JP2006093339A - Processor of substrate - Google Patents

Processor of substrate Download PDF

Info

Publication number
JP2006093339A
JP2006093339A JP2004275755A JP2004275755A JP2006093339A JP 2006093339 A JP2006093339 A JP 2006093339A JP 2004275755 A JP2004275755 A JP 2004275755A JP 2004275755 A JP2004275755 A JP 2004275755A JP 2006093339 A JP2006093339 A JP 2006093339A
Authority
JP
Japan
Prior art keywords
processing tank
substrate
tank
processing
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004275755A
Other languages
Japanese (ja)
Other versions
JP4641168B2 (en
Inventor
Hideki Sueyoshi
秀樹 末吉
Akinori Iso
明典 磯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2004275755A priority Critical patent/JP4641168B2/en
Priority to TW094130357A priority patent/TWI389185B/en
Priority to KR1020050087548A priority patent/KR101160535B1/en
Priority to CNB2005101051270A priority patent/CN100514543C/en
Publication of JP2006093339A publication Critical patent/JP2006093339A/en
Application granted granted Critical
Publication of JP4641168B2 publication Critical patent/JP4641168B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/40Casings; Connections of working fluid
    • F04D29/52Casings; Connections of working fluid for axial pumps
    • F04D29/522Casings; Connections of working fluid for axial pumps especially adapted for elastic fluid pumps
    • F04D29/526Details of the casing section radially opposing blade tips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processor whose rigidity improved without thickening a plate forming a processing tank. <P>SOLUTION: The processor for processing a substrate is provided with: the processing tank 1 which is formed in a box shape where an upper face is opened by the plate, and in which a take-in port 2 of the substrate is made on one side face and a take-out port 3 on the other side face; a reinforcement frame 7 which is integrally installed along an outer peripheral face at an upper part of the processing tank and forms the processing tank; and a lid member 16 which is fitted to the reinforcement frame so that it can turn and opens/closes an upper opening of the processing tank. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は処理槽内を搬送される基板をたとえば薬液などの処理液で処理する基板の処理装置に関する。   The present invention relates to a substrate processing apparatus for processing a substrate conveyed in a processing tank with a processing solution such as a chemical solution.

たとえば液晶表示装置や半導体装置の製造工程においては、基板としてのガラス基板や半導体ウエハをエッチング処理したり、エッチング後にマスクとして使用されたレジストの剥離処理をしたり、エッチングや剥離処理が行なわれた基板を洗浄処理するという工程がある。このような基板の処理工程では、基板を一枚ずつ搬送しながら処理する枚葉方式が採用されている。   For example, in a manufacturing process of a liquid crystal display device or a semiconductor device, a glass substrate or a semiconductor wafer as a substrate is etched, a resist used as a mask after etching is stripped, or etching or stripping is performed. There is a process of cleaning the substrate. In such a substrate processing process, a single wafer method is employed in which substrates are processed while being conveyed one by one.

枚葉方式によって基板を処理する場合、基板を搬送しながらその上下面或いは上面にシャワ−ノズルから処理液を噴射して処理する処理装置が知られている。この処理装置は処理槽を有する。処理槽内には上記基板の搬送方向に沿って搬送ローラを有する搬送軸が所定間隔で回転駆動可能に設けられている。したがって、上記基板は回転駆動される搬送軸に設けられた搬送ローラによって処理槽内を搬送されるようになっている。   In the case of processing a substrate by a single wafer method, a processing apparatus is known in which a processing liquid is ejected from a shower nozzle onto the upper and lower surfaces or the upper surface of the substrate while the substrate is transported. This processing apparatus has a processing tank. A transport shaft having a transport roller is provided in the processing tank so as to be rotationally driven at a predetermined interval along the transport direction of the substrate. Therefore, the substrate is transported in the processing tank by a transport roller provided on a transport shaft that is rotationally driven.

処理槽内で基板を処理液によって処理すると、基板に噴射された処理液がミスト状となってチャンバ内を浮遊する。チャンバ内を浮遊するミスト状の処理液は、処理後の基板に付着し、基板を汚染する原因となる。とくに洗浄処理された基板にミスト状の処理液が付着すると、品質の低下や不良品の発生を招くということがあり、好ましくない。そこで、処理槽には排気ダクトを接続し、チャンバ内に生じるミスト状の処理液を含む雰囲気を排気する構成となっている。   When the substrate is processed with the processing liquid in the processing tank, the processing liquid sprayed onto the substrate becomes a mist and floats in the chamber. The mist-like processing liquid floating in the chamber adheres to the processed substrate and causes the substrate to be contaminated. In particular, if a mist-like treatment liquid adheres to a substrate that has been subjected to a cleaning treatment, it may cause deterioration in quality or generation of defective products, which is not preferable. Therefore, an exhaust duct is connected to the processing tank, and the atmosphere containing the mist processing liquid generated in the chamber is exhausted.

