A (en) * 2016-01-22 2017-08-03 芝浦メカトロニクス株式会社 Substrate processing apparatus
CN107024790A (en) * 2016-01-29 2017-08-08 芝浦机械电子株式会社 Substrate board treatment
JP2017139453A (en) * 2016-01-29 2017-08-10 芝浦メカトロニクス株式会社 Substrate processing apparatus
JP2019201963A (en) * 2018-05-24 2019-11-28 ホシザキ株式会社 Conveyor type washer

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55139260A (en) * 1979-04-17 1980-10-30 Matsushita Electric Ind Co Ltd Wall body
JPS6412004U (en) * 1987-07-14 1989-01-23
JPH0176758U (en) * 1987-11-06 1989-05-24
JPH0245180U (en) * 1988-09-21 1990-03-28
JPH02133485U (en) * 1988-07-22 1990-11-06
JPH03284386A (en) * 1990-03-30 1991-12-16 Shibaura Eng Works Co Ltd Cleaning tank

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55139260A (en) * 1979-04-17 1980-10-30 Matsushita Electric Ind Co Ltd Wall body
JPS6412004U (en) * 1987-07-14 1989-01-23
JPH0176758U (en) * 1987-11-06 1989-05-24
JPH02133485U (en) * 1988-07-22 1990-11-06
JPH0245180U (en) * 1988-09-21 1990-03-28
JPH03284386A (en) * 1990-03-30 1991-12-16 Shibaura Eng Works Co Ltd Cleaning tank

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006247541A (en) * 2005-03-11 2006-09-21 Toray Ind Inc Liquid removing device
KR100839876B1 (en) * 2005-09-29 2008-06-19 아라까와 가가꾸 고교 가부시끼가이샤 Apparatus and method for cleaning of thin substrate
JP2017134392A (en) * 2016-01-22 2017-08-03 芝浦メカトロニクス株式会社 Substrate processing apparatus
CN107024790A (en) * 2016-01-29 2017-08-08 芝浦机械电子株式会社 Substrate board treatment
JP2017139453A (en) * 2016-01-29 2017-08-10 芝浦メカトロニクス株式会社 Substrate processing apparatus
JP2019201963A (en) * 2018-05-24 2019-11-28 ホシザキ株式会社 Conveyor type washer

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