JP2564931Y2 - Printed circuit board mounting structure of 2 pole parts - Google Patents
Printed circuit board mounting structure of 2 pole partsInfo
- Publication number
- JP2564931Y2 JP2564931Y2 JP1990126663U JP12666390U JP2564931Y2 JP 2564931 Y2 JP2564931 Y2 JP 2564931Y2 JP 1990126663 U JP1990126663 U JP 1990126663U JP 12666390 U JP12666390 U JP 12666390U JP 2564931 Y2 JP2564931 Y2 JP 2564931Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- mounting structure
- component
- pole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は２極部品のプリント基板実装構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application field] The present invention relates to a printed circuit board mounting structure of two-pole parts.
従来、抵抗、コンデンサ、ダイオード等の２極部品の
プリント基板実装構造としては、プリント基板に設けら
れたスルーホールに２極部品のリード線を挿入した後、
半田付けするリード線実装構造と、チップ部品を用いた
表面実装構造が提案されていた。Conventionally, as a printed circuit board mounting structure of a two-pole part such as a resistor, a capacitor, and a diode, after inserting a lead wire of the two-pole part into a through hole provided in the printed board,
A lead wire mounting structure for soldering and a surface mounting structure using chip components have been proposed.
しかしながら、従来の２極部品のプリント基板実装構
造において、前者のリード線実装構造は、半田付けが容
易でなく、しかも実装面積が大きくなるという問題があ
った。また、後者の表面実装構造は、自動搭載機を使用
する前の前作業に、工数がかかるという問題があった。However, in the conventional two-pole component printed circuit board mounting structure, the former lead wire mounting structure has a problem that soldering is not easy and the mounting area is large. In addition, the latter surface mounting structure has a problem that it takes a lot of man-hours to perform a pre-operation before using the automatic mounting machine.
本考案の目的は上述した問題に鑑みなされたもので、
半田付けが容易に行えると共に実装面積を小さくでき、
さらに前作業を少なくできるようにした２極部品のプリ
ント基板実装構造を提供するにある。The purpose of the present invention was made in view of the above-mentioned problems,
Soldering is easy and the mounting area can be reduced.
It is still another object of the present invention to provide a printed circuit board mounting structure for a two-pole component which can reduce the number of pre-operations.
本考案の２極部品のプリント基板実装構造では、プリ
ント基板に２極部品の実装用穴を穿設し、この実装用穴
に嵌装する側の端部を先細とし、かつ熱膨張を吸収しう
る素材からなる円筒状の樹脂部品をその外周に嵌装配置
してなる２極部品をこの実装穴に埋め込んだ後、２極部
品の電極とプリント基板の電極パターンを半田により接
続するよう構成したことを特徴としている。In the printed circuit board mounting structure of the present invention, a mounting hole for the two-electrode component is formed in the printed circuit board, and an end on the side to be fitted in the mounting hole is tapered, and thermal expansion is absorbed. After embedding a two-electrode component in which a cylindrical resin component made of a resilient material is fitted around the outer periphery thereof into the mounting hole, the electrodes of the two-electrode component and the electrode pattern of the printed circuit board are connected by soldering. It is characterized by:
このように本考案によれば、２極部品をプリント基板
の実装用穴内に埋め込み実装しており、２極部品を埋設
したプリント基板を半田層に浸漬することにより、２極
部品の電極とプリント基板の電極パターンが半田付けさ
れる。したがって、半田付けが容易で、しかも実装面積
を小さくできる。また、プリント基板に実装用の穴を設
けるだけなので、従来の表面実装構造のような前作業が
少ない。As described above, according to the present invention, the two-electrode component is embedded and mounted in the mounting hole of the printed circuit board, and the printed circuit board having the two-electrode component embedded therein is immersed in the solder layer to form the electrodes of the two-electrode component and the printed circuit board. The electrode pattern of the substrate is soldered. Therefore, soldering is easy and the mounting area can be reduced. Also, since only holes for mounting are provided on the printed circuit board, there is little pre-work such as the conventional surface mounting structure.
次に、本考案について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本考案に係わる２極部品のプリント基板実装
構造の一実施例を示す断面図、第２図は同実装構造に使
用される２極部品の断面図である。FIG. 1 is a sectional view showing an embodiment of a printed circuit board mounting structure of a two-pole component according to the present invention, and FIG. 2 is a cross-sectional view of a two-pole component used in the mounting structure.
プリント基板１の所定の位置には適当な大きさに形成
された２極部品（抵抗、コンデンサ、ダイオード等）２
を埋設するための実装用穴３が穿設されている。この実
装用穴３には、第１図に示すようにして２極部品２が埋
設されており、この２極部品２を埋設したプリント基板
１を半田槽（図示せず）内に浸漬することにより、２極
部品２の上下に位置する電極４、５とプリント基板１の
電極パターン６とが半田７により接続された構造となっ
ている。なお、２極部品２の外周には樹脂部品８が嵌装
配置されており、この樹脂部品８によって２極部品２の
膨張を吸収し、プリント基板１と２極部品２間の絶縁を
図るようになっている。At a predetermined position on the printed circuit board 1, a two-pole component (resistance, capacitor, diode, etc.) 2 formed in an appropriate size
Is provided with a mounting hole 3 for burying a hole. As shown in FIG. 1, a two-pole component 2 is buried in the mounting hole 3, and the printed circuit board 1 in which the two-pole component 2 is buried is immersed in a solder bath (not shown). Thus, the electrodes 4 and 5 located above and below the two-pole component 2 and the electrode pattern 6 of the printed circuit board 1 are connected by the solder 7. A resin component 8 is fitted around the outer periphery of the two-pole component 2 so as to absorb the expansion of the two-pole component 2 and to insulate the printed circuit board 1 from the two-pole component 2. It has become.
