JPS5870548A - Substrate transfer system - Google Patents

Substrate transfer system

Info

Publication number
JPS5870548A
JPS5870548A JP16929981A JP16929981A JPS5870548A JP S5870548 A JPS5870548 A JP S5870548A JP 16929981 A JP16929981 A JP 16929981A JP 16929981 A JP16929981 A JP 16929981A JP S5870548 A JPS5870548 A JP S5870548A
Authority
JP
Japan
Prior art keywords
groove
air
track
substrate
lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16929981A
Other languages
Japanese (ja)
Inventor
Katsuyuki Arii
有井 勝之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16929981A priority Critical patent/JPS5870548A/en
Publication of JPS5870548A publication Critical patent/JPS5870548A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Abstract

PURPOSE:To prevent the contamination of track by providing strip-shaped grooves along the transfer direction on the upper surface of transfer track and by giving roundness to the corner of groove and the corner of edges. CONSTITUTION:The air injection holes 2 are provided in lines 9a-9f in the transfer direction on the surface of transfer air track 1, a line of air exhaust groove 7 is provided respectively between the lines a-b, b-c, d-e, e-f along the transfer direction, and the corners of the upper edge and bottom are given gradual roundness. Also, at the center region of track between the lines c-d, similar exhaust groove 7 is provided in two lines. The intervals D1, D2 between the air injection hole lines are respectively 20mm. and 40mm., pitch p of the groove 7 is 20mm., width of flat portion between grooves is about 10mm., depth of groove 7 is about 3mm. and is given roundness of about gamma=2-3mm., and the hole 2 is inclined by about 60 degrees to the transfer direction. Since the corner of bottom part and angled portion of upper edge of the exhaust groove are given roundness, it is prevented that contaminant substances are fixed and remained within the air exhausting groove and the inside of groove can also be cleaned easily.

Description

【発明の詳細な説明】 本発明はニアやベアリング方式の基板搬送装置の改良E
llする。
DETAILED DESCRIPTION OF THE INVENTION The present invention is an improved E
I'll do it.

半導体装置やフォト・マスクの製造工程に於て半導体基
板、7オト・マスク成るいれマスク基板等の搬送手段と
してエア会ベアリング方式の基板搬送方法が用いられる
。ヒの方法に於ては基板面を器物に触れさせずに搬送が
なされるので、器物に触れることによって生ずる基板面
の汚染や損傷が防止され優れた方法である。然し従来の
エア・ベアリング方式の基板搬送装置には、下記に示す
ような基板搬送用エア・トラックの構造に起因する問題
点があった。
2. Description of the Related Art In the manufacturing process of semiconductor devices and photo masks, an air bearing type substrate transport method is used as a means for transporting semiconductor substrates, mask substrates made of seven-layer masks, and the like. In method (2), since the substrate surface is transported without touching the objects, it is an excellent method because contamination and damage to the substrate surface caused by touching objects can be prevented. However, the conventional air bearing type substrate transport apparatus has the following problems due to the structure of the air track for transporting the substrate.

第1図は従来から広く用すられているエア・ベアリング
方式の基板搬送装置に於ける要部平面図(a)、A−A
 ’矢視断面図伽)、B−B’矢祷断面図(e)である
1図に於て1はエア・トラックで該装置に於ては全面が
平面状に形成される。2は基板の搬送方向及びエア・ト
ラックlの中心方向に向って傾いて形成された噴気孔、
3社送気口、4はガイド板を示している。そして該図の
ようにエア・トラック1面が平面状に形成された従来の
基板搬送装置に於ては、第2図(断面模式図)k示すよ
うKlfl孔2から噴出され被搬送基板5を押し上は搬
送に富与した気体例えば窒素ガス(N雪 )はエア・ト
ラック1の上面と被搬送基板5の全周縁部から矢印6に
示すようにトラックl外に逃ける。
Figure 1 is a plan view (a) of the main parts of an air bearing type substrate transfer device that has been widely used in the past, and A-A.
In Figure 1, which is a sectional view taken along the line B-B' (e), numeral 1 denotes an air track, and the entire surface of the device is formed into a flat surface. 2 is a blowhole formed at an angle toward the conveyance direction of the substrate and the center direction of the air track l;
3 shows the air inlet, and 4 shows the guide plate. In the conventional substrate transport device in which the air track 1 surface is formed in a planar shape as shown in the figure, air is ejected from the Klfl hole 2 and carries the transported substrate 5 as shown in Fig. 2 (schematic cross-sectional view) k. As a result, the gas enriched in the transport, such as nitrogen gas (N snow), escapes from the upper surface of the air track 1 and the entire peripheral edge of the transported substrate 5 to the outside of the track 1 as shown by arrow 6.