従来、処理槽は耐薬品性を備えた材料、たとえば塩化ビニルなどの合成樹脂製の板材によって箱型状に形成されている。そして、処理槽はその大きさに応じて板材の厚さを変え、その板材によってたとえば処理槽内で生じる雰囲気の流れによる加わる風圧などに対し、損傷することのない剛性を持たせるようにしていた。つまり、処理槽は単体で使用に耐え得る剛性を備えるようにしていた。   Conventionally, the treatment tank is formed in a box shape from a chemical-resistant material, for example, a plate made of synthetic resin such as vinyl chloride. Then, the thickness of the plate is changed according to the size of the processing tank so that the plate material has rigidity that does not damage the wind pressure applied by the flow of the atmosphere generated in the processing tank, for example. . That is, the treatment tank is provided with rigidity that can withstand use.

ところで、最近では上記基板の大型化が著しく、液晶表示装置に用いられる基板の場合、2m角以上の大きさになることがある。基板が大型化すれば、それに応じて処理槽も大型化させなければならない。処理槽を大型化する場合、この処理槽に単体で使用に耐え得る剛性を備えるためには板材の厚さを数十mmの厚さにしなければならない。   By the way, recently, the size of the substrate has been remarkably increased, and in the case of a substrate used for a liquid crystal display device, the size may be 2 m square or more. If the substrate is enlarged, the processing tank must be enlarged accordingly. In the case of increasing the size of the processing tank, the thickness of the plate material must be several tens of mm in order to provide the processing tank with rigidity that can be used alone.

しかしながら、処理槽を構成する板材を厚くして剛性を備えるようにすると、処理槽の高重量化を招くことになるから、工場からの出荷時などの取り扱いが困難になるということがある。しかも、処理槽を形成する板材の面積が大きくなるため、その板材を厚くしても、十分な剛性が得難く、処理槽内に生じる気流などの影響を受けて変形を繰り返し、板材相互の接続部分が損傷する虞がある。   However, if the plate material constituting the processing tank is made thick to have rigidity, the processing tank will be increased in weight, which may make it difficult to handle at the time of shipment from the factory. In addition, since the area of the plate material that forms the treatment tank increases, it is difficult to obtain sufficient rigidity even if the plate material is thickened. There is a risk of damage.

この発明は、処理槽が大型化しても、板材を厚くすることなく剛性を備えることができるようにした基板の処理装置を提供することにある。   An object of the present invention is to provide a substrate processing apparatus capable of providing rigidity without increasing the thickness of a plate material even if the processing tank is enlarged.

この発明は、基板を処理するための処理装置であって、
板材によって上面が開口した箱型状に形成され一側面に上記基板の搬入口、他側面に搬出口が形成された処理槽と、
上記処理槽の上部の外周面に沿って一体的に設けられこの処理槽を形成する板材を補強する補強フレームと、
この補強フレームに取り付けられ上記処理槽の上面開口を開閉する蓋部材と
を具備したことを特徴とする基板の処理装置にある。
The present invention is a processing apparatus for processing a substrate,
A processing tank in which the upper surface is opened by a plate material and is formed in a box shape on one side surface and the substrate is loaded on the side surface, and a conveying port is formed on the other side surface,
A reinforcing frame that is integrally provided along the outer peripheral surface of the upper portion of the processing tank and reinforces a plate material that forms the processing tank;
A substrate processing apparatus comprising: a lid member attached to the reinforcing frame for opening and closing the upper surface opening of the processing tank.

上記処理槽は平面形状が矩形状であって、上記補強フレームは、上記処理槽の外周面の角部に設けられる4本の角筒状の支柱部材と、上記処理槽の4つの外面の上部に設けられ両端部が各角部に位置する上記支柱部材に連結されて上記処理槽と対応する矩形枠状をなした4本の角筒状の横部材とによって構成されていることが好ましい。   The processing tank has a rectangular planar shape, and the reinforcing frame includes four square cylindrical column members provided at corners of the outer peripheral surface of the processing tank and upper portions of the four outer surfaces of the processing tank. It is preferable that both end portions are connected to the supporting column members positioned at the respective corners, and are formed by four rectangular tube-shaped horizontal members having a rectangular frame shape corresponding to the processing tank.

上記処理槽の上部の内周面には全長にわたって吸引ダクトが一体的に設けられ、この吸引ダクトには上記処理槽内の雰囲気を吸引する吸引口が形成され、この吸引口から吸引された処理槽内の雰囲気は上記吸引ダクトに接続された排気ダクトによって排出される構成であることが好ましい。   A suction duct is integrally provided over the entire inner peripheral surface of the treatment tank, and a suction port for sucking the atmosphere in the treatment tank is formed in the suction duct, and the treatment sucked from the suction port. It is preferable that the atmosphere in the tank is exhausted by an exhaust duct connected to the suction duct.

上記吸引ダクトには複数の上記吸引口が形成されていて、各吸引口は開度調整可能な構成であることが好ましい。   It is preferable that a plurality of suction ports are formed in the suction duct, and each suction port has a configuration in which the opening degree can be adjusted.