このように本実施例にあっては、２極部品２をプリン
ト基板１の実装用穴２内に埋め込み実装しており、この
２極部品２を埋設したプリント基板１を半田槽に浸漬す
ることにより、２極部品２の電極４、５とプリント基板
１の電極パターン６とが自動的に半田付けされるように
なっているので、半田付け作業が容易となり、しかも２
極部品２のプリント基板１における実装面積を小さくで
きるという利点を有する。また、プリント基盤１には実
装用穴３を設けるだけの構成なので、チップ部品を用い
た表面実装構造に比べて前作業を減少できるという利点
も有する。As described above, in the present embodiment, the two-pole component 2 is embedded and mounted in the mounting hole 2 of the printed board 1, and the printed board 1 in which the two-pole component 2 is embedded is immersed in a solder bath. As a result, the electrodes 4 and 5 of the two-pole component 2 and the electrode pattern 6 of the printed circuit board 1 are automatically soldered.
There is an advantage that the mounting area of the pole parts 2 on the printed circuit board 1 can be reduced. In addition, since the printed circuit board 1 has a configuration in which only the mounting holes 3 are provided, there is an advantage that the number of previous operations can be reduced as compared with a surface mounting structure using chip components.
以上説明したように本考案によれば、２極部品の外周
に嵌装する円筒状の樹脂部品の実装用穴に嵌装する側の
端部を先細としたので、例えば２極部品の外周に樹脂膜
を形成した場合と比べて挿入が容易であり、かつ樹脂膜
よりも厚いので２極部品の一端から他端に半田が流れ込
む危険性を有効に回避することができる。更に樹脂部品
は２極部品の熱膨張を吸収しうる素材からなっているの
で、半田付け時の２極部品の保護を有効に行うことがで
きる。As described above, according to the present invention, the end of the cylindrical resin component to be fitted to the mounting hole of the cylindrical resin component to be fitted to the outer periphery of the two-pole component is tapered. Insertion is easier than in the case where a resin film is formed, and since it is thicker than the resin film, the risk of solder flowing from one end to the other end of the two-pole component can be effectively avoided. Further, since the resin component is made of a material capable of absorbing the thermal expansion of the two-electrode component, the two-electrode component can be effectively protected during soldering.
第１図は本考案に係わる２極部品のプリント基板実装構
造の一実施例を示す断面図、第２図は同実装構造に使用
される２極部品の断面図である。 １……プリント基板、２……２極部品、３……実装用
穴、４、５……電極、６……電極パターン、７……半
田。FIG. 1 is a sectional view showing an embodiment of a printed circuit board mounting structure of a two-pole component according to the present invention, and FIG. 2 is a cross-sectional view of a two-pole component used in the mounting structure. 1 ... printed circuit board, 2 ... 2-pole parts, 3 ... mounting holes, 4, 5 ... electrodes, 6 ... electrode patterns, 7 ... solder.
フロントページの続き (72)考案者 井沢 繁夫 宮城県黒川郡大和町吉岡字雷神２番地 宮城日本電気株式会社内 (56)参考文献 特開 昭63−98183（ＪＰ，Ａ) 実開 昭61−168671（ＪＰ，Ｕ) 実開 平１−116401（ＪＰ，Ｕ)Continuation of the front page (72) Inventor Shigeo Izawa Miyagi Prefecture Kurokawa-gun Yamato-cho Yoshioka character Raijin 2 Miyagi NEC Corporation (56) References JP-A-63-98183 (JP, A) (JP, U) Hikaru 1-116401 (JP, U)
Claims (1)
し、この実装用穴に嵌装する側の端部を先細とし、かつ
熱膨張を吸収しうる素材からなる円筒状の樹脂部品をそ
の外周に嵌装配置してなる２極部品をこの実装穴に埋め
込んだ後、２極部品の電極とプリント基板の電極パター
ンを半田により接続するよう構成したことを特徴とする
２極部品のプリント基板実装構造。A cylindrical resin made of a material capable of absorbing thermal expansion by drilling a mounting hole for a two-pole component in a printed circuit board, tapering an end on a side to be fitted in the mounting hole. A two-pole component, in which the component is fitted and arranged on the outer periphery thereof, is embedded in the mounting hole, and then the electrode of the two-pole component is connected to the electrode pattern of the printed circuit board by soldering. Printed circuit board mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990126663U JP2564931Y2 (en) | 1990-11-30 | 1990-11-30 | Printed circuit board mounting structure of 2 pole parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990126663U JP2564931Y2 (en) | 1990-11-30 | 1990-11-30 | Printed circuit board mounting structure of 2 pole parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0485765U JPH0485765U (en) | 1992-07-24 |
| JP2564931Y2 true JP2564931Y2 (en) | 1998-03-11 |
Family
ID=31874204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990126663U Expired - Lifetime JP2564931Y2 (en) | 1990-11-30 | 1990-11-30 | Printed circuit board mounting structure of 2 pole parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2564931Y2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61168671U (en) * | 1985-04-09 | 1986-10-20 | ||
| JPS6398183A (en) * | 1986-10-15 | 1988-04-28 | 横河電機株式会社 | Printed wiring board device |
| JPH01116401U (en) * | 1988-01-29 | 1989-08-07 |
-
1990
- 1990-11-30 JP JP1990126663U patent/JP2564931Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0485765U (en) | 1992-07-24 |
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