そのために被搬送基板5の移動方向が不安定になり、搬
送−〇まくなされ倉かりたり、又11IIIII送基4
f5の周縁部がトラック1のガイド板4に衝突して破損
するという問題がToりた。但しwI構造に於てはエア
・トラックI−は平面状であるので、トラック1上xs
mされる汚染物質は少なく、従って被搬送基板の汚染は
少ない。
As a result, the direction of movement of the substrate 5 to be transported becomes unstable, causing the substrate 5 to be transported over and over again, or
There was a problem that the peripheral edge of f5 collided with the guide plate 4 of the truck 1 and was damaged. However, in the wI structure, air track I- is planar, so xs on track 1
Fewer contaminants are removed, and therefore less contamination of the transported substrate.

第3図は上P基板移動方向の本安定性を除去する手段を
付加した従来の基板搬送装置の要部平面図(a)及びA
−A’矢初断面図缶)である、即ち計基板搬送装置に於
ては、図に示すように基板移動方向の安定性確保の手段
としてエア・トラックl上面の噴気孔20列間に基板の
搬送方向に沿った帯状の排気溝7が設けられており、該
排気溝7から基板を押し上げ搬送に寄与した気体を搬送
方向に沿って逃がすととKより、移動方向の安定化が図
られている。然しなから該構造の基板搬送装置に於ては
、上記排気溝7が矩形状の断面形状を有しており、且つ
該排気溝7がトラック外側に面する上縁部のみに僅かに
曲面状の面とりがなされている(8は面とり部)構造で
あるために、厘角に形成されている溝底部の隅に汚染物
質が固定蓄積され、該汚染物質にLり被搬送基板が汚染
されるという問題があった。(図中3は送気孔、4はガ
イド板) 本発明は上P問題点に鑑み、被搬送基板の移動方向が安
定し、且つトラック汚染の少ないエア・トラック構造を
提供することを目的とする。
FIG. 3 is a plan view (a) of a main part of a conventional substrate transfer device that is equipped with a means for removing the main stability in the upper P substrate movement direction, and (A)
In other words, in the board transfer device, as shown in the figure, as a means of ensuring stability in the direction of board movement, the board is placed between 20 rows of air holes on the top surface of the air track l. A belt-shaped exhaust groove 7 is provided along the conveyance direction, and the gas that has contributed to the conveyance by pushing up the substrate is released from the exhaust groove 7 along the conveyance direction, thereby stabilizing the movement direction. ing. However, in the substrate transfer device having this structure, the exhaust groove 7 has a rectangular cross-sectional shape, and the exhaust groove 7 has a slightly curved surface only at the upper edge facing the outside of the track. Because of the chamfered structure (8 is the chamfered part), contaminants are fixed and accumulated at the corners of the bottom of the groove formed at the angle, and the contaminants are absorbed and contaminate the substrate to be transported. There was a problem with being exposed. (In the figure, 3 is an air supply hole, and 4 is a guide plate) In view of the above problem, an object of the present invention is to provide an air track structure in which the direction of movement of the substrate to be transported is stabilized and there is less track contamination. .

即ち本発−けエア・ベア1Jング方式の基板搬送装置に
於て、基板搬送用トラックの上面に、少なくとも底部の
隅及び綴部の角に丸みを持たせた溝を、基板の搬送方向
に沿りて帯状に設けてなることを特徴とする。
In other words, in the present air bearer 1J type substrate transfer device, grooves with rounded corners at least at the bottom corners and binding portions are formed on the top surface of the substrate transfer truck in the substrate transfer direction. It is characterized by being provided in a band-like manner along the length.