この発明によれば、処理槽を形成する板材を補強フレームで補強するようにしたから、大型の処理槽であっても、板材を厚くして高重量化を招くことなく、剛性を高めることが可能となる。   According to the present invention, the plate material forming the treatment tank is reinforced with the reinforcing frame, so that even a large treatment tank can increase the rigidity without increasing the thickness of the plate material and increasing the weight. It becomes possible.

以下、この発明の一実施の形態を図面を参照して説明する。
図1はこの発明の処理装置の概略的構成を示す斜視図であって、この処理装置は処理槽1を備えている。処理槽1は、たとえば塩化ビニルなどの合成樹脂製の板材によって上面が開口し平面形状が矩形状をなした箱型状に形成されている。
An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view showing a schematic configuration of a processing apparatus according to the present invention. The processing apparatus includes a processing tank 1. The treatment tank 1 is formed in a box shape having an upper surface opened and a rectangular planar shape by a synthetic resin plate material such as vinyl chloride.

つまり、処理槽1は、図3に示す基板Wの搬送方向に位置する第1の側板1aと第2の側板1b、これら側板1a,1bと交差する方向に位置する前板1cと後板1d及び底板1eとによって上述した箱型状に形成されている。   That is, the processing tank 1 includes a first side plate 1a and a second side plate 1b that are positioned in the transport direction of the substrate W shown in FIG. 3, and a front plate 1c and a rear plate 1d that are positioned in a direction intersecting these side plates 1a and 1b. And the bottom plate 1e are formed in the box shape described above.

上記処理槽1の第1の側板1aと第2の側板1bとには、それぞれスリット状の搬入口2と搬出口3とが上記基板Wの搬送方向と交差する前後方向に対して所定の角度で傾斜して形成されている。この実施の形態では上記搬入口2と搬出口3は処理槽1の後方から前方に向かって低く傾斜して形成されている。   The first side plate 1a and the second side plate 1b of the processing tank 1 have a predetermined angle with respect to the front-rear direction in which the slit-shaped inlet 2 and outlet 3 intersect the substrate W transfer direction, respectively. It is formed with an inclination. In this embodiment, the carry-in port 2 and the carry-out port 3 are formed so as to be inclined downward from the rear to the front of the processing tank 1.

上記底板1cの上記前後方向の両端部にはそれぞれ段部4が形成されている。処理槽1をクリーンルーム内に設置する際、クリーンルーム内の架台を構成する受け部材5(図1に鎖線で示す)に上記段部4を係合させる。それによって、処理槽1を上記受け部材5に安定した状態で設置できるようになっている。   Steps 4 are formed at both ends in the front-rear direction of the bottom plate 1c. When the processing tank 1 is installed in the clean room, the stepped portion 4 is engaged with a receiving member 5 (indicated by a chain line in FIG. 1) that constitutes a frame in the clean room. Thereby, the processing tank 1 can be installed in a stable state on the receiving member 5.

上記処理槽1の外面には補強フレーム7が設けられる。この補強フレーム7は、アルミニウムなどの軽量な金属によって角筒状に形成された4本の支柱部材8を有する。各支柱部材8は上記処理槽1の角部に配置されている。隣り合う角部に配置された一対の支柱部材8の上部には、同じくアルミニウムなどの金属によって角筒状に形成された4本の横部材9が両端を連結して設けられている。   A reinforcing frame 7 is provided on the outer surface of the processing tank 1. The reinforcing frame 7 has four support members 8 formed in a square tube shape by a light metal such as aluminum. Each support member 8 is disposed at a corner of the processing tank 1. Four horizontal members 9 that are also formed in a rectangular tube shape from a metal such as aluminum are provided on the upper portions of a pair of support members 8 arranged at adjacent corners, with both ends connected.

各横部材9は、それぞれ第1、第2の側板1a,1b、前板1c及び後板1dの上部外面に一側面を接触させ、その側面を図示しないねじで各板に連結固定している。それによって、処理槽1と補強フレーム7とは一体化され、処理槽1の第1、第2の側板1a,1b、前板1c及び後板1dは上記補強フレーム7によって補強されている。   Each lateral member 9 has one side surface in contact with the upper outer surface of each of the first and second side plates 1a, 1b, front plate 1c and rear plate 1d, and the side surface is connected and fixed to each plate with screws (not shown). . Thereby, the processing tank 1 and the reinforcing frame 7 are integrated, and the first and second side plates 1 a and 1 b, the front plate 1 c and the rear plate 1 d of the processing tank 1 are reinforced by the reinforcing frame 7.

なお、上記支柱部材8は下端が上記受け部材5に取り付け固定される。それによって、補強フレーム7と受け部材5とが一体化され、補強フレーム7の剛性が高まるから、補強フレーム7による処理槽1の補強強度も向上することになる。   Note that the lower end of the support member 8 is fixedly attached to the receiving member 5. As a result, the reinforcing frame 7 and the receiving member 5 are integrated, and the rigidity of the reinforcing frame 7 is increased. Therefore, the reinforcing strength of the treatment tank 1 by the reinforcing frame 7 is also improved.