以下本発明を実施例に?いて、第4図に示す一実施例に
於ける要部平面図(a)、A−A’矢視断面図ら)、B
−B’矢視断面図(c)及び第5図に示す送気系統図−
を用いて詳細に説明する。
The following is an example of the present invention? A plan view (a) of main parts in one embodiment shown in FIG. 4, a sectional view taken along the line A-A', and B
- B' arrow sectional view (c) and air supply system diagram shown in Figure 5 -
This will be explained in detail using .

本発明が適用されており、且つ最大5〔吋〕のフォト・
マスク(マスク基vi)を搬送することが可能な基板搬
送装置は、例えば第4図(al、 (bl、 (c)に
示すような搬送用エア・トラックを有してなっている。
The present invention is applied, and up to 5 [inches] of photo
A substrate transport device capable of transporting a mask (mask group vi) includes a transport air track as shown in FIGS. 4(al), (bl, and (c)), for example.

即ち幅約130〔■〕程度のエア会トラック1面に基板
搬送方向に沿って整列形成されている複数列の噴気孔2
0列、例えば9aと9b、9bと9c、9dと9e、9
eと9fの間にそれぞれ基板の搬送方向に沿ったI〔条
〕の上紛部及び底部の隅になだらかな丸みを持たせた排
気溝7が、又トラック1の中心領竣即ち噴気孔列9cと
9dの間に2条の前記同様の排気11117が設けられ
る。なお皺実施例に於ては、噴気孔2は0.5〔■φ〕
、噴気孔列91と9b、9bと9 c s 9 dと9
・、9eと9fの間隔D1は201” m )、9cと
9dQ間隔り、は40〔■〕、排気溝7のピッチpFi
20(■〕、排気溝7を挾む平担領域の幅Wfは約10
〔■〕程度、排気溝7の深さdtj、約3〔■〕、該排
気溝7の底部の隅及び上縁部flKは2〜3〔■r)種
度のなだらかな丸みが形成されている。又噴気孔2の向
きは従来構造と同様基板搬送方向に対して約60〔度〕
、トラ、り1の中心方向に対して約60〔度〕傾いて形
成されている。なお図中3a* abl 3c、3d+
 3e+3fは送気孔を、4はガイド板を示す。
That is, a plurality of rows of blowholes 2 are formed in alignment along the substrate conveyance direction on one surface of an air truck with a width of about 130 [■].
0 column, e.g. 9a and 9b, 9b and 9c, 9d and 9e, 9
Between e and 9f, there is an exhaust groove 7 with gentle roundness at the top and bottom corners of the I [row] along the substrate conveyance direction, and also at the center area of the track 1, that is, the row of blowholes. Two exhaust lines 11117 similar to those described above are provided between 9c and 9d. In addition, in the wrinkled embodiment, the fumarole 2 has a diameter of 0.5 [■φ]
, fumarole rows 91 and 9b, 9b and 9 c s 9 d and 9
・, the distance D1 between 9e and 9f is 201" m), the distance between 9c and 9dQ is 40 [■], the pitch pFi of the exhaust groove 7
20 (■), the width Wf of the flat area sandwiching the exhaust groove 7 is approximately 10
The depth dtj of the exhaust groove 7 is approximately 3 [■], and the bottom corner and upper edge flK of the exhaust groove 7 are formed with a gentle roundness of 2 to 3 [■r]. There is. Also, the direction of the blowhole 2 is approximately 60 degrees with respect to the substrate transport direction, similar to the conventional structure.
, and are formed at an angle of approximately 60 degrees with respect to the center direction of the ri 1 . In addition, 3a* abl 3c, 3d+ in the figure
3e+3f indicates an air supply hole, and 4 indicates a guide plate.

そして噴出気体例えば窒素ガスN、は、第5図に示すよ
うに1第1の圧力調整器CIで例えば1.0〜1.5 
(Kf/m) K調整され、第1のフィルタ(0,5(
μm3程度)Ftを経て送気孔3c及び3dに、又第2
の圧力調整器Ctで例えば2.θ〜2.5(Kf/cj
″IK調整され、嬉2のフィルタF!を経て送気孔3b
及び38に、又第3の圧力調整器C3で例えば3.0〜
3.5(KF/al)に調整され、第3のフィルタF、
を経て送気孔3a及び3fにそれぞれ送られ、噴気孔9
a、sb、9e、9tL9s、9fからそれぞれ噴出ゼ
しめられて被搬送基板5の搬送がなされる。(図中1は
搬送用エア・トラック、2は噴気孔、4はガイド板、7
は排気溝)そして基板の搬送に寄与したN、ガスは搬送
方向に沿りて設けられた排気溝に沿って豪搬送基板の下
部から逸脱するので基板の移動方向は安定する。そして
史に本発明の構造に於ては、上記実施例のように排気溝
の底部の隅及び綴部の角になだらかな丸みが形成される
ので、排気溝内に汚染物質が固持残留せしめられること
が防止されると同時に、排気構内の清掃も容易になる。
Then, as shown in FIG.
(Kf/m) K adjusted, first filter (0,5(
(about μm3) Ft to the air supply holes 3c and 3d, and the second
For example, with the pressure regulator Ct of 2. θ~2.5(Kf/cj
``The IK is adjusted, and the air supply hole 3b passes through the filter F! of Yuki 2.
and 38, and the third pressure regulator C3, e.g.
3.5 (KF/al), the third filter F,
are sent to the blowholes 3a and 3f, respectively, through the fumarole holes 9.
A, sb, 9e, 9tL9s, and 9f are ejected and the substrate 5 to be transported is transported. (In the figure, 1 is the transport air track, 2 is the blowhole, 4 is the guide plate, 7 is the
is an exhaust groove) and the nitrogen gas that contributed to the conveyance of the substrate deviates from the lower part of the conveyed substrate along the exhaust groove provided along the conveyance direction, so that the direction of movement of the substrate is stabilized. In addition, in the structure of the present invention, as in the above embodiment, the bottom corner of the exhaust groove and the corner of the binding part are gently rounded, so that contaminants are retained and remain in the exhaust groove. At the same time, cleaning of the exhaust premises is also facilitated.

なお本発明の構造は、フォト・マスク(!スク基板)に
限らず半導体基板底るいは液晶用ガラス板等の搬送に用
いるエア・ベアリング方式の基板搬送装置にも適用でき
る。
Note that the structure of the present invention is applicable not only to photo masks (!substrates) but also to air bearing-type substrate conveyance devices used for conveying semiconductor substrate bottoms, liquid crystal glass plates, and the like.

以上説明したように本発明によればエア・ベアリング方
式の基板搬送装置に於ける基板移動方向の安定性が確保
され、且つエアートラックの汚染が防止できる。従りて
本発明はフォト・マスクや半導体装置の製造工程の安定
化、製造品質向上に有効である。
As described above, according to the present invention, stability in the direction of substrate movement in an air bearing type substrate transfer device is ensured, and contamination of the air track can be prevented. Therefore, the present invention is effective in stabilizing the manufacturing process of photo masks and semiconductor devices and improving manufacturing quality.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のエア・ベアリング方式の基板搬送装置に
於ける要部平面図(a)、A−A’矢視断面図(b)及
びB−B ’矢視断面図(eJ、第2図は従来構造に於
ける基板動作説明図、第3図は基板移動方向安定化手段
を付加した従来装置の警部平面図(a)及びA−A ’
矢視断面図(b)、第4図は本発明の一実施例に於ける
要部平面図−)、A−A ’矢視断面図(b)、及びB
−B ’矢視断面図(c)、第5図は送気系統図である
。 図に於て、lは基板搬送用エア・トラック、2は噴気孔
、3及び3a〜3fは送気孔、4はガイド板、5は被搬
送基板、6は噴出ガスの経路矢印し、7は排気溝、8は
面とり部、9a〜9fは噴気孔の列、DI 及びり、は
噴気孔列の間隔、pは排気溝のピッチ、dは排気溝の深
さ、Wfは平担−領域の幅、自〜Caは圧力調整器、F
、〜Flはフィルタ、N、はv1素ガスを示す。 千 l 図 P 2 図  32 1′下
Figure 1 shows a plan view (a) of a main part of a conventional air bearing type substrate transfer device, a sectional view taken along the line A-A' (b), and a sectional view taken along the line B-B' (eJ, The figure is an explanatory diagram of board operation in a conventional structure, and Figure 3 is a plan view (a) and A-A' of a conventional device with a board movement direction stabilizing means added.
4 is a plan view of essential parts in an embodiment of the present invention, A-A' sectional view (b), and B
-B' arrow sectional view (c) and FIG. 5 are air supply system diagrams. In the figure, l is the air track for transporting the substrate, 2 is the blowhole, 3 and 3a to 3f are the air holes, 4 is the guide plate, 5 is the substrate to be transferred, 6 is the route arrow of the ejected gas, and 7 is the blowout gas route arrow. Exhaust groove, 8 is the chamfered part, 9a to 9f is the row of fumarole holes, DI is the interval between the fumarole rows, p is the pitch of the exhaust groove, d is the depth of the exhaust groove, Wf is the flat area width, auto~Ca is the pressure regulator, F
, ~Fl represents a filter, and N represents v1 elementary gas. 1,000 l Figure P 2 Figure 32 1'bottom