つまり、処理槽1は、この処理槽1を構成する第1、第2の側板1a,1b、前板1c、後板1d及び底板1eを厚くしなくとも、上記補強フレーム7によって剛性を備えることができるようになっている。   That is, the processing tank 1 is provided with rigidity by the reinforcing frame 7 without increasing the thickness of the first and second side plates 1a and 1b, the front plate 1c, the rear plate 1d, and the bottom plate 1e constituting the processing tank 1. Can be done.

上記処理槽1の内周面の上部には、角筒状の部材を矩形枠状に配置した吸引ダクト11が設けられている。図2は吸引ダクト11を実線で示し、処理槽1を鎖線で示している。図3は処理槽1を前後方向に対して直交する横方向に沿う縦断面で、上記吸引ダクト11は補強フレーム7を形成する横部材9よりも断面形状が大きな角筒状をなしている。   A suction duct 11 in which square tubular members are arranged in a rectangular frame shape is provided on the upper part of the inner peripheral surface of the processing tank 1. FIG. 2 shows the suction duct 11 by a solid line and the treatment tank 1 by a chain line. FIG. 3 is a vertical cross section of the processing tank 1 along a horizontal direction orthogonal to the front-rear direction, and the suction duct 11 has a rectangular tube shape having a larger cross-sectional shape than the horizontal member 9 forming the reinforcing frame 7.

上記吸引ダクト11は、たとえば処理槽1と同じ塩化ビニルなどの材料によって形成されていて、その外周面を第1、第2の側板1a,1b、前板1c及び後板1dの内面に接触させ、図示せぬねじなどで固定されている。   The suction duct 11 is made of, for example, the same material such as vinyl chloride as the processing tank 1, and its outer peripheral surface is brought into contact with the inner surfaces of the first and second side plates 1a and 1b, the front plate 1c and the rear plate 1d. It is fixed with a screw (not shown).

処理槽1の内周面の上部に、この処理槽1と一体的に吸引ダクト11を設けることで、この吸引ダクト11によって処理槽1は補強される。そのことによっても、処理槽1は第1、第2の側板1a,1b、前板1c及び後板1dを厚くせずに、剛性を備えることができる。   By providing the suction duct 11 integrally with the processing tank 1 at the upper part of the inner peripheral surface of the processing tank 1, the processing tank 1 is reinforced by the suction duct 11. Also by this, the processing tank 1 can be provided with rigidity without increasing the thickness of the first and second side plates 1a and 1b, the front plate 1c, and the rear plate 1d.

図2に示すように、上記吸引ダクト11の上記前板1cと上記後板1dとに対応する部分の内面には、それぞれ一対の吸引口12が所定間隔で開口形成されている。各吸引口12はスライド弁13によって開度が設定できるようになっている。   As shown in FIG. 2, a pair of suction ports 12 are formed at predetermined intervals on the inner surface of the suction duct 11 corresponding to the front plate 1c and the rear plate 1d. The opening degree of each suction port 12 can be set by a slide valve 13.

上記吸引ダクト11の上記後板1dの内面に設けられた部分には外部から排気ダクト14が接続されている。この排気ダクト14は図示せぬ排気ファンに接続されている。排気ファンが作動すれば、上記処理槽1内の雰囲気が上記吸引ダクト11に形成された吸引口12から吸引されて排気される。   An exhaust duct 14 is connected to the portion of the suction duct 11 provided on the inner surface of the rear plate 1d from the outside. The exhaust duct 14 is connected to an exhaust fan (not shown). When the exhaust fan operates, the atmosphere in the processing tank 1 is sucked and exhausted from the suction port 12 formed in the suction duct 11.

吸引ダクト11の上記前板1cと上記後板1dとに対応する部分にはそれぞれスライド弁13によって開度調整可能な一対の吸引口12が処理槽1の左右方向に所定間隔で形成されている。したがって、各吸引口12の開度を調整すれば、処理槽1内の雰囲気を、この処理槽1内の前後方向及び左右方向からほぼ均一に排気することができるようになっている。   A pair of suction ports 12 whose opening degree can be adjusted by a slide valve 13 are formed at predetermined intervals in the left-right direction of the processing tank 1 at portions corresponding to the front plate 1 c and the rear plate 1 d of the suction duct 11. . Therefore, if the opening degree of each suction port 12 is adjusted, the atmosphere in the processing tank 1 can be exhausted substantially uniformly from the front-rear direction and the left-right direction in the processing tank 1.

上記吸引ダクト11の内面には、処理槽1の幅方向中央に前後方向に沿って断面U字状の支持部材15が架設されている。上記処理槽1の第1の側板1aと第2の側板1bとの外面に設けられた上記補強フレーム7の一対の横部材9の上面にはそれぞれ蓋部材16が一端部をヒンジ17によって回動可能に連結されている。   On the inner surface of the suction duct 11, a support member 15 having a U-shaped cross section is installed in the center in the width direction of the treatment tank 1 along the front-rear direction. A lid member 16 is pivoted at one end by a hinge 17 on the upper surfaces of the pair of transverse members 9 of the reinforcing frame 7 provided on the outer surfaces of the first side plate 1a and the second side plate 1b of the processing tank 1. Connected as possible.