Claims (1)

【特許請求の範囲】[Claims] エア脅べ了りング方式の基板搬送装置に於て、基板搬送
用トラックの上面に、少なくとも底部の隅及び縁部の角
に丸みを持たせた溝を、基板の搬送方向に沿つて帯状に
設けてなることを特徴とする基板搬送装置。
In an air gripping type substrate transfer device, grooves with rounded bottom corners and edge corners are formed in a band shape along the substrate transfer direction on the top surface of the substrate transfer truck. A substrate transport device comprising:
JP16929981A 1981-10-22 1981-10-22 Substrate transfer system Pending JPS5870548A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16929981A JPS5870548A (en) 1981-10-22 1981-10-22 Substrate transfer system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16929981A JPS5870548A (en) 1981-10-22 1981-10-22 Substrate transfer system

Publications (1)

Publication Number Publication Date
JPS5870548A true JPS5870548A (en) 1983-04-27

Family

ID=15883940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16929981A Pending JPS5870548A (en) 1981-10-22 1981-10-22 Substrate transfer system

Country Status (1)

Country Link
JP (1) JPS5870548A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003086917A1 (en) * 2002-04-18 2003-10-23 Olympus Corporation Substrate conveying device
JP2006008350A (en) * 2004-06-28 2006-01-12 Motoyama:Kk Object floating unit and object floating device
WO2008062831A1 (en) * 2006-11-22 2008-05-29 Sinfonia Technology Co., Ltd. Air floatation conveyance device and method of conveyance using air
JP2009040598A (en) * 2007-08-10 2009-02-26 Shinko Electric Co Ltd Air floatation transportation device, air floatation unit, and air floatation transportation method
CN101941593A (en) * 2010-09-02 2011-01-12 立晔科技股份有限公司 Chip conveyer table with turning function

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003086917A1 (en) * 2002-04-18 2003-10-23 Olympus Corporation Substrate conveying device
KR100848229B1 (en) * 2002-04-18 2008-07-24 올림푸스 가부시키가이샤 Substrate conveying device
KR100848228B1 (en) * 2002-04-18 2008-07-24 올림푸스 가부시키가이샤 Substrate conveying device
JP2006008350A (en) * 2004-06-28 2006-01-12 Motoyama:Kk Object floating unit and object floating device
WO2008062831A1 (en) * 2006-11-22 2008-05-29 Sinfonia Technology Co., Ltd. Air floatation conveyance device and method of conveyance using air
CN102267630A (en) * 2006-11-22 2011-12-07 翔风技术有限公司 Air floatation conveyance device and method of conveyance using air
TWI458036B (en) * 2006-11-22 2014-10-21 Shinko Electric Co Ltd Air-floating carrier apparatus and air carrying method
JP2009040598A (en) * 2007-08-10 2009-02-26 Shinko Electric Co Ltd Air floatation transportation device, air floatation unit, and air floatation transportation method
CN101941593A (en) * 2010-09-02 2011-01-12 立晔科技股份有限公司 Chip conveyer table with turning function

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