図3に示すように、各蓋部材16の他端部はL字状に折曲された係合部18に形成されていて、この上記係合部18は蓋部材16をほぼ水平に倒伏させると、上記支持部材15に係合して上記処理槽1の上面開口を気密に閉塞するようになっている。蓋部材16の上面には把手19が設けられ、この蓋部材16を開閉するときに用いられる。   As shown in FIG. 3, the other end portion of each lid member 16 is formed in an engaging portion 18 bent in an L shape, and the engaging portion 18 lies down on the lid member 16 almost horizontally. The upper surface opening of the processing tank 1 is airtightly closed by engaging with the support member 15. A handle 19 is provided on the upper surface of the lid member 16 and is used when the lid member 16 is opened and closed.

蓋部材16は補強フレーム7の横部材9に取り付けられている。そのため、蓋部材16を開閉することで発生するモーメントは上記横部材9が受け、処理槽1の第1、第2の側板1a,1bに加わることがないから、その分、第1、第2の側板1a,1bを厚くせずにすむ。   The lid member 16 is attached to the transverse member 9 of the reinforcing frame 7. Therefore, the moment generated by opening and closing the lid member 16 is received by the lateral member 9 and is not applied to the first and second side plates 1a and 1b of the processing tank 1. The side plates 1a and 1b can be made thicker.

図3に示すように、上記処理槽1内には、搬送ローラ21が軸方向に所定間隔で設けられた搬送軸22が処理槽1の前後方向に沿って設けられている。この搬送軸22は、上記搬入口2及び搬出口の傾斜角度に対応する角度で傾斜して回転可能に支持されている。各搬送軸22は図示しない駆動機構によって回転駆動される。   As shown in FIG. 3, a conveying shaft 22 in which conveying rollers 21 are provided at predetermined intervals in the axial direction is provided in the processing tank 1 along the front-rear direction of the processing tank 1. The transport shaft 22 is rotatably supported while being inclined at an angle corresponding to the inclination angle of the carry-in port 2 and the carry-out port. Each transport shaft 22 is rotationally driven by a drive mechanism (not shown).

それによって、上記搬送軸22を回転駆動すれば、上記搬入口2から処理槽1内に搬入された基板Wは上記搬送軸22に設けられた搬送ローラ21によって処理槽1の前後方向に対して傾斜して搬送され、上記搬出口3から搬出される。基板Wは処理槽1内を搬送される間に、この処理槽1内の基板Wの上面側に設けられた図示しないシャワーノズルから噴射される処理液によって処理されるようになっている。   Accordingly, if the transport shaft 22 is rotationally driven, the substrate W carried into the processing tank 1 from the transport inlet 2 is moved in the front-rear direction of the processing tank 1 by the transport roller 21 provided on the transport shaft 22. Inclined and transported, and transported from the transport outlet 3. The substrate W is processed by the processing liquid sprayed from a shower nozzle (not shown) provided on the upper surface side of the substrate W in the processing tank 1 while being transported in the processing tank 1.

このように構成された処理装置によれば、処理槽1を単体では高い剛性を得ることができない厚さの合成樹脂製の板材によって形成しても、この処理槽1は補強フレーム7によって補強されている。つまり、第1、第2の側板1a,1b、前板1c及び後板1dの外面の上部外面に、4本の支柱部材8によって矩形枠状に連結された横部材9をそれぞれ固定するようにした。   According to the processing apparatus configured as described above, even if the processing tank 1 is formed of a synthetic resin plate having a thickness that cannot provide high rigidity by itself, the processing tank 1 is reinforced by the reinforcing frame 7. ing. That is, the lateral members 9 connected in a rectangular frame shape by the four support members 8 are fixed to the upper outer surfaces of the outer surfaces of the first and second side plates 1a and 1b, the front plate 1c, and the rear plate 1d, respectively. did.

そのため、処理槽1を形成する板材を厚くすることなく、補強フレーム7によって所定の剛性を持たせることができるから、処理槽1の高重量化を招くことなく、第1、第2の側板1a,1b、前板1及び後板1dの剛性を高めることができる。   Therefore, a predetermined rigidity can be given by the reinforcing frame 7 without increasing the thickness of the plate material that forms the processing tank 1, so that the first and second side plates 1 a are not increased without increasing the weight of the processing tank 1. , 1b, the front plate 1 and the rear plate 1d can be increased in rigidity.

上記補強フレーム7の支柱部材8と横部材9とはアルミニウムによって角筒状に形成されている。そのため、軽量であるにも係わらず、高い剛性を備えているから、そのことによっても、高重量化を招くことなく、処理槽1の剛性を高めることができる。   The strut member 8 and the lateral member 9 of the reinforcing frame 7 are formed in a rectangular tube shape from aluminum. Therefore, although it is lightweight, since it has high rigidity, the rigidity of the processing tank 1 can be increased without causing an increase in weight.

上記補強フレーム7の支柱部材8を処理装置が設置される架台の受け部材5に固定したため、この受け部材5によって補強フレーム7の剛性を高めることができる。補強フレーム7の剛性を高めることができれば、この補強フレーム7による処理槽1の補強も確実となる。   Since the support member 8 of the reinforcing frame 7 is fixed to the receiving member 5 of the gantry on which the processing apparatus is installed, the rigidity of the reinforcing frame 7 can be increased by the receiving member 5. If the rigidity of the reinforcement frame 7 can be increased, the reinforcement of the treatment tank 1 by the reinforcement frame 7 can be ensured.

処理槽1の上部開口を開閉する蓋部材16を上記補強フレーム7の横部材9に取り付けるようにした。そのため、蓋部材16を開閉する際に生じるモーメントが処理槽1に直接加わることがないから、その分、処理槽1を形成する板材を薄くすることが可能となる。   A lid member 16 that opens and closes the upper opening of the treatment tank 1 is attached to the transverse member 9 of the reinforcing frame 7. Therefore, the moment generated when the lid member 16 is opened and closed is not directly applied to the processing tank 1, and accordingly, the plate material forming the processing tank 1 can be made thinner.

しかも、蓋部材16の荷重の一部又は全部を補強フレーム7で支持するようにしているので、処理槽1に蓋部材16の荷重がほとんど加わらない。そのため、処理槽1を形成する板材を薄くすることが可能である。   In addition, since part or all of the load of the lid member 16 is supported by the reinforcing frame 7, the load of the lid member 16 is hardly applied to the treatment tank 1. Therefore, it is possible to reduce the thickness of the plate material that forms the treatment tank 1.

処理槽1の上部の内周面全体に吸引ダクト11を上記処理槽1と一体的に設けたので、この吸引ダクト11によっても処理槽1を補強することができるから、それによっても処理槽1を形成する板材を薄くすることが可能となる。   Since the suction duct 11 is provided integrally with the processing tank 1 on the entire inner peripheral surface of the upper part of the processing tank 1, the processing tank 1 can be reinforced by the suction duct 11. It is possible to reduce the thickness of the plate material forming the.

吸引ダクト11には、処理槽1の前板1cと後板1dとに対応する部分にそれぞれスライド弁12によって開度調整が可能な一対の吸引口12を形成し、処理槽1内の雰囲気を吸引口12を通じて排気ダクト14へ排出するようにした。   The suction duct 11 is formed with a pair of suction ports 12 whose opening degree can be adjusted by the slide valve 12 at portions corresponding to the front plate 1c and the rear plate 1d of the processing tank 1, and the atmosphere in the processing tank 1 is changed. It was made to discharge to the exhaust duct 14 through the suction port 12.

4つの吸引口12は処理槽1の前後方向と左右方向とに分かれて形成されている。そのため、各吸引口12の開度をそれぞれ設定することで、処理槽1内の雰囲気を前後左右方向から均一に排出することができる。   The four suction ports 12 are formed separately in the front-rear direction and the left-right direction of the processing tank 1. Therefore, the atmosphere in the processing tank 1 can be uniformly discharged from the front, rear, left, and right directions by setting the opening of each suction port 12.

すなわち、処理槽1内の雰囲気を全体にわたって均一に排出できることで、基板Wを処理液で処理したときに処理槽1内にミストが発生しても、そのミストを処理槽1内に滞留させることなく排出することが可能となる。それによって、処理槽1内で処理された基板Wにミストが付着し、汚れの原因になるのを防止できる。   That is, even if the mist is generated in the processing tank 1 when the substrate W is processed with the processing liquid, the mist is retained in the processing tank 1 because the atmosphere in the processing tank 1 can be uniformly discharged over the entire surface. It becomes possible to discharge without. Accordingly, it is possible to prevent mist from adhering to the substrate W processed in the processing tank 1 and causing contamination.

この発明は上記一実施の形態に限定されず、たとえば処理槽を形成する板材は合成樹脂に限られず、耐蝕性を有する金属で形成された板材であってもよい。また、補強フレームは4本の支柱部材と横部材とで形成したが、支柱部材の数は5本以上であってもよく、たとえば処理槽1の前板と後板との幅方向中央部にそれぞれ支柱部材を設けることで、6本としてもよい。   The present invention is not limited to the above-described embodiment. For example, the plate material forming the treatment tank is not limited to the synthetic resin, and may be a plate material formed of a metal having corrosion resistance. Moreover, although the reinforcement frame was formed with four support members and cross members, the number of support members may be five or more. For example, at the center in the width direction between the front plate and the rear plate of the treatment tank 1 It is good also as six by providing each support | pillar member.

また、上記一実施の形態では蓋部材16が一端部をヒンジ17によって回動可能に連結されるようにしたが、蓋部材の一部又は全部を補強フレームで支持する構成であればよい。   In the above-described embodiment, the lid member 16 is pivotally connected at one end by the hinge 17. However, any part or all of the lid member may be supported by the reinforcing frame.

この発明の一実施の形態を示す処理装置の斜視図。The perspective view of the processing apparatus which shows one embodiment of this invention. 吸引ダクトを実線で示し、処理槽を鎖線で示した処理装置の斜視図。The perspective view of the processing apparatus which showed the suction duct with the continuous line, and showed the process tank with the chain line. 基板の搬送方向に沿う処理装置の縦断面図。The longitudinal cross-sectional view of the processing apparatus along the conveyance direction of a board | substrate. 蓋部材の一部を残して破断した処理装置の平面図。The top view of the processing apparatus fractured | ruptured leaving a part of lid member.

符号の説明Explanation of symbols

1…処理槽、2…搬入口、3…搬出口、5…受け部材、7…補強フレーム、8…支柱部材9…横部材、11…吸引ダクト、12…吸引口、13…スライド弁、14…排気ダクト、15…支持部材、16…蓋部材。   DESCRIPTION OF SYMBOLS 1 ... Processing tank, 2 ... Carry-in port, 3 ... Carry-out port, 5 ... Receiving member, 7 ... Reinforcement frame, 8 ... Strut member 9 ... Lateral member, 11 ... Suction duct, 12 ... Suction port, 13 ... Slide valve, 14 ... exhaust duct, 15 ... support member, 16 ... lid member.

Claims (4)

基板を処理するための処理装置であって、
板材によって上面が開口した箱型状に形成され一側面に上記基板の搬入口、他側面に搬出口が形成された処理槽と、
上記処理槽の上部の外周面に沿って一体的に設けられこの処理槽を形成する板材を補強する補強フレームと、
この補強フレームに取り付けられ上記処理槽の上面開口を開閉する蓋部材と
を具備したことを特徴とする基板の処理装置。
A processing apparatus for processing a substrate,
A processing tank in which the upper surface is opened by a plate material and is formed in a box shape on one side surface and the substrate is loaded on the side surface, and a conveying port is formed on the other side surface,
A reinforcing frame that is integrally provided along the outer peripheral surface of the upper portion of the processing tank and reinforces a plate material that forms the processing tank;
A substrate processing apparatus comprising: a lid member attached to the reinforcing frame for opening and closing the upper surface opening of the processing tank.
上記処理槽は平面形状が矩形状であって、上記補強フレームは、上記処理槽の外周面の角部に設けられる4本の角筒状の支柱部材と、上記処理槽の4つの外面の上部に設けられ両端部が各角部に位置する上記支柱部材に連結されて上記処理槽と対応する矩形枠状をなした4本の角筒状の横部材とによって構成されていることを特徴とする請求項1記載の基板の処理装置。   The processing tank has a rectangular planar shape, and the reinforcing frame includes four square cylindrical column members provided at corners of the outer peripheral surface of the processing tank and upper portions of the four outer surfaces of the processing tank. The two end portions are connected to the supporting column members positioned at the respective corners, and are formed by four rectangular tube-shaped horizontal members having a rectangular frame shape corresponding to the processing tank. The substrate processing apparatus according to claim 1. 上記処理槽の上部の内周面には全長にわたって吸引ダクトが一体的に設けられ、この吸引ダクトには上記処理槽内の雰囲気を吸引する吸引口が形成され、この吸引口から吸引された処理槽内の雰囲気は上記吸引ダクトに接続された排気ダクトによって排出される構成であることを特徴とする請求項1記載の基板の処理装置。   A suction duct is integrally provided over the entire inner peripheral surface of the treatment tank, and a suction port for sucking the atmosphere in the treatment tank is formed in the suction duct, and the treatment sucked from the suction port. 2. The substrate processing apparatus according to claim 1, wherein the atmosphere in the tank is exhausted by an exhaust duct connected to the suction duct. 上記吸引ダクトには複数の上記吸引口が形成されていて、各吸引口は開度調整可能な構成であることを特徴とする請求項3記載の基板の処理装置。   4. The substrate processing apparatus according to claim 3, wherein a plurality of the suction ports are formed in the suction duct, and each suction port has a configuration capable of adjusting an opening degree.
JP2004275755A 2004-09-22 2004-09-22 Substrate processing equipment Active JP4641168B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004275755A JP4641168B2 (en) 2004-09-22 2004-09-22 Substrate processing equipment
TW094130357A TWI389185B (en) 2004-09-22 2005-09-05 Apparatus for treating substrates
KR1020050087548A KR101160535B1 (en) 2004-09-22 2005-09-21 Apparatus for treating substrates
CNB2005101051270A CN100514543C (en) 2004-09-22 2005-09-22 Substrate treater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004275755A JP4641168B2 (en) 2004-09-22 2004-09-22 Substrate processing equipment

Publications (2)

Publication Number Publication Date
JP2006093339A true JP2006093339A (en) 2006-04-06
JP4641168B2 JP4641168B2 (en) 2011-03-02

Family

ID=36234027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004275755A Active JP4641168B2 (en) 2004-09-22 2004-09-22 Substrate processing equipment

Country Status (4)

Country Link
JP (1) JP4641168B2 (en)
KR (1) KR101160535B1 (en)
CN (1) CN100514543C (en)
TW (1) TWI389185B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009266962A (en) * 2008-04-23 2009-11-12 Hitachi Kokusai Electric Inc Substrate processing apparatus and method for manufacturing semiconductor device
JP2010091727A (en) * 2008-10-07 2010-04-22 Dainippon Screen Mfg Co Ltd Substrate processing tank and method for manufacturing the same
JP2010225687A (en) * 2009-03-19 2010-10-07 Shibaura Mechatronics Corp Apparatus for processing of substrate
JP2013026490A (en) * 2011-07-22 2013-02-04 Tokyo Electron Ltd Substrate processor
US8383702B2 (en) 2006-12-20 2013-02-26 Saint-Gobain Ceramics & Plastics, Inc. Composite materials having improved thermal performance

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6732213B2 (en) * 2016-11-16 2020-07-29 日本電気硝子株式会社 Glass substrate manufacturing method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03284386A (en) * 1990-03-30 1991-12-16 Shibaura Eng Works Co Ltd Cleaning tank
JPH08318169A (en) * 1995-05-26 1996-12-03 Sanyo Electric Co Ltd Draft device
JPH09320998A (en) * 1996-05-29 1997-12-12 Ebara Corp Air discharge structure for apparatus
WO2001003167A1 (en) * 1999-07-02 2001-01-11 Tokyo Electron Limited Semiconductor manufacture equipment, and method and apparatus for semiconductor manufacture
JP2003260422A (en) * 2002-03-12 2003-09-16 J P C:Kk Part cleaning system
JP2004140336A (en) * 2002-08-19 2004-05-13 Sumitomo Precision Prod Co Ltd Lift type substrate treatment apparatus and substrate treatment system equipped with the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3556110B2 (en) * 1998-12-22 2004-08-18 大日本スクリーン製造株式会社 Substrate processing equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03284386A (en) * 1990-03-30 1991-12-16 Shibaura Eng Works Co Ltd Cleaning tank
JPH08318169A (en) * 1995-05-26 1996-12-03 Sanyo Electric Co Ltd Draft device
JPH09320998A (en) * 1996-05-29 1997-12-12 Ebara Corp Air discharge structure for apparatus
WO2001003167A1 (en) * 1999-07-02 2001-01-11 Tokyo Electron Limited Semiconductor manufacture equipment, and method and apparatus for semiconductor manufacture
JP2003260422A (en) * 2002-03-12 2003-09-16 J P C:Kk Part cleaning system
JP2004140336A (en) * 2002-08-19 2004-05-13 Sumitomo Precision Prod Co Ltd Lift type substrate treatment apparatus and substrate treatment system equipped with the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8383702B2 (en) 2006-12-20 2013-02-26 Saint-Gobain Ceramics & Plastics, Inc. Composite materials having improved thermal performance
JP2009266962A (en) * 2008-04-23 2009-11-12 Hitachi Kokusai Electric Inc Substrate processing apparatus and method for manufacturing semiconductor device
JP2010091727A (en) * 2008-10-07 2010-04-22 Dainippon Screen Mfg Co Ltd Substrate processing tank and method for manufacturing the same
JP2010225687A (en) * 2009-03-19 2010-10-07 Shibaura Mechatronics Corp Apparatus for processing of substrate
JP2013026490A (en) * 2011-07-22 2013-02-04 Tokyo Electron Ltd Substrate processor

Also Published As

Publication number Publication date
CN1753150A (en) 2006-03-29
TWI389185B (en) 2013-03-11
KR101160535B1 (en) 2012-06-28
TW200616057A (en) 2006-05-16
CN100514543C (en) 2009-07-15
JP4641168B2 (en) 2011-03-02
KR20060051450A (en) 2006-05-19

Similar Documents

Publication Publication Date Title
JP4495618B2 (en) Substrate processing apparatus and processing method
KR101160535B1 (en) Apparatus for treating substrates
TWI360836B (en) Substrate processing apparatus
JP2004170451A (en) Developing method and developing apparatus
JP3754905B2 (en) Substrate dryer
JP4079579B2 (en) Wet processing equipment
JP4452033B2 (en) Substrate transfer apparatus and transfer method
JPH11307494A (en) Substrate processing device
TWI257473B (en) High-speed drying device
JP2001108977A (en) Apparatus for manufacturing liquid crystal display device and method for the same
JPH0994546A (en) Liquid-extraction device for substrate
KR101179819B1 (en) Apparatus for treating substrate
JP2001035778A (en) Substrate treatment apparatus
JP4213805B2 (en) Drying processing equipment
JP2006093591A (en) Processor of substrate
JP4057993B2 (en) Liquid drainer
JP4663919B2 (en) Substrate dryer
JP3843252B2 (en) Substrate processing apparatus and substrate processing method
JP2003229356A (en) Substrate treatment device
JP2004153033A (en) Substrate processing apparatus
JPH11307493A (en) Substrate processing device
JPH11335872A (en) Substrate treating apparatus
JPH1110096A (en) Substrate treating device
JP3120289B2 (en) Processing equipment
JPH11204490A (en) Stuck liquid removal device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070918

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090811

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090818

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091009

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100413

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100708

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20100803

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101019

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101101

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20101124

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20101126

R150 Certificate of patent or registration of utility model

Ref document number: 4641168

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131210

Year of fee payment: